CN217470385U - Compatible sensor circuit board and circuit thereof - Google Patents
Compatible sensor circuit board and circuit thereof Download PDFInfo
- Publication number
- CN217470385U CN217470385U CN202220745034.3U CN202220745034U CN217470385U CN 217470385 U CN217470385 U CN 217470385U CN 202220745034 U CN202220745034 U CN 202220745034U CN 217470385 U CN217470385 U CN 217470385U
- Authority
- CN
- China
- Prior art keywords
- pad
- sensor
- pads
- pad group
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Pressure Sensors (AREA)
Abstract
The utility model relates to a compatible sensor circuit board and circuit thereof. The circuit board comprises a sensor pad group for welding the sensor; the device pad group is used for welding a peripheral circuit of the sensor and the sensor pad group; the signal pad group is used for welding a control end of the sensor and the sensor pad group; the sensor pad group is connected with the sensor, the device pad group is connected with the sensor pad group through a zero ohm resistor, the device pad group is further connected with the peripheral circuit, the signal pad group is connected with the sensor pad group through a zero ohm resistor, and the signal pad group is further connected with the control end. When a channel between the device pad group and the sensor pad group and a channel between the signal pad group and the sensor pad group are needed, two pads of the corresponding channel are bridged through a zero ohm resistor; the pin functions of the sensors under different pin definitions can be switched through one circuit board, and the sensors with the same number of pins and different pin definitions can be adapted.
Description
Technical Field
The utility model relates to a sensor technical field, in particular to compatible sensor circuit board and circuit thereof.
Background
The sensor is a detection device which can sense the measured information and convert the sensed information into an electric signal or other information in a required form according to a certain rule to output, so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like. Because of its characteristics of miniaturization, digitalization, intellectualization, multifunctionalization, systematization, networking and the like, it is widely used in various fields.
With the development of sensor applications, sensor manufacturers are increasing. For sensors with the same pin number (pin number for short), each manufacturer sets a set of pin definitions on the sensor chip produced by the manufacturer, that is, defines the functions of the pins with each serial number (pin number for short). The user connects the electronic component through the pin definition of pin order, carries out circuit design, and then realizes the function that the sensor corresponds. However, the current sensor manufacturers are more, the pin sequence is the same for the sensors of different manufacturers, and the functions of the sensors may be different. Each manufacturer defines pins under a pin sequence set by the manufacturer, the pins cannot be unified, and in the sensor circuit design with the same pin number and different pin definitions, a user needs to manufacture different PCBs (printed circuit boards), so that resource waste is easily caused, and the design efficiency of the sensor is also influenced.
Therefore, it is a problem to be solved urgently to design a sensor circuit board compatible with different pin definitions.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model aims to solve the technical problem that how compatible pin of sensor circuit board defines different sensors to resources are saved improves the design efficiency of sensor.
In order to solve the technical problem, the utility model provides a compatible sensor circuit board, include:
the sensor pad group is used for welding the sensor;
the device pad group is used for welding a peripheral circuit of the sensor and the sensor pad group;
the signal pad group is used for welding the control end of the sensor and the sensor pad group;
the sensor pad group is connected with the sensor, the device pad group is connected with the sensor pad group through a zero ohm resistor, the device pad group is further connected with the peripheral circuit, the signal pad group is connected with the sensor pad group through a zero ohm resistor, and the signal pad group is further connected with the control end.
Preferably, in the compatible sensor circuit board, the total number of pads in the sensor pad group is the same as the number of pins of the sensor.
Preferably, in the compatible sensor circuit board, the sensor pad set includes:
l ground pads;
m power pads; and
n input signal pads; wherein L, M and N are both positive integers;
the L grounding bonding pads, the M power bonding pads and the N input signal bonding pads are all connected with the sensor, the L grounding bonding pads are also all connected with the device bonding pad group through zero ohm resistors, the M power bonding pads are also all connected with the device bonding pad group through zero ohm resistors, and the N input signal bonding pads are also all connected with the signal bonding pad group through zero ohm resistors.
Preferably, in the compatible sensor circuit board, the device pad set includes:
k first pad groups; and
k second pad groups; wherein K is L + M + N;
any L first welding pad groups in the K first welding pad groups are connected with a grounding end in the peripheral circuit and are correspondingly connected with the L grounding welding pads one by one through zero ohm resistors, and the rest K-L first welding pad groups are not welded;
and any M second welding pad groups in the K second welding pad groups are connected with a power supply end in the peripheral circuit and are correspondingly connected with the M power supply welding pads one by one through zero ohm resistors, and the rest K-M second welding pad groups are not welded.
