CN217442680U - Vibration pickup device - Google Patents

Abstract

The embodiment of the application discloses a vibration pickup device, which comprises a shell, a substrate, a vibration assembly and a sensor assembly, wherein the substrate is arranged on the shell; an accommodating cavity is formed between the substrate and the shell in an enclosing manner; the vibration assembly and the sensor assembly are arranged in the accommodating cavity, and the sensor assembly is electrically connected with the substrate; the sensor assembly comprises a pressure MEMS chip and a pressure ASIC chip; wherein, the thickness of the diaphragm of the pressure MEMS chip is more than 800 μm. The technical effect of the embodiment of the application lies in that structural design is very reasonable, not only is the sensitivity to foreign matters weaker, improves vibration pickup apparatus's use reliability effectively, helps reducing the requirement to the encapsulation environment moreover, reduces vibration pickup apparatus's manufacturing cost.

Description

Vibration pickup device

Technical Field

The application belongs to the technical field of micro electro mechanical systems, and particularly relates to a vibration pickup device.

Background

The vibration pickup device comprises a vibration component and a sensor component, wherein the vibration component is used for sensing external vibration information and converting air pressure change generated during vibration into an electric signal through the sensor component so as to express the vibration information.

The vibration pickup device is used to recognize operations such as a tap, a long-time press, a short-time press by a user. Taking the knocking as an example, when the user knocks the vibration pickup device, the vibration assembly picks up a vibration signal caused by the knocking and causes the air pressure inside the device to change through vibration; then, the air pressure change is converted into an electric signal through the sensor assembly, and then a knocking signal of a user is indirectly expressed.

However, the current vibration pickup device is unreasonable in structural design, and the sensor assembly is sensitive to foreign matters, so that the requirements on the reliability of products and the packaging environment are high.

SUMMERY OF THE UTILITY MODEL

It is an object of embodiments of the present application to provide a new solution for a vibration pickup apparatus.

According to an aspect of an embodiment of the present application, there is provided a vibration pickup apparatus including:

the substrate and the shell are enclosed to form an accommodating cavity;

the vibration assembly and the sensor assembly are arranged in the accommodating cavity, and the sensor assembly is electrically connected with the substrate;

the sensor assembly comprises a pressure MEMS chip and a pressure ASIC chip; wherein, the thickness of the diaphragm of the pressure MEMS chip is more than 800 μm.

Optionally, a pressure relief hole is provided on the housing.

Optionally, the pressure MEMS chip is an absolute pressure MEMS chip, and a vacuum cavity is disposed inside the absolute pressure MEMS chip; the pressure ASIC chip is an absolute pressure ASIC chip.

Optionally, the absolute MEMS chip and the absolute ASIC chip are disposed on the substrate;

the vibration assembly is arranged on the inner wall of the shell far away from the substrate.

Optionally, the vibrating assembly includes a vibrating membrane and a mass fixed to the vibrating membrane, and the mass is fixed to one side of the vibrating membrane close to the sensor assembly.

Optionally, the pressure MEMS chip is a differential pressure MEMS chip; the pressure ASIC chip is a differential pressure ASIC chip.

Optionally, the vibrating assembly is disposed on the substrate, the sensor assembly is disposed above the vibrating assembly, and a vibrating space is formed between the sensor assembly and the vibrating assembly;

a first closed cavity and a second closed cavity are formed on two sides of a vibrating diaphragm of the differential pressure MEMS chip; and the second closed cavity is communicated with the vibration space.

Optionally, the vibration pickup device further comprises:

the supporting component is arranged on the vibrating component, a vibrating gap is formed between the supporting component and the vibrating component, and the sensor component is arranged on the supporting component;

and the supporting component is provided with a through hole for communicating the second closed cavity with the vibration space.

Optionally, the vibrating assembly includes a fixing ring, a vibrating membrane and a mass block fixedly arranged on the vibrating membrane, the vibrating membrane is arranged on the fixing ring, and the mass block is fixed on one side of the vibrating membrane far away from the sensor assembly.

Optionally, the support assembly is bonded to the retaining ring.

One technical effect of the embodiment of the application is as follows:

in the embodiment of the application, the structural design is very reasonable. The sensor component comprises a pressure MEMS chip and a pressure ASIC chip, and the thickness of a diaphragm of the pressure MEMS chip is larger than 800 μm. Because the thickness of the vibrating diaphragm of the pressure MEMS chip is larger, the sensitivity to foreign matters is weaker, the use reliability of the vibration pickup device is effectively improved, the requirement on the packaging environment is reduced, and the production cost of the vibration pickup device is reduced.

Further features of the present application and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which is to be read in connection with the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.

Fig. 1 is a schematic structural diagram of a first implementation of a vibration pickup apparatus provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a second implementation manner of a vibration pickup apparatus provided in an embodiment of the present application.

In the figure: 1. a housing; 101. an accommodating chamber; 2. a substrate; 31. a vibrating membrane; 32. a mass block; 33. a fixing ring; 41. a pressure MEMS chip; 42. a pressure ASIC chip; 5. a pressure relief vent; 6. a support assembly; 71. a first closed cavity; 72. a second closed cavity; 73. a vibration space; 74. a vacuum chamber; 75. and a through hole.

Detailed Description

Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

As shown in fig. 1 and 2, an embodiment of the present application provides a vibration pickup apparatus for recognizing an operation such as a tap, a long-time tap, a short-time tap, or the like by a user.

Specifically, the vibration pickup apparatus includes a housing 1, a substrate 2, a vibration component, and a sensor component; an accommodating cavity 101 is formed between the substrate 2 and the housing 1 in an enclosing manner. The accommodating cavity 101 is used for accommodating components inside the vibration pickup device, such as the vibration assembly, the pressure MEMS chip 41, the pressure ASIC chip 42, and the like, so that the safety of the whole structure of the vibration pickup device can be better ensured, and the vibration pickup device is favorable for better converting a vibration signal into an electrical signal.

More specifically, the vibration component and the sensor component are both disposed in the accommodating cavity 101, and the sensor component is electrically connected with the substrate 2; the sensor assembly includes a pressure MEMS chip 41 and a pressure ASIC chip 42; wherein, the thickness of the diaphragm of the pressure MEMS chip 41 is greater than 800 μm. The pressure MEMS chip 41 and the pressure ASIC chip 42 have high structural strength and low sensitivity to foreign substances, so that the reliability of the vibration pickup device can be improved.

In the embodiment of the application, the structural design is very reasonable. Wherein the sensor assembly comprises a pressure MEMS chip 41 and a pressure ASIC chip 42, and the thickness of the diaphragm of the pressure MEMS chip 41 is greater than 800 μm. Because the thickness of the diaphragm of the pressure MEMS chip 41 is large, the sensitivity to foreign matter is weak, which effectively improves the reliability of the vibration pickup device, and helps to reduce the requirements for the packaging environment and the production cost of the vibration pickup device.

Optionally, as shown in fig. 1, the pressure MEMS chip 41 is an absolute pressure MEMS chip, and a vacuum cavity 74 is disposed inside the absolute pressure MEMS chip; the pressure ASIC chip 42 is an absolute pressure ASIC chip. Wherein, the absolute pressure MEMS chip is a capacitance absolute pressure chip.

In the above embodiment, the absolute pressure MEMS chip and the absolute pressure ASIC chip are used to better pick up the vibration generated by the vibration pickup device. When the vibration pickup device does not sense, for example, a tap (or other vibration signal) of a user, the air pressure inside the vibration pickup device is in an equilibrium state; when the vibration pickup device senses a user tap (or other vibration signal), the mass 32 of the vibration assembly moves relatively to compress the air inside the vibration pickup device, causing a change in the internal air pressure; then, the absolute pressure MEMS chip picks up the air pressure change and transmits the air pressure change to the absolute pressure ASIC chip 42 for processing, so as to convert the knocking signal (or other vibration signal) into an electrical signal which can be processed subsequently, thereby realizing the identification and pickup of the knocking signal (or other vibration signal).

It should be noted that the cavity inside the absolute pressure MEMS is the vacuum cavity 74, and therefore, the absolute pressure ASIC chip handles the air pressure change value inside the accommodating cavity 101 caused by the movement of the mass.

Further optionally, a pressure relief hole 5 is provided on the housing 1.

The pressure relief holes 5 are used to balance the air pressure inside and outside the housing 1 during the packaging process of the vibration pickup apparatus. In the use process of the vibration pickup device, the pressure relief hole 5 is plugged so as to ensure the stability and accuracy of vibration pickup.

In the above embodiment, the pressure relief hole 5 can effectively prevent the vibration pickup device from exploding the shell in the packaging process, where the packaging process may be a product packaging process or a client packaging process, and can ensure the safety of the vibration pickup device packaging process.

It should be noted that the pressure relief hole 5 is only used as a structural hole, and functions to balance the air pressure inside and outside the product during the product packaging process and the client packaging process. If no pressure release hole 5 or the pressure release hole 5 is blocked, when the product reflows (sticks to the housing) during packaging or the client reflows (loads) due to an over-high temperature, the internal pressure of the product may change sharply, which may cause damage to the MEMS film or displacement of the housing position. However, when the product is assembled to the whole machine for normal use (no reflow operation or high temperature treatment is performed subsequently), the pressure relief hole 5 must be sealed to prevent the air pressure change of the accommodating cavity caused by the vibration of the vibration component from leaking out.

Optionally, the absolute pressure MEMS chip and the absolute pressure ASIC chip are disposed on the substrate 2;

the vibration component is arranged on the inner wall of the shell 1 far away from the substrate 2.

In the embodiment, the vibration assembly can generate vibration well according to the state of the vibration pickup device, and the absolute pressure MEMS chip and the absolute pressure ASIC chip can effectively convert vibration signals into electric signals, so that the vibration is accurately picked up, and the use reliability is high. Moreover, the vibration pickup device is reasonable in internal layout, the miniaturization design of the vibration pickup device is facilitated, and the use habit of a user is met.

Optionally, the vibrating assembly includes a vibrating membrane 31 and a mass 32 fixed to the vibrating membrane 31, and the mass 32 is fixed to a side of the vibrating membrane 31 close to the sensor assembly.

In the above embodiment, the diaphragm 31 of the vibration assembly can vibrate well, and at the same time, the sensor assembly can pick up the vibration well, thereby helping to ensure that the vibration pickup device accurately converts the vibration signal into an electrical signal.

Alternatively, as shown in fig. 2, the pressure MEMS chip 41 is a differential pressure MEMS chip; the pressure ASIC chip 42 is a differential pressure ASIC chip. The differential pressure MEMS chip can sensitively acquire the vibration signal of the vibration pickup device, and then transmits the vibration signal to the differential pressure ASIC chip for processing, so that the sensor component can accurately sense the vibration signal and convert the vibration signal into an electric signal.

Optionally, the vibrating assembly is disposed on the substrate 2, the sensor assembly is disposed above the vibrating assembly, and a vibrating space 73 is formed between the sensor assembly and the vibrating assembly;

a first closed cavity 71 and a second closed cavity 72 are formed on two sides of a vibrating diaphragm of the differential pressure MEMS chip; wherein the second closed chamber 72 is in communication with the vibration space 73.

In the above embodiment, the vibration assembly can vibrate well in the vibration space 73, and can cause the change of the air pressure in the second sealed cavity 72, thereby facilitating the identification of the vibration signal of the differential pressure MEMS chip.

Further, referring to fig. 2, the cavity at the bottom of the differential pressure MEMS chip is not sealed, and the air pressures at the upper and lower sides of the membrane of the differential pressure MEMS chip are balanced, so that the differential pressure ASIC chip processes the air pressure difference value after the first sealed cavity 71 and the second sealed cavity 72 are unbalanced when the mass moves, and when there is no vibration signal, the air pressures of the first sealed cavity 71 and the second sealed cavity 72 are the same, and the difference value is 0.

Optionally, the vibration pickup device further comprises:

the supporting component 6 is arranged on the vibrating component, a vibrating gap is formed between the supporting component 6 and the vibrating component, and the sensor component is arranged on the supporting component 6;

the support assembly 6 is provided with a through hole 75 communicating the second closed chamber 72 with the vibration space 73.

In the above embodiment, the supporting component 6 can firmly fix the sensor component on the vibrating component to well form the vibrating space 73 for the vibrating component to vibrate between the vibrating component and the sensor component, and meanwhile, the second sealed cavity 72 is communicated with the vibrating space 73, which helps the differential pressure MEMS chip to better sense the vibrating signal, and is also convenient for the differential pressure ASIC chip to process the vibrating signal, so as to better convert the vibrating signal into an electrical signal.

Optionally, the vibration assembly includes a fixing ring 33, a diaphragm 31 and a mass 32 fixedly disposed on the diaphragm 31, the diaphragm 31 is disposed on the fixing ring 33, and the mass 32 is fixed on a side of the diaphragm 31 away from the sensor assembly.

In the above embodiment, the vibration ring can be firmly fixed to the substrate 2, and the diaphragm 31 is fixed to the vibration ring, so that vibration can be generated in the vibration ring and the vibration space 73, thereby facilitating the sensing of the vibration signal by the differential pressure MEMS chip. The mass 32 is fixed to the side of the diaphragm 31 remote from the sensor assembly, which helps to optimise the structure of the vibrating assembly and the sensor assembly, helping to further reduce the bulk of the vibration pickup.

Optionally, the support member 6 is bonded to the fixing ring 33. This makes the connection relationship between the support member 6 and the fixing ring 33 very simple, and helps to firmly fix the support member 6 to the fixing ring 33 to provide a good fixation of the sensor assembly. The supporting member 6 may be formed by enclosing a plurality of components, or may be integrally formed, so as to form a vibration space 73 at the bottom of the supporting member 6 for the mass 32 to vibrate better.

Referring to FIG. 2, for example, when the vibration pickup device does not sense a user tap (or other vibration signal), the air pressure across the differential pressure MEMS chip is at equilibrium, i.e., P _{First sealed cavity} ＝P’ _{Second closed cavity} . When the vibration pickup device senses external knocking (or other vibration signals), the mass blocks of the vibration assembly move relatively to compressThe air in the first closed cavity causes the pressure in the first closed cavity to change, resulting in P _{First sealed cavity} ≠P’ _{Second closed cavity} Then the vibrating pick-up device generates a signal Δ P. The differential pressure MEMS chip senses the delta P signal and transmits the delta P signal to the differential pressure ASIC for signal processing, and then the knocking signal (or other vibration signals) is converted into an electric signal, so that the identification and the pickup of the knocking signal (or other vibration signals) are realized. In this configuration, the support assembly functions to provide a support platform for the differential pressure MEMS and differential pressure ASIC.

In a specific embodiment, referring to fig. 2, the housing 1 is provided with a pressure relief hole 5. The pressure relief hole 5 needs to be opened in the product packaging process and the client packaging process, and has the function of balancing the air pressure inside and outside the product, so that the pressure difference MEMS chip is prevented from being damaged or the shell is prevented from deviating during backflow or high-temperature operation. However, when the differential pressure ASIC chip is used at a terminal, two processing modes can be adopted, wherein the two processing modes are different, and differential pressure signals processed by the differential pressure ASIC chip are different.

The first mode is as follows: when the terminal is used, the pressure relief hole 5 is sealed. At this time, since the second sealed cavity 72 is in a sealed state and the second sealed cavity 72 is not in vacuum, the air pressure of the first sealed cavity 71 and the air pressure of the second sealed cavity 72 both change when the mass vibrates, that is, the signal processed by the differential pressure ASIC is the air pressure difference value between the first sealed cavity 71 and the second sealed cavity 72.

The second way is: when the terminal is used, the pressure relief hole 5 is opened. At this time, the top of the film of the differential pressure MEMS chip always senses the external atmospheric pressure, the vibration of the mass only causes the change of the atmospheric pressure of the second sealed cavity 72, and the atmospheric pressure of the first sealed cavity 71 does not change (always is an atmospheric pressure value), that is, the signal processed by the differential pressure ASIC is the difference between the atmospheric pressure of the second sealed cavity 72 and the atmospheric pressure. In the structure, the adhesive can be dispensed inside the product, so that the product achieves the dustproof and waterproof effects.

In a specific embodiment, the connection relationship between two structural members inside the vibration pickup device can be bonded by using a dispensing method, so that the vibration pickup device achieves a better dustproof and waterproof effect.

Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.

Claims (10)

1. A vibration pickup apparatus, comprising:

the substrate and the shell are enclosed to form an accommodating cavity;

the vibration assembly and the sensor assembly are arranged in the accommodating cavity, and the sensor assembly is electrically connected with the substrate;

the sensor assembly comprises a pressure MEMS chip and a pressure ASIC chip; wherein, the thickness of the diaphragm of the pressure MEMS chip is more than 800 μm.

2. The vibration pickup apparatus according to claim 1, wherein a pressure relief hole is provided in said housing.

3. The vibration pickup apparatus according to claim 1, wherein the pressure MEMS chip is an absolute pressure MEMS chip, an inside of which is provided with a vacuum chamber;

the pressure ASIC chip is an absolute pressure ASIC chip.

4. The vibration pickup apparatus according to claim 3, wherein the absolute pressure MEMS chip and the absolute pressure ASIC chip are provided on the substrate;

the vibration assembly is arranged on the inner wall of the shell far away from the substrate.

5. The vibration pickup apparatus according to claim 4, wherein the vibration assembly includes a diaphragm, and a mass fixed to the diaphragm, the mass being fixed to a side of the diaphragm adjacent to the sensor assembly.

6. The vibratory pickup apparatus of claim 1 wherein the pressure MEMS die is a differential pressure MEMS die; the pressure ASIC chip is a differential pressure ASIC chip.

7. The vibration pickup apparatus according to claim 6, wherein the vibration member is provided on the base plate, the sensor member is provided above the vibration member, and a vibration space is formed between the sensor member and the vibration member;

a first closed cavity and a second closed cavity are formed on two sides of a vibrating diaphragm of the differential pressure MEMS chip; and the second closed cavity is communicated with the vibration space.

8. The vibration pickup apparatus according to claim 7, further comprising:

the supporting component is arranged on the vibrating component, a vibrating gap is formed between the supporting component and the vibrating component, and the sensor component is arranged on the supporting component;

and the supporting component is provided with a through hole for communicating the second closed cavity with the vibration space.

9. The vibration pickup apparatus according to claim 8, wherein the vibration assembly includes a fixing ring, a diaphragm, and a mass fixed to the diaphragm, the diaphragm being provided to the fixing ring, the mass being fixed to a side of the diaphragm away from the sensor assembly.

10. The vibration pickup apparatus according to claim 9, wherein the support member is bonded to the fixing ring.

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