CN217442750U - High-performance silicon piezoresistive pressure sensor chip - Google Patents
High-performance silicon piezoresistive pressure sensor chip Download PDFInfo
- Publication number
- CN217442750U CN217442750U CN202220803202.XU CN202220803202U CN217442750U CN 217442750 U CN217442750 U CN 217442750U CN 202220803202 U CN202220803202 U CN 202220803202U CN 217442750 U CN217442750 U CN 217442750U
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- sealing
- installation department
- closing cap
- base
- base member
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The utility model discloses a high performance silicon piezoresistive pressure sensor chip, the sensor chip includes base member, base, closing cap, chip and lead wire, the base member sets up on the base, the base is connected with the closing cap, base member and closing cap junction are provided with first installation department and second installation department, first installation department includes first sealing and second sealing, the second installation department includes the third sealing, first installation department sets up in closing cap and base member both sides position, the second installation department sets up in closing cap and base member a week, can ensure the leakproofness between closing cap and the base member through first installation department and the second installation department between closing cap and the base member.
Description
Technical Field
The invention belongs to the field of semiconductor chips, and particularly relates to a high-performance silicon piezoresistive pressure sensor chip.
Background
Silicon piezoresistive pressure sensors are made using the piezoresistive effect of single crystal silicon. 4 semiconductor resistors with equal values are diffused in a specific direction of the silicon diaphragm and connected into a Wheatstone bridge to serve as a sensitive element of the force-electricity converter. When the diaphragm is acted by external pressure and the bridge is out of balance, if an excitation power supply (constant current and constant voltage) is applied to the bridge, an output voltage in direct proportion to the measured pressure can be obtained, so that the purpose of measuring the pressure is achieved, and if the sealing performance inside the chip is poor, an error occurs in a measuring result.
Disclosure of Invention
In order to achieve the purpose, the technical scheme of the invention is as follows: the utility model provides a high performance silicon piezoresistive pressure sensor chip, the sensor chip includes base member, base, closing cap, chip and lead wire, and the base member sets up on the base, and the base is connected with the closing cap, and base member and closing cap junction are provided with first installation department and second installation department, and first installation department includes first sealing and second sealing, and the second installation department includes the third sealing, and first installation department sets up in closing cap and base member both sides position, and the second installation department sets up in closing cap and base member a week.
Based on the technical scheme, the utility model discloses well innovation part is not in the connected mode between closing cap and base member, and lies in mutually supporting of the seal assembly between closing cap and the base member to reach the purpose that improves the chip leakproofness, can ensure the leakproofness between closing cap and the base member through first installation department and the second installation department between closing cap and the base member.
As an improvement of the utility model, first installation department sets up the slot including setting up in the installation cavity of base member outer wall both sides in the installation cavity, is provided with first spring part in the slot, and first briquetting is connected to first spring part, and first briquetting sets up the inboard at first spring part, and pressing piece is connected to first spring part, and the pressing piece sets up to be in the outside of equipment, and first spring part, first briquetting and pressing piece set up to an organic whole.
Based on above-mentioned technical scheme, set up in the installation cavity of base member outer wall both sides, can not influence the leakproofness between closing cap and the base member when fixed closing cap and base member.
As an improvement of the utility model, first installation department is still including setting up in the piece that compresses tightly of closing cap both sides, and it is protruding to be provided with the card on the piece that compresses tightly, compresses tightly a cooperation with the slot and compresses tightly, and it sets up downwards to compress tightly a perpendicular to closing cap, and when compressing tightly a downstream, it passes the slot to compress tightly the protruding card on the piece, supports the outside removal of first briquetting on the right, then the protruding tight card of card is in the position of first briquetting bottom, and it has fixed inside the slot to compress tightly the piece this moment.
Based on above-mentioned technical scheme, along with compressing tightly of piece and slot, it is fixed between closing cap and the base member.
As an improvement of the utility model, still be provided with the second spring part in the installation cavity, the second briquetting is connected to the second spring part, and the second spring part sets up in slot bottom position, and the second briquetting sets up in second spring upper portion position for the contact compresses tightly the piece, provides the buffering for compressing tightly the piece.
Based on above-mentioned technical scheme, second spring part and second briquetting have played the effect of buffering and support to compressing tightly the piece, have guaranteed to compress tightly the stability of piece in the slot inside.
As an improvement of the utility model, the second installation department is including the third sealing that is provided with closing cap lower limb and base member upper limb, and the third sealing includes rubber groove and closing plate, and the position of rubber groove is on the base member, and the closing plate setting plays the leakproofness between closing cap and the base member in inserting the rubber groove through the closing plate at the closing cap lower limb.
Based on above-mentioned technical scheme, set up the sealed degree and the firmness between sealed lid and the base member of aim at reinforcing of third sealing, compensatied first sealing and second sealing and only played the defect of sealed effect to the sealed both sides of covering.
As an improvement of the utility model, first sealing sets up in the bottom of closing cap, compress tightly the top of piece, on closing cap and the position that compresses tightly between the piece promptly, be used in the enhancement when compressing tightly a downwardly extending, compress tightly the leakproofness after piece and slot contact, the second sealing sets up in first briquetting and the sealed hole that compresses tightly on the piece, first briquetting compresses tightly with compressing tightly the sealed hole of piece and mutually supporting, in the design, set up first briquetting and the sealed hole that compresses tightly into when first briquetting and compressing tightly piece paste tightly, form two tight wavy surfaces of pasting, strengthened first briquetting and the leakproofness of compressing tightly between the piece, the effect in sealed hole lies in promoting first briquetting and the leakproofness of compressing tightly between the piece, accomplish not strengthening the internal installation portion leakproofness in traditional design.
Compared with the prior art, the invention has the beneficial effects that: the base member and closing cap junction are provided with first installation department and second installation department, and first installation department includes first sealing and second sealing, and the second installation department includes the third sealing, and first installation department sets up in closing cap and base member both sides position, and the second installation department sets up in closing cap and base member a week, the utility model discloses in through the effect of first sealing, second sealing and third sealing, to having the chip that can dismantle the closing cap, promoted the leakproofness of chip itself greatly.
Drawings
Fig. 1 is a schematic diagram of the structure of the sensor chip of the present invention.
Fig. 2 is the schematic view of the structure of the middle installation cavity of the present invention.
Fig. 3 is a schematic structural view of the third sealing portion of the present invention.
List of reference symbols: 100-base body, 101-base, 102-sealing cover, 103-chip, 104-lead, 105-first mounting part, 106-second mounting part, 107-first sealing part, 108-second sealing part, 109-third sealing part, 110-mounting cavity, 111-slot, 112-first spring part, 113-first pressing block, 114-pressing part, 115-pressing part, 116-clamping protrusion, 117-second spring part, 118-second pressing block, 119-rubber groove, 120-sealing plate and 121-sealing pit.
Detailed Description
The present invention will be further illustrated with reference to the accompanying drawings and specific embodiments, which are to be understood as merely illustrative of the invention and not as limiting the scope of the invention.
Example (b): referring to fig. 1 to 3, a high performance silicon piezoresistive pressure sensor chip 103, where the sensor chip 103 includes a base 100, a base 101, a cap 102, a chip 103, and a lead 104, the base 100 is disposed on the base 101, the base 101 is connected to the cap 102, a first mounting portion 105 and a second mounting portion 106 are disposed at a joint of the base 100 and the cap 102, the first mounting portion 105 includes a first sealing portion 107 and a second sealing portion 108, the second mounting portion 106 includes a third sealing portion 109, the first mounting portion 105 is disposed at two sides of the cap 102 and the base 100, the second mounting portion 106 is disposed at one circumference of the cap 102 and the base 100, and the first mounting portion 105 and the second mounting portion 106 between the cap 102 and the base 100 can ensure the sealing performance between the cap 102 and the base 100.
