CN217405396U - Wafer clamping device - Google Patents
Wafer clamping device Download PDFInfo
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- CN217405396U CN217405396U CN202220437338.3U CN202220437338U CN217405396U CN 217405396 U CN217405396 U CN 217405396U CN 202220437338 U CN202220437338 U CN 202220437338U CN 217405396 U CN217405396 U CN 217405396U
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- lower chuck
- clamping
- chuck
- connecting rod
- motor
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Abstract
The utility model discloses a wafer clamping device relates to the technical field of monolithic wet processing. The wafer clamping device comprises a power part and a clamping part, wherein the power part is positioned above the clamping device, the clamping part is positioned below the clamping device, the clamping part comprises a lower chuck plate and an upper chuck plate, and the power part comprises a clamping cylinder and a motor; the lower chuck is connected to a lower chuck horizontal connecting rod through a lower chuck vertical connecting rod, the upper part of the upper chuck is connected to a clamping cylinder, a cylinder fixing plate is arranged on the lower chuck horizontal connecting rod, and the lower chuck horizontal connecting rod and the cylinder fixing plate are connected to the end of a motor shaft through bolts; the motor is a hollow arrangement, and an intake pipe and an exhaust pipe penetrate through the upper portion of the motor, the intake pipe is connected to a rodless cavity of the clamping cylinder, and the exhaust pipe is connected to a rod cavity of the clamping cylinder. The output thrust of the cylinders uniformly distributed on the two sides is stable and consistent, and the risk of damaging the wafer can be reduced. The standard cylinder is convenient to replace, and the structure is simple and reliable.
Description
Technical Field
The utility model relates to a technical field of monolithic wet processing specifically is a wafer clamping device.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the raw material is silicon, and high-purity polycrystalline silicon is dissolved and doped into a silicon crystal seed crystal, and then slowly pulled out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, silicon crystal wafers are formed, namely, the wafer production line is mainly 8 inches and 12 inches in the wafer domestic.
In the manufacture of semiconductor chips, electroplating is a common method for forming a film on a wafer. In advanced packaging technology, electroplating is often used to form copper pillars, solder joints, etc. on the wafer because electroplating has the advantages of simple process, low cost, etc.
During the electroplating process, the wafer surface devices are all exposed to the electroplating solution and are rotated slowly, and the wafer is fixed on the electroplating plate and rotates along with the electroplating plate. Only the edge and the back of the wafer can be clamped and contacted, and the wafer needs to be fixed by using a clamping mode.
In the prior art, a clamping process usually adopts an air cylinder to provide power, thrust nonuniformity is easily formed, an upper pressure ring is easily eccentric, and a certain risk of crushing a wafer exists.
SUMMERY OF THE UTILITY MODEL
For solving above-mentioned problem, solve the problem that above-mentioned background art provided promptly, the utility model provides a wafer clamping device, concrete technical scheme is as follows:
a wafer clamping device comprises a power part positioned on the upper part and a clamping part positioned on the lower part, wherein the clamping part comprises a lower chuck 1 and an upper chuck 2, and the power part comprises a clamping cylinder 5 and a motor 6; the lower chuck 1 is connected to a lower chuck horizontal connecting rod 4 through a lower chuck vertical connecting rod 3, the upper part of the upper chuck 2 is connected to a clamping cylinder 5, a cylinder fixing plate 7 is arranged on the lower chuck horizontal connecting rod 4, and the lower chuck horizontal connecting rod 4 and the cylinder fixing plate 7 are connected to the shaft end of a motor 6 through bolts; the motor 6 is a hollow structure, an air inlet pipe 8 and an air outlet pipe 9 penetrate through the upper portion of the hollow structure, the air inlet pipe 8 is connected to a rodless cavity of the clamping cylinder, and the air outlet pipe 9 is connected to a rod cavity of the clamping cylinder 5.
Further, the upper chuck 2 is circular, an outer wall is arranged upwards at the periphery of the upper chuck to enable the upper chuck 2 to form a groove, a lower chuck horizontal connecting rod 4 is arranged along a diameter direction, and the lower chuck vertical connecting rod 3 penetrates through the ground of the upper chuck 2 and is connected to two ends of the lower chuck horizontal connecting rod 4.
Further, a cylinder fixing plate 7 in an inverted concave shape is arranged on the upper surface of the lower chuck horizontal connecting rod 4, the lower chuck horizontal connecting rod 4 is embedded in a concave position of the cylinder fixing plate 7, two sides of the cylinder fixing plate 7 are fixedly connected with the side wall of the clamping cylinder 5 through bolts, and the bottom of a pressure rod 11 in the clamping cylinder 5 is fixed to the upper surface inside the upper chuck 2.
Further, the lower chuck plate 1 is a hollow circular ring, and the inner diameter of the lower surface of the lower chuck plate 1 is slightly smaller than that of the upper surface of the lower chuck plate 1, so that the inner wall of the lower chuck plate 1 forms a certain inclination angle; the upper surfaces of two sides of the diameter of the lower chuck 1 are connected to the lower chuck vertical connecting rod 3.
Furthermore, the outside of the motor 6 is provided with a U-shaped motor sleeve 10, the bottoms of the two sides of the motor sleeve 10 are slightly protruded inwards, so that the motor sleeve 10 is clamped in the concave position of the bottom of the motor 6, and the effect of fixing the motor sleeve 10 is achieved.
The utility model has the advantages of: the cylinder output thrust of both sides equipartition is steady unanimous, reducible risk of damaging the wafer. The standard cylinder is convenient to replace, and the structure is simple and reliable.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a front view of an embodiment of the present invention;
FIG. 3 is a side view of an embodiment of the present invention;
FIG. 4 is a cross-sectional view taken along the line A-A in FIG. 3;
FIG. 5 is a cross-sectional view taken along line B-B of FIG. 2;
fig. 6 is a top view of an embodiment of the present invention.
Reference numeral 1, a lower chuck; 2, mounting a chuck; 3, a lower chuck vertical connecting rod; 4, a lower chuck horizontal connecting rod; 5, clamping the cylinder; 6, a motor; 7, a cylinder fixing plate; 8, an air inlet pipe; 9, an exhaust pipe; 10, a motor cover; 11, a pressure lever.
Detailed Description
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.
As shown in fig. 1 to 6, a wafer clamping apparatus includes a power part located above and a clamping part located below, the clamping part including a lower chuck and an upper chuck, the power part including a clamping cylinder and a motor; the lower chuck is connected to a lower chuck horizontal connecting rod through a lower chuck vertical connecting rod, the upper part of the upper chuck is connected to a clamping cylinder, a cylinder fixing plate is arranged on the lower chuck horizontal connecting rod, and the lower chuck horizontal connecting rod and the cylinder fixing plate are connected to the end of a motor shaft through bolts; the motor is arranged in a hollow mode, an air inlet pipe and an exhaust pipe penetrate through the upper portion of the motor, the air inlet pipe is connected to a rodless cavity of the clamping cylinder, and the exhaust pipe is connected to a rod cavity of the clamping cylinder.
The upper chuck is circular, the outer wall is arranged upwards at the periphery of the upper chuck to enable the upper chuck to form a groove, the lower chuck horizontal connecting rod is arranged along the diameter direction, and the lower chuck vertical connecting rod penetrates through the ground of the upper chuck and is connected to the two ends of the lower chuck horizontal connecting rod.
The upper surface of the lower chuck horizontal connecting rod is provided with an inverted concave cylinder fixing plate, the lower chuck horizontal connecting rod is embedded into a concave part of the cylinder fixing plate, two sides of the cylinder fixing plate are fixedly connected with the side wall of the clamping cylinder through bolts, and the bottom of a pressing rod in the clamping cylinder is fixed to the upper surface of the inner part of the upper chuck.
The lower chuck is in a hollow annular shape, and the inner diameter of the lower surface of the lower chuck is slightly smaller than that of the upper surface of the lower chuck, so that a certain inclination angle is formed on the inner wall of the lower chuck; the upper surfaces of two sides of the diameter of the lower clamping plate are connected to the vertical connecting rod of the lower clamping plate.
The U-shaped motor sleeve is arranged outside the motor, and the bottoms of two sides of the motor sleeve are inwards slightly protruded, so that the motor sleeve is clamped in the concave part of the bottom of the motor, and the effect of fixing the motor sleeve is achieved.
In the use, when the motor shaft begins to rotate, lower (holding) chuck horizontal connecting rod, cylinder fixed plate, the perpendicular connecting rod of lower (holding) chuck can be with motor shaft synchronous revolution, and the (holding) chuck is connected with the centre gripping cylinder, and the back is intake in the rodless chamber of centre gripping cylinder, and the depression bar can move down, promotes the (holding) chuck and removes and compress tightly the wafer, and when needs unclamped the wafer, the (holding) cylinder has the pole chamber to intake, and the depression bar drives the (holding) chuck withdrawal, takes out the wafer through the gap of (holding) chuck and lower (holding) chuck.
