CN217405681U - Low frequency resonator - Google Patents
Low frequency resonator Download PDFInfo
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- CN217405681U CN217405681U CN202221327043.7U CN202221327043U CN217405681U CN 217405681 U CN217405681 U CN 217405681U CN 202221327043 U CN202221327043 U CN 202221327043U CN 217405681 U CN217405681 U CN 217405681U
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Abstract
The utility model discloses a low-frequency resonator, which comprises at least two resonator bodies, wherein two axial end surfaces of one resonator body are respectively arranged into a metallized short road surface and a first connecting surface, the first connecting surface is provided with a first metallized area and a first demetallized area, and the first metallized area is connected with an inner metallized layer of the inner wall of a resonant hole; two end surfaces on the other resonator body shaft are respectively arranged to be a second connecting surface and an open surface, a second metalized area and a second demetallized area are arranged on the second connecting surface, and the second metalized area is connected with the inner metalized layer of the inner wall of the resonant hole; the first connecting surface and the second connecting surface are arranged in a fitting mode and are fixed through welding of the first metalized area and the second metalized area, and the first metalized area is electrically connected with the second metalized area. The utility model discloses the frequency of syntonizer can accomplish below 400MHz, and the yield of the syntonizer of frequency more than 400MHz of simultaneous production is higher.
Description
Technical Field
The utility model relates to a communication device technical field, concretely relates to low frequency syntonizer.
Background
The filter relates to one of the common and important devices in the communication field, the resonator is required to be used for designing the filter, the frequency of the resonator determines the frequency of the filter, the frequency of the TEM mode resonator is related to the dielectric constant of the material of the resonator and the length of the resonator, and the three components meet the following relation:
wherein F represents the resonator frequency, ER represents the dielectric constant of the resonator material, L represents the length of the resonator, and the relationship between the three can be determined as follows: the frequency of the resonator is inversely proportional to the length of the resonator. Taking the dielectric constant 90 of the material which is mature in the market at present as an example, the frequency of the resonator is about 400MHz under the limit of 20MM of the length of the resonator formed by dry pressing. Filters below 400MHz are often required for processing signals in communication systems, i.e. resonators below 400MHz are also required. It is clear that the existing dry-pressing techniques limit the frequency range of application of the dielectric filter.
Disclosure of Invention
For this reason, the utility model aims to solve the technical problem that exists among the prior art, provide a low frequency syntonizer, the frequency of syntonizer can accomplish below 400MHz, and the yield of the syntonizer of frequency more than 400MHz of coproduction is higher.
In order to solve the technical problem, the utility model provides a low-frequency resonator, which comprises at least two resonator bodies, wherein the resonator bodies are respectively provided with a resonant hole which is axially communicated, and the two resonator bodies are coaxially connected;
two axial end surfaces of a resonator body are respectively provided with a metalized short-circuit surface and a first connecting surface, the first connecting surface is provided with a first metalized area and a first demetallized area, the first metalized area is connected with the inner metalized layer of the inner wall of the resonant hole, and the first demetallized area is used for separating the first metalized area and the grounding metalized layer on the outer surface of the resonator body;
two end surfaces on the axis of the other resonator body are respectively set as a second connecting surface and an open surface, a second metalized region and a second demetallized region are arranged on the second connecting surface, the second metalized region is connected with the inner metalized layer on the inner wall of the resonant hole, and the second demetallized region is used for separating the second metalized region and the grounding metalized layer on the outer surface of the resonator body;
the first connecting surface and the second connecting surface are attached and fixed through the first metalized area and the second metalized area in a welding mode, and the first metalized area is electrically connected with the second metalized area.
The utility model discloses a preferred embodiment, further include all still be equipped with outer metallization region on first connection face, the second connection face, outer metallization region with the ground metallization layer of syntonizer body surface is connected, and is passed through first demetalization region cuts off with first metallization region, passes through second demetalization region cuts off with second metallization region, the outer metallization region welded fastening of both is connected to first connection face and second.
In a preferred embodiment of the present invention, the first metalized area and the second metalized area are fixed by silver soldering.