Preferably, in the compatible sensor circuit board, each of the first pad groups includes:
l first resistance pads;
in any first pad group connected with the corresponding grounding pad, any first resistance pad in the L first resistance pads is connected with a grounding end in the peripheral circuit and is connected with the corresponding grounding pad through a zero ohm resistor, and the rest L-1 first resistance pads are not welded.
Preferably, in the compatible sensor circuit board, each of the second pad groups includes:
m second resistance pads;
a third resistor pad; and
a fourth resistor pad;
in any one of the second pad groups connected with the corresponding power supply pad, any one of the M second resistance pads is connected with a power supply end in the peripheral circuit and is connected with the corresponding third resistance pad through a zero ohm resistor, and the rest M-1 second resistance pads are not welded; the third resistance pad is further connected with the corresponding fourth resistance pad through a zero ohm resistor, and the fourth resistance pad is further connected with the corresponding power supply pad through a zero ohm resistor.
Preferably, in the compatible sensor circuit board, the signal pad set includes:
k control signal pads;
the K control signal bonding pads are connected with the control end; and any N control signal bonding pads in the K control signal bonding pads are correspondingly connected with the N input signal bonding pads in the sensor bonding pad group through zero ohm resistors, and the rest K-N control signal bonding pads are not welded.
Preferably, in the compatible sensor circuit board, the control signal pad is specifically an FPGA signal pad.
Furthermore, the utility model discloses still provide a compatible sensor circuit, including the sensor, still include:
a controller;
a power supply connected to the controller; and
the compatible sensor circuit board is connected with the controller, the sensor and the power supply.
Preferably, in the above compatibility sensor circuit, the controller includes:
the central processing unit is connected with the power supply; and
and the programmable logic device is connected with the central processing unit, the compatible sensor circuit board and the power supply.
The technical scheme provided by the utility model, following advantage has:
the utility model provides a compatible sensor circuit board and circuit thereof, sensor pad group welding sensor, and peripheral circuit and sensor pad group of device pad group welding sensor can loop through device pad group and sensor pad group, transmit the electric signal (including power signal and ground signal) in the peripheral circuit to the sensor, guarantee that the sensor can normally work; meanwhile, the signal welding pad group is used for welding the control end of the sensor and the sensor welding pad group, and the control signal of the control end can be transmitted to the sensor group through the signal welding pad group and the sensor welding pad group in sequence, so that the signal control of each pin of the sensor is realized. Because the device bonding pad group, the sensor bonding pad group and the signal bonding pad group all comprise a plurality of bonding pads, when a channel between the device bonding pad group and the sensor bonding pad group needs to be used, two bonding pads corresponding to the channel are bridged through the zero ohm resistor; when a channel between the signal pad group and the sensor pad group is needed, two pads corresponding to the channel are bridged through a zero ohm resistor; based on the pin definition of each sensor when leaving the factory, the pin functions of the sensors defined by different pins can be switched and switched only through one circuit board or circuit according to actual conditions, so that the compatible circuit board or circuit can adapt to the sensors with the same pin number and different pin definitions, a PCB (printed circuit board) does not need to be manufactured again, resources are saved, and the design efficiency of the sensors is improved to a certain extent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained without creative efforts.
Fig. 1 is a schematic structural diagram of a compatible sensor circuit board according to a first embodiment of the present invention;
fig. 2 is a flowchart illustrating a complete structure of a circuit board of a compatible sensor according to a first embodiment of the present invention;
fig. 3 is a structural diagram of a specific implementation of a compatible sensor circuit board in the first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a compatible sensor circuit according to a second embodiment of the present invention;
fig. 5 is a schematic diagram of a complete structure of a compatible sensor circuit according to an embodiment of the present invention.
Description of reference numerals:
100. a sensor pad group;
110. a ground pad, 120, a power pad, 130, an input signal pad;
200. a device pad group;
210. a first pad group 220, a second pad group;
211. a first resistance pad, 221, a second resistance pad, 222, a third resistance pad, 223, a fourth resistance pad;
300. signal pad group, 310, control signal pad.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In the present application, where the contrary is not intended, the use of directional words such as "upper, lower, top and bottom" is generally with respect to the orientation shown in the drawings, or with respect to the component itself in the vertical, perpendicular or gravitational direction; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the invention.
In the conventional technology, each manufacturer defines the pin in the pin sequence set by the manufacturer, the pin cannot be unified, and in the sensor circuit design with the same pin number and different pin definitions, a user needs to manufacture different PCB boards, so that resource waste is easily caused, and the design efficiency of the sensor is also influenced. In order to solve the technical problem, the utility model provides a compatible sensor circuit board and circuit thereof.
The utility model provides a compatible sensor circuit board and circuit thereof is adapted to any sensor that has the same pin number. In the following embodiments, the present invention is described taking a sensor applied to 12pin as an example.
Example one
As shown in fig. 1, the present embodiment provides a compatible sensor circuit board, including:
a sensor pad group 100 for welding a sensor;
a device pad group 200 for welding a peripheral circuit of the sensor and the sensor pad group 100;
a signal pad set 300 for welding a control terminal of the sensor and the sensor pad set 100;
the sensor pad group 100 is connected with a sensor, the device pad group 200 is connected with the sensor pad group 100 through a zero ohm resistor, the device pad group 200 is further connected with a peripheral circuit, the signal pad group 300 is connected with the sensor pad group 100 through a zero ohm resistor, and the signal pad group 300 is further connected with a control end.
In the compatible sensor circuit board of this embodiment, the sensor is welded by the sensor pad group, and the peripheral circuit of the sensor and the sensor pad group are welded by the device pad group, and the electrical signal (including the power signal and the ground signal) in the peripheral circuit can be transmitted to the sensor through the device pad group and the sensor pad group in sequence, so as to ensure that the sensor can normally work; meanwhile, the signal welding pad group is used for welding the control end of the sensor and the sensor welding pad group, and the control signal of the control end can be transmitted to the sensor group through the signal welding pad group and the sensor welding pad group in sequence, so that the signal control of each pin of the sensor is realized. Because the device bonding pad group, the sensor bonding pad group and the signal bonding pad group all comprise a plurality of bonding pads, when a channel between the device bonding pad group and the sensor bonding pad group needs to be used, two bonding pads corresponding to the channel are bridged through the zero ohm resistor; when a channel between the signal pad group and the sensor pad group is needed, two pads corresponding to the channel are bridged through a zero ohm resistor; based on the pin definition of each sensor when leaving the factory, the pin functions of the sensors defined by different pins can be switched and switched only through one circuit board or circuit according to actual conditions, so that the compatible circuit board or circuit can adapt to the sensors with the same pin number and different pin definitions, a PCB (printed circuit board) does not need to be manufactured again, resources are saved, and the design efficiency of the sensors is improved to a certain extent.
Specifically, the peripheral circuit of the sensor includes:
a power supply terminal for providing a power supply signal to the sensor; and
and a ground terminal for providing a ground signal to the sensor.
When the sensor requires a plurality of power supply signals of different voltage values, the power supply terminals may respectively provide the power supply signals corresponding to the plurality of voltage values, such as VCC1, VCC2, … … and VCCM in fig. 2. When the sensor requires multiple ground signals, the ground terminals may provide a corresponding number of ground signals, such as GND1, GND2, … … and GNDL in fig. 2, respectively.
Likewise, the Control terminal of the sensor may provide multi-channel Control signals for the sensor, such as Control1, Control2, … … and Control in fig. 2.
In this embodiment, the pad groups are uniformly distributed on a PCB (printed circuit board). The sensor pad group 100 can be connected with a sensor through a lead based on a PCB; the device pad group 200 and the zero ohm resistor and the sensor pad group 100 and the zero ohm resistor can be connected with each other through a lead; similarly, the device pad set 200 and the peripheral circuit, the signal pad set 300 and the control terminal, and the signal pad set 300 and the zero ohm resistor may be connected to each other through wires.
Specifically, as shown in fig. 2, the sensor pad group 100 includes one sensor pad holder and a plurality of pads uniformly arranged on both sides of the sensor pad holder.
Preferably, the total number of pads in the sensor pad group 100 is the same as the number of pins of the sensor.
Through the sensor welding pad group with the total quantity of the welding pads, the sensor welding pad group can be better connected with the sensor, the functions of all pins of the sensor with the same pin number can be conveniently switched, and therefore the sensor with the same pin number and different pin definitions can be conveniently compatible.
Preferably, as shown in fig. 2, the sensor pad group 100 includes:
n input signal pads 130; wherein L, M and N are both positive integers;
the L ground pads 110, the M power pads 120, and the N input signal pads 130 are all connected to the sensor, the L ground pads 110 are also all connected to the device pad group 200 through zero ohm resistors, the M power pads 120 are also all connected to the device pad group 200 through zero ohm resistors, and the N input signal pads 130 are also all connected to the signal pad group 300 through zero ohm resistors.
