CN220956552U - Brake cooling mechanism - Google Patents
Brake cooling mechanism Download PDFInfo
- Publication number
- CN220956552U CN220956552U CN202323119152.7U CN202323119152U CN220956552U CN 220956552 U CN220956552 U CN 220956552U CN 202323119152 U CN202323119152 U CN 202323119152U CN 220956552 U CN220956552 U CN 220956552U
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- China
- Prior art keywords
- arc
- brake
- shaped cover
- cooling mechanism
- semiconductor refrigeration
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- 238000001816 cooling Methods 0.000 title claims abstract description 36
- 239000004065 semiconductor Substances 0.000 claims abstract description 43
- 238000005057 refrigeration Methods 0.000 claims abstract description 42
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 239000000110 cooling liquid Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 230000005611 electricity Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- 210000003205 muscle Anatomy 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of brake accessories, in particular to a brake cooling mechanism. The utility model provides a brake cooling mechanism, which solves the technical problem that a heat dissipation structure of a brake in the prior art is poor in heat dissipation performance. A brake cooling mechanism comprising a brake disc and a brake for braking the brake disc; the brake disc is annular, the brake comprises an arc-shaped cover covered on the brake disc, the arc-shaped cover is provided with a brake pad, and the arc-shaped cover is provided with a cooling assembly; through setting up the semiconductor refrigeration pipe, can produce refrigeration effect after the semiconductor refrigeration pipe gets electricity to dispel the heat effectively to the arc cover, thereby improved the radiating efficiency of stopper, and the stability of stopper. The heat dissipation ribs play a role in natural heat dissipation, and after heat generated by the brake block is absorbed by the arc cover, the heat dissipation ribs can rapidly dissipate heat absorbed by the arc cover, so that the heat dissipation performance of the brake is further improved.
Description
Technical Field
The utility model relates to the technical field of brake accessories, in particular to a brake cooling mechanism.
Background
The automobile brake is a brake device of an automobile, and brakes used for the automobile are almost all friction type and can be divided into two main types, namely drum type and disc type. The rotary element in the friction pair of the drum brake is a brake drum, and the working surface of the rotary element is a cylindrical surface; the rotating element of the disc brake is then a rotating brake disc, the working surface of which is an end surface.
In actual use, the automobile brake generates a large amount of heat during friction braking, so that the brake needs to be cooled to reduce the temperature of the brake and improve the braking performance of the brake.
However, in the prior art, the brake generally uses a heat sink to dissipate heat, and the heat dissipation mode has a certain heat dissipation effect, but the heat dissipation effect of the heat dissipation mode is poor, so that the brake requiring frequent braking cannot be satisfied.
Therefore, the brake heat dissipation structure in the prior art has the technical problem of poor heat dissipation performance.
Disclosure of Invention
The utility model provides a brake cooling mechanism, which solves the technical problem that a heat dissipation structure of a brake in the prior art is poor in heat dissipation performance.
Some embodiments employed to solve the above technical problems include:
a brake cooling mechanism comprising a brake disc and a brake for braking the brake disc;
The brake disc is annular, the brake comprises an arc-shaped cover covered on the brake disc, the arc-shaped cover is provided with a brake pad, and the arc-shaped cover is provided with a cooling assembly;
The cooling assembly comprises semiconductor refrigeration pipes, the semiconductor refrigeration pipes are uniformly distributed on the outer surface of the arc-shaped cover, the arc-shaped cover is further provided with a controller for controlling the semiconductor refrigeration pipes to work, the arc-shaped cover is provided with a temperature sensor for detecting the temperature of the arc-shaped cover, and the temperature sensor is in communication connection with the controller;
The arc-shaped cover is provided with radiating ribs, and the radiating ribs protrude out of the outer wall of the arc-shaped cover.
Preferably, the heat dissipation ribs and the arc-shaped cover are of an integrated structure, a containing groove for containing the semiconductor refrigeration tube is formed between two adjacent heat dissipation ribs, and the semiconductor refrigeration tube is installed in the containing groove.
Preferably, the heat dissipation ribs are arranged in an arc shape, and the axes of the heat dissipation ribs are coaxial with the axes of the arc-shaped cover.
Preferably, the height of the radiating ribs protruding out of the arc-shaped cover is larger than the diameter of the circumcircle of the semiconductor refrigeration tube.
Preferably, the semiconductor refrigeration tube is adhered in the accommodating groove through heat-conducting glue.
Preferably, the controller is mounted on the arc-shaped cover through a mounting frame, the controller is fixed on the mounting frame through screws, and the temperature sensor is fixed on the mounting frame through threads.
Preferably, the mounting frame and the arc-shaped cover are of an integrated structure, or the mounting frame is welded to the arc-shaped cover.
Preferably, a sealed accommodating space is arranged in the arc-shaped cover, and cooling liquid is filled in the accommodating space.
Preferably, the brake pad is projected forward toward the arc-shaped cover, and the projection of the brake pad on the arc-shaped cover is completely positioned in the accommodating space.
Preferably, the thickness of the accommodating space is not more than 1/3 of the thickness of the arc-shaped cover.
Compared with the prior art, the utility model has the following advantages:
1. through setting up the semiconductor refrigeration pipe, can produce refrigeration effect after the semiconductor refrigeration pipe gets electricity to dispel the heat effectively to the arc cover, thereby improved the radiating efficiency of stopper, and the stability of stopper.
2. Through setting up the heat dissipation muscle, the heat dissipation muscle plays natural heat dissipation's function, and the heat that the brake block produced is absorbed the back by the arc cover, and the heat dissipation muscle can be rapidly with the heat energy of arc cover absorption give off to further improved the heat dispersion of stopper.
3. By arranging the controller and the temperature sensor, the semiconductor refrigeration tube automatically works or stops, and the electricity consumption of the brake cooling mechanism is saved. Meanwhile, compared with other circulating refrigeration schemes, the semiconductor refrigeration tube has the advantage of small occupied space, and is particularly suitable for brakes with small installation space such as automobiles.
Drawings
For purposes of explanation, several embodiments of the present technology are set forth in the following figures. The following drawings are incorporated herein and constitute a part of this detailed description. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring the concepts of the subject technology.
Fig. 1 is a schematic view of the internal structure of the present utility model.
Fig. 2 is a schematic view of a first angle of the present utility model.
FIG. 3 is a schematic view of a second angle of the present utility model.
Fig. 4 is a schematic view of an arcuate shroud.
FIG. 5 is a schematic view of the mounting position of the controller on the mounting frame.
Fig. 6 is a schematic view of a semiconductor refrigeration tube.
In the figure:
1. a brake disc.
2. The semiconductor cooling device comprises an arc-shaped cover 21, a brake block 22, a semiconductor cooling tube 23, a controller 231, a temperature sensor 24, a heat radiation rib 241, a containing groove 25, a mounting frame 26 and a containing space.
Description of the embodiments
The specific embodiments illustrated below are intended as descriptions of various configurations of the subject technology and are not intended to represent the only configurations in which the subject technology may be practiced. Particular embodiments include specific details for the purpose of providing a thorough understanding of the subject technology. It will be clear and apparent, however, to one skilled in the art that the subject technology is not limited to the specific details shown herein and may be practiced without these specific details.
Referring to fig. 1 to 6, a brake cooling mechanism includes a brake disc 1 and a brake for braking the brake disc 1;
The brake disc 1 is annular, the brake comprises an arc-shaped cover 2 covered on the brake disc 1, the arc-shaped cover 2 is provided with a brake block 21, and the arc-shaped cover 2 is provided with a cooling assembly;
The cooling assembly comprises semiconductor refrigeration pipes 22, the semiconductor refrigeration pipes 22 are uniformly distributed on the outer surface of the arc-shaped cover 2, the arc-shaped cover 2 is further provided with a controller 23 for controlling the semiconductor refrigeration pipes 22 to work, the arc-shaped cover 2 is provided with a temperature sensor 231 for detecting the temperature of the arc-shaped cover 2, and the temperature sensor 231 is in communication connection with the controller 23;
The arc-shaped cover 2 is provided with radiating ribs 24, and the radiating ribs 24 protrude out of the outer wall of the arc-shaped cover 2.
The brake disc 1 is typically mounted to a wheel, and the brake disc 1 rotates with the wheel. The brake pads 21 are controlled to operate by a brake system of the automobile, and when braking is required, the brake pads 21 contact the brake disc 1 to generate friction, thereby braking the brake disc 1.
The installation space of the automobile is very limited, so that the installation space of the cooling assembly is more limited, and the cooling assembly is not allowed to be oversized to occupy the space of the automobile.
The semiconductor refrigeration tube 22 is adopted for cooling, and only the semiconductor refrigeration tube 22 is required to be electrified with current, so that the semiconductor refrigeration tube 22 can be refrigerated, and the cooling assembly is smaller in volume.
Both the controller 23 and the temperature sensor 231 are electronic components common in the art, and both the controller 23 and the temperature sensor 231 can communicate with the brake system of the automobile.
Referring to fig. 1 to 6, in some embodiments, the heat dissipating ribs 24 and the arc-shaped cover 2 are integrally formed, and a receiving groove 241 for receiving the semiconductor cooling tube 22 is formed between two adjacent heat dissipating ribs 24, and the semiconductor cooling tube 22 is mounted in the receiving groove 241.
An accommodating groove 241 is formed between two adjacent heat dissipation ribs 24, the accommodating groove 241 is used for accommodating the semiconductor refrigeration tube 22, the semiconductor refrigeration tube 22 is located in the accommodating groove 241, and the semiconductor refrigeration tube 22 is not easy to damage. Meanwhile, the semiconductor refrigeration tube 22 is located in the accommodating groove 241, and the semiconductor refrigeration tube 22 and the arc-shaped cover 2 have larger contact area, so that heat exchange can be performed more efficiently, and the cooling effect of the semiconductor refrigeration tube 22 is further improved.
The heat dissipation ribs 24 are arranged in an arc shape, and the axis of the heat dissipation ribs 24 is coaxial with the axis of the arc-shaped cover 2.
The height of the heat dissipation ribs 24 protruding out of the arc-shaped cover 2 is larger than the diameter of the circumcircle of the semiconductor refrigeration tube 22.
The semiconductor refrigeration tube 22 is adhered to the inside of the receiving groove 241 by a heat-conductive adhesive. The semiconductor refrigeration tube 22 is adhered in the accommodating groove 241 by adopting the heat-conducting glue, and the heat-conducting glue enables the semiconductor refrigeration tube 22 to have larger contact area with the arc-shaped cover 2 and the heat dissipation ribs 24, so that the arc-shaped cover 2 and the heat dissipation ribs 24 can rapidly complete heat exchange with the semiconductor refrigeration tube 22.
In some embodiments, the controller 23 is mounted to the arc-shaped cover 2 through a mounting bracket 25, the controller 23 is fixed to the mounting bracket 25 through screws, and the temperature sensor 231 is fixed to the mounting bracket 25 through screws.
The mounting frame 25 and the arc-shaped cover 2 are of an integrated structure, or the mounting frame 25 is welded to the arc-shaped cover 2.
The controller 23 may be mounted at other locations of the automobile, and when the temperature sensor 231 is a non-contact sensor, the temperature sensor 231 may be mounted at other locations of the automobile. The mounting manner of the controller 23 and the temperature sensor 231 is not limited and may be freely selected.
In some embodiments, a sealed accommodating space 26 is provided in the arc-shaped cover 2, and the accommodating space 26 is filled with a cooling liquid.
The semiconductor refrigeration pipe 22 and the heat dissipation ribs 24 are in local contact with the arc-shaped cover 2, the arc-shaped cover 2 possibly has the problem of uneven heat dissipation, the accommodating space 26 is arranged, cooling liquid is filled in the accommodating space 26, the cooling liquid has the function of transitional medium, and the cooling liquid can uniformly disperse heat to the part forming the accommodating space 26, so that the whole heat of the arc-shaped cover 2 is uniform, and the performance reduction caused by overhigh local temperature of the arc-shaped cover 2 is prevented.
The cooling liquid can be any liquid medium with heat conduction capability.
The brake pad 21 is projected forward toward the arc-shaped cover 2, and the projection of the brake pad 21 on the arc-shaped cover 2 is completely positioned in the accommodating space 26.
The thickness of the accommodating space 26 is not more than 1/3 of the thickness of the arc-shaped cover 2. The arc-shaped cover 2 plays a role in positioning the brake block 21, the arc-shaped cover 2 has certain strength, and the strength of the arc-shaped cover 2 can be reduced by the arrangement of the accommodating space 26, so that the smaller the thickness of the accommodating space 26 is, the smaller the influence on the strength of the arc-shaped cover 2 is.
The cooling liquid only has the function of transition heat, so that the cooling liquid is not needed excessively, and the accommodating space 26 can be provided with a smaller thickness, so that the influence of the accommodating space 26 on the strength of the arc-shaped cover 2 is reduced.
While the foregoing has been presented with a specific embodiment of the subject matter and with corresponding details, it should be understood that the foregoing description is only a few embodiments of the subject matter and that some details may be omitted when the embodiments are particularly implemented.
In addition, in some embodiments of the above utility model, there are many embodiments that can be implemented in combination, and the various combinations are not listed here. The above embodiments may be freely combined and implemented by those skilled in the art in specific implementation according to requirements, so as to obtain a better application experience.
When implementing the subject matter technical scheme, the person skilled in the art can obtain other detail configurations or drawings according to the subject matter technical scheme and the drawings, and obviously, the details still belong to the scope covered by the subject matter technical scheme without departing from the subject matter technical scheme.
Claims (10)
1. A brake cooling mechanism, characterized by: comprises a brake disc (1) and a brake for braking the brake disc (1); the brake disc (1) is annular, the brake comprises an arc-shaped cover (2) covered on the brake disc (1), the arc-shaped cover (2) is provided with a brake block (21), and the arc-shaped cover (2) is provided with a cooling assembly; the cooling assembly comprises semiconductor refrigeration pipes (22), the semiconductor refrigeration pipes (22) are uniformly distributed on the outer surface of the arc-shaped cover (2), the arc-shaped cover (2) is further provided with a controller (23) for controlling the semiconductor refrigeration pipes (22) to work, the arc-shaped cover (2) is provided with a temperature sensor (231) for detecting the temperature of the arc-shaped cover (2), and the temperature sensor (231) is in communication connection with the controller (23); the arc-shaped cover (2) is provided with radiating ribs (24), and the radiating ribs (24) protrude out of the outer wall of the arc-shaped cover (2).
2. The brake cooling mechanism of claim 1, wherein: the heat dissipation ribs (24) and the arc-shaped cover (2) are of an integrated structure, a containing groove (241) for containing the semiconductor refrigeration tube (22) is formed between two adjacent heat dissipation ribs (24), and the semiconductor refrigeration tube (22) is installed in the containing groove (241).
3. The brake cooling mechanism of claim 2, wherein: the radiating ribs (24) are arranged in an arc shape, and the axis of the radiating ribs (24) is coaxial with the axis of the arc-shaped cover (2).
4. A brake cooling mechanism according to claim 3, wherein: the height of the radiating ribs (24) protruding out of the arc-shaped cover (2) is larger than the diameter of the circumcircle of the semiconductor refrigeration tube (22).
5. The brake cooling mechanism of claim 4, wherein: the semiconductor refrigeration tube (22) is adhered in the accommodating groove (241) through heat-conducting glue.
6. The brake cooling mechanism of claim 1, wherein: the controller (23) is installed in the arc-shaped cover (2) through a mounting frame (25), the controller (23) is fixed to the mounting frame (25) through screws, and the temperature sensor (231) is fixed to the mounting frame (25) through threads.
7. The brake cooling mechanism of claim 6, wherein: the mounting frame (25) and the arc-shaped cover (2) are of an integrated structure, or the mounting frame (25) is welded to the arc-shaped cover (2).
8. The brake cooling mechanism of claim 1, wherein: a sealed accommodating space (26) is arranged in the arc-shaped cover (2), and cooling liquid is filled in the accommodating space (26).
9. The brake cooling mechanism of claim 8, wherein: the brake block (21) makes orthographic projection to the arc-shaped cover (2), and orthographic projection of the brake block (21) on the arc-shaped cover (2) is completely positioned in the accommodating space (26).
10. The brake cooling mechanism of claim 9, wherein: the thickness of the accommodating space (26) is not more than 1/3 of the thickness of the arc-shaped cover (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323119152.7U CN220956552U (en) | 2023-11-20 | 2023-11-20 | Brake cooling mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323119152.7U CN220956552U (en) | 2023-11-20 | 2023-11-20 | Brake cooling mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220956552U true CN220956552U (en) | 2024-05-14 |
Family
ID=90973889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323119152.7U Active CN220956552U (en) | 2023-11-20 | 2023-11-20 | Brake cooling mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220956552U (en) |
-
2023
- 2023-11-20 CN CN202323119152.7U patent/CN220956552U/en active Active
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