In a preferred embodiment of the present invention, the first and second metalized regions are formed in a shape similar to the first metalized region and the second metalized region, and the shapes of the first and second metalized regions are set to be circular or square.
In a preferred embodiment of the present invention, it is further included that the open face is configured as a fully demetallized surface.
In a preferred embodiment of the present invention, the open surface is provided with a central local metalized area, and the central local metalized area is connected to the inner metalized layer of the inner wall of the resonant hole and separated from the ground metalized layer of the outer surface of the resonator body.
In a preferred embodiment of the present invention, the resonator further comprises an edge local metallization region disposed on the open surface, the edge local metallization region is connected to the ground metallization layer of the outer surface of the resonator body, and is separated from the central local metallization region.
In a preferred embodiment of the present invention, it is further included that the resonant hole is a through hole or a stepped hole.
In a preferred embodiment of the present invention, the metallized area is a silver layer area, a gold layer area, a copper layer area or an aluminum alloy layer area.
In a preferred embodiment of the present invention, the resonator is configured as a rectangular parallelepiped structure or a cylindrical structure.
Compared with the prior art, the technical scheme of the utility model have following advantage:
the low-frequency resonator of the utility model comprises at least two resonator bodies which are coaxially connected and structurally connected to form a resonator; two terminal surfaces in the axial of one of them syntonizer body form the metallization short road surface respectively and the metallization is connected the face, two terminal surfaces in the axial of another syntonizer body form respectively open face and metallization and are connected the face, the metallization of two syntonizer bodies is connected the face laminating setting, and through being located two metallization district welded fastening on the face is connected to two metallizations respectively, and form electrical connection, get up the signal of telecommunication of two syntonizer bodies on the structure and associate and constitute a syntonizer, the equivalent length L of this syntonizer is the length sum of two syntonizer bodies, from this design, the syntonizer, below 400MHz can be accomplished to the frequency, the yield of the syntonizer of the 400-.
Drawings
Fig. 1 is a schematic structural diagram of a low-frequency resonator in a preferred embodiment of the present invention;
fig. 2 is a first perspective structural diagram of a first resonator body in the low frequency resonator shown in fig. 1;
fig. 3 is a second perspective structural diagram of the first resonator body in the low frequency resonator shown in fig. 1;
fig. 4 is a first perspective structural diagram of a second resonator body in the low frequency resonator shown in fig. 1;
fig. 5 is a schematic diagram of a second perspective structure of a second resonator body in the low-frequency resonator shown in fig. 1;
FIG. 6 is a schematic diagram of an open face of a second resonator body in another embodiment;
fig. 7 is a schematic structural view of an open face of a second resonator body in yet another embodiment.
The reference numbers in the figures illustrate:
1-dielectric block, 3-ground metallization layer;
2-a first resonator body, 21-a first resonant hole, 22-a metalized stub, 23-a first connection, 24-a first metalized area, 25-a first demetallized area;
4-a second resonator body, 41-a second resonance hole, 42-a second connection face, 43-an open face, 44-a second metalized region, 45-a second demetallized region;
6-outer metalized area, 8-central local metalized area, 10-edge local metalized area.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Examples
Referring to fig. 1 to 5, the present embodiment discloses a low frequency resonator, which includes at least two resonator bodies, where each of the resonator bodies has a through resonance hole in an axial direction, and the two resonator bodies are coaxially connected; specifically, the low-frequency resonator includes a first resonator body 2 and a second resonator body 4, and the first resonator body 2 and the second resonator body 4 are coaxially connected and are respectively provided with a first resonance hole 21 and a second resonance hole 41 which axially penetrate through the first resonator body and the second resonator body. It should be noted that the two resonator bodies each include a rectangular or cylindrical dielectric block 1, the resonant hole is located in the dielectric block 1, the resonant hole is a cylindrical through hole or a stepped through hole, all outer surfaces of the dielectric block, which are parallel to the resonant hole, are provided with a ground metallization layer 3, an inner metallization layer is provided on an inner wall of the resonant hole, and the ground metallization layer and the inner metallization layer may be coated on the surface of the dielectric block or on an inner wall surface of the resonant hole through existing mature processes such as an infiltration process, an electroplating process, a sputtering process, and the like, and implementation steps of the method are not described herein.