The grounding pad is connected with the device pad group through the cross-over connection of the zero ohm resistor, and then a grounding signal in a grounding end is accessed through the device pad group and transmitted to the sensor, so that the function of a grounding pin of the sensor is realized; the L grounding welding pads can be connected with a plurality of grounding signals, so that various grounding functions of the sensor can be realized conveniently, and the number of the grounding welding pads depends on the specific design of the sensor. Similarly, the power supply bonding pad is connected with the device bonding pad group through the cross-over connection of the zero ohm resistor, and then a power supply signal in a power supply end is accessed through the device bonding pad group and transmitted to the sensor, so that the function of a power supply pin of the sensor is realized; the input signal pad is connected with the signal pad group through the cross-over connection of the zero ohm resistor, and then the control signal in the control end is accessed through the signal pad group and transmitted to the sensor, so that the function of a signal pin of the sensor is realized.
It should be noted that the L ground pads, the M power pads, and the N input signal pads in the sensor pad group mean that there are L pads capable of implementing a ground function, M pads capable of implementing a power function, and N pads capable of implementing an input signal, and specifically, it is not determined which L pads can implement a ground function, which M pads can implement a power function, and which N pads can implement an input signal function, that is, the L, M and N only limit the number of the pads of various functional types in the sensor pad group, and the function of each pad is not uniquely limited. For the sensor defined by any pin, each pad in the sensor pad group can realize a grounding function, a power supply function and an input signal function, but cannot realize multiple functions at the same time. For example, for a sensor defined by a known pin, when L pads are pads for implementing a ground function, the remaining pads can only implement a power supply function or an input signal function; when M pads are pads for realizing the power supply function, the rest pads can only realize the grounding function or the signal input function; when the N bonding pads are the bonding pads for realizing the function of inputting signals, the rest bonding pads can only realize the grounding function or the power supply function.
Specifically, the control signal accessed by the signal pad group includes, but is not limited to, a clock signal, a communication signal, an enable input signal, a close input signal, a drive signal, a reset signal and a protection signal, and the communication signal includes, but is not limited to, an I2C signal, an MIPI signal, an RS485 signal, an RS232 signal, a UART signal, a CAN signal, a USB signal and an SPI signal, depending on the chip design of the sensor.
In one embodiment, as shown in fig. 3, the number of the ground pads 110 in the sensor pad group 100 is 1 (i.e., the pad P1 in fig. 3), the number of the power pads 120 is 3 (i.e., the pads P2 to P4 in fig. 3), the number of the input signal pads 130 is 8 (i.e., the pads P5 to P12 in fig. 3), and the number of the input signal pads is 12, which is the same as the number of pins of the sensor of 12 pins.
Preferably, as shown in fig. 2, the device pad set 200 includes:
k first pad groups 210; and
k second pad groups 220; wherein K is L + M + N;
any L first pad groups 210 in the K first pad groups 210 are all connected with a grounding end in the peripheral circuit and are correspondingly connected with the L grounding pad groups 110 one by one through zero ohm resistors, and the rest K-L first pad groups 210 are not welded;
any M second bonding pad groups 220 in the K second bonding pad groups 220 are all connected with a power supply end in the peripheral circuit and are correspondingly connected with the M power supply bonding pads 120 through zero ohm resistors one by one, and the rest K-M second bonding pad groups 220 are not welded.
The total number of the grounding bonding pads, the power supply bonding pads and the input signal bonding pads in the sensor bonding pad group is L + M + N, the number of the first bonding pad group in the device bonding pad group is K-L + M + N, and the number of the first bonding pad group are the same, so that the first bonding pad group and each bonding pad of the sensor bonding pad group are arranged in a one-to-one correspondence manner, and the functions of each bonding pad in the sensor bonding pad group can be switched conveniently; since any L first welding pad groups in the K first welding pad groups are connected with the grounding end, the functions of L grounding pins of the sensor under different pin definitions can be switched randomly in each welding pad of the sensor welding pad group through the cross connection of the zero ohm resistors between any L first welding pad groups and L grounding welding pads; when any sensor needs to define which pad in a sensor pad group as a grounding pin under the definition of a pin when leaving a factory, the grounding pad realizing the grounding function is connected with the first pad group only through the cross-over of a zero ohm resistor; when L bonding pads are defined as the functions of the grounding pins, the L grounding bonding pads realizing the grounding function are respectively connected with the corresponding first bonding pad group through the zero ohm resistors.
