CN217470405U - Glass base Mini LED circuit board tool - Google Patents
Glass base Mini LED circuit board tool Download PDFInfo
- Publication number
- CN217470405U CN217470405U CN202221232470.7U CN202221232470U CN217470405U CN 217470405 U CN217470405 U CN 217470405U CN 202221232470 U CN202221232470 U CN 202221232470U CN 217470405 U CN217470405 U CN 217470405U
- Authority
- CN
- China
- Prior art keywords
- support plate
- glass substrate
- supporting plate
- circuit board
- bonding layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011521 glass Substances 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 6
- 239000010959 steel Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011324 bead Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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Abstract
The utility model discloses a glass-based Mini LED circuit board jig, which belongs to the technical field of circuit board jigs and comprises an upper die and a lower die which are made of steel materials, and a supporting plate component which is composed of an upper supporting plate, a bonding layer and a lower supporting plate, wherein the upper die is provided with a downward lug, the size of the lug is consistent with that of the supporting plate component, and the lug can not be pressed on a glass substrate; the upper die is provided with an exhaust hole so as to facilitate vacuum exhaust in the pressing process; the lower die steel plate is provided with an upward groove, the size of the groove is completely matched with the convex block of the upper die and is consistent with the external size of the upper support plate, the bonding layer, the lower support plate and the glass substrate after combination, so that the position matching precision of the components is ensured; the thickness of the upper supporting plate, the bonding layer and the lower supporting plate after the pressing plate is combined is consistent with that of the glass substrate, and the glass substrate and the supporting plate are bonded into a whole through the fluidity of resin in the bonding layer.
Description
Technical Field
The utility model relates to a circuit board tool, more specifically say, it relates to a glass base Mini LED circuit board tool.
Background
The Mini LED circuit board is a carrier for electrical connection of the Mini LED backlight module, the distance between the LED lamp beads is designed to be smaller and smaller along with the improvement of the definition requirement of a display screen, and the heat dissipation capacity of the LED lamp beads on the unit area is higher and higher accordingly. Glass base has better thermal diffusivity than conventional PCB substrate, and splendid surface smoothness also more is favorable to the display quality of booth apart from LED, becomes high-end Mini LED backlight unit's first choice gradually.
However, the glass substrate has the defects of brittleness and frangibility, and the situation that the glass substrate is cracked easily occurs in the production links of electroplating clamping plates, horizontal line compression roller transmission, punching forming machine positioning and the like, so that the glass substrate Mini LED circuit board product is limited to be manufactured by adopting conventional PCB production equipment.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a solve glass base Mini LED circuit board tool of the problem that the above-mentioned background art provided.
In order to achieve the above purpose, the utility model provides a following technical scheme:
a glass-based Mini LED circuit board jig comprises
A glass substrate having a plurality of glass layers,
the support plate component comprises an upper support plate, a lower support plate and a bonding layer, the upper support plate and the lower support plate are stacked and connected through the bonding layer, the glass substrate is embedded into the support plate component and bonded with the bonding layer,
a lower die comprising a groove for supporting the plate assembly,
the upper die comprises a convex block matched with the groove, the convex block is matched with the supporting plate component, and the upper die is provided with an exhaust hole communicated with the groove.
Further, the adhesive layer is made of resin.
Further, the upper die and the lower die block are both made of steel materials.
Furthermore, the size of the upper supporting plate is the same as that of the lower supporting plate.
Further, the groove is attached to the support plate assembly.
Furthermore, the upper surface of glass substrate and the top surface parallel and level of last backup pad, the lower surface of glass substrate and the bottom surface parallel and level of lower backup pad.
By adopting the technical scheme, the beneficial effects of the utility model are that:
the jig has the characteristics of simple structural design, low manufacturing cost and the like; by adopting the jig, the fragile production problem of the glass substrate is solved, the glass substrate product can be manufactured on the conventional PCB production line, the investment of expensive customized glass substrate equipment is avoided, and good quality benefit and economic benefit are achieved.
Drawings
Fig. 1 is a schematic sectional structure diagram of an embodiment of the present invention.
Detailed Description
The embodiment of the present invention will be further explained with reference to fig. 1.
The utility model discloses a concrete implementation scheme:
a glass-based Mini LED circuit board jig comprises an upper die 1 and a lower die 2 which are made of steel materials, and a supporting plate assembly 3 which is composed of an upper supporting plate 31, a bonding layer 32 and a lower supporting plate 33, wherein a downward convex block 11 is designed on the upper die 1, the size of the convex block 11 is consistent with that of the supporting plate assembly 3, and the convex block cannot be pressed on a glass substrate 4; the upper die 1 is provided with an exhaust hole 101 so as to facilitate vacuum exhaust in the pressing process;
the steel plate of the lower die 2 is designed with an upward groove 201, the size of the groove 201 is completely matched with the bump 11 of the upper die 1, and the groove is consistent with the external dimensions of the upper support plate 31, the bonding layer 32, the lower support plate 33 and the glass substrate 4 after combination, so as to ensure the position matching precision of the components.
The thickness of the upper support plate 31, the bonding layer 32 and the lower support plate 33 after the pressing plate is combined is consistent with that of the glass substrate 4, and the glass substrate 4 and the support plates are bonded into a whole through the fluidity of resin in the bonding layer 32.
After the combination shown in the attached figure 1 is completed, a PCB production vacuum press is adopted for pressing, and demoulding is carried out after the pressing is completed, so that the glass substrate 4 with the supporting plate is obtained. The performance of the support plate is consistent with that of a conventional PCB, and the glass substrate 4 cannot be cracked due to the reasons of clamping plate edges, pressing plate edges and the like.
The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and the skilled in the art can carry out the common changes and replacements within the technical solution of the present invention.
Claims (6)
1. A glass-based Mini LED circuit board jig is characterized by comprising
A glass substrate having a plurality of glass layers,
the support plate component comprises an upper support plate, a lower support plate and a bonding layer, the upper support plate and the lower support plate are stacked and connected through the bonding layer, the glass substrate is embedded into the support plate component and bonded with the bonding layer,
a lower die comprising a groove for supporting the plate assembly,
the upper die comprises a convex block matched with the groove, the convex block is matched with the supporting plate component, and the upper die is provided with an exhaust hole communicated with the groove.
2. The glass-based Mini LED circuit board fixture of claim 1, wherein the adhesive layer is made of resin.
3. The jig for glass-based Mini LED circuit boards of claim 1 or 2, wherein the upper mold and the lower mold are both made of steel material.
4. The jig of claim 3, wherein the upper support plate and the lower support plate are the same size.
5. The glass-based Mini LED circuit board fixture of claim 4, wherein the recess is attached to the support plate assembly.
6. The jig of claim 5, wherein the upper surface of the glass substrate is flush with the top surface of the upper support plate, and the lower surface of the glass substrate is flush with the bottom surface of the lower support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221232470.7U CN217470405U (en) | 2022-05-18 | 2022-05-18 | Glass base Mini LED circuit board tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221232470.7U CN217470405U (en) | 2022-05-18 | 2022-05-18 | Glass base Mini LED circuit board tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217470405U true CN217470405U (en) | 2022-09-20 |
Family
ID=83274725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221232470.7U Active CN217470405U (en) | 2022-05-18 | 2022-05-18 | Glass base Mini LED circuit board tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217470405U (en) |
-
2022
- 2022-05-18 CN CN202221232470.7U patent/CN217470405U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A glass based Mini LED circuit board fixture Granted publication date: 20220920 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2024330000090 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |