CN114378714A - Grinding disc and polishing equipment - Google Patents
Grinding disc and polishing equipment Download PDFInfo
- Publication number
- CN114378714A CN114378714A CN202011119552.6A CN202011119552A CN114378714A CN 114378714 A CN114378714 A CN 114378714A CN 202011119552 A CN202011119552 A CN 202011119552A CN 114378714 A CN114378714 A CN 114378714A
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- Prior art keywords
- polishing
- grinding
- disc
- polishing pad
- waste liquid
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- 238000005498 polishing Methods 0.000 title claims abstract description 230
- 238000000227 grinding Methods 0.000 title claims abstract description 66
- 239000007788 liquid Substances 0.000 claims description 67
- 239000002699 waste material Substances 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 21
- 238000007599 discharging Methods 0.000 claims 1
- 238000007517 polishing process Methods 0.000 abstract description 13
- 239000012530 fluid Substances 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000002002 slurry Substances 0.000 description 18
- 239000010410 layer Substances 0.000 description 16
- 230000005484 gravity Effects 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a grinding disc and polishing equipment, relates to the technical field of semiconductors, and is used for preventing grinding fluid from being thrown away from the grinding disc in a polishing process, saving the grinding fluid and reducing the manufacturing cost of a semiconductor device. The height of the edge portion of the abrasive disk is greater than the height of the central portion of the abrasive disk. The grinding disc is applied to polishing equipment.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a grinding disc and polishing equipment.
Background
The chemical mechanical polishing apparatus is an apparatus for obtaining a planarized polished surface by combining chemical etching with mechanical rubbing. In order to improve the polishing efficiency during the polishing process, the chemical mechanical polishing apparatus includes a polishing disc and a polishing head that rotate at a certain speed and in the same or opposite directions so as to remove the soft layer under the mechanical action of the abrasive and the polishing pad.
However, during the rotation of the polishing disk, approximately 70% of the slurry supplied to the polishing pad by the slurry supply device is thrown off the polishing pad by centrifugal force, thereby causing a waste of slurry and eventually increasing the manufacturing cost of the semiconductor device.
Disclosure of Invention
The invention aims to provide a grinding disc and a polishing device, which are used for preventing grinding fluid from being thrown away from the grinding disc in the polishing process, saving the grinding fluid and reducing the manufacturing cost of a semiconductor device.
In order to achieve the above object, the present invention provides an abrasive disk having an edge portion with a height greater than that of a central portion of the abrasive disk.
Compared with the prior art, the edge part of the grinding disc provided by the invention has a height which is larger than that of the central part of the grinding disc. In this case, when the polishing disk rotates during polishing, the slurry dropped onto the polishing disk is subjected not only to the centrifugal force generated during rotation of the polishing disk but also to gravity and the supporting force provided by the polishing disk to the slurry. The centrifugal force can enable the grinding fluid to move along the direction far away from the center of the grinding disc, and the resultant force of the supporting force and the gravity can enable the grinding fluid to move along the direction close to the center of the grinding disc, so that when the gravity, the centrifugal force and the supporting force which are applied to the grinding fluid are balanced with each other, the grinding fluid cannot be thrown away from the grinding disc even if the grinding disc rotates in the polishing process, the waste of the grinding fluid can be avoided, and the manufacturing cost of a semiconductor device is reduced.
The present invention also provides a polishing apparatus comprising: the polishing head, the polishing liquid supply device, the polishing pad and the polishing disc provided by the technical scheme are provided; the grinding fluid supply device is positioned above the grinding disc, and the polishing pad is arranged on the upper surface of the grinding disc;
when the polishing equipment polishes a polishing object, the polishing liquid supply device supplies polishing liquid to the polishing pad, and the polishing head clamps the polishing object to be in contact with the polishing pad.
Compared with the prior art, the polishing equipment provided by the invention has the same beneficial effects as the grinding disc provided by the technical scheme, and the details are not repeated.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a prior art CMP apparatus;
fig. 2a is a schematic longitudinal sectional view of a first polishing disc according to an embodiment of the present invention;
FIG. 2b is a schematic longitudinal sectional view of a second abrasive disk according to an embodiment of the present invention;
FIG. 2c is a schematic longitudinal sectional view of a third abrasive disk according to an embodiment of the present invention;
FIG. 2d is a schematic longitudinal sectional view of a fourth polishing disk according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a polishing apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic view of the stress condition of the grinding disk in the rotation process according to the embodiment of the present invention.
Reference numerals:
a polishing platen 1, a polishing head 2, a polishing liquid supply device 3, a polishing pad 4, a polishing liquid 5, a waste liquid discharge portion 6, a waste liquid discharge pipe 61, and a sealing cover 62.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed. In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The chemical mechanical polishing process is a process in which chemical etching is combined with mechanical abrasion to obtain a planarized polished surface. Specifically, fig. 1 shows a schematic structural diagram of a chemical mechanical polishing apparatus in the prior art. Referring to fig. 1, the chemical mechanical polishing apparatus includes: a polishing disk 1, a polishing head 2, a polishing liquid supply device 3, and a polishing pad 4. The polishing pad 4 is located on the upper surface of the grinding apparatus. When the chemical mechanical polishing apparatus is used to polish an object to be polished (e.g., a wafer), the polishing liquid supply device 3 supplies the polishing liquid 5 to the polishing pad 4 on the polishing platen 1. The polishing head 2 is brought into contact with the polishing pad 4 while holding a polishing object therebetween, and causes a surface material of the polishing object to chemically react with an oxidizing agent, a catalyst, and the like in the polishing liquid 5, thereby generating a soft layer which is relatively easy to remove. The softer layer is then removed by the mechanical action of the abrasive in the slurry 5 and the polishing pad 4. And repeating the chemical action process and the mechanical action process until the surface of the grinding object is polished, so that the grinding object with a relatively flat surface can be obtained. In the above polishing process, the polishing disc 1 and the polishing head 2 rotate at a certain speed and in the same or opposite directions, so as to remove the soft layer under the mechanical action of the abrasive and the polishing pad 4, thereby improving the polishing efficiency.
However, during the rotation of the grinding disc, the polishing pad on the grinding disc is also driven to rotate. In the above case, since the surfaces of the polishing platen and the polishing pad are relatively flat, approximately 70% of the polishing liquid supplied to the polishing pad by the polishing liquid supply device is thrown off the polishing pad by the centrifugal force. In order to ensure the polishing effect, the polishing liquid supply device is required to supply more polishing liquid to the polishing pad, and the polishing liquid thrown off the polishing pad does not substantially participate in the polishing operation, so that the polishing liquid is wasted, and the manufacturing cost of the semiconductor device is increased.
In order to solve the above technical problem, an embodiment of the present invention provides an abrasive disk that can be applied to a polishing apparatus for planarizing a semiconductor device.
Referring to fig. 2a to 2d, the height of the edge portion of the above-described abrasive disk 1 is greater than the height of the central portion of the abrasive disk 1.
Specifically, referring to fig. 2a, the upper surface of the central portion of the abrasive disc 1 may be planar. Also, the height of the edge portion of the abrasive disk 1 may be increased linearly in a direction away from the central portion. Meanwhile, the minimum top height of the edge portion is greater than or equal to the height of the upper surface of the central portion. Alternatively, the abrasive disc 1 may have a height which increases linearly in a direction away from the central portion, see fig. 2b to 2 d. At this time, the polishing disk 1 is a funnel-type polishing disk. The degree of the linear increase of the height of the grinding disc 1 may be set according to the actual application, and is not limited in particular.
In an example, referring to fig. 2b to 2d, the upper surface of the polishing disc 1 may be a conical surface, and the conical surface forms a space gradually expanding outward in a direction away from the polishing disc 1. The conical surface has a cone angle of less than 174.
Specifically, the conical surface has a conical angle that determines the degree of height variation from the central portion to the edge portion of the abrasive disk. Wherein, the larger the cone angle of the cone surface, the smaller the degree of height change from the central part to the edge part of the grinding disc. At this time, the smaller the supporting force that the polishing disk can provide to the polishing liquid during rotation. Conversely, the smaller the cone angle the conical surface has, the greater the degree of height variation from the central portion to the edge portion of the abrasive disk. At this time, the larger the supporting force that the polishing disk can provide for the polishing liquid during rotation. In this case, since the magnitude of the centrifugal force applied to the polishing liquid is related to the rotational speed of the polishing disk, the taper angle of the tapered surface can be set according to the rotational speed of the polishing disk and other practical applications so that the polishing liquid is not thrown out during the rotation of the polishing disk. In addition, the specific specification and shape of the abrasive disk may also be set according to the actual application as long as the height of the edge portion of the abrasive disk can be made larger than the height of the central portion of the abrasive disk.
Exemplarily, referring to fig. 2b and 2c, the longitudinal section of the abrasive disc 1 may comprise two opposite right-angled triangular sections or two opposite right-angled trapezoidal sections. Of course, the shape of the longitudinal section of the abrasive disc 1 may be any desired shape. For example: referring to fig. 2d, the longitudinal section of the grinding disk 1 may further include two opposite special-shaped section portions, and the special-shaped section portions may be composed of a rectangular section portion and a right-angled triangular section portion on the rectangular section portion.
In the practical process, referring to fig. 3 and 4, when the polishing disc 1 provided by the embodiment of the present invention rotates during the polishing process, the slurry 5 dropped on the polishing disc 1 is subjected to not only the centrifugal force F2 generated during the rotation of the polishing disc 1, but also the gravity G and the supporting force F1 provided by the polishing disc 1 to the slurry 5. The centrifugal force F2 causes the slurry 5 to move in a direction away from the central portion, and the resultant force of the supporting force F1 and the gravity G causes the slurry 5 to move in a direction close to the central portion, so that when the gravity G, the centrifugal force F2 and the supporting force F1, which are applied to the slurry 5, are balanced with each other, the slurry 5 is not thrown away from the polishing disk 1 even if the polishing disk 1 rotates during the polishing process, thereby avoiding the waste of the slurry 5 and reducing the manufacturing cost of the semiconductor device.
An embodiment of the present invention also provides a polishing apparatus, referring to fig. 3, including: a polishing head 2, a polishing liquid supply device 3, a polishing pad 4, and the polishing disk 1 provided in the above embodiments.
Specifically, the polishing head may be any polishing head capable of holding and rotating a polishing target.
Illustratively, referring to fig. 3, the abrading head 2 may include: grinding head, pivot, holding ring and lining membrane. The grinding surface of the grinding head is provided with a groove, and the groove is an accommodating space of a grinding object. The rotating shaft is arranged on the other surface of the grinding head opposite to the grinding surface. The driving device (such as a motor) can drive the grinding head to rotate through the rotating shaft. The positioning ring is arranged on the grinding surface of the grinding head and used for limiting the position of a grinding object. Specifically, during the actual polishing process, the positioning ring can prevent the grinding object from deviating from the rail under the action of the rotating force. The lining film is positioned in the groove, and the top of the grinding object is contacted with the grinding head through the lining film. The lining film can be used for adapting to the top of an abrasive object and compensating the unevenness caused by the top of the abrasive object and particles.
Referring to fig. 3, the polishing liquid supply device 3 is located above the polishing platen 1. The polishing liquid supply device 3 may be any device capable of supplying the polishing liquid 5 to the polishing pad 4. For example: the slurry supply means 3 may include a nozzle. The nozzle may spray the polishing liquid 5 toward the polishing pad 4 during the polishing process.
Referring to fig. 3, the above-described polishing pad 4 is disposed on the upper surface of the abrasive disc 1. Specifically, the polishing pad 4 may be fixedly attached to the upper surface of the polishing platen 1 by means of bonding or the like. The structure and specification of the polishing pad 4 may be set according to the structure and specification of the abrasive disk 1. The following are exemplary: as described above, when the polishing disc 1 is a funnel-type polishing disc, the polishing pad 4 may be a funnel-type polishing pad. At this time, the bottom of the polishing pad 4 may be more closely attached to the upper surface of the abrasive disk 1.
In some cases, the above polishing apparatus may further include an end point detection device and an end point control device. The end point detection device can monitor the polishing progress when polishing equipment polishes a ground object, and prevents the surface layer material of the ground object from being removed too much or the material from being removed insufficiently. The terminal control device can be respectively connected with an end point detection device, a grinding fluid supply device, a device for driving a grinding disc to rotate, a device for driving a grinding head to rotate and clamp, and the like, so as to realize a polishing strategy for a grinding object. The connection means may be a communication connection, an electrical connection, or the like. Specifically, the end point detection device, the end point control device, the device for driving the polishing disk to rotate, and the device for driving the polishing head to rotate and clamp are not the main features of the embodiments of the present invention, and therefore, only those components are briefly described in the present specification so that those skilled in the art can easily realize the embodiments provided by the present invention.
In practical application, referring to fig. 3 and 4, the polishing liquid supply device 3 may supply the polishing liquid 5 to the polishing pad 4 when the polishing apparatus polishes the polishing object. Next, the polishing head 2 holds the polishing object in contact with the polishing pad 4, and chemically reacts the surface material of the polishing object with the polishing liquid 5, thereby forming a soft layer that is easily removed on the surface of the polishing object in contact with the polishing pad 4. During the rotation of the grinding disc 1 and the grinding head 2, the soft layer can be removed by the mechanical action of the grinding material and the polishing pad 4, and the grinding object can be polished. In the above polishing process, since the height of the edge portion of the polishing platen 1 is greater than the height of the central portion of the polishing platen 1, when the gravity G applied to the polishing slurry 5, the centrifugal force F2 generated by the rotation, and the supporting force F1 provided by the polishing platen 1 are balanced with each other, the polishing slurry 5 is not thrown off the polishing platen 1 even if the polishing platen 1 rotates during the polishing process, so that the waste of the polishing slurry 5 can be avoided, and the manufacturing cost of the semiconductor device can be reduced.
In one example, referring to fig. 3, the polishing apparatus may further include a waste liquid discharge portion 6 disposed at a central portion of the polishing pad 1, the waste liquid discharge portion 6 being configured to discharge liquid on the polishing pad 4 after polishing is completed.
Specifically, when the polishing device polishes the polishing object, the waste liquid discharge portion is in a closed state, so that the polishing liquid on the polishing pad is prevented from being discharged from the waste liquid discharge portion, and waste of the polishing liquid is avoided. After the polishing device polishes the polishing object to a required target position and washes the polishing object, the waste liquid discharge device is in an open state, and discharges the grinding liquid, deionized water and the like on the polishing pad, so that the grinding liquid is prevented from excessively corroding the polishing object, and meanwhile, preparation is made for the next polishing object under the mask.
For example, referring to fig. 3, the waste liquid discharge part 6 may include a waste liquid discharge pipe 61 and a sealing cap 62. The waste liquid discharge pipe 61 is provided on the side of the polishing disk 1 remote from the polishing head 2. The sealing cap 62 is used to close the inlet of the waste liquid discharge pipe 61 at the time of polishing and to open the inlet of the waste liquid discharge pipe 61 after polishing is completed.
Specifically, because of the height that the edge portion of abrasive disc is higher than the height of central part, when finishing polishing and the abrasive disc is in quiescent condition, under the effect of gravity, lapping liquid can be along the direction motion of being close to the abrasive disc central part to assemble at the central part. In this case, in order to facilitate the discharge of all the polishing slurry, deionized water, and the like to be discharged from the polishing pad, the above-mentioned waste liquid discharge pipe may be provided on the rear surface of the central portion having the lowest height of the top. For example: referring to fig. 3, as described above, when the upper surface of the above-described polishing disk 1 is a conical surface, the waste liquid discharge pipe 61 may be provided on the back surface of the polishing disk 1 at the vertex of the conical surface, and the inlet of the waste liquid discharge pipe has a height smaller than the minimum top height of the polishing pad 4.
As for the sealing cover, the position of the sealing cover may be set according to the position of the waste liquid discharge pipe. For example: referring to fig. 3, the sealing cover 62 is disposed at the geometric center of the abrasive disk 1. The top height of the seal cover 62 is equal to the minimum top height of the polishing pad 4. Further, the sealing cover may be any one capable of closing and opening the inlet of the waste liquid discharge pipe. For example: the sealing cap may be a drain valve.
In one example, in order to achieve automated control of the waste liquid discharge operation, the above polishing apparatus may further include a sealing cover control device. The sealing cover control device is used for enabling the sealing cover to be in a closed state during polishing and enabling the sealing cover to be in an open state after polishing is finished.
For example, the sealing cover control device may be communicatively or electrically connected with a terminal control device included in the polishing apparatus, or the like. The terminal control means may transmit closing control information to the seal cap control means before the polishing apparatus polishes the polishing object. The seal cover control device may control the seal cover to be in a closed state according to the closing control information after receiving the closing control information to prevent the abrasive liquid from being discharged from the waste liquid discharge pipe when the polishing apparatus polishes the object to be polished. And, the polishing apparatus includes an end point detecting device that can monitor the progress of polishing in real time during the polishing process. When the end point detection device monitors that the polishing equipment finishes polishing the ground object, the end point detection device can send polishing completion information to the terminal control device. The end point detection means may send the opening control information to the seal cover control means according to the polishing completion information after receiving the polishing completion information. The sealing cover control device can control the sealing cover to be opened according to the opening control information after receiving the opening control information, so that grinding liquid, deionized water and the like can be discharged through the waste liquid discharge pipe. That is to say, under terminal control device's regulation and control, sealed lid controlling means can be before the polishing or the polishing finishes the on-off state of the sealed lid of back control, realizes the automation of waste liquid discharge operation, need not the manual work and adjusts sealed lid state according to polishing job progress, when reducing polishing work risk, can improve polishing efficiency.
Specifically, the sealing cover control device may be any device capable of controlling the working state of the sealing cover. For example: the sealing cover control device may be a Programmable Logic Controller (PLC).
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.
Claims (10)
1. An abrasive disc characterized in that the height of the edge portion of the abrasive disc is greater than the height of the central portion of the abrasive disc.
2. The abrasive disc according to claim 1, wherein the upper surface of the abrasive disc is a conical surface, the conical surface forming a space gradually expanding outward in a direction away from the abrasive disc, the conical surface having a conical angle of less than 174 °.
3. An abrasive disc according to claim 2, characterized in that the longitudinal section of the abrasive disc comprises two opposite right-angled triangular sections or two opposite right-angled trapezoidal sections.
4. A grinding disc according to any one of claims 1 to 3, wherein the grinding disc is a funnel-type grinding disc.
5. A polishing apparatus, characterized by comprising: a polishing head, a polishing liquid supply device, a polishing pad, and a polishing disk according to any one of claims 1 to 4; the grinding liquid supply device is positioned above the grinding disc, and the polishing pad is arranged on the upper surface of the grinding disc;
when the polishing device polishes a polishing object, the polishing liquid supply device supplies polishing liquid to the polishing pad, and the polishing head clamps the polishing object to be in contact with the polishing pad.
6. The polishing apparatus according to claim 5, further comprising a waste liquid discharge portion provided at a central portion of the polishing platen, for discharging liquid on the polishing pad after completion of polishing.
7. The polishing apparatus according to claim 6, wherein the waste liquid discharge portion includes a waste liquid discharge pipe and a seal cap, the waste liquid discharge pipe being provided on a side of the polishing disk away from the polishing head; the sealing cap is used for closing the inlet of the waste liquid discharge pipe during polishing and opening the inlet of the waste liquid discharge pipe after polishing.
8. The polishing apparatus as recited in claim 7, wherein the sealing cover is disposed at a geometric center of the polishing pad, and a top height of the sealing cover is equal to a minimum top height of the polishing pad.
9. The polishing apparatus as recited in claim 7, further comprising a seal cover control device for bringing the seal cover into a closed state at the time of polishing and bringing the seal cover into an open state after the completion of polishing.
10. The polishing apparatus according to any one of claims 5 to 9, wherein when the polishing disk is the polishing disk according to claim 4, the polishing pad is a funnel-type polishing pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011119552.6A CN114378714A (en) | 2020-10-19 | 2020-10-19 | Grinding disc and polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011119552.6A CN114378714A (en) | 2020-10-19 | 2020-10-19 | Grinding disc and polishing equipment |
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| Publication Number | Publication Date |
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| CN114378714A true CN114378714A (en) | 2022-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011119552.6A Pending CN114378714A (en) | 2020-10-19 | 2020-10-19 | Grinding disc and polishing equipment |
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| CN (1) | CN114378714A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833716A (en) * | 2022-05-20 | 2022-08-02 | 北京烁科精微电子装备有限公司 | Chemical mechanical polishing equipment and polishing method |
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| CN110625515A (en) * | 2019-09-23 | 2019-12-31 | 黄功钢 | Industrial chemical mechanical grinding equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833716A (en) * | 2022-05-20 | 2022-08-02 | 北京烁科精微电子装备有限公司 | Chemical mechanical polishing equipment and polishing method |
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