When any L first welding pad groups in the K first welding pad groups are correspondingly connected with the L grounding welding pads one by one through zero ohm resistors, and the rest K-L first welding pad groups are not welded, the condition that the rest welding pads are not connected with the rest K-L first welding pad groups and the rest K-L first welding pad groups are not connected with a grounding end is indicated, so that the definitions of all the welding pads needing to realize the grounding function in the sensor welding pad group are uniquely determined, and the rest welding pads do not realize the grounding function.
The connection relationship and principle between the K second welding pad groups and the sensor welding pad groups are the same as the connection relationship and principle between the K first welding pad groups and the sensor welding pad groups, and the description is omitted here.
Based on the K first pad groups, the K second pad groups and the sensor pad groups, the functions of the grounding pins and the power pins of the sensors under different pin definitions can be switched by only using one compatible sensor circuit board.
In one embodiment, as shown in fig. 3, each of the first pad group 210 and the second pad group 220 in the device pad group 200 is 12 (4 of them are shown in the drawing, and the remaining 8 are not shown).
Preferably, as shown in fig. 2, each of the first pad groups 210 includes:
l first resistance pads 211;
in any first pad group 210 connected to the corresponding ground pad 110, any one first resistance pad 211 of the L first resistance pads 211 is connected to a ground terminal in a peripheral circuit and connected to the corresponding ground pad 110 through a zero ohm resistor, and the remaining L-1 first resistance pads 211 are not welded.
Because the grounding signals required to be accessed by the sensor can be in various types, such as L types, and the number of the first resistance bonding pads in each first bonding pad group is the same as that of the grounding bonding pads capable of realizing the grounding function in the sensor bonding pad group, the input of different grounding signals can be realized on the basis that any bonding pad in the sensor bonding pad group can realize the grounding pin function through the first bonding pad group consisting of the L first resistance bonding pads, and the compatibility of the whole circuit board to the sensor under different pin definitions is further improved.
Specifically, when any one pad in the sensor pad group needs to be connected to a ground signal of GND1, the ground pad that needs to realize the ground function is connected across one first resistor pad in the corresponding first pad group through a zero ohm resistor, and the first resistor pad is connected with GND1 through a conducting wire. At this time, the rest L-1 first resistance pads in the first pad group corresponding to the ground pad accessed to the GND1 are not welded, and the L-1 first resistance pads are in an unconnected state with the ground pad and the ground terminal, so that unique determination of each pad definition accessed to the ground signal is further realized, and the pin functions of the sensor under different pin definitions can be further switched and switched.
In one embodiment, as shown in fig. 3, the first resistance pads 211 in each first pad group 210 are 1 (e.g., a1, a2, A3, a4 in fig. 3). When a pin-defined sensor is known from factory, one pin of the sensor needs to be connected with a GND signal, a pad P1 corresponding to the pin in a sensor pad group needs to be connected with a ground signal GND, and the pad P1 corresponding to the pin and a first resistance pad a1 in a first pad group corresponding to the pin are connected in a bridging mode through a zero ohm resistor.
Preferably, as shown in fig. 2, each of the second pad groups 220 includes:
m second resistance pads 221;
a third resistor pad 222; and
a fourth resistance pad 223;
in any one of the second pad groups 220 connected to the corresponding power pad 120, any one of the M second resistance pads 221 is connected to a power source terminal in a peripheral circuit and connected to a corresponding third resistance pad 222 through a zero ohm resistor, and the remaining M-1 second resistance pads 221 are not welded; the third resistor pad 222 is also connected to a corresponding fourth resistor pad 223 through a zero ohm resistor, and the fourth resistor pad 223 is also connected to a corresponding power pad 120 through a zero ohm resistor.
The same principle as that of a ground signal required to be accessed by the sensor, the power signals required to be accessed by the sensor may be multiple, for example, M, and the number of the second resistance pads in each second pad group is also the same as that of the power pads capable of realizing the power function in the sensor pad group.
Specifically, when any one pad in the sensor pad group needs to access a ground signal of VCC1, the zero ohm resistor is used to bridge the power supply pad that needs to realize the power supply function with the fourth resistor pad in the corresponding second pad group, the zero ohm resistor is used to bridge the fourth resistor pad with the third resistor pad in the corresponding second pad group, and finally the zero ohm resistor is used to bridge the third resistor pad with one second resistor pad in the corresponding second pad group, and the second resistor pad is connected with VCC1 through a lead. At this time, all the other M-1 second resistance pads in the second pad group corresponding to the power pad accessed to the VCC1 are not welded, and the M-1 second resistance pads and the third resistance pad and the power supply end are in an unconnected state, so that unique determination of each pad definition accessed to the power signal is further realized, and the transfer and switching of the pin functions of the sensor under different pin definitions can be further realized.