As shown in fig. 2 and 3, the length of the first resonator body 2 is L1, two end surfaces in the axial direction are respectively provided as a metalized short-circuit surface 22 and a first connecting surface 23, the metalized short-circuit surface 22 is fully coated with a metalized layer on the whole surface and is connected with the ground metalized layer 3 on the outer surface of the first resonator body 2; a first metalized region 24 and a first demetallized region 25 are arranged on the first connection surface 23, the first metalized region 24 is connected with an inner metalized layer of the inner wall of the first resonance hole 21, and the first demetallized region 25 is used for separating the first metalized region 24 and the ground metalized layer 3 on the outer surface of the first resonator body 21; the length of the second resonator body 4 is L2, two end surfaces on the axis of the second resonator body are respectively provided as a second connection surface 42 and an open surface 43, the open surface 43 is an entirely demetallized surface, a second metalized region 44 and a second demetallized region 45 are arranged on the second connection surface 42, the second metalized region 44 is connected with an inner metalized layer on the inner wall of the second resonance hole 41, and the second demetallized region 45 is used for separating the second metalized region 44 from the ground metalized layer 3 on the outer surface of the second resonator body 41; specifically, the shapes of the first metalized region 24 and the second metalized region 44 are similar, and the shapes of the two regions are set to be circular or square. The first connection surface 23 and the second connection surface 42 are attached to each other and fixed by welding through the first metalized region 24 and the second metalized region 44, and the first metalized region 24 is electrically connected with the second metalized region 44.
Specifically, ground connection metallization layer, interior metallization layer, first metallization region 24, second metallization region 44 can be based on silver layer, gold layer, copper layer or the aluminum alloy layer of coating of technologies such as electroplating process, sputtering process, printing process, the utility model discloses preferably use the silver layer, have better electric conductivity and economic nature.
The low-frequency resonator comprises at least two resonator bodies which are coaxially connected and structurally connected to form a resonator; two terminal surfaces in the axial of one of them syntonizer body form the metallization short road surface respectively and the metallization is connected the face, two terminal surfaces in the axial of another syntonizer body form respectively open face and metallization and are connected the face, the metallization of two syntonizer bodies is connected the face laminating setting, and through being located two metallization regional welded fastening on the face is connected to two metallizations respectively, and form electrical connection, get up the signal of telecommunication of two syntonizer bodies on the structure and associate and constitute a syntonizer, the equivalent length L of this syntonizer is the length sum (L1+ L2) of two syntonizer bodies, by this design, the syntonizer, support that the syntonizer can be done under the prerequisite of current dry pressing forming technique longer, the frequency can accomplish below 400 MHz. On the other hand, for the resonator in the frequency range of 400-600, the above structural design can solve the problem that the existing production resonator is easy to deform in length (the resonator is easy to deform in the length direction during dry-pressing, so that a gap is easy to generate on the structure), and the yield of the production resonator is higher.
In the preferred embodiment of the present invention, the first metalized region 24 and the second metalized region 44 are fixed by silver soldering. When the silver soldering is used for welding and fixing, the silver medal is used as an adhesive, and the product is fixed after being sintered at the high temperature of 850 ℃, so that the reliability of the product can be ensured when the product is soldered (the general temperature is 200 ℃ and 300 ℃).
Further, the first connection surface 23 and the second connection surface 42 are both provided with an outer metalized region 6, the outer metalized region 6 is connected to the ground metalized layer 3 on the outer surface of the resonator body, and is separated from the first metalized region 24 by the first demetallized region 25 and separated from the second metalized region 44 by the second demetallized region 45, and the outer metalized regions 6 of the first connection surface 23 and the second connection surface 42 are fixed by welding. By adding the outer metalized area 6 on the connecting surface of the two resonator bodies, the leakage of magnetic signals can be reduced, and the grounding effect of the resonators in the filter circuit is improved.
