CN213878361U

CN213878361U - Integrated filter

Info

Publication number: CN213878361U
Application number: CN202023222015.2U
Authority: CN
Inventors: 廖明
Original assignee: Suzhou Fudian Communication Co ltd
Current assignee: Suzhou Fudian Communication Co ltd
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2021-08-03
Anticipated expiration: 2030-12-28

Abstract

The utility model discloses an integrated filter, including first wave filter, it sets up to dielectric filter, dielectric filter includes the dielectric block of cuboid form structure, the dielectric block has relative first surface and the second surface that sets up, and connect the third surface of first surface and second surface, be equipped with first IO terminal on the first surface, and first IO terminal extends to third surface and second surface in proper order; the bottom of the second filter is provided with a flat connecting surface, a second I/O terminal is arranged on the connecting surface, the second filter is arranged on the first filter in a stacking mode through the connecting surface of the second filter, and the second I/O terminal is electrically connected with the first I/O terminal extending to the second surface of the dielectric block. The utility model discloses an integrated form wave filter can reduce the welding area of the wave filter module in the complete machine that comprises first wave filter and second wave filter.

Description

Integrated filter

Technical Field

The utility model relates to a communication device technical field, concretely relates to integrated form wave filter.

Background

The filter is used as a basic communication device and plays an important role in the field of mobile communication, and a full communication chain from a signal source, a channel, an antenna feed system, an antenna to a mobile terminal and the like needs to use the filter. With the mobile communication coming into the 5G era, distributed small base stations, large-scale array active antennas and the like become main solutions for network coverage, and higher requirements are put forward on miniaturization, high performance and low power consumption of filters.

Common filter types include an LC filter (constructed by discrete capacitor elements and inductor elements), a dielectric filter (composed of a dielectric block formed by a material with a high dielectric constant and a metal film layer designed on the dielectric block to form a filter circuit structure), and a cavity filter (composed of a metal structure), and from the viewpoint of technical indexes (including insertion loss, in-band fluctuation, out-of-band rejection, port standing-wave ratio, and the like), the technical indexes of the LC filter, the dielectric filter, and the cavity filter gradually become better in sequence. In some application environments, the LC filter and the dielectric filter are combined for use, the LC filter and the dielectric filter are simultaneously welded on a PCB to form a filter module, and the existing filter module occupies a large welding area in the whole machine, so that the requirement of miniaturization of the whole machine is not facilitated.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide an integrated filter, reduce the welding area of the filter module that comprises first wave filter and second wave filter in the complete machine, simultaneously, under the same length and width condition requirement, integrated filter's harmonic rejection performance is better.

In order to solve the above technical problems, the present invention provides an integrated filter, including,

the filter comprises a first filter, a second filter and a third filter, wherein the first filter is a dielectric filter, the dielectric filter comprises a dielectric block with a rectangular parallelepiped structure, the dielectric block is provided with a first surface and a second surface which are oppositely arranged, and a third surface which is used for connecting the first surface and the second surface, the first surface is provided with a first I/O terminal, and the first I/O terminal sequentially extends to the third surface and the second surface;

the bottom of the second filter is provided with a flat connecting surface, a second I/O terminal is arranged on the connecting surface, the second filter is arranged on the first filter in a stacking mode through the connecting surface of the second filter, and the second I/O terminal is electrically connected with the first I/O terminal extending to the second surface of the dielectric block.

The utility model discloses a preferred embodiment, further include still include first PCB board, be equipped with signal transmission line on the first PCB board, first wave filter sets up on the first PCB board, just the medium piece is located on its first surface first IO terminal with signal transmission line electric connection.

In a preferred embodiment of the present invention, the second filter further comprises a second PCB, the second PCB has a pair of oppositely disposed surfaces, which are the connecting surface and the soldering surface respectively;

the welding surface is provided with a welding surface, and the welding surface is provided with a first I/O terminal and a second I/O terminal which are electrically connected with each other.

The present invention further provides a signal shielding structure, wherein the signal shielding structure is fixed on the second PCB, and the capacitor and the inductor are disposed inside the signal shielding structure.