In one embodiment, as shown in fig. 3, the number of the second resistor pads 221 in each second pad group 220 is 3 (e.g., B11-B13, B21-B23, B31-B33, and B41-B43 in fig. 3), so that each pad of the sensor pad group can receive power signals with three voltage values, i.e., 1.5V, 1.8V, and 2.8V, respectively, and the corresponding power signals are respectively denoted as VCC _1V5, VCC _1V8, and VCC _2V 8. When a pin-defined sensor is known when leaving a factory, and a pin of the pin needs to access a VCC _1V5 signal, a pad P2 corresponding to the pin in a sensor pad group needs to access a VCC _1V5 signal, the pad P2 corresponding to the pin and a fourth resistor pad D2 in a second pad group corresponding to the pin are bridged through a zero ohm resistor, the fourth resistor pad D2 and a corresponding third resistor pad C2 are bridged through the zero ohm resistor, and the third resistor pad C2 and a second resistor pad B21 connected with the VCC _1V5 signal are bridged through the zero ohm resistor; the access procedure of the VCC _1V8 signal and VCC _2V8 signal is the same, and is not described herein again.
Preferably, as shown in fig. 2, the signal pad set 300 includes:
k control signal pads 310;
the K control signal pads 310 are all connected with the control end; any N control signal bonding pads 310 in the K control signal bonding pads 310 are correspondingly connected with the N input signal bonding pads 130 in the sensor bonding pad group 100 through zero ohm resistors one by one, and the rest K-N control signal bonding pads 310 are not welded.
In the signal pad group consisting of the K control signal pads, the number of the pads is the same as the total number of the pads in the sensor pad group, and the signal pad group and each pad of the sensor pad group are also arranged in a one-to-one correspondence manner, so that any pad in the sensor pad group can realize the function of an input signal pin; and because K control signal pads are all connected with the control end, the functions of N signal pins of the sensor under different pin definitions can be switched randomly in each pad of the sensor pad group through the one-to-one corresponding bridging of the zero ohm resistors between any N control signal pads and N input signal pads, and the compatibility of the whole circuit board to the sensors under different pin definitions is improved.
When any sensor needs to define which pad in a sensor pad group as the function of an input signal pin under the definition of a pin when leaving a factory, the input signal pad realizing the input signal function is connected with the signal pad group only through the cross-over of a zero ohm resistor; when the Control1 Control signal is required to be introduced, the input signal bonding pad is bridged with the Control signal bonding pad accessed with the Control1 Control signal; when N pads are required to be defined as the functions of the input signal pins, the N input signal pads for realizing the input signal functions are connected with the corresponding control signal pads in a bridging mode through the zero ohm resistors.
When any N control signal bonding pads are correspondingly connected with the N input signal bonding pads 130 through the zero ohm resistors one by one, and the rest K-N control signal bonding pads are not welded, it is indicated that the rest bonding pads in the sensor bonding pad group and the rest K-N control signal bonding pads are in an unconnected state, so that the definitions of all bonding pads needing to realize the input signal function in the sensor bonding pad group are uniquely determined, and the rest bonding pads do not realize the input signal function.
In one embodiment, as shown in fig. 3, the number of Control signal pads 310 in the signal pad group 300 is 12 (i.e., E1-E12 in fig. 3), and the number of pads that can implement the function of input signals in the sensor pad group is 8 (e.g., P5-P12 in fig. 3), so that each pad of the sensor pad group can access 8 Control signals, specifically, any 8 Control signals of Control1, Control2, … …, and Control 12. When a pin-defined sensor is known when leaving a factory, and a Control5 Control signal needs to be accessed to one pin, a Control5 Control signal needs to be accessed to a pad P5 corresponding to the pin in a sensor pad group, and the pad P5 corresponding to the pin and a Control signal pad E5 accessed to the Control signal of the Control5 are bridged through a zero ohm resistor; the access process of the other control signals is the same, and is not described herein again.
According to the connection mode of fig. 3, the pin connecting the sensor and the P1 pad is defined as a ground pin, the pin connecting the sensor and the P2 is defined as a 1.5V power supply pin, the pin connecting the sensor and the P3 is defined as a 1.8V power supply pin, the pin connecting the sensor and the P4 is defined as a 2.8V power supply pin, and 8 pins connecting the sensor and the P5 to P12 are defined as input signal pins.
