CN217459573U - Rotary cathode magnetic rod for magnetron sputtering and magnetron - Google Patents

Abstract

The utility model discloses a rotatory cathode bar magnet that magnetron sputtering was used, include the carrier assembly and fix the work subassembly on the carrier assembly, the work subassembly sets up along the length direction of carrier assembly, the work subassembly includes many permanent magnets that set up side by side, and many permanent magnets that set up side by side are including two permanent magnets in the middle of being located and being located many permanent magnets of its both sides, and wherein, the direction of magnetizing of two permanent magnets in the middle is for inside and relative slope magnetizing to form the contained angle with the horizontal installation direction of carrier assembly. In this way, the utility model discloses not changing self size and the relative position size of adjustment magnet, reaching the effect that whole magnetic field formed and reduced the angle of sputtering under the interact of many permanent magnets, not losing as far as possible when guaranteeing the angle of sputtering and reacing the magnetic field intensity on target surface to guarantee higher sputtering rate.

Description

Rotary cathode magnetic rod for magnetron sputtering and magnetron

Technical Field

The utility model relates to a sputter coating technical field especially relates to a rotatory cathode bar magnet and have its magnetron that magnetron sputtering was used.

Background

Magnetron sputtering is a widely used coating technique in which a target material is bombarded with ionized inert gas ions under the combined action of an electric field and a magnetic field in a vacuum environment, so that the target material is ejected in the form of ions, atoms or molecules and deposited on a substrate to form a thin film. The magnetic bar in the magnetron sputtering rotating cathode is one of the core components in the related equipment, and the common structure of the magnetic bar is shown in figure 1. A common magnet arrangement mode of a magnetic rod in a magnetron sputtering rotating cathode commonly used in the current industry is shown in fig. 2, a plurality of rows of permanent magnets with contour sizes calculated through design are arranged at a certain relative position and are installed on a magnetic yoke bottom plate and a central cooling water pipe, the permanent magnets are integrally installed in a target material, and arrows represent the magnetizing directions of the permanent magnets and point to the N pole of the magnets; when designing the straight line magnet part in the middle part of the bar magnet in the current industry, the main consideration to guarantee the required factors is magnetic field intensity, sputtering rate, sputtering angle and magnetic field uniformity.

Sputtering angle: the connection of the axial center line of the target material and the point where the direction of the gradient magnetic field of the permanent magnet is parallel to the tangent of the target material is a first connection line, the connection of the axial center line of the target material and the middle point of the working assembly is a second connection line, and the angle between the first connection line and the second connection line is a sputtering angle, as shown by alpha in fig. 2. The working sputtering angle range of the design of the magnetic bar in the current industry is generally 12-42 degrees.

The sputtering generation principle determines that a part of sputtered target atoms are deposited on a substrate along a certain angle probability distribution in the coating process, and the rest of sputtered target atoms move to other positions in the vacuum chamber and are attached to the surfaces of parts, so that certain target waste is caused, the maintenance period of the parts is shortened, the coating cost and the equipment use cost are increased, and the like.

Obviously, the size of the sputtering angle plays a positive role in reducing the coating area, reducing target waste and other problems, most magnetic rod designs in the current market still have larger reducing space of the sputtering angle, the requirement for obviously reducing the sputtering angle is met under certain coating, such as the working condition of a precious target, and the purpose of improving the target collection rate in the sputtering process can be achieved by reducing the sputtering angle to control the area where plasma is gathered and sputtered.

Utilization rate: the ratio of the mass of the target deposited on the substrate surface during the target lifetime to the initial mass of the target. The major waste generating situations include, but are not limited to: the part of the target material which is remained on the outer surface of the target material and can not be etched at the end of the life cycle of the target material is mainly determined by the whole etching uniformity of the surface of the target material, and the part of the target material which can not reach the substrate after being bombarded is mainly related to the collection rate in the sputtering process.

The collection rate is as follows: the ratio of the mass of target material deposited on the substrate surface during sputtering to the mass of target material bombarded by argon ions from the target material surface. Major influencing factors include, but are not limited to: the size of the sputtering angle, the length of an effective sputtering area, the target base distance, the placement density of the substrate on the carrying disc and the like.

Relationship between collection rate and utilization: under the condition that the etching uniformity of the surface of the target cannot be further improved, the collection rate is improved, and the overall utilization rate of the target can be improved.

The prior art has the following defects:

1. the waste of the precious target material due to a larger sputtering angle can increase the film coating cost;

2. the larger sputtering angle generates a larger coating area, so that the speed of the part in the vacuum cavity for covering the film is increased, the maintenance period is shortened, and the use cost of equipment is increased;

3. the current design scheme for achieving a smaller sputtering angle smaller than 20 degrees is less in types;

4. it is currently difficult to ensure the required high magnetic field strength with small sputtering angles of less than 20.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a rotatory cathode bar magnet and magnetron that magnetron sputtering was used to solve that current magnetron sputtering angle is limited or will lose the more technical problem who reachs the magnetic field intensity on target surface under the condition that obtains less sputtering angle.

