CN217481814U - Electronic heat dissipation disc brake system and bicycle - Google Patents
Electronic heat dissipation disc brake system and bicycle Download PDFInfo
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- CN217481814U CN217481814U CN202221391555.XU CN202221391555U CN217481814U CN 217481814 U CN217481814 U CN 217481814U CN 202221391555 U CN202221391555 U CN 202221391555U CN 217481814 U CN217481814 U CN 217481814U
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- disc brake
- power supply
- connecting rod
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Abstract
The embodiment of the utility model discloses electron heat dissipation dish system of stopping and bicycle, wherein: the electronic heat dissipation disc brake system comprises a clamp main body, 2 brake pads arranged on the clamp main body, 2 semiconductor radiators and a power supply connected with all semiconductor radiator wires, wherein each brake pad is connected with the clamp main body through a corresponding back plate, each back plate extends outwards to form a mounting plate, the 2 semiconductor radiators are respectively arranged on the mounting plates, and the power supply is arranged on the clamp main body. The utility model discloses heat dissipation dish system of stopping has better radiating efficiency and radiating effect, and the structure has better compactedness.
Description
Technical Field
The utility model relates to a bicycle accessory field especially relates to an electron heat dissipation dish system and bicycle of stopping.
Background
The heat dissipation structure used for the current bicycle brake clamp and disc brake is an aluminum sheet extended from a lining sheet for heat dissipation, or is not extended, and the heat dissipation is carried out by the heat conduction characteristic of the heat dissipation structure.
At the utility model patent of current patent publication No. CN206419373U, a dish heat dissipation lining piece device of stopping is disclosed, including dish brake lining piece, dish brake lining piece and dish are stopped between being provided with many protruding heat dissipation aluminium seats, it struts the shell fragment to be provided with between the lining piece to prop the dish, it will to strut the shell fragment dish heat dissipation lining piece device supports for upper and lower heat dissipation brake mechanism, and the symmetric distribution is in the both sides of brake disc.
Although the disc brake heat dissipation lining device dissipates heat of the disc brake lining through the convex heat dissipation aluminum seat, the disc brake and clamp lining heat dissipation efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an electron heat dissipation dish system of stopping and bicycle aims at solving current brake dish and stops, the not high problem of clamp incoming sheet radiating efficiency.
In order to solve the technical problem, the purpose of the utility model is realized through following technical scheme: the electronic heat dissipation disc brake system is characterized by further comprising 2 semiconductor radiators and a power supply connected with all semiconductor radiator wires, wherein the back plates extend outwards to form mounting plates, the 2 semiconductor radiators are respectively mounted on the mounting plates, and the power supply is mounted on the clamp main body.
Further, the semiconductor heat spreader includes:
the heat absorption end of the heat conduction shell is fixedly arranged on the outer side of the corresponding mounting plate through a connecting piece;
the heat conducting fins are arranged and are connected with the heat release end of the heat conducting shell through metal cooling fins;
the control circuit board is arranged in the heat conduction shell and connected with the power supply lead, and the control circuit board is used for dissipating heat of the mounting plate after being electrified.
Further, the semiconductor radiator includes a temperature sensor, the temperature sensor is installed in the heat conduction shell and connected with the power supply wire, and is used for controlling the power supply to supply power to the semiconductor radiator after the mounting plate reaches a preset temperature, and is used for controlling the power supply to power off the semiconductor radiator after the current temperature of the mounting plate is lower than the preset temperature.
Furthermore, the power supply is an external power supply which is detachably mounted on the clamp main body, and the external power supply is respectively connected with the 2 semiconductor radiators through power lines.
Furthermore, the clamp main body faces one side of the mounting plate, a mounting seat is installed on the mounting plate, and the external power supply is detachably installed on the mounting seat.
Furthermore, the mount pad is including the first connecting rod, second connecting rod and the third connecting rod that connect gradually, the both ends of second connecting rod respectively with the one end of first connecting rod and third connecting rod is connected, the end of first connecting rod and third connecting rod with the clamp main part is connected, wherein, external power supply demountable installation in the second connecting rod outside.
Furthermore, the connecting piece is a mounting bolt which penetrates through the heat conduction shell and is in threaded connection with the back plate.