It should be noted that fig. 2 and fig. 3 only show the connection relationship between the components, and do not limit the specific positions of the components, and the specific positions of the components may all be arranged according to actual situations.
Specifically, the control signal pads 310 are specifically FPGA signal pads.
Through the FPGA signal pad, FPGA control signals can be accessed, and through the control signals, the switching of the pin functions of different pin definition sensors can be better realized, and the compatibility of the circuit board to the sensors is ensured.
Specifically, in this embodiment, all the first pad groups and all the second pad groups are uniformly arranged on both sides of the PCB.
The PCB is provided with a top layer and a bottom layer, and all the first pad groups and all the second pad groups are uniformly distributed on the top layer and the bottom layer of the PCB, so that the layout of the whole PCB can be optimized, and the circuit board resources are saved.
In a specific embodiment, a first bonding pad group and a second bonding pad group corresponding to a first bonding pad in a sensor bonding pad group, and a first bonding pad group and a second bonding pad group corresponding to a second bonding pad are arranged on a top layer of a PCB (printed circuit board); arranging a first pad group and a second pad group corresponding to a third pad and a first pad group and a second pad group corresponding to a fourth pad in the sensor pad group on a bottom layer of the PCB; and then arranging a first bonding pad group and a second bonding pad group corresponding to a fifth bonding pad in the sensor bonding pad group, and a first bonding pad group and a second bonding pad group corresponding to a sixth bonding pad in a top layer of the PCB, … … and so on. By the layout mode, the layout of the circuit board can be optimized, and resources are saved. Of course, the present embodiment may also adopt other reasonable layout manners to uniformly arrange all the first pad groups and all the second pad groups on the top layer and the bottom layer of the PCB, so that the layout of the PCB is optimized, which is not specifically listed here.
Example two
As shown in fig. 4, the present embodiment provides a compatibility sensor circuit, which includes a sensor, and further includes:
a controller;
the power supply is connected with the controller; and
the compatible sensor circuit board in the first embodiment is connected to the controller, the sensor and the power supply.
Through above-mentioned circuit, can be according to actual conditions, the pin function to the sensor under the different pin definitions switches over and switches, can the adaptation pin number the same and the different sensor of pin definition, and need not to make the PCB board again, has practiced thrift the resource, improves the design efficiency of sensor to a certain extent.
Preferably, as shown in fig. 5, the controller includes:
the central processing unit is connected with the power supply; and
and the programmable logic device is connected with the central processing unit, the compatible sensor circuit board and the power supply.
In this embodiment, the central processing unit is the CPU in fig. 5, and the programmable logic device is the FPGA in fig. 5.
A compatible sensor circuit board in the compatible sensor circuit described in this embodiment is the same as the compatible sensor circuit board described in the first embodiment, details of the compatible sensor circuit board in this embodiment are not described in detail in the first embodiment and the specific description in fig. 1 to 3, and details are not described here again.
It is obvious that the above described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, a person skilled in the art can make changes or changes in other different forms without creative work, and all should belong to the protection scope of the present invention.
Claims (10)
1. A compatible sensor circuit board, comprising:
the sensor pad group is used for welding the sensor;
the device pad group is used for welding a peripheral circuit of the sensor and the sensor pad group;
the signal pad group is used for welding the control end of the sensor and the sensor pad group;
the sensor pad group is connected with the sensor, the device pad group is connected with the sensor pad group through a zero ohm resistor, the device pad group is further connected with the peripheral circuit, the signal pad group is connected with the sensor pad group through a zero ohm resistor, and the signal pad group is further connected with the control end.
2. The compatible sensor circuit board of claim 1, wherein the total number of pads in the set of sensor pads is the same as the number of pins of the sensor.
3. The compatible sensor circuit board of claim 1 or 2, wherein the sensor pad set comprises:
l ground pads;
m power pads; and
n input signal pads; wherein L, M and N are both positive integers;
the L grounding bonding pads, the M power bonding pads and the N input signal bonding pads are all connected with the sensor, the L grounding bonding pads are also all connected with the device bonding pad group through zero ohm resistors, the M power bonding pads are also all connected with the device bonding pad group through zero ohm resistors, and the N input signal bonding pads are also all connected with the signal bonding pad group through zero ohm resistors.
4. The compatibility sensor circuit board of claim 3, wherein the device pad set comprises:
k first pad groups; and
k second pad groups; wherein K is L + M + N;
any L first welding pad groups in the K first welding pad groups are connected with a grounding end in the peripheral circuit and are correspondingly connected with the L grounding welding pads one by one through zero ohm resistors, and the rest K-L first welding pad groups are not welded;
and any M second welding pad groups in the K second welding pad groups are connected with a power supply end in the peripheral circuit and are correspondingly connected with the M power supply welding pads one by one through zero ohm resistors, and the rest K-M second welding pad groups are not welded.