In a preferred embodiment of the present invention, the shielding structure is a metal cover, and the metal cover is electrically connected to the ground area on the second PCB.

In a preferred embodiment of the present invention, a debugging window is disposed on the top of the metal cover.

In a preferred embodiment of the present invention, the dielectric block further includes at least two through holes formed on a fourth surface of the dielectric block, the through holes extending to a fifth surface opposite to the fourth surface of the dielectric block, inner conductor layers formed on inner surfaces of the through holes, and outer conductor layers formed on the first surface, the second surface, the third surface and the fifth surface of the dielectric block, the inner conductor layers being connected to the outer conductor layers of the fifth surface; and a circuit local conductor layer is arranged on the fourth surface of the dielectric block around the through hole and is connected with the inner conductor layer of the through hole corresponding to the circuit local conductor layer, and an insulation gap is formed between the inner conductor layer and the outer conductor layer.

In a preferred embodiment of the present invention, the outline of the circuit partial conductor layer is one or any combination of a polygon, a circle and an ellipse, and the area of the circuit partial conductor layer can be adjusted.

The present invention further provides a circuit extending conductor layer disposed between the two through holes on the fourth surface of the dielectric block, wherein the circuit extending conductor layer is connected to the outer conductor layer, and an insulating gap is formed between the circuit extending conductor layer and the circuit local conductor layer.

In a preferred embodiment of the present invention, the outline of the circuit extension conductor layer is one or any combination of a polygon, a circle or an ellipse, and the area of the circuit extension conductor layer can be adjusted.

The utility model has the advantages that:

the utility model discloses an integrated form wave filter, second wave filter heap set up in first wave filter top, and realize the IO terminal electric connection between second wave filter and first wave filter under the prerequisite that does not increase extra component, realize the integrated form structural design of two different wave filters, reduce the welding area of the wave filter module in the complete machine that comprises first wave filter and second wave filter, simultaneously, under the same length wide condition requirement, the harmonic rejection performance of integrated form wave filter is better.

Drawings

Fig. 1 is a schematic structural diagram of an integrated filter according to a preferred embodiment of the present invention;

fig. 2 is a schematic structural diagram of the first filter shown in fig. 1.

The reference numbers in the figures illustrate:

2-first filter, 21-dielectric block, 22-through via, 23-first surface, 24-second surface, 25-third surface, 26-fourth surface, 27-fifth surface, 28-first I/O terminal, 29-inner conductor layer, 30-outer conductor layer, 31-circuit partial conductor layer, 32-circuit extended conductor layer;

4-second filter, 41-connection face, 42-second I/O terminal, 43-second PCB, 44-soldering face, 45-metal cover, 46-debugging window;

6-first PCB version, 61-signal transmission line.

Detailed Description

The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

It will be understood that when an element is referred to as being "disposed on," "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "secured" to, or "fixedly coupled" to another element, it can be removably secured or non-removably secured to the other element. When an element is referred to as being "connected," "pivotally connected," to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," "up," "down," and the like are used for illustrative purposes only and are not meant to be the only real-time.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the present invention, the terms "first", "second", "third", and the like are used for distinguishing names, rather than representing specific numbers and orders.

As shown in fig. 1-2, in one embodiment, the present invention discloses an integrated filter, which includes a first filter 2, a second filter 4 and a first PCB 6, wherein the first PCB 6 is provided with a signal transmission line 61, the first filter 2 has a first I/O terminal 28, and the second filter 4 has a second I/O terminal 42; the first filter 2 is disposed on the first PCB 6, and the first I/O terminal 28 is electrically connected to the signal transmission line 61; the second filter 4 is stacked on the first filter 2, and the second I/O terminal 42 is electrically connected to the first I/O terminal 28. The second filter 4 is stacked and fixed on the first filter 2, and the electrical connection of the I/O terminals of the second filter 4 and the first filter 2 is realized on the premise of not adding additional elements, so that the integrated structural design of two different filters is realized. The welding area 44 of the filter module consisting of the first filter 2 and the second filter 4 in the whole machine is reduced, and meanwhile, under the condition of the same length and width, the harmonic suppression performance of the integrated filter is better.

Specifically, the first filter 2 is provided as a dielectric filter including a dielectric block 21 of a rectangular parallelepiped structure die-cast from a high dielectric constant material (such as ceramic), the dielectric block 21 having a first surface 23 and a second surface 24 which are oppositely arranged, and a third surface 25 connecting the first surface 23 and the second surface 24; the fourth surface 26 of the dielectric block 21 is provided with at least two through holes 22, the through holes 22 extend to a fifth surface 27 opposite to the fourth surface 26 of the dielectric block 21, the inner surface of each through hole 22 is provided with an inner conductor layer 29, the first surface 23, the second surface 24, the third surface 25 and the fifth surface 27 of the dielectric block 21 are provided with outer conductor layers 30, and the inner conductor layers 29 are connected with the outer conductor layers 30 of the fifth surface 27; a circuit local conductor layer 31 is arranged on the fourth surface 26 of the dielectric block 21 around the through hole 22, the circuit local conductor layer 31 is connected with an inner conductor layer 29 of the through hole 22 corresponding to the circuit local conductor layer 31, and an insulation gap is formed between the inner conductor layer 29 and an outer conductor layer 30; the first surface 23 is isolated from the outer conductor layer 30 on the surface thereof by a wire type insulation part to form a first I/O terminal 28, and the first I/O terminal 28 extends to the third surface 25 and the second surface 24 in sequence. The first I/O terminal 28 of the dielectric block 21 on the first surface 23 thereof is electrically connected to the signal transmission line 61.

The inner conductor layer 29, the outer conductor layer 30, the circuit local conductor layer 31, and the circuit extension conductor layer 32 are all formed as metal film layers processed based on an electroplating process, a sputtering process, or a soaking process, the first I/O terminal 28 is formed as a metal film layer processed based on a laser process or a printing process, and the metal film layer is a silver film layer, a copper film layer, or a gold film layer.

The second filter 4 is configured as an LC filter, and includes a second PCB 43 and a capacitor element or/and an inductor element for forming a filter circuit structure, the second PCB 43 has a pair of oppositely disposed surfaces, which are a connection surface 41 and a soldering surface 44, respectively, the connection surface 41 is provided with a second I/O terminal 42, the second filter 4 is stacked on the first filter 2 through the connection surface 41 thereof, and the second I/O terminal 42 is electrically connected to the first I/O terminal 28 extending to the second surface 24 of the dielectric block 21. The capacitor and inductor are disposed on the soldering surface 44, and the filter circuit structure is electrically connected to the second I/O terminal 42.

Therefore, the two filters respectively arranged as the dielectric filter and the LC filter are arranged in a vertically stacked manner, the electrical connection of the I/I terminals between the two different filters arranged in the stacked manner is realized on the premise of not adding additional elements, the welding area 44 area of the filter module consisting of the first filter 2 and the second filter 4 in the whole machine is reduced, and meanwhile, the harmonic suppression performance of the integrated filter is better under the requirement of the same length and width.

Further, the second filter 4 further includes a signal shielding structure, the signal shielding structure is fixed on the second PCB 43, and the capacitive element and the inductive element are disposed inside the signal shielding structure. The signal shielding structure is arranged to be a closed structure capable of reducing electromagnetic interference, such as a box body structure, a barrel body structure or a cover body structure. In the technical solution of this embodiment, the shielding structure is configured as a metal cover 45, and the metal cover 45 is electrically connected to the ground area on the second PCB 43. Especially, the aluminum cover obtained by processing the aluminum material has low cost and good shielding effect.

Further, a debugging window is arranged at the top of the metal cover 45. Generally, the inductance element constituting the filter circuit structure of the second filter 4 is a coil inductance, and the coil inductance can be finely adjusted after being welded and assembled on the second PCB 43, so that the inductance can be finely adjusted through the debugging window.