The embodiment of the utility model provides a bicycle is still provided, include as above electron heat dissipation dish system of stopping, electron heat dissipation dish system of stopping install in on the bicycle body.
The embodiment of the utility model provides an electron heat dissipation dish system of stopping and bicycle, wherein: the electronic heat dissipation disc brake system comprises a clamp main body, 2 brake pads arranged on the clamp main body, 2 semiconductor radiators and a power supply connected with all semiconductor radiator wires, wherein each brake pad is connected with the clamp main body through a corresponding back plate, each back plate extends outwards to form a mounting plate, the 2 semiconductor radiators are respectively arranged on the mounting plates, and the power supply is arranged on the clamp main body. The utility model discloses heat dissipation dish system of stopping has better radiating efficiency and radiating effect, and the structure has better compactedness.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.
Fig. 1 is a schematic structural view of a first viewing angle of an electronic heat dissipation disc brake system according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a second viewing angle of the electronic heat dissipation disc brake system according to an embodiment of the present invention;
fig. 3 is a local explosion diagram of the electronic heat dissipation disc brake system provided by the embodiment of the present invention.
The designations in the drawings illustrate:
1. a clamp main body; 11. a first clamping portion; 12. a second clamping portion; 2. a linen pad; 3. a back plate; 31. mounting a plate; 4. a thermally conductive housing; 5. a heat conductive fin; 51. a metal heat sink; 6. an external power supply; 7. a mounting seat; 71. a first link; 72. a second link; 73. a third link; 8. and (6) installing a bolt.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
It should be added that the semiconductor radiator, also called semiconductor refrigeration sheet radiator, semiconductor refrigeration sheet, also called thermoelectric refrigeration sheet, is a heat pump. By using the Peltier effect of the semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the aim of refrigeration can be fulfilled.
Combine fig. 1 to fig. 3, the embodiment of the utility model provides an electron heat dissipation dish system of stopping, including clamp main part 1 and install in 2 linen pads 2 in the clamp main part 1, each the linen pad 2 through corresponding backplate 3 with clamp main part 1 is connected, this application electron heat dissipation dish system of stopping still include 2 semiconductor radiators, with all the power that the semiconductor radiator wire is connected, wherein, each backplate 3 outwards extends and forms mounting panel 31, 2 the semiconductor radiator install respectively in on the mounting panel 31, the power install in clamp main part 1 is last.
In this embodiment, the clamp main body 1 is mounted on the bicycle body, and includes a first clamping portion 11, a second clamping portion 12 and a return spring (not shown), the first clamping portion 11 is connected with the second clamping portion 12 by a plurality of fastening bolts, wherein one of the pads 2 is mounted on the inner side of the first clamping portion 11 (the side of the first clamping portion 11 facing the second clamping portion 12), the other pad 2 is mounted on the inner side of the second clamping portion 12 (the side of the second clamping portion 12 facing the first clamping portion 11), one end of the return spring is connected with one of the clamping portions, and the other end of the return spring is connected with the back plate 3 at the corresponding position, so as to control the moving position between the first clamping portion 11 and the second clamping portion 12.
Because the existing heat dissipation structure for the bicycle brake caliper and the disc brake is to dissipate heat by an aluminum sheet extended from the brake pad 2, or only by the heat conduction characteristic of the disc brake, that is, the existing heat dissipation disc brake system has the problem of low heat dissipation efficiency, the mounting plate 31 beneficial to mounting the semiconductor radiator is obtained by extending a part (namely the back plate 3 of the application) for fixing the brake pad 2 in the disc brake system, the semiconductor radiator can enable the temperature of the brake pad 2 to be lower than that of a heat dissipation part, and the semiconductor radiator can provide better heat dissipation effect because the temperature difference between the two parts is large; meanwhile, the semiconductor radiator replaces a purely mechanical radiating structure, and the radiating effect and radiating efficiency of the disc brake system are improved.
It should be noted that heat is generated by friction between the brake disc and the brake lining 2 when the brake disc is clamped by the brake lining 2 (the contact position between the brake disc and the brake lining is the heat dissipation position).