5. The compatibility sensor circuit board of claim 4, wherein each of the first pad sets comprises:
l first resistance pads;
in any first pad group connected with the corresponding grounding pad, any first resistance pad in the L first resistance pads is connected with a grounding end in the peripheral circuit and is connected with the corresponding grounding pad through a zero ohm resistor, and the rest L-1 first resistance pads are not welded.
6. The compatibility sensor circuit board of claim 4, wherein each of the second pad sets comprises:
m second resistance pads;
a third resistor pad; and
a fourth resistor pad;
in any one of the second pad groups connected with the corresponding power supply pad, any one of the M second resistance pads is connected with a power supply end in the peripheral circuit and is connected with the corresponding third resistance pad through a zero ohm resistor, and the rest M-1 second resistance pads are not welded; the third resistance pad is further connected with the corresponding fourth resistance pad through a zero ohm resistor, and the fourth resistance pad is further connected with the corresponding power supply pad through a zero ohm resistor.
7. The compatibility sensor circuit board of claim 4, wherein the signal pad set comprises:
k control signal pads;
the K control signal bonding pads are connected with the control end; and any N control signal bonding pads in the K control signal bonding pads are correspondingly connected with the N input signal bonding pads in the sensor bonding pad group through zero ohm resistors, and the rest K-N control signal bonding pads are not welded.
8. The compatibility sensor circuit board of claim 7, wherein said control signal pads are specifically FPGA signal pads.
9. A compatible sensor circuit comprising a sensor, further comprising:
a controller;
a power supply connected to the controller; and
the compatibility sensor circuit board of any of claims 1-8, connected to all of the controller, the sensor, and the power source.
10. The compatibility sensor circuit of claim 9, wherein said controller comprises:
the central processing unit is connected with the power supply; and
and the programmable logic device is connected with the central processing unit, the compatible sensor circuit board and the power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220745034.3U CN217470385U (en) | 2022-04-01 | 2022-04-01 | Compatible sensor circuit board and circuit thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220745034.3U CN217470385U (en) | 2022-04-01 | 2022-04-01 | Compatible sensor circuit board and circuit thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217470385U true CN217470385U (en) | 2022-09-20 |
Family
ID=83267763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220745034.3U Active CN217470385U (en) | 2022-04-01 | 2022-04-01 | Compatible sensor circuit board and circuit thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217470385U (en) |
-
2022
- 2022-04-01 CN CN202220745034.3U patent/CN217470385U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102750252B (en) | USB/UART interface multiplexing circuit and use the electronic equipment of this circuit | |
| CN217470385U (en) | Compatible sensor circuit board and circuit thereof | |
| CN107544932B (en) | The electronic device of ON-OFF control circuit and the application ON-OFF control circuit | |
| CN113131923A (en) | Source type drain type automatic compatible interface circuit | |
| CN102624372A (en) | Touch key circuit | |
| CN219145076U (en) | Quick charging circuit | |
| CN211478551U (en) | Circuit and electronic equipment | |
| CN213987484U (en) | Protocol switching board and battery management system | |
| CN201754463U (en) | Circuit switching board | |
| JPH0116186Y2 (en) | ||
| CN201955777U (en) | Data switching equipment | |
| CN114355815A (en) | Controller, control system and communication method of controller | |
| CN111045361A (en) | Program-controlled NPN _ PNP switching input circuit and circuit board | |
| CN111427825A (en) | Serial port level conversion circuit | |
| CN206353307U (en) | Mobile terminal for debugging peripheral hardware | |
| CN219643897U (en) | Enhanced GPIO output signal isolation dual-mode driving circuit and conversion card | |
| CN218676167U (en) | Switching device for internal and external antennas of POS terminal | |
| CN201854077U (en) | Relay board with double power supplies | |
| CN217739749U (en) | Switch control circuit | |
| CN218471436U (en) | Multiplexing control circuit, external connector, infrared control equipment and infrared control system | |
| CN211906268U (en) | Serial port level conversion circuit | |
| CN211718733U (en) | Enhanced general radar data acquisition unit | |
| CN110740569A (en) | Printed circuit board | |
| CN219938601U (en) | Mainboard and terminal equipment compatible with flash memory chips of different standards | |
| CN212935957U (en) | Telephone module circuit capable of being embedded |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |