CN217434056U

CN217434056U - Chemical mechanical polishing equipment

Info

Publication number: CN217434056U
Application number: CN202220025838.6U
Authority: CN
Inventors: 林龙; 刘峻; 陈昊
Original assignee: Yangtze River Advanced Storage Industry Innovation Center Co Ltd
Current assignee: Yangtze River Advanced Storage Industry Innovation Center Co Ltd
Priority date: 2022-01-06
Filing date: 2022-01-06
Publication date: 2022-09-16
Anticipated expiration: 2032-01-06

Abstract

The embodiment of the disclosure discloses a chemical mechanical polishing device, comprising: at least two liquid supply devices; wherein each liquid supply device is loaded with different liquids; a liquid mixing device, in communication with the liquid supply device, comprising: the storage assembly is used for receiving and storing the liquid provided by the liquid supply device; the stirring paddle is positioned in the cavity for storing the liquid in the storage assembly and is used for stirring the liquid stored in the cavity; and the monitoring assembly is electrically connected with the stirring paddle and used for monitoring the relative position relation between the liquid stored in the storage assembly and the stirring paddle.

Description

Chemical mechanical polishing equipment

Technical Field

The embodiment of the disclosure relates to the technical field of semiconductor manufacturing, in particular to chemical mechanical polishing equipment.

Background

In the semiconductor industry, a wafer can be partially or entirely planarized by using a chemical mechanical polishing (cmp) apparatus, and a large amount of consumables such as polishing solution, a polishing pad, a polishing head, etc. are required in the cmp process, wherein the polishing solution is an important consumable and plays a key role in polishing materials during the polishing process.

The polishing slurry can be prepared by mixing at least two slurries, and different slurries are required to be mixed for different materials to prepare polishing slurries with different properties, so that the structure of a polishing slurry supply system is complex, the problem of uneven mixing exists, and the controllability and repeatability of the planarization process are affected. Therefore, how to simplify the structure of the slurry supply system and improve the uniformity of slurry mixing to improve the controllability and repeatability of the planarization process is a technical problem to be solved.

SUMMERY OF THE UTILITY MODEL

The disclosed embodiment provides a chemical mechanical polishing apparatus, including:

at least two liquid supply devices; wherein each liquid supply device is loaded with different liquids;

the liquid mixing device is communicated with the liquid supply device and comprises:

the storage assembly is used for receiving and storing the liquid provided by the liquid supply device;

the stirring paddle is positioned in the cavity for storing the liquid in the storage assembly and is used for stirring the liquid stored in the cavity;

and the monitoring assembly is electrically connected with the stirring paddle and used for monitoring the relative position relation between the liquid stored in the storage assembly and the stirring paddle.

In some embodiments, the chemical mechanical polishing apparatus further comprises:

the control device is respectively electrically connected with the monitoring assembly and the stirring paddle and is used for acquiring the relative position relation between the stored liquid and the stirring paddle;

the control device is also used for controlling the stirring paddle to start rotating when the stored liquid submerges the stirring paddle.

In some embodiments, the storage assembly comprises: a bottom surface and a side surface intersecting the bottom surface;

the monitoring assembly is positioned on the bottom surface of the storage assembly;

or the like, or, alternatively,

the monitoring assembly is positioned on the side surface of the storage assembly.

In some embodiments, the monitoring assembly is configured to monitor the weight of the liquid stored within the storage assembly when the monitoring assembly is positioned on the bottom surface of the storage assembly;

when the monitoring assembly is located on the side face of the storage assembly, the monitoring assembly is used for monitoring the liquid level of liquid stored in the storage assembly.

In some embodiments, when the monitoring assembly is located on a side of the storage assembly, the monitoring assembly comprises:

the first sub-monitoring unit is positioned at a first preset position on the side surface; the first preset position is used for indicating that the liquid level of the stored liquid submerges the stirring paddle;

the control device is connected with the first sub-monitoring unit and used for controlling the stirring paddle to start rotating when the first sub-monitoring unit monitors that the liquid level of the stored liquid reaches the first preset position.

In some embodiments, the monitoring component further comprises:

the second sub-monitoring unit is positioned at a second preset position on the side surface; wherein the second predetermined position is above the first predetermined position;

and the control device is respectively connected with the second sub-monitoring unit and the liquid supply device and is used for controlling the liquid supply device to stop supplying the liquid to the liquid mixing device when the second sub-monitoring unit monitors that the liquid level of the stored liquid reaches the second preset position.

at least two input conduits; the input ends of different input pipelines are communicated with different liquid supply devices, and the output ends of at least two input pipelines are communicated with the liquid mixing device;

the input valve is positioned on the input pipeline and used for opening or closing the input pipeline;

and the input driving device is connected with the liquid supply device and is used for driving the liquid in the liquid supply device to be conveyed to the liquid mixing device through the input pipeline.

the input end of the output pipeline is communicated with the liquid mixing device;

the output valve is positioned on the output pipeline and used for opening or closing the output pipeline;

the output driving device is connected with the liquid mixing device; the liquid mixing device is used for driving the liquid in the liquid mixing device to be output through the output pipeline.

In some embodiments, the monitoring component comprises: a level sensor or a gravity sensor.

In some embodiments, the chemical mechanical polishing further comprises:

the grinding head is used for adsorbing a structure to be ground;

the grinding table is used for receiving the grinding liquid provided by the liquid mixing device and grinding the structure to be ground by utilizing the grinding liquid; wherein the structure to be ground is located between the grinding head and the grinding table.

In the embodiment of the disclosure, by arranging the liquid mixing device communicated with the liquid supply device, as the liquid mixing device comprises the storage assembly and the stirring paddle positioned in the cavity of the storage assembly, at least two liquids provided by the liquid supply device can be fully mixed, which is beneficial to improving the uniformity of the mixed solution, the mixed solution which is uniformly mixed is output to the chemical mechanical polishing equipment, and the controllability and the repeatability of the planarization process are beneficial to improving.

In addition, through the monitoring assembly electrically connected with the stirring paddle, the relative position relation between the liquid stored in the cavity of the storage assembly and the stirring paddle can be monitored in real time, so that the opening/closing/rotating speed and the like of the stirring paddle can be dynamically controlled, the liquid in the cavity can be fully mixed, and the uniformity of the mixed solution can be further improved.

Furthermore, the liquid mixing device communicated with the liquid supply device is arranged, so that the mode is simple, and the structure of a grinding liquid supply system of the chemical mechanical grinding equipment is simplified.

Drawings

FIG. 1 is a schematic illustration of a simplified supply device according to an exemplary embodiment;

fig. 2a and 2b are schematic views illustrating a chemical mechanical polishing apparatus according to an embodiment of the present disclosure.

Detailed Description

The technical solutions of the present disclosure will be further explained in detail with reference to the drawings and examples. While exemplary implementations of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

The present disclosure is more particularly described in the following paragraphs with reference to the accompanying drawings by way of example. Advantages and features of the present disclosure will become apparent from the following description and claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present disclosure.

In the embodiments of the present disclosure, the terms "first", "second", and the like are used for distinguishing similar objects, and are not necessarily used for describing a particular order or sequence.

It should be noted that the technical solutions described in the embodiments of the present disclosure can be arbitrarily combined to obtain a new embodiment without conflict.

As described in the background art, different slurries are mixed according to different materials to prepare polishing solutions with different properties, and for a structure to be polished with multiple materials and complex patterns, the two-agent polishing solution can be used to achieve efficient planarization by adjusting the ratio of the two polishing solutions. However, the central slurry supply system is complicated and occupies a large space, which is not favorable for supplying and evaluating the two-dose slurry.

In the related art, the cmp apparatus can achieve flexible slurry supply in the development stage by using a simple local supply device. Fig. 1 shows a simplified supply device, two slurry paths (slurry a and slurry B) are input through two different ports of a tee pipe, and combined into one slurry path (grinding fluid) and output through the other port of the tee pipe, so as to be transmitted to a grinding table.

When two-dose slurry evaluation is performed in a simple supply apparatus, the mixing of the two slurries is very important. The two paths of slurry are directly mixed into one path of slurry through the three-way pipe, so that the problem of nonuniform slurry mixing is possibly caused, the physical and chemical properties of the slurry are nonuniform, and the controllability and repeatability of the planarization process are not facilitated.

In view of the above, the disclosed embodiments provide a chemical mechanical polishing apparatus.

Fig. 2a and 2b are schematic views illustrating a chemical mechanical polishing apparatus 200 according to an embodiment of the present disclosure. Referring to fig. 2a, the chemical mechanical polishing apparatus 200 includes:

at least two liquid supply devices 210; wherein each liquid supply device 210 is loaded with different liquids;

the liquid mixing device 220 is communicated with the liquid supply device 210 and comprises:

a storage assembly 221 for receiving and storing the liquid supplied from the liquid supply device 210;

a stirring paddle 222, which is located in the cavity of the storage module 221 for storing the liquid, and is used for stirring the liquid stored in the cavity;

and a monitoring component 223 electrically connected to the paddle 222 for monitoring the relative position relationship between the liquid stored in the storage component 221 and the paddle 222.

Illustratively, referring to FIG. 2a, the chamber of a first liquid supply 210 can be loaded with a first liquid (e.g., liquid A), and the chamber of a second liquid supply 210 can be loaded with a second liquid (e.g., liquid B), the first and second liquids being different. Although only two liquid supply devices 210 are shown in fig. 2a, the number of the liquid supply devices 210 is not limited to two, but may be three, four, five or even more, and the liquid loaded in the cavity of each liquid supply device 210 is different.

The materials of the liquid supply device 210 include: a corrosion resistant material. For example, when the liquid to be loaded is acidic (including strong acidity or weak acidity), a material that does not react with the acidic liquid may be selected, and when the liquid to be loaded is basic (including strong basicity or weak basicity), a material that does not react with the basic liquid may be selected, and the material of the liquid supply device 210 may be selected according to the nature of the liquid to be loaded, and the disclosure is not limited thereto. In this example, the liquid supply device 210 is made of teflon.

The liquid mixing device 220 is communicated with the liquid supply device 210 and is used for uniformly mixing different liquids supplied by the liquid supply device 210. The method specifically comprises the following steps:

the storage module 221 may receive at least two liquids (e.g., liquid a and liquid B) provided by the liquid supply device 210, and may further store a mixed solution configured by at least two liquids. The volume of storage assembly 221 includes: the volume of the mixed solution prepared each time is usually 70% to 80% of the volume, and the mixed solution is usually prepared on the same day according to the actual use requirement, so as to avoid the waste caused by the change of the concentration of the mixed solution due to overlong standing time, influence on use and even deterioration due to overlong standing time. The storage assembly 221 includes: a cylindrical container, a rectangular parallelepiped container, a square container, a conical container, or the like. For example, a liquid mixing tank or a liquid mixing tank.

The paddles 222 are located in the liquid-storing cavity of the storage module 221, for example, relatively close to the bottom surface of the storage module 221, and have a distance greater than zero from the bottom surface of the storage module 221, so as to prevent the paddles 222 from scratching the bottom surface of the storage module 221 when rotating. The paddle 222 includes: at least three blades (as shown in the dashed circle in fig. 2 a) fixedly connected to the main shaft can drive the main shaft to rotate, so as to stir the liquid in the cavity of the storage assembly 221.

The storage assembly 221 and the paddle 222 comprise materials that are not reactive with the mixing solution and may be selected according to the nature of the liquid to be mixed, and the disclosure is not limited thereto. In this example, the storage assembly 221 and paddle 222 are polytetrafluoroethylene.

The monitoring assembly 223 can monitor the relative position relationship between the liquid stored in the storage assembly 221 and the paddle 222 in real time. In one embodiment, the monitoring assembly 223 may directly monitor the relative position of the liquid stored in the storage assembly 221 and the paddle 222. For example, the monitoring component 223 may directly observe the level position of the stored liquid and the position of the paddle. In another embodiment, the monitoring assembly 223 may indirectly monitor the relative position of the liquid stored in the storage assembly 221 and the paddles 222. For example, the monitoring component 223 may generate monitoring information indicative of the relative positional relationship of the stored liquid to the paddles 222 based on the monitored volume or mass of the stored liquid, and the like.

In some embodiments, when the monitoring component monitors that liquid is stored in the cavity of the storage component and the liquid stored in the cavity does not contact the stirring paddle, the stirring paddle is fixed;

when the monitoring assembly monitors that liquid is stored in the cavity of the storage assembly and the liquid stored in the cavity contacts with the stirring paddle, the stirring paddle starts to rotate.

It can be appreciated that when the liquid stored in the chamber does not contact the paddle, it is difficult to agitate the liquid stored in the chamber of the storage assembly even if the paddle is rotated. In the embodiment of the disclosure, when the monitoring assembly monitors that the liquid stored in the cavity of the storage assembly contacts the stirring paddle, the stirring paddle starts to rotate, so that the stirring paddle can be prevented from idling.

In some embodiments, when the monitoring component detects that the liquid stored in the cavity of the storage component is in contact with the stirring paddle and the stirring paddle is not submerged, the stirring paddle is driven to rotate at a first rotating speed;

when the monitoring assembly monitors that the liquid stored in the cavity of the storage assembly submerges the stirring paddle, the stirring paddle is driven to rotate at a second rotating speed; wherein the second rotation speed is greater than the first rotation speed.

It will be appreciated that when the paddle is not submerged in the liquid contained within the chamber, the paddle will rotate at a greater speed and will cause splashing of the liquid. In the embodiment of the disclosure, when the monitoring assembly monitors that the stirring paddle is completely immersed in the liquid stored in the cavity of the storage assembly, the stirring paddle is driven to rotate at a second rotating speed which is greater than the first rotating speed, so that the splashing of the liquid is reduced, and meanwhile, the liquid in the cavity is favorably and fully mixed, so that the uniformity of the grinding liquid is improved.

In some embodiments, the monitoring assembly 223 is further configured to generate monitoring information based on a monitored relative position of the fluid stored in the storage assembly to the paddles 222.

In some embodiments, monitoring information includes:

the first sub-monitoring information is used for indicating that the liquid stored in the storage assembly does not contact the stirring paddle;

the second sub-monitoring information is used for indicating that the liquid stored in the storage assembly contacts the stirring paddle and is not immersed in the stirring paddle;

and the third sub-monitoring information is used for indicating that the liquid stored in the storage assembly submerges the stirring paddle.

Here, the liquid level of the stored liquid not contacting the stirring paddle may be lower than the plane where the bottom of the blade of the stirring paddle is located.

The liquid level of the stored liquid is not lower than the plane where the bottom of the fan blade of the stirring paddle is located and is not higher than the plane where the top of the fan blade of the stirring paddle is located.

The liquid immersion stirring paddle can be a plane where the liquid level of the liquid stored in the storage assembly is flush with the top of the fan blade of the stirring paddle, and can also be a plane where the liquid level of the liquid stored in the storage assembly is higher than the top of the fan blade of the stirring paddle.

The liquid mixing device further comprises a driving device for driving the stirring paddle to rotate, for example, when the monitoring component generates the second sub-monitoring information, the driving device drives the stirring paddle to rotate at a first rotating speed, and when the monitoring component generates the third sub-monitoring information, the driving device drives the stirring paddle to rotate at a second rotating speed. Here, the paddle may rotate in a clockwise direction or a counterclockwise direction, and the present disclosure is not limited thereto.

Compared with the chemical mechanical polishing equipment in the related art which adopts a simple local supply device, two paths of slurry are mixed into one path of slurry through a three-way pipe, in the embodiment of the disclosure, through arranging the liquid mixing device communicated with the liquid supply device, as the liquid mixing device comprises the storage assembly and the stirring paddle positioned in the cavity of the storage assembly, at least two kinds of liquid provided by the liquid supply device can be fully mixed, the uniformity of the mixed solution can be improved, the uniformly mixed solution can be output to the chemical mechanical polishing equipment, and the controllability and the repeatability of the planarization process can be improved.

In some embodiments, the chemical mechanical polishing apparatus 200 further comprises:

the control device is electrically connected with the monitoring component 223 and the stirring paddle 222 respectively and is used for acquiring the relative position relation between the stored liquid and the stirring paddle 222;

the control device is further used for controlling the stirring paddle 222 to start rotating when the stored liquid submerges the stirring paddle 222.

Illustratively, the control device (not shown) may include a general purpose processor chip or other logic device chip or the like for obtaining the relative positional relationship of the deposited liquid and the paddles 222. For example, the monitoring result observed by the monitoring component or the monitoring information generated by the monitoring component is received to obtain the relative position relationship between the stored liquid and the stirring paddle 222.

The stirring paddle can start to rotate or stop rotating according to the instruction output by the control device. For example, when the monitoring assembly monitors that the stored liquid does not submerge the stirring paddle, the control device outputs a rotation stopping instruction to the driving device so as to keep the stirring paddle fixed; when the monitoring assembly monitors that the stored liquid submerges the stirring paddle, the control device outputs a rotation starting command to the driving device so as to control the stirring paddle to start rotating.

For example, when the monitoring assembly detects that the volume/mass/level of the stored liquid reaches a certain preset value, it can be determined that the stored liquid has submerged the paddle, and the control device controls the paddle to start rotating.

Here, the preset value may be determined according to at least one parameter of a plane position of a top of a blade of the paddle, a plane position of a bottom in the storage assembly chamber, a bottom area in the storage assembly chamber, a ratio of the mixed liquid, and a density of the mixed liquid.

It should be noted that when the liquid stored in the storage assembly does not submerge the stirring paddle, the stirring paddle starts to rotate, which may cause the liquid to splash and adhere to the inner cavity wall of the storage assembly, resulting in the actual concentration of the prepared mixed solution being less than the theoretical concentration/calculated concentration, and affecting the planarization effect.

In the embodiment of the disclosure, the control device electrically connected with the monitoring assembly and the stirring paddle is arranged, so that the relative position relationship between the stored liquid and the stirring paddle can be acquired in real time. When the monitoring result or the monitoring information obtained by the control device indicates that the stored liquid is immersed in the stirring paddle, the control device controls the stirring paddle to start rotating, so that the accurate control of the moment when the stirring paddle starts rotating is facilitated, the liquid splashing caused by the premature rotation of the stirring paddle is avoided, the fact that the actual concentration of the prepared mixed solution is closer to the theoretical concentration/the calculated concentration is facilitated, and the planarization treatment effect is ensured.

In some embodiments, as shown with reference to fig. 2a, storage assembly 221 includes: a bottom surface 221a and a side surface 221b intersecting the bottom surface 221 a;

a monitoring module 223 positioned on the bottom surface 221a of the storage module 221;

or the like, or, alternatively,

and a monitoring module 223 positioned on the side 221b of the storage module 221.

The angle α between the bottom surface 221a and the side surface 221b of the storage unit 221 satisfies the relationship: alpha is more than 0 degree and less than 180 degrees. For example, when the storage module 221 is a regular cylindrical container, a rectangular parallelepiped container, or a square container, the bottom surface 221a of the storage module 221 is perpendicular to the side surface 221b with an angle α of 90 °. When the storage unit 221 is an irregular tapered container, the bottom surface 221a of the storage unit 221 intersects the side surface 221b, and the included angle α satisfies the relationship: alpha is more than 0 degree and less than 90 degrees, or alpha is more than 90 degrees and less than 180 degrees.

The bottom surface 221a further includes an outer bottom surface and an inner bottom surface, and the side surface 221b further includes an outer side surface and an inner side surface. Here, the inner bottom surface or inner side surface means a surface that is in contact with the liquid in the cavity of the storage module 221, and the outer bottom surface or outer side surface means a surface that is not in contact with the liquid in the cavity of the storage module 221.

Preferably, the monitoring member 223 is located on an outer bottom surface of the storage member 221, or the monitoring member 223 is located on an outer side surface of the storage member 221. By locating the monitoring component 223 on the outer bottom or side surface, damage to the monitoring component by portions of the corrosive liquid may be reduced.

In other embodiments, the monitoring assembly may also be located on the inner bottom surface of the storage assembly 221, or the monitoring assembly 223 may be located on the inner side surface of the storage assembly 221. For example, when the monitoring assembly is not damaged by the liquid in the cavity of the storage assembly, or when the surface of the monitoring assembly is coated with a corrosion-resistant coating.

In the embodiment of the present disclosure, the monitoring component may be located on a bottom surface (outer bottom surface or inner bottom surface) or a side surface (outer side surface or inner side surface) of the storage component, so as to increase the diversity of the arrangement modes of the monitoring component in the liquid mixing device, and a person skilled in the art may select the monitoring component according to actual monitoring requirements, which is not further limited in the present disclosure.

In some embodiments, the monitoring assembly 223 is used to monitor the weight of the liquid stored within the storage assembly 221 when the monitoring assembly 223 is positioned on the bottom surface 221a of the storage assembly 221.

Illustratively, the monitoring component 223 includes a gravity sensor, which can monitor the weight of the liquid stored in the storage component 221 in real time, and generate monitoring information including the mass or volume of the storage component 221, and when the monitoring information indicates that the volume/mass of the stored liquid reaches a predetermined value, it can be determined that the stored liquid has submerged the paddle, and the paddle is driven to rotate.

In some embodiments, the monitoring assembly 223 is configured to monitor a level of the liquid stored within the storage assembly 221 when the monitoring assembly 223 is positioned on the side 221b of the storage assembly 221.

Illustratively, the monitoring component 223 includes a liquid level sensor, which can monitor the liquid level or the liquid level position of the liquid stored in the storage component 221 in real time, and generate monitoring information including the liquid level or the liquid level position of the liquid, and when the monitoring information indicates that the liquid level or the liquid level position of the liquid reaches a certain preset value, it can be determined that the stored liquid has submerged the paddle, and the paddle is driven to start rotating. In a particular example, the monitoring assembly 223 includes a non-contact level sensor.

It can be understood that, in the embodiment of the present disclosure, the type of the monitoring assembly can be appropriately selected according to the position where the monitoring assembly needs to be disposed, so as to monitor the relative position relationship between the liquid stored in the storage assembly and the stirring paddle in real time.

In some embodiments, referring to fig. 2a, when the monitoring assembly 223 is located at the side 221b of the storage assembly 221, the monitoring assembly 223 includes:

a first sub-monitoring unit 2231 located at a first preset position on the side surface 221 b; wherein the first predetermined position is used to indicate that the level of the stored liquid submerges the paddles 222;

and a control device connected to the first sub-monitoring unit 2231, configured to control the stirring paddle 222 to start rotating when the first sub-monitoring unit 2231 detects that the liquid level of the stored liquid reaches a first preset position.

For example, the first predetermined position may be flush with a plane where the top of the blade of the paddle is located, and is used to indicate that the top of the blade of the paddle is submerged by the level of the stored liquid. When the first sub-monitoring unit 2231 monitors that the liquid level of the stored liquid reaches the first preset position, the control device outputs a rotation start instruction to the driving device to control the paddle to start rotating.

Exemplarily, referring to fig. 2a, the first sub-monitoring unit 2231 is located on an outer side surface of the storage assembly 221, and includes: a non-contact level sensor, for example an ultrasonic level sensor or a radar level sensor.

In the embodiment of the disclosure, the first sub-monitoring unit is arranged at the first preset position on the side surface of the storage assembly, and the first preset position is used for indicating the liquid level of the stored liquid to immerse the stirring paddle, so that when the first sub-monitoring unit monitors that the liquid level of the stored liquid reaches the first preset position, the control device can timely control the stirring paddle to start rotating.

In some embodiments, as shown with reference to fig. 2a, the monitoring component 223 further comprises:

a second sub-monitoring unit 2232 located at a second preset position on the side surface 221 b; wherein the second preset position is located above the first preset position;

and the control device is respectively connected with the second sub-monitoring unit 2232 and the liquid supply device 210, and is configured to control the liquid supply device 210 to stop supplying the liquid to the liquid mixing device 220 when the second sub-monitoring unit 2232 monitors that the liquid level of the stored liquid reaches a second preset position.

For example, the liquid supply device 210 may start or stop supplying liquid according to a command output by the control device. For example, when the liquid level of the liquid in the cavity of the storage assembly 221 reaches the second preset position, the control device outputs a command of stopping the liquid supply to the liquid supply device 210, so as to control the liquid supply device 210 to stop supplying the liquid to the liquid mixing device 220.

Here, the second predetermined position may be an upper limit set by the liquid level in the chamber of the storage assembly 221 to prevent the liquid level in the chamber of the storage assembly 221 from being too high. The second sub-monitoring unit 2232 may be the same as the first sub-monitoring unit 2231, and will not be described again.

In some embodiments, referring to fig. 2a, the control device is further configured to control the liquid supply device 210 to decrease the flow rate of the liquid supplied to the liquid mixing device 220 when the second sub-monitoring unit 2232 monitors that the distance between the liquid level of the stored liquid and the second preset position is smaller than the preset distance.

For example, the second sub-monitoring unit 2232 may monitor the level of the stored liquid in real time and generate monitoring information. When the shortest distance between the liquid level of the liquid and the second preset position is monitored to be smaller than or equal to the preset distance, the control device outputs a command of reducing the liquid supply flow to the liquid supply device 210 so as to control the liquid supply device 210 to reduce the flow of the liquid conveyed to the liquid mixing device 220. Here, the preset distance indicates that the liquid level of the stored liquid is about to reach the second preset position, and may be set according to the design of the actual chemical mechanical polishing apparatus.

It can be understood that, in the embodiment of the present disclosure, the second sub-monitoring unit monitors the position relationship between the liquid level of the stored liquid and the second preset position, and the flow rate of the liquid delivered by the liquid supply device to the liquid mixing device can be dynamically adjusted, so as to prevent the liquid level in the cavity of the storage assembly from being too high.

In some embodiments, referring to fig. 2a, the cmp apparatus 200 further comprises:

at least two input conduits 230; wherein, the input ends 230a of different input pipelines 230 are communicated with different liquid supply devices 210, and the output ends 230b of at least two input pipelines 230 are communicated with the liquid mixing device 220;

an input valve 240 on the input pipe 230 for opening or closing the input pipe 230;

and the input driving device 250 is connected with the liquid supply device 210 and is used for driving the liquid in the liquid supply device 210 to be conveyed to the liquid mixing device 220 through the input pipeline 230.

Illustratively, referring to FIG. 2a, the input end 230a of the input pipe 230 is in communication with the liquid supply device 210, the output end 230b of the input pipe 230 is in communication with the storage assembly 221, and the output end 230b of the input pipe 230 can extend to a position relatively close to the bottom in the cavity of the storage assembly 221 to avoid liquid remaining at the top in the cavity of the storage assembly 221, and the input pipe 230 can be made of a polytetrafluoroethylene material to avoid corrosion of the input pipe 230 by the liquid.

The input valves 240 are used to control the flow of the liquid from the input pipes 230 to the storage module 221, and in one embodiment, at least one input valve 240 is disposed on each input pipe 230, so that the flow of the liquid from each input pipe 230 to the storage module 221 can be independently controlled.

The input valve 240 includes: manual valves or automatic valves. The automatic valve may include at least one of a pneumatic control valve, an electric control valve, and a hydraulic control valve, and the type of the input valve 240 may be selected as desired. The number of input valves 240 may be one or more.

The input drive 250 is coupled to the liquid supply 210 and is operable to draw liquid from the liquid supply 210 and to regulate the pressure of the liquid in the input line 230. The input driving device 250 comprises a liquid inlet pump with switching and speed regulating functions, and can pump the liquid in the liquid supply device 210 through a certain pressure and change the flow rate of the liquid on the input pipeline 230 by regulating the speed of the pump.

In the embodiment of the disclosure, at least two input pipelines connected with at least two liquid supply devices and the liquid mixing device are arranged, each input pipeline is provided with an input valve and an input driving device, and the opening or closing of each input pipeline can be independently controlled and the flow rate of liquid on each input pipeline can be independently adjusted.

at least one output pipeline 260, wherein the input end 260a of the output pipeline 260 is communicated with the liquid mixing device 220;

an output valve 270 on the output pipe 260 for opening or closing the output pipe 260;

an output driving device 280 connected to the liquid mixing device 220; for driving the liquid in the liquid mixing device 220 to be output through the output pipe 260.

Illustratively, referring to FIG. 2a, the input end 260a of the output conduit 260 communicates with the storage assembly 221, the output end of the output conduit 260 may communicate with the grinding table 291, and the material of the output conduit 260 may be the same as the material of the input conduit 230.

The chemical mechanical polishing apparatus 200 further comprises a plurality of output pipelines 260, output ends of different output pipelines 260 are communicated with different polishing tables 291, and input ends 260a of the plurality of output pipelines 260 are communicated with the liquid mixing device 220.

It should be emphasized that the liquid mixing device 220 can also be connected to other machines which need to use the mixed solution, not limited to the grinding table 291, for example, the liquid mixing device 220 can also be connected to a wet etching apparatus for delivering the mixed wet etchant to the wet etching apparatus.

The output valves 270 are used to control the flow of the output pipes 260 to the grinding table 291, and in a specific example, at least one output valve 270 is disposed on each output pipe 260, so that the flow of the liquid from each output pipe 260 to the grinding table 291 can be controlled independently.

The output valve 270 includes: manual valves or automatic valves. The automatic valve may include at least one of a pneumatic control valve, an electric control valve, and a hydraulic control valve, and the type of the output valve 270 may be selected as desired. The number of the output valves 270 may be one or more.

The output driving device 280 is connected to the liquid mixing device 220, and can be used for pumping out the liquid in the liquid mixing device 220 and adjusting the pressure of the liquid in the output pipeline 260. The output driving device 280 comprises a liquid outlet pump with switching and speed regulating functions, which can pump the liquid in the liquid mixing device 220 under a certain pressure and can also change the flow rate of the liquid on the output pipeline 260 by regulating the pump speed.

In the embodiment of the disclosure, by arranging at least one output pipeline connecting the liquid mixing device and the grinding table, and arranging an output valve and an output driving device on the output pipeline, the opening or closing of the output pipeline can be independently controlled, and the flow rate of the mixed solution on the output pipeline can be adjusted, so that the controllability of the planarization treatment can be improved.

In some embodiments, referring to fig. 2b, the cmp apparatus 200 further comprises:

a polishing head 292 for adsorbing the structure to be polished 300;

a grinding table 291, configured to receive the grinding fluid provided by the fluid mixing device 220, and grind the structure 300 to be ground by using the grinding fluid; wherein the structure to be polished 300 is located between the polishing head 292 and the polishing table 291.

The polishing head 292 may include a circular platform or a square platform, and an adsorption device is disposed in the polishing head 292, and the adsorption device adsorbs the structure 300 to be polished by vacuum adsorption or electrostatic adsorption. For example, the structure 300 to be polished includes a polishing surface and a non-polishing surface which are oppositely disposed, and when performing the chemical mechanical polishing, the non-polishing surface of the structure 300 to be polished is adsorbed by the adsorption device, so that the polishing surface of the structure 300 to be polished faces the polishing table 291.

The structure to be ground 300 may include a substrate or a substrate formed with a stacked structure. The constituent materials of the substrate may include: elemental semiconductor materials (e.g., silicon, germanium), group iii-v compound semiconductor materials, group ii-vi compound semiconductor materials, organic semiconductor materials, or other semiconductor materials known in the art.

In some embodiments, the stacked structure may be a stacked structure in a 3D NAND memory, including alternately arranged insulating layers and sacrificial layers, or alternately arranged insulating layers and gate layers. In other embodiments, the stacked structure may also be a phase change memory cell stacked structure in a phase change memory, and includes a first electrode layer, a first electrode layer and a gate layer, or the first electrode layer, the gate layer and a second electrode layer, which are stacked in sequence from bottom to top.

It is to be understood that the structure to be ground 300 is representative of a structure that requires grinding, polishing, or planarization, and is not intended to describe a particular type.

The surface of the grinding table 291 facing the structure 300 to be ground is provided with a polishing pad, the surface of the grinding table 291 contacting the structure 300 to be ground is sprayed with grinding liquid, and the grinding surface of the structure 300 to be ground can be partially or wholly planarized by using the physical action of the polishing pad and the chemical action of the grinding liquid.

In the embodiment of the disclosure, the grinding table of the chemical mechanical grinding equipment can receive the grinding liquid uniformly mixed by the liquid mixing device to grind the structure to be ground, which is beneficial to improving the controllability and repeatability of chemical mechanical grinding and improving the grinding effect of the structure to be ground.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A chemical mechanical polishing apparatus, comprising:

a liquid mixing device, in communication with the liquid supply device, comprising:

2. The chemical mechanical polishing apparatus of claim 1, further comprising:

3. The chemical mechanical polishing apparatus of claim 2, wherein the storage assembly comprises: a bottom surface and a side surface intersecting the bottom surface;

or the like, or, alternatively,

4. A chemical mechanical polishing apparatus according to claim 3,

the monitoring assembly is used for monitoring the weight of the liquid stored in the storage assembly when the monitoring assembly is positioned on the bottom surface of the storage assembly;

5. The chemical mechanical polishing apparatus of claim 3, wherein when the monitoring assembly is positioned on a side of the storage assembly, the monitoring assembly comprises:

6. The chemical mechanical polishing apparatus of claim 5, wherein the monitoring assembly further comprises:

the second sub-monitoring unit is positioned at a second preset position on the side surface; wherein the second preset position is located above the first preset position;

7. The chemical mechanical polishing apparatus of claim 1, further comprising:

8. The chemical mechanical polishing apparatus of claim 1, further comprising:

9. The chemical mechanical polishing apparatus of claim 1, wherein the monitoring assembly comprises: a level sensor or a gravity sensor.

10. The chemical mechanical polishing apparatus of claim 1, further comprising:

the grinding head is used for adsorbing a structure to be ground;