A circuit extension conductor layer 32 is disposed on the fourth surface 26 of the dielectric block 21 between the two through holes 22, the circuit extension conductor layer 32 is connected to the outer conductor layer 30, and an insulation gap is formed between the circuit extension conductor layer 32 and the circuit local conductor layer 31. The circuit partial conductor layer 31 and the circuit extended conductor layer 32 on the fourth surface 26 of the dielectric block 21 constitute a filter circuit structure of the first filter 2. In the technical solution of this embodiment, the area of the circuit local conductor layer 31 can be adjusted, and by adjusting the area of the circuit local conductor layer 31, the frequency of the corresponding resonant cavity can be adjusted (increased or decreased), and the coupling amount (usually, a negative coupling amount) between the circuit local conductor layer 31 and the resonant cavity adjacent to the circuit local conductor layer can be adjusted on the other side. The area of the circuit extension conductor layer 32 can be adjusted, and the frequency between the resonant cavities corresponding to the circuit extension conductor layer 32 can be adjusted (increasing or decreasing the frequency) on the one hand, and the coupling amount between the resonant cavity and the adjacent resonant cavity (usually positive coupling amount) on the other hand. The outline of the circuit local conductor layer 31 is one or any combination of a polygon, a circle and an ellipse, and the outline of the circuit extension conductor layer 32 is one or any combination of a polygon, a circle and an ellipse, so that the outline of the circuit local conductor layer 31 and the outline of the circuit extension conductor layer 32 can be flexibly processed or designed according to actual use requirements or process requirements to adapt to use requirements. The outline of the circuit partial conductor layer 31 and the outline of the circuit extended conductor layer 32 are preferably polygonal, which facilitates processing.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims

1. An integrated filter, characterized by: comprises the steps of (a) preparing a mixture of a plurality of raw materials,

2. The integrated filter of claim 1, wherein: the filter is characterized by further comprising a first PCB, a signal transmission line is arranged on the first PCB, the first filter is arranged on the first PCB, and the first I/O terminal is located on the first surface of the dielectric block and electrically connected with the signal transmission line.

3. The integrated filter of claim 1, wherein: the second filter comprises a second PCB, and the second PCB is provided with a pair of oppositely arranged surfaces which are respectively a connecting surface and a welding surface;

4. An integrated filter as claimed in claim 3, wherein: the second filter further comprises a signal shielding structure, the signal shielding structure is fixed on the second PCB, and the capacitive element and the inductive element are arranged inside the signal shielding structure.

5. The integrated filter of claim 4, wherein: the shielding structure is set to be a metal cover, and the metal cover is electrically connected with the grounding area on the second PCB.

6. The integrated filter of claim 5, wherein: and a debugging window is arranged at the top of the metal cover.

7. The integrated filter of claim 1, wherein: the fourth surface of the dielectric block is provided with at least two through holes, the through holes extend to a fifth surface opposite to the fourth surface of the dielectric block, the inner surfaces of the through holes are provided with inner conductor layers, the first surface, the second surface, the third surface and the fifth surface of the dielectric block are provided with outer conductor layers, and the inner conductor layers are connected with the outer conductor layers of the fifth surface; and a circuit local conductor layer is arranged on the fourth surface of the dielectric block around the through hole and is connected with the inner conductor layer of the through hole corresponding to the circuit local conductor layer, and an insulation gap is formed between the inner conductor layer and the outer conductor layer.

8. The integrated filter of claim 7, wherein: the outline of the circuit local conductor layer is one or any combination of a polygon, a circle and an ellipse, and the area of the circuit local conductor layer can be adjusted.

9. The integrated filter of claim 7, wherein: and a circuit extension conductor layer is arranged between the two through holes on the fourth surface of the dielectric block and connected with the outer conductor layer, and an insulation gap is formed between the circuit extension conductor layer and the circuit local conductor layer.

10. The integrated filter of claim 9, wherein: the outline of the circuit extension conductor layer is one or any combination of a polygon, a circle or an ellipse, and the area of the circuit extension conductor layer can be adjusted.