Further, first installation department 105 is including setting up in the installation cavity 110 of base member 100 outer wall both sides, set up slot 111 in the installation cavity 110, be provided with first spring part 112 in the slot 111, first spring part 112 is connected first briquetting 113, first briquetting 113 sets up the inboard at first spring part 112, a pressing piece 114 is connected to first spring part 112, pressing piece 114 sets up to the outside at equipment, first spring part 112, first briquetting 113 and pressing piece 114 set up as an organic whole, set up in the installation cavity 110 of base member 100 outer wall both sides, can not influence the leakproofness between closing cap 102 and the base member 100 when fixed closing cap 102 and base member 100.
Further, the first mounting portion 105 further includes a pressing member 115 disposed on two sides of the sealing cover 102, a clamping protrusion 116 is disposed on the pressing member 115, the pressing member 115 is pressed in cooperation with the slot 111, the pressing member 115 is disposed downward perpendicular to the sealing cover 102, when the pressing member 115 moves downward, the clamping protrusion 116 on the pressing member 115 penetrates through the slot 111 and abuts against the right first pressing block 113 to move outward, then the clamping protrusion 116 is clamped at the bottom of the first pressing block 113, at this time, the pressing member 115 is fixed inside the slot 111, and the sealing cover 102 and the base 100 are fixed together with the pressing member 115 and the slot 111. The first seal portion 107 is a seal pad, the second seal portion 108 is a seal pit 121, and the third seal portion 109 is a rubber groove 119 and a seal plate 120.
Further, still be provided with second spring part 117 in the installation cavity 110, second spring part 117 connects second briquetting 118, and second spring part 117 sets up in slot 111 bottom position, and second briquetting 118 sets up in second spring upper portion position for the contact compresses tightly piece 115, for compressing tightly piece 115 provides the buffering, and second spring part 117 and second briquetting 118 have played the effect of buffering and support to compressing tightly piece 115, have guaranteed to compress tightly the inside stability of piece 115 in slot 111.
Further, the second mounting portion 106 includes a third sealing portion 109 provided with a lower edge of the sealing cover 102 and an upper edge of the base 100, the third sealing portion 109 includes a rubber groove 119 and a sealing plate 120, the rubber groove 119 is located on the base 100, the sealing plate 120 is disposed at the lower edge of the sealing cover 102, and is inserted into the rubber groove 119 through the sealing plate 120 to achieve a sealing effect between the sealing cover 102 and the base 100, the third sealing portion 109 is provided to enhance the sealing effect and the firmness between the sealing cover 102 and the base 100, and a defect that the first sealing portion 107 and the second sealing portion 108 only achieve a sealing effect on two sides of the sealing cover 102 is overcome.
Further, the first sealing portion 107 is disposed at the bottom of the cover 102, the top of the pressing member 115, that is, the position between the cover 102 and the pressing member 115, is used for enhancing the sealing performance after the pressing member 115 extends downward and the pressing member 115 contacts the slot 111, the second sealing portion 108 is disposed in the first pressing block 113 and the sealing pit 121 on the pressing member 115, the first pressing block 113 and the sealing pit 121 on the pressing member 115 are mutually matched and pressed, the sealing pit 121 is used for improving the sealing performance between the first pressing block 113 and the pressing member 115, and no structure for enhancing the sealing performance inside the installation portion is provided in the conventional design.
The working principle is as follows: when the chip 103 is mounted, the pressing piece 115 on the cover 102 of the chip 103 is aligned with the slot 111 inside the mounting cavity 110, when the pressing piece 115 moves downwards, the clamping protrusion 116 on the pressing piece 115 passes through the slot 111 to abut against the right first pressing block 113 to move outwards, then the clamping protrusion 116 is clamped at the position of the bottom of the first pressing block 113, the pressing piece 115 and the sealing pit 121 on the first pressing block 113 are matched with each other, the sealing plate 120 on the cover 102 contacts and is inserted into the rubber groove 119 on the upper edge of the substrate 100, at this time, the pressing piece 115 is fixed inside the slot 111, the sealing block on the cover 102 is pressed against the upper edge of the substrate 100, along with the pressing of the slot 111 and the pressing piece 115, the cover 102 and the substrate 100 are fixed, when the chip 103 is taken out, the pressing pieces on both sides of the chip 103 are pulled out (the pressing piece passes through the chip 103 to be connected with the spring piece, the spring piece moves along with the movement of the pressing piece), the pressing piece moving towards the outside drives the spring to move outwards, the compression members 115 are then released and the closure 102 can be pulled apart.
It should be noted that the above-mentioned contents only illustrate the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and it is obvious to those skilled in the art that several modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations fall within the protection scope of the claims of the present invention.
Claims (6)
1. The utility model provides a high performance silicon piezoresistive pressure sensor chip, characterized in that, sensor chip (103) includes base member (100), base (101), closing cap (102), chip (103) and lead wire (104), base member (100) sets up on base (101), base (101) are connected with closing cap (102), base member (100) and closing cap (102) junction are provided with first installation department (105) and second installation department (106), first installation department (105) include first sealing (107), second installation department (106) include second sealing (108), first installation department (105) set up in closing cap (102) and base member (100) both sides position, second installation department (106) set up in closing cap (102) and base member (100) a week.
2. The silicon piezoresistive pressure sensor chip as claimed in claim 1, wherein the first mounting portion (105) comprises a mounting cavity (110) disposed on two sides of the outer wall of the substrate (100), a slot (111) is disposed in the mounting cavity (110), a first spring member (112) is disposed in the slot (111), and the first spring member (112) is connected to the first pressing block (113).
3. The silicon piezoresistive pressure sensor chip according to claim 2, wherein the first mounting portion (105) further comprises a pressing member (115) disposed on both sides of the cover (102), a clamping protrusion (116) is disposed on the pressing member (115), and the pressing member (115) is matched with the slot (111) for pressing.
4. A high performance silicon piezoresistive pressure sensor chip according to claim 3, wherein a second spring member (117) is arranged in the mounting cavity (110), and the second spring member (117) is connected to the second pressure block (118).
5. A high performance silicon piezoresistive pressure sensor chip according to claim 4, wherein the second mounting part (106) comprises a third sealing part (109) provided with the lower edge of the cover (102) and the upper edge of the base body (100), the third sealing part (109) comprising a rubber groove (119) and a sealing plate.
6. A high performance silicon piezoresistive pressure sensor chip according to claim 5, wherein the first sealing portion (107) is provided at a position between the cover (102) and the pressure member (115).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220803202.XU CN217442750U (en) | 2022-04-08 | 2022-04-08 | High-performance silicon piezoresistive pressure sensor chip |
| DE202022104538.0U DE202022104538U1 (en) | 2022-04-08 | 2022-08-10 | A high performance piezoresistive silicon pressure sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220803202.XU CN217442750U (en) | 2022-04-08 | 2022-04-08 | High-performance silicon piezoresistive pressure sensor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217442750U true CN217442750U (en) | 2022-09-16 |
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ID=83193067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220803202.XU Active CN217442750U (en) | 2022-04-08 | 2022-04-08 | High-performance silicon piezoresistive pressure sensor chip |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN217442750U (en) |
| DE (1) | DE202022104538U1 (en) |
-
2022
- 2022-04-08 CN CN202220803202.XU patent/CN217442750U/en active Active
- 2022-08-10 DE DE202022104538.0U patent/DE202022104538U1/en active Active
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| Publication number | Publication date |
|---|---|
| DE202022104538U1 (en) | 2022-08-23 |
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