In order to achieve the purpose, the invention provides the following specific scheme:

in order to solve the above technical problem, the utility model discloses a technical scheme be: a rotary cathode magnetic rod for magnetron sputtering comprises a bearing assembly and a working assembly fixed on the bearing assembly, wherein the working assembly is arranged along the length direction of the bearing assembly.

The working assembly comprises a plurality of permanent magnets which are arranged in parallel, the plurality of permanent magnets which are arranged in parallel comprise two permanent magnets positioned in the middle and a plurality of permanent magnets positioned on two sides of the permanent magnets, and the magnetizing directions of the two permanent magnets in the middle are inwards and oppositely inclined.

According to a specific implementation manner of the embodiment of the present disclosure, after the two middle permanent magnets rotate relative to each other with their center lines, the N poles or S poles of the two middle permanent magnets are inclined and opposite to each other.

According to a concrete implementation mode of the embodiment of the disclosure, the cooling device further comprises a cooling assembly, the cooling assembly comprises a cooling water pipe and supporting ends connected with two ends of the cooling water pipe, and the cooling water pipe is connected with the bearing assembly.

According to a specific implementation of the embodiment of the present disclosure, the bearing assembly includes a yoke base plate and a mounting member, and the mounting member connects the yoke base plate and the cooling assembly.

According to a specific implementation manner of the embodiment of the present disclosure, the yoke bottom plate is magnetically connected to the working assembly.

According to a specific implementation of the embodiment of the present disclosure, the permanent magnet is a neodymium iron boron magnet.

According to a specific implementation of the embodiments of the present disclosure, the bearing assembly includes a yoke base plate and a mounting member that connects the yoke base plate with the cooling assembly.

In a second aspect, to solve the above technical problem, an embodiment of the present invention provides a magnetron, including a cylindrical target material, in which the above-mentioned rotating cathode magnetic rod is disposed.

The utility model discloses a rotary cathode bar magnet and magnetron that magnetron sputtering was used's beneficial effect is:

1. designing and fixing neodymium iron boron magnets with proper height-width ratio in a limited space, and when the size and shape of the original equipment are not changed, only adjusting the magnetizing directions of the two middle rows of neodymium iron boron magnets, wherein the magnetizing directions of the two middle rows of neodymium iron boron magnets are relatively inclined inwards, and simultaneously, the magnetic field direction of the neodymium iron boron magnets and the installation horizontal plane thereof have a magnetic declination angle, so that a smaller sputtering angle is obtained;

2. the neodymium iron boron magnet with a proper height-width ratio is designed and fixed in a limited space, when the size and the shape of the original equipment are not changed, and the magnetizing directions of two middle lines of neodymium iron boron magnets cannot be changed, only the two middle lines of neodymium iron boron magnets are directly and integrally rotated and then are installed on the bottom plate of the magnetic yoke, so that the magnetizing directions of the two middle lines of neodymium iron boron magnets are in a state of being relatively inclined inwards, the magnetic field direction of the neodymium iron boron magnets and the installation horizontal plane of the neodymium iron boron magnets can have a declination angle, and a smaller sputtering angle can be obtained;

3. this application does not change self size and the relative position size of adjustment magnet, reaches the effect that whole magnetic field formed and reduced the sputtering angle under the interact of multiseriate neodymium iron boron magnet, does not lose the magnetic field intensity who reachs the target surface as far as possible when guaranteeing the sputtering angle to guarantee higher sputtering rate.

Drawings

FIG. 1 is a perspective view of the prior art;

FIG. 2 is a front view of the prior art;

fig. 3 is a schematic structural diagram of a first embodiment of the present invention;

fig. 4 is a schematic structural diagram of a second embodiment of the present invention;

fig. 5 is a graph of the magnetic field strength at the sputtering zone on the target surface calculated by simulation.

1 rotating a cathode magnetic bar;

10 a carrier assembly; 11 a yoke bottom plate; 12 a mounting member;

20 a working assembly; 21 a permanent magnet;

30 cooling the assembly; 31 a cooling water pipe;

40 target materials.

Detailed Description

The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

The embodiments of the present disclosure are described below with specific examples, and other advantages and effects of the present disclosure will be readily apparent to those skilled in the art from the disclosure of the present disclosure. It is to be understood that the described embodiments are merely illustrative of some, and not restrictive, of the embodiments of the disclosure. The disclosure may be embodied or carried out in various other specific embodiments, and various modifications and changes may be made in the details within the description without departing from the spirit of the disclosure. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the disclosure, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways.

It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present disclosure, and the drawings only show the structures related to the present disclosure rather than the number, shape and size of the structures in practical implementation, and the type, amount and ratio of each structure in practical implementation can be changed freely, and the structural layout may be more complicated.

In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.

Most of the magnetic rods in the current market have larger reduced sputtering angles, the sputtering angles are required to be obviously reduced under the working conditions of certain coating (such as precious targets), and the target collection rate in the sputtering process can be improved by reducing the sputtering angles to control the plasma gathering and sputtering areas. In order to overcome the problems, the following technical scheme is adopted in the application, and the sputtering angle of 10 degrees or less can be achieved.

The application provides a first specific embodiment, and referring to fig. 3, a specific structure is as follows: a rotary cathode magnetic rod 1 for magnetron sputtering comprises a bearing assembly 10 and a working assembly 20 fixed on the bearing assembly 10, wherein the working assembly 20 is arranged along the length direction of the bearing assembly 10, and the bearing assembly 10 is connected with a cooling assembly 30.

Specifically, the working assembly 20 is a plurality of permanent magnets 21 arranged in parallel. Preferably, the permanent magnet 21 is a neodymium iron boron magnet.

Specifically, the bearing assembly 10 includes a yoke base plate 11 and a mounting member 12, and the mounting member 12 connects the yoke base plate 11 with the cooling assembly 30.

Specifically, the cooling assembly 30 includes a cooling water pipe 31 and a support end connected to two ends of the cooling water pipe 31, and the cooling water pipe 31 is connected to the carrier assembly 10.

Specifically, the yoke bottom plate 11 is connected with the working assembly 20 through magnetic force, the middle two permanent magnets are installed on the yoke bottom plate 11, and the horizontal installation surfaces of the middle two permanent magnets are connected with the horizontal installation surface of the yoke bottom plate 11.

The two permanent magnets in the middle are oppositely and obliquely magnetized inwards, and meanwhile, under the interaction of the external magnetic fields, the effect that the sputtering angle is reduced by the whole magnetic field is achieved.

The application also provides another specific embodiment two, referring to fig. 4, the rest of the structures are the same as the above embodiment one, but the adjustment is made for the two rows of ndfeb magnets in the middle, and the specific structure of the adjustment part is as follows:

when the direction of magnetizing of two interior neodymium iron boron magnet of being listed as does not change, only need with two middle permanent magnets with its central line relative rotation and set up on yoke bottom plate 11, also obtained the magnetic field direction that relative slope set up promptly, relative slope divergent magnetic field direction with the horizontal installation direction of yoke bottom plate 21 has the contained angle, under the interact in outside magnetic field simultaneously, reaches the effect that whole magnetic field formed and reduced the angle of spattering.

In summary, the two middle permanent magnets are higher than the outer adjacent permanent magnets, and the adjacent magnetic poles of the two middle permanent magnets and the outer adjacent permanent magnets are the same.

In a second aspect, an embodiment of the present invention provides a magnetron, which includes a cylindrical target 40, and the inside of the target 40 is used as an installation chamber, and a rotary cathode magnetic rod 1 for magnetron sputtering is arranged in the installation chamber.

Specifically, referring to fig. 3, the structure of the rotating cathode magnetic rod is the structure of the rotating cathode magnetic rod mentioned in the first embodiment.

Specifically, referring to fig. 4, the structure of the rotating cathode magnetic rod is the structure of the rotating cathode magnetic rod mentioned in the second embodiment.

Referring to fig. 5, the present application calculates the horizontal component of the magnetic field strength in the sputtering area on the target surface through simulation, and changes the magnetizing direction of the two middle permanent magnets with the designed size from the horizontal direction along which the magnets are placed to the opposite direction inclined by a certain angle, so as to achieve an obvious adjustment effect on the magnetic field distribution and achieve a sputtering angle of 10 ° or less. The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present disclosure should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (7)

1. The utility model provides a rotatory cathode bar magnet that magnetron sputtering was used, includes, carrier assembly and fixes the work subassembly on carrier assembly, work subassembly sets up along carrier assembly's length direction, its characterized in that, work subassembly includes many permanent magnets that set up side by side, many permanent magnets that set up side by side are including lieing in two permanent magnets in the middle and lieing in many permanent magnets of its both sides, and wherein, the direction of magnetizing of two permanent magnets in the middle is inside and relative slope magnetize, just the direction of magnetizing forms the contained angle that is less than 90 with carrier assembly's horizontal installation direction.

2. The rotating cathode magnetic rod for magnetron sputtering according to claim 1, wherein the central two permanent magnets are rotated relative to each other about their center lines such that the N poles or S poles of the central two permanent magnets are obliquely opposed to each other.

3. The rotating cathode magnetic rod for magnetron sputtering according to claim 1, further comprising a cooling assembly, wherein the cooling assembly comprises a cooling water pipe and support ends connected with both ends of the cooling water pipe, and the cooling water pipe is connected with the bearing assembly.

4. The rotating cathode bar magnet for magnetron sputtering of claim 3 wherein the carrier assembly comprises a yoke base plate and a mount connecting the yoke base plate to the cooling assembly.

5. The rotating cathode bar magnet for magnetron sputtering of claim 4 wherein the yoke base plate is magnetically coupled to the working assembly.

6. The rotating cathode magnetic rod for magnetron sputtering of claim 1, wherein the permanent magnet is a neodymium iron boron magnet.

7. A magnetron comprising a cylindrical target material, wherein a rotary cathode magnetic rod as claimed in any one of claims 1 to 6 is provided in the target material.

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