CN219925626U - Silicon wafer polishing equipment - Google Patents
Silicon wafer polishing equipment Download PDFInfo
- Publication number
- CN219925626U CN219925626U CN202321033508.2U CN202321033508U CN219925626U CN 219925626 U CN219925626 U CN 219925626U CN 202321033508 U CN202321033508 U CN 202321033508U CN 219925626 U CN219925626 U CN 219925626U
- Authority
- CN
- China
- Prior art keywords
- polishing
- silicon wafer
- power source
- assembly
- elastic element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005498 polishing Methods 0.000 title claims abstract description 78
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 49
- 239000010703 silicon Substances 0.000 title claims abstract description 49
- 238000005096 rolling process Methods 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001125 extrusion Methods 0.000 abstract description 3
- 238000007517 polishing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to the technical field of silicon wafer polishing, in particular to silicon wafer polishing equipment, which comprises a machine body base, wherein supporting legs and a top plate are arranged above the machine body base, the top plate is positioned above the supporting legs, and the silicon wafer polishing equipment further comprises: the polishing assembly is positioned between the machine body base and the top plate and comprises a rolling element and a first elastic element, wherein the rolling element and the first elastic element are driven by a first power source to move along the vertical direction, and the polishing assembly is driven by a second power source to rotate, so that friction impact when the polishing assembly is in contact with a silicon wafer is reduced; the clamping assembly is positioned below the polishing assembly and comprises a second elastic element, and the second elastic element is matched with the polishing assembly to play a role in limiting and extruding the silicon wafer in the Z-axis direction in a three-dimensional system. According to the polishing device, the polishing assembly and the clamping assembly are arranged, so that the extrusion force is reduced, meanwhile, the silicon wafer is prevented from sliding, and the polishing effect is prevented from being influenced.
Description
Technical Field
The utility model relates to the technical field of silicon wafer polishing, in particular to silicon wafer polishing equipment.
Background
On a silicon wafer with large grains, 16 ten thousand transistors can be integrated, which is another milestone of scientific and technological progress. The silicon element in the crust reaches 25.8%, and an inexhaustible source spring is provided for the production of monocrystalline silicon. Since elemental silicon is one of the most abundant elements in the crust, the advantage of reserves is also one of the reasons that silicon is the main material of photovoltaics for products such as solar cells destined to enter the mass market. In the prior art, when polishing a silicon wafer, the silicon wafer is fixed and clamped due to the stability of the polishing process, but when the silicon wafer is fixed, the position of the silicon wafer is fixed, and then the polishing process is carried out, so that the polishing head cannot be accurately manually operated to the top end of the silicon wafer, the surface of the silicon wafer is easily damaged or deviated from the top end of the silicon wafer, and the polishing effect is affected. In view of this, we propose a silicon wafer polishing apparatus.
Disclosure of Invention
In order to overcome the defects, the utility model provides silicon wafer polishing equipment.
The technical scheme of the utility model is as follows:
the utility model provides a silicon chip polishing equipment, includes the organism base, organism base top is equipped with supporting leg and roof, the roof is located the supporting leg top still includes:
the polishing assembly is positioned between the machine body base and the top plate and comprises a rolling element and a first elastic element, wherein the rolling element and the first elastic element are driven by a first power source to move along the vertical direction, and the polishing assembly is driven by a second power source to rotate, so that friction impact when the polishing assembly is in contact with a silicon wafer is reduced;
the clamping assembly is positioned below the polishing assembly and comprises a second elastic element, and the second elastic element is matched with the polishing assembly to play a role in limiting and extruding the silicon wafer in the Z-axis direction in a three-dimensional system.
Preferably, the polishing assembly further comprises a polishing head, the first power source and the second power source are both located above the polishing head, and the second power source is located at a position between the first power source and the polishing head.
Preferably, the first power source drives the second power source and the polishing head to synchronously move along the vertical direction, and an output shaft of the second power source drives the polishing head to coaxially rotate.