During the specific use, the manipulator places the wafer in lower chuck, then compressed air lets in the rodless chamber of centre gripping cylinder, because the depression bar has already been fixed with last chuck, the depression bar can be along with the increase of air input slowly descend, and the wafer centre gripping below is lived to last chuck dropping. And then, the motor drives the wafer to rotate to finish the electroplating process. After the process is finished, compressed air is introduced into a rod cavity of the air cylinder, the pressure rod retracts to drive the upper chuck plate to lift and separate from the wafer, and when the pressure rod retracts completely, the manipulator extends into the gap to take out the wafer, so that the process is finished.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention, and particularly, all technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present invention is not intended to be limited to the particular embodiments disclosed herein, but rather to include all embodiments falling within the scope of the appended claims.
In the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, which indicate directions or positional relationships, are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus.
So far, the technical solution of the present invention has been described with reference to the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, a person skilled in the art can make equivalent changes or substitutions to the related technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.
Claims (5)
1. A wafer clamping device is characterized in that: the wafer clamping device comprises a power part and a clamping part, wherein the power part is positioned above the clamping part, the clamping part is positioned below the clamping part, the clamping part comprises a lower clamping disc (1) and an upper clamping disc (2), and the power part comprises a clamping cylinder (5) and a motor (6); the lower chuck (1) is connected to a lower chuck horizontal connecting rod (4) through a lower chuck vertical connecting rod (3), the upper part of the upper chuck (2) is connected to a clamping cylinder (5), a cylinder fixing plate (7) is arranged on the lower chuck horizontal connecting rod (4), and the lower chuck horizontal connecting rod (4) and the cylinder fixing plate (7) are connected to the shaft end of a motor (6) through bolts; the motor (6) is arranged in a hollow mode, an air inlet pipe (8) and an exhaust pipe (9) penetrate through the upper portion of the motor, the air inlet pipe (8) is connected to a rodless cavity of the clamping cylinder, and the exhaust pipe (9) is connected to a rod cavity of the clamping cylinder (5).
2. A wafer clamping device as recited in claim 1, wherein: the upper chuck (2) is circular, the outer wall is arranged upwards at the periphery of the upper chuck to enable the upper chuck (2) to form a groove, the lower chuck horizontal connecting rod (4) is arranged along the diameter direction, and the lower chuck vertical connecting rod (3) penetrates through the upper chuck (2) and is connected to the two ends of the lower chuck horizontal connecting rod (4).
3. A wafer-clamping device as defined in claim 2, wherein: the upper surface of the lower chuck horizontal connecting rod (4) is provided with a cylinder fixing plate (7) in an inverted concave shape, the lower chuck horizontal connecting rod (4) is embedded into a depression of the cylinder fixing plate (7), two sides of the cylinder fixing plate (7) are fixedly connected with the side wall of the clamping cylinder (5) through bolts, the bottom of a pressing rod (11) in the clamping cylinder (5) is fixed to the upper surface of the inner part of the upper chuck (2), the bottom of the upper chuck (2) is downwards provided with a bulge, and the shape of the bulge side wall is the same as that of the inner wall of the lower chuck (1).
4. A wafer-clamping device as defined in claim 1, wherein: the lower chuck (1) is in a hollow circular ring shape, and the inner diameter of the lower surface of the lower chuck (1) is slightly smaller than that of the upper surface of the lower chuck (1), so that a certain inclination angle is formed on the inner wall of the lower chuck (1); the upper surfaces of two sides of the diameter of the lower chuck (1) are connected to a vertical connecting rod (3) of the lower chuck.
5. A wafer clamping device as recited in claim 1, wherein: the U-shaped motor sleeve is characterized in that a motor sleeve (10) in an inverted U shape is arranged outside the motor (6), and the bottoms of the two sides of the motor sleeve (10) are inwards slightly protruded, so that the motor sleeve (10) is clamped in a concave position of the bottom of the motor (6), and the effect of fixing the motor sleeve (10) is achieved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220437338.3U CN217405396U (en) | 2022-03-02 | 2022-03-02 | Wafer clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220437338.3U CN217405396U (en) | 2022-03-02 | 2022-03-02 | Wafer clamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217405396U true CN217405396U (en) | 2022-09-09 |
Family
ID=83139241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220437338.3U Active CN217405396U (en) | 2022-03-02 | 2022-03-02 | Wafer clamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217405396U (en) |
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2022
- 2022-03-02 CN CN202220437338.3U patent/CN217405396U/en active Active
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