CN217411713U - Simple ultrasonic cleaning equipment used after grinding - Google Patents
Simple ultrasonic cleaning equipment used after grinding Download PDFInfo
- Publication number
- CN217411713U CN217411713U CN202220774600.3U CN202220774600U CN217411713U CN 217411713 U CN217411713 U CN 217411713U CN 202220774600 U CN202220774600 U CN 202220774600U CN 217411713 U CN217411713 U CN 217411713U
- Authority
- CN
- China
- Prior art keywords
- cabinet body
- ultrasonic
- ultrasonic cleaning
- washing tank
- fixed mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004506 ultrasonic cleaning Methods 0.000 title claims abstract description 17
- 238000004140 cleaning Methods 0.000 claims abstract description 23
- 238000005406 washing Methods 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 28
- 229910052710 silicon Inorganic materials 0.000 abstract description 27
- 239000010703 silicon Substances 0.000 abstract description 27
- 239000007788 liquid Substances 0.000 abstract description 21
- 239000004570 mortar (masonry) Substances 0.000 abstract description 8
- 230000003749 cleanliness Effects 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 239000007787 solid Substances 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 230000006378 damage Effects 0.000 abstract description 2
- 208000002925 dental caries Diseases 0.000 abstract 2
- 239000008187 granular material Substances 0.000 abstract 1
- 238000011012 sanitization Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a simple and easy ultrasonic cleaning equipment behind abrasive disc, the intelligent cabinet temperature adjusting device comprises a cabinet body, the inside of the cabinet body is transversely arranged and is provided with the washing tank, the bottom of washing tank all is provided with the ultrasonic wave and shakes the board, the ultrasonic wave shakes one side of board and all is provided with the heating pipe, a bottom fixed mounting of the cabinet body has places the frame. This simple and easy ultrasonic cleaning equipment behind abrasive disc, high energy through utilizing the ultrasonic wave, make the substance molecule produce apparent sound pressure effect, make liquid molecule arrange and easily take place the fracture, liquid molecule fracture back, appear many bubbly little cavitys in it, these cavitys are closed in the time of the utmost point short, produce huge instantaneous pressure simultaneously, can make the solid surface who suspends in liquid receive sharp destruction, and the particle diameter of the mortar of abrasive disc is about 8.6 mu m, according to this principle, silicon chip surface large granule mortar sanitization is passed through the mode of supersound with silicon chip behind the abrasive disc, reduce cleaning pressure behind the abrasive disc, improve silicon chip surface cleanliness factor.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technology field specifically is a simple and easy ultrasonic cleaning equipment behind abrasive disc.
Background
16 ten thousand transistors can be integrated on a silicon wafer with large grains of rice, which is another milestone of scientific and technical progress, the silicon element with the content of 25.8 percent in the crust provides an inexhaustible source for the production of monocrystalline silicon, and as the silicon element is one of the most abundant elements in the crust, for the products of solar cells which are destined to enter large-scale markets, the reserve is also one of the reasons that the silicon becomes the main material of photovoltaic cells, and the silicon wafer needs to be cleaned and disinfected by cleaning equipment in the production process.
Because the demand of semiconductor wafer manufacturing on cost is increasing day by day, and the large-area silicon chip has advantages in the number of chips produced per unit and per unit cost, the size of the semiconductor silicon substrate slice also tends to be large-diameter, the size is developed from the earliest 2 inches and 3 inches to the current 8 inches and 12 inches and 18 inches in research and development, the area of the silicon chip is increasing day by day, the cleanliness of the surface of the 12-inch wafer is also a new requirement, and the silicon powder on the surface of the silicon chip after grinding cannot be completely removed by grinding disc cleaning machine equipment, so that the silicon chip cannot reach the subsequent processing conditions.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a simple and easy ultrasonic cleaning equipment behind abrasive disc to solve the current abrasive disc cleaning machine equipment that proposes in the above-mentioned background art and can't get rid of silicon chip surface silica flour behind the abrasive disc totally, lead to the problem that the silicon chip can't reach the later process condition.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a simple and easy ultrasonic cleaning equipment behind abrasive disc, includes the cabinet body, the inside of the cabinet body is transversely arranged and is provided with the washing tank, the bottom of washing tank all is provided with the ultrasonic wave and shakes the board, one side that the ultrasonic wave shakes the board all is provided with the heating pipe, a bottom fixed mounting of the cabinet body has the frame of placing, the inboard of placing the frame is vertically arranged and has been seted up the standing groove, the inboard of standing groove all is provided with supersonic generator, one side fixed mounting of supersonic generator has the temperature controller, the quantity of washing tank and standing groove all is two.
Preferably, a heating switch is arranged below the temperature controller, and an ultrasonic switch is arranged on the surface of one side of the ultrasonic generator.
Preferably, the top of the cleaning tank is movably provided with a sealing cover, and the top of the sealing cover is fixedly provided with a handle through a bolt.
Preferably, the surface of one side of the cabinet body is movably clamped with an access panel, and the surface of the access panel is provided with pull rings.
Preferably, the bottom fixed mounting of the cabinet body has the supporting leg, and the supporting leg all is provided with the supporting seat with the bottom of placing the frame.
Preferably, the washing tank runs through cabinet body fixed mounting near one side surface at top and has the inlet tube, the washing tank runs through cabinet body fixed mounting near one side surface of bottom and has the drain pipe, and all is provided with the control valve on inlet tube and the drain pipe.
Compared with the prior art, the beneficial effects of the utility model are that:
according to the principle, large-particle mortar on the surface of a silicon wafer is cleaned in an ultrasonic mode after the silicon wafer is grinded, the cleaning pressure after the grinding is reduced, the surface cleanliness of the silicon wafer is improved, the ultrasonic cleaning needs to be matched with a surfactant and hot water to reduce the adhesion between the mortar and the surface of the silicon wafer, and therefore the cleaning cleanliness reaches 100%.
Drawings
Fig. 1 is a perspective view of the present invention;
FIG. 2 is a front view of the present invention;
fig. 3 is a side view of the present invention;
fig. 4 is a top view of the present invention.
In the figure: 1. a cabinet body; 2. placing the frame; 3. a drain pipe; 4. supporting legs; 5. a supporting seat; 6. an ultrasonic generator; 7. an access panel; 8. a pull ring; 9. a cleaning tank; 10. a sealing cover; 11. a grip; 12. heating a tube; 13. an ultrasonic vibration plate; 14. an ultrasonic switch; 15. a temperature controller; 16. a heating switch; 17. a control valve; 18. a placement groove; 19. and (4) a water inlet pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a simple ultrasonic cleaning device after grinding disc comprises a cabinet body 1, a cleaning tank 9 is transversely arranged in the cabinet body 1, ultrasonic vibration plates 13 are arranged at the bottom of the cleaning tank 9, substance molecules generate obvious sound pressure action by utilizing the high energy of ultrasonic waves, so that the liquid molecule arrangement is easy to break, a plurality of bubble-shaped small cavities are formed in the liquid molecules after the liquid molecules break, the cavities are closed in a very short time and generate huge instantaneous pressure, the solid surface suspended in the liquid can be subjected to a sharp destructive action, the particle diameter of mortar of the grinding disc is about 8.6 mu m, according to the principle, large-particle mortar on the surface of the silicon wafer is cleaned by the silicon wafer after grinding disc in an ultrasonic mode, the cleaning pressure after the grinding disc is reduced, the surface cleanliness of the silicon wafer is improved, and heating pipes 12 are arranged on one side of the ultrasonic vibration plates 13, can heat the intensification to the water liquid when wasing, and then promote abluent effect and efficiency, a bottom fixed mounting of the cabinet body 1 places frame 2, the inboard of placing frame 2 is vertically arranged and has been seted up standing groove 18, the inboard of standing groove 18 all is provided with supersonic generator 6, one side fixed mounting of supersonic generator 6 has temperature controller 15, can carry out real-time supervision to the temperature when wasing and adjust, avoid the temperature too high or low influence cleaning performance that crosses of temperature, washing tank 9 and standing groove 18's quantity all is two, the below of temperature controller 15 is provided with heating switch 16, and a side surface of supersonic generator 6 is provided with ultrasonic switch 14, can carry out real-time control to the operation of opening and close of device, avoid the long-time idle operation of device to lead to the fault occurrence or cause the waste of the energy.
The top of the cleaning tank 9 is movably provided with a sealing cover 10, the top of the sealing cover 10 is fixedly provided with a handle 11 through a bolt, the cleaning device can be sealed when being cleaned, water liquid in the cleaning process is prevented from spilling to the outside, one side surface of the cabinet body 1 is movably clamped with an access panel 7, the surface of the access panel 7 is provided with a pull ring 8, the real-time maintenance device inside the cabinet body 1 can be conveniently opened in real time for real-time maintenance, the bottom of the cabinet body 1 is fixedly provided with a supporting leg 4, the supporting leg 4 and the bottom of the placing frame 2 are both provided with a supporting seat 5, the stability of the integral cleaning of the device can be improved, the device is prevented from being toppled due to the force generated in the cleaning process, one side surface of the cleaning tank 9 close to the top penetrates through the cabinet body 1 and is fixedly provided with a water inlet pipe 19, the real-time addition and supplement of the cleaning water can be carried out through the overflow effect to lead out excessive water, washing tank 9 runs through cabinet body 1 fixed mounting who is close to the bottom has drain pipe 3, can discharge the sewage after the washing in real time to appointed position department, and all be provided with control valve 17 on inlet tube 19 and the drain pipe 3, can conveniently carry out real-time accuse to the water yield of washing tank 9 inside, avoid the water yield to lead to rinsing unclean or too much to cause the waste too little, supersonic generator 6's ultrasonic frequency is 20-60KHZ, 1000W, ultrasonic cleaning's liquid medicine ratio water is cleaner 04K ═ 30L: 0.8L, and ultrasonic cleaning's time is 10 minutes, can make abluent abundant effect better efficiency better, the waste of the energy is avoided causing to the accuse time of accuracy simultaneously.
The working principle is as follows: when the silicon wafer is required to be cleaned, firstly, the silicon wafer to be cleaned is placed in a cleaning tank 9, the cleaning tank 9 is sealed in real time through a sealing cover 10, then a heating pipe 12 and an ultrasonic generator 6 are started through a heating switch 16 and an ultrasonic switch 14, substance molecules generate obvious sound pressure action by utilizing the high energy of ultrasonic waves, when the ultrasonic waves emitted through an ultrasonic vibration plate 13 are vibrated to enable liquid molecules to be tightly arranged, the liquid molecules are subjected to pressure, when the liquid molecules are sparse due to ultrasonic vibration, the liquid molecules are subjected to outward scattered pulling force, the liquid molecules can bear the pressure, but when the liquid molecules are subjected to the pulling force, the arrangement is easy to break, the breakage usually occurs at the positions where impurities or bubbles exist in the liquid, a plurality of bubble-shaped small cavities are formed in the liquid molecules after the liquid molecules are broken, and the cavities are closed in a very short time, meanwhile, huge instantaneous pressure which generally can reach thousands of MPa is generated, the surface of a solid suspended in liquid can be subjected to sharp destruction, the sound pressure effect of the ultrasonic waves on the liquid and the solid is called as a hole erosion phenomenon, the particle size of mortar of the grinding plate is about 8.6 mu m, according to the principle, large-particle mortar on the surface of the silicon wafer is cleaned by the silicon wafer after the grinding plate in an ultrasonic mode, the cleaning pressure after the grinding plate is reduced, and the surface cleanliness of the silicon wafer is improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a simple and easy ultrasonic cleaning equipment behind abrasive disc, includes cabinet body (1), its characterized in that: the inside of the cabinet body (1) is transversely arranged and is provided with washing tank (9), the bottom of washing tank (9) all is provided with ultrasonic wave vibration plate (13), one side that ultrasonic wave vibration plate (13) all is provided with heating pipe (12), a bottom fixed mounting of the cabinet body (1) has places frame (2), the inboard of placing frame (2) is vertically arranged and has been seted up standing groove (18), the inboard of standing groove (18) all is provided with supersonic generator (6), one side fixed mounting of supersonic generator (6) has temperature controller (15), the quantity of washing tank (9) and standing groove (18) all is two.
2. The simple post-lapping ultrasonic cleaning equipment according to claim 1, characterized in that: a heating switch (16) is arranged below the temperature controller (15), and an ultrasonic switch (14) is arranged on one side surface of the ultrasonic generator (6).
3. The simple ultrasonic cleaning device after grinding according to claim 1, characterized in that: the top of the cleaning tank (9) is movably provided with a sealing cover (10), and the top of the sealing cover (10) is fixedly provided with a handle (11) through a bolt.
4. The simple ultrasonic cleaning device after grinding according to claim 1, characterized in that: an access panel (7) is movably clamped on the surface of one side of the cabinet body (1), and pull rings (8) are arranged on the surface of the access panel (7).
5. The simple ultrasonic cleaning device after grinding according to claim 1, characterized in that: the bottom fixed mounting of the cabinet body (1) has supporting legs (4), and the supporting legs (4) and the bottom of placing the frame (2) all are provided with supporting seat (5).
6. The simple ultrasonic cleaning device after grinding according to claim 1, characterized in that: washing tank (9) are close to one side surface at top and run through cabinet body (1) fixed mounting and have inlet tube (19), washing tank (9) are close to one side surface of bottom and run through cabinet body (1) fixed mounting and have drain pipe (3), and all are provided with control valve (17) on inlet tube (19) and drain pipe (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220774600.3U CN217411713U (en) | 2022-04-06 | 2022-04-06 | Simple ultrasonic cleaning equipment used after grinding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220774600.3U CN217411713U (en) | 2022-04-06 | 2022-04-06 | Simple ultrasonic cleaning equipment used after grinding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217411713U true CN217411713U (en) | 2022-09-13 |
Family
ID=83180450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220774600.3U Active CN217411713U (en) | 2022-04-06 | 2022-04-06 | Simple ultrasonic cleaning equipment used after grinding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217411713U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114602886A (en) * | 2022-04-06 | 2022-06-10 | 中环领先半导体材料有限公司 | Simple ultrasonic cleaning equipment used after grinding |
-
2022
- 2022-04-06 CN CN202220774600.3U patent/CN217411713U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114602886A (en) * | 2022-04-06 | 2022-06-10 | 中环领先半导体材料有限公司 | Simple ultrasonic cleaning equipment used after grinding |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN217411713U (en) | Simple ultrasonic cleaning equipment used after grinding | |
| CN102832101B (en) | Crystalline silicon cleaning method | |
| CN102303870B (en) | High-purity quartz sand purifying and pickling device | |
| CN103774239B (en) | A kind of monocrystal silicon silicon chip cleaning and texturing technique | |
| CN210543371U (en) | MVR evaporation concentrator | |
| CN203030566U (en) | Cleaning machine for recycled silicon wafers | |
| CN205144479U (en) | High -efficient clean device of ultrasonic wave | |
| CN209266365U (en) | A kind of cleaning machine of semiconductor product | |
| CN202290654U (en) | Mega sonic cleaning head and mega sonic cleaning system comprising same | |
| CN114602886A (en) | Simple ultrasonic cleaning equipment used after grinding | |
| CN103611705A (en) | Ultrasonic cleaning device for diamond wires | |
| CN205701647U (en) | Solar silicon wafer ultrasonic cleaning tank | |
| CN208437358U (en) | A kind of semiconductors manufacture wet-cleaning device | |
| CN102091701A (en) | Full-automatic ultrasonic cleaning process | |
| CN214515118U (en) | Monocrystalline silicon crushing, cleaning and drying integrated machine | |
| CN210692489U (en) | Cleaning equipment with silicon wafer separation structure for polycrystalline silicon wafers | |
| CN102381711A (en) | Method for purifying metallurgical-grade polycrystalline silicon by using microwave plasmas | |
| CN101875048A (en) | Method for removing impurities on surface of silicon chip | |
| CN206854240U (en) | Alternate oscillation mega sonic wave cleaning device for photoelectricity parts | |
| CN206652771U (en) | A kind of root of kudzu vine leaf washs steaming apparatus | |
| CN213026052U (en) | Novel diversified cleaning equipment for semiconductor chip | |
| CN205863147U (en) | A kind of Novel silicon slice cleans device | |
| CN216245147U (en) | Device for fixing infrared radiator in vacuum drying container | |
| CN212168361U (en) | Ultrasonic cleaning machine | |
| CN214588768U (en) | Silicon chip washs uses basket of flowers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China |