In an embodiment, with reference to fig. 1 and fig. 2, the semiconductor heat spreader includes:
the heat absorption end of the heat conduction shell 4 is fixedly arranged on the outer side of the corresponding mounting plate 31 through a connecting piece;
a plurality of heat conducting fins 5, wherein the heat conducting fins 5 are connected with the heat radiating end of the heat conducting shell 4 through metal heat radiating fins 51;
and a control circuit board (not shown) mounted in the heat-conducting shell 4 and connected with the power supply lead, and configured to dissipate heat of the mounting plate 31 after being powered on.
In the present embodiment, the heat absorbing end of the heat conducting casing 4 is also called as the cooling end, that is, the lower temperature end of the heat conducting casing 4 is attached to the mounting plate 31, and the heat radiating end of the heat conducting casing 4 is the end far away from the cooling end.
Based on improving the compact structure nature of the dish system of stopping of this application and guaranteeing sufficient good radiating effect, the heat conduction fin 5 of this application is regular slice, and all heat conduction fins 5 arrange along same direction array, but when making, according to actual need, the shape of heat conduction fin 5 can be other, and heat conduction fin 5's the mode of arranging also can be different, as long as can be better realize the radiating effect can, so this application is not explaining.
In a specific embodiment, the semiconductor heat sink includes a temperature sensor, the temperature sensor is installed in the heat conducting housing 4 and connected to the power line, and is configured to control the power supply to supply power to the semiconductor heat sink after the mounting plate 31 reaches a preset temperature, and is configured to control the power supply to power off the semiconductor heat sink after the current temperature of the mounting plate 31 is lower than the preset temperature.
In this embodiment, temperature sensor passes through the power cord and is connected with power and control circuit board respectively, and after the temperature of lining 2, backplate 3 reached the default, temperature sensor sent start signal to control circuit board, and control circuit board switched on semiconductor radiator based on the start signal control power of receipt to start semiconductor radiator, make heat conduction fin 5 can dispel the heat to lining 2, backplate 3 fast, that is to say, the dish system of stopping of this application has better suitability and practicality.
With reference to fig. 2 and fig. 3, in a specific embodiment, the power supply is an external power supply 6 detachably mounted on the clamp main body 1, and the external power supply 6 is connected to the 2 semiconductor heat sinks through power lines.
In this embodiment, set up external power supply 6 (usually for the battery) to the power, be favorable to the user to change the power after the power does not have the electricity, simultaneously, for the compact structure nature that improves the dish system of stopping of this application, so use 1 external power supply 6 to supply power to 2 semiconductor radiators, but should understand, can also utilize 2 power supplies to supply power to 2 semiconductor radiators respectively.
In a specific embodiment, the mounting seat 7 is installed on one side of the clamp body 1 facing the mounting plate 31, and the external power source 6 is detachably installed on the mounting seat 7.
In this embodiment, the mounting seat 7 may be fixed to the second clamping portion 12 by welding or bolting, and the external power source 6 is separated from the clamping body by the mounting seat 7, i.e. away from the heat dissipation portion, so as to protect the external power source 6, reduce the influence of high temperature on the external power source 6, and reduce the service life of the external power source 6.
In a specific embodiment, the mounting base 7 includes a first connecting rod 71, a second connecting rod 72 and a third connecting rod 73, which are connected in sequence, two ends of the second connecting rod 72 are connected to one ends of the first connecting rod 71 and the third connecting rod 73, respectively, ends of the first connecting rod 71 and the third connecting rod 73 are connected to the clamp main body 1, and the external power source 6 is detachably mounted on an outer side of the second connecting rod 72.
In this embodiment, the first link 71, the second link 72 and the third link 73 are integrally formed to improve the structural strength of the mounting seat 7, wherein the ends of the first link 71 and the third link 73 are fixedly disposed on the second clamping portion 12 by welding, and the external power source 6 can be detachably mounted on the second link 72 by bolting.
In a specific embodiment, the connecting member is a mounting bolt 8 penetrating through the heat conducting shell 4 and in threaded connection with the back plate 3.
In the present embodiment, there are 2 mounting bolts 8, which are respectively located at both ends of the heat conductive housing 4.
The embodiment of the utility model provides a bicycle is still provided, include as above electron heat dissipation dish system of stopping, electron heat dissipation dish system of stopping install in on the bicycle body.