Referring to fig. 6, in another embodiment of the present invention, a central local metalized area 8 is disposed on the open surface 43, and the central local metalized area 8 is connected to the inner metalized layer of the inner wall of the second resonant hole 42 and isolated from the ground metalized layer 3 on the outer surface of the second resonator body 41. The central local metallisation region 8 can further reduce the frequency of the resonator, and the larger the area of the central local metallisation region 8, the lower the frequency of the resonator.
Referring to fig. 7, in another embodiment of the present invention, an edge local metalized area 10 is further disposed on the open surface 43, and the edge local metalized area 10 is connected to the ground metalized layer 3 on the outer surface of the second resonator body 41 and separated from the central local metalized area 8. The edge local metallization region 10 can further reduce the frequency of the resonator on one hand, and improve the grounding effect of the resonator in the filter circuit on the other hand.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (10)
1. A low frequency resonator, characterized by: the resonator comprises at least two resonator bodies, wherein the resonator bodies are provided with axially through resonance holes and are coaxially connected;
two axial end surfaces of a resonator body are respectively provided with a metalized short-circuit surface and a first connecting surface, the first connecting surface is provided with a first metalized area and a first demetallized area, the first metalized area is connected with an inner metalized layer of the inner wall of the resonant hole, and the first demetallized area is used for separating the first metalized area and a grounding metalized layer on the outer surface of the resonator body;
two end surfaces on the axis of the other resonator body are respectively set as a second connecting surface and an open surface, a second metalized region and a second demetallized region are arranged on the second connecting surface, the second metalized region is connected with the inner metalized layer on the inner wall of the resonant hole, and the second demetallized region is used for separating the second metalized region and the grounding metalized layer on the outer surface of the resonator body;
the first connecting surface and the second connecting surface are attached and fixed through the first metalized area and the second metalized area in a welding mode, and the first metalized area is electrically connected with the second metalized area.
2. The low frequency resonator of claim 1, wherein: the first connecting surface and the second connecting surface are respectively provided with an outer metalized area, the outer metalized area is connected with the grounding metalized layer on the outer surface of the resonator body, and is separated from the first metalized area through the first demetallization area and is separated from the second metalized area through the second demetallization area, and the outer metalized areas of the first connecting surface and the second connecting surface are welded and fixed.
3. The low frequency resonator of claim 1, wherein: the first metalized area and the second metalized area are fixed through silver soldering.
4. The low frequency resonator of claim 1, wherein: the shapes of the first metalized area and the second metalized area are similar, and the shapes of the first metalized area and the second metalized area are round or square.
5. The low frequency resonator of claim 1, wherein: the open face is provided as a fully demetallised surface.
6. The low frequency resonator of claim 5, wherein: and a central local metalized area is arranged on the opening surface, is connected with the inner metalized layer of the inner wall of the resonance hole and is separated from the grounding metalized layer on the outer surface of the resonator body.
7. The low frequency resonator of claim 6, wherein: the opening surface is further provided with an edge local metalized area, and the edge local metalized area is connected with the grounding metalized layer on the outer surface of the resonator body and is isolated from the central local metalized area.
8. The low frequency resonator of any of claims 1-7, wherein: each metalized area is set to be a silver layer area, a gold layer area, a copper layer area or an aluminum alloy layer area.
9. The low frequency resonator of claim 1, wherein: the resonator is arranged in a cuboid-shaped structure or a cylindrical structure.
10. The low frequency resonator of claim 1, wherein: the resonant hole is a through hole or a stepped hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221327043.7U CN217405681U (en) | 2022-05-30 | 2022-05-30 | Low frequency resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221327043.7U CN217405681U (en) | 2022-05-30 | 2022-05-30 | Low frequency resonator |
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| Publication Number | Publication Date |
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| CN217405681U true CN217405681U (en) | 2022-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221327043.7U Active CN217405681U (en) | 2022-05-30 | 2022-05-30 | Low frequency resonator |
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- 2022-05-30 CN CN202221327043.7U patent/CN217405681U/en active Active
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