In this embodiment, the electron heat dissipation dish of this application is stopped the system install in on the bicycle body.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. The utility model provides an electron heat dissipation dish system of stopping, including clamp main part (1) and install in 2 lining (2) on clamp main part (1), each lining (2) through corresponding backplate (3) with clamp main part (1) is connected, its characterized in that still include 2 semiconductor radiators, with all the power that the semiconductor radiator wire is connected, wherein, each backplate (3) outwards extend and form mounting panel (31), 2 the semiconductor radiator install respectively in on mounting panel (31), the power install in on clamp main part (1).
2. The electronic heat dissipating disc brake system of claim 1, wherein the semiconductor heat sink comprises:
the heat absorption end of the heat conduction shell (4) is fixedly arranged on the outer side of the corresponding mounting plate (31) through a connecting piece;
the heat conduction fins (5) are arranged, and the heat conduction fins (5) are connected with the heat release end of the heat conduction shell (4) through metal cooling fins (51);
the control circuit board is arranged in the heat conduction shell (4) and connected with the power supply lead, and the control circuit board is used for dissipating heat of the mounting plate (31) after being electrified.
3. The electronic heat dissipation disc brake system of claim 2, wherein: the semiconductor radiator comprises a temperature sensor, the temperature sensor is installed in the heat conduction shell (4) and connected with a power supply wire, the mounting plate (31) is controlled after reaching a preset temperature, the power supply is used for supplying power to the semiconductor radiator, and the current temperature of the mounting plate (31) is lower than the preset temperature, and then the power supply is controlled to cut off the power of the semiconductor radiator.
4. The electronic heat dissipation disc brake system of claim 2, wherein: the power supply is an external power supply (6) which is detachably mounted on the clamp main body (1), and the external power supply (6) is respectively connected with the 2 semiconductor radiators through power lines.
5. The electronic heat dissipation disc brake system of claim 4, wherein: holder main part (1) orientation mount pad (7) are installed to one side of mounting panel (31), external power source (6) demountable installation in on mount pad (7).
6. The electronic heat dissipation disc brake system according to claim 5, wherein the mounting seat (7) comprises a first connecting rod (71), a second connecting rod (72) and a third connecting rod (73) which are connected in sequence, two ends of the second connecting rod (72) are respectively connected with one ends of the first connecting rod (71) and the third connecting rod (73), the tail ends of the first connecting rod (71) and the third connecting rod (73) are connected with the clamp main body (1), and the external power supply (6) is detachably mounted on the outer side of the second connecting rod (72).
7. The electronic heat dissipation disc brake system of claim 2, wherein: the connecting piece is a mounting bolt (8) which penetrates through the heat conduction shell (4) and is in threaded connection with the back plate (3).
8. A bicycle, its characterized in that: the electronic heat dissipation disc brake system comprises a bicycle body and the electronic heat dissipation disc brake system according to any one of claims 1 to 7, wherein the electronic heat dissipation disc brake system is installed on the bicycle body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221391555.XU CN217481814U (en) | 2022-05-27 | 2022-05-27 | Electronic heat dissipation disc brake system and bicycle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221391555.XU CN217481814U (en) | 2022-05-27 | 2022-05-27 | Electronic heat dissipation disc brake system and bicycle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217481814U true CN217481814U (en) | 2022-09-23 |
Family
ID=83312645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221391555.XU Active CN217481814U (en) | 2022-05-27 | 2022-05-27 | Electronic heat dissipation disc brake system and bicycle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217481814U (en) |
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2022
- 2022-05-27 CN CN202221391555.XU patent/CN217481814U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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Address after: 519000 building B-2, No. 8, Honghui fifth road, Shuanglin District, LIANGANG Industrial Zone, Jinwan District, Zhuhai City, Guangdong Province Patentee after: Zhuhai Blueprint Sports Technology Co.,Ltd. Address before: 519000 building B-2, No. 8, Honghui fifth road, Shuanglin District, LIANGANG Industrial Zone, Jinwan District, Zhuhai City, Guangdong Province Patentee before: ZHUHAI LTWOO CONTROLLER TECHNOLOGY CO.,LTD. |