Preferably, the rolling element includes a movable ball and a movable groove, the movable ball is located in the movable groove, the movable groove is uniformly distributed on the circumference of the bottom of the polishing head, and the diameter of the notch of the movable groove is smaller than that of the movable ball, so as to limit the movable ball to move out of the movable groove.
Preferably, the first elastic element comprises a first spring, and the first spring is located in the movable groove and connected with the movable ball.
Preferably, the clamping assembly further comprises a limiting ring, and the second elastic element comprises a second spring, wherein the second spring is located at the bottom end of the limiting ring and distributed circumferentially at the bottom end of the limiting ring.
Compared with the prior art, the utility model has the beneficial effects that:
according to the polishing device, the polishing assembly and the clamping assembly are arranged, so that the polishing head cannot damage the upper surface of the silicon wafer due to the strength of rotation force, the extrusion force is reduced, the silicon wafer is clamped and limited by the limiting rings under the action of the elastic force of the second spring from the upper side and the lower side, and the silicon wafer is prevented from sliding, so that the polishing effect is prevented from being influenced.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a front view of the present utility model;
FIG. 3 is a schematic view showing the structure of a polishing head and a movable ball according to the present utility model;
FIG. 4 is an exploded view of the polishing head and movable ball of the present utility model;
fig. 5 is an exploded view of the stop collar and body mount of the present utility model.
In the figure: 1. a machine body base; 2. support legs; 3. a top plate; 4. a cylinder; 5. a collection tray; 6. a motor; 7. a polishing head; 8. a movable ball; 9. a movable groove; 10. a first spring; 11. a groove; 12. a second spring; 13. and a limiting ring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1-5, the present utility model is described in detail by the following embodiments:
the utility model provides a silicon chip polishing equipment, includes organism base 1, organism base 1 top is equipped with supporting leg 2 and roof 3, the upper end and the roof 3 fixed connection of supporting leg 2, lower extreme and organism base 1 fixed connection, roof 3 is located supporting leg 2 top, organism base 1 upper end fixedly connected with collection dish 5 for collect the piece, still include:
the polishing assembly is positioned between the machine body base 1 and the top plate 3 and comprises rolling elements and first elastic elements, the rolling elements and the first elastic elements are driven by a first power source to move along the vertical direction, and the polishing assembly is driven by a second power source to rotate, so that friction impact when the polishing assembly is in contact with a silicon wafer is reduced;
the clamping assembly is positioned below the polishing assembly and comprises a second elastic element, and the second elastic element is matched with the polishing assembly to play a role in limiting and extruding the silicon wafer in the Z-axis direction in a three-dimensional system. The first power source is a cylinder 4, the cylinder 4 is fixed at the upper end of the top plate 3, and the second power source is a motor 6. The polishing assembly further includes a polishing head 7, and the first power source and the second power source are both located above the polishing head 7, and the second power source is located at a position between the first power source and the polishing head 7. The first power source drives the second power source and the polishing head 7 to synchronously move along the vertical direction, and an output shaft of the second power source drives the polishing head 7 to coaxially rotate. The upper end of the motor 6 is fixedly connected with the cylinder 4, and the lower end is fixedly connected with the polishing head 7.
The rolling element comprises a movable ball 8 and a movable groove 9, wherein the movable ball 8 is positioned in the movable groove 9, the movable groove 9 is uniformly distributed on the circumference at the bottom of the polishing head 7, and the diameter of the notch of the movable groove 9 is smaller than that of the movable ball 8 and is used for limiting the movable ball 8 to move out of the movable groove 9. The first elastic element comprises a first spring 10, the first spring 10 being located in the movable groove 9 and being connected to the movable ball 8. One end of the first spring 10 is fixedly connected with the movable ball 8, and the other end is fixedly connected with the bottom of the movable groove 9. The clamping assembly further comprises a limiting ring 13, and the second elastic element comprises a second spring 12, wherein the second spring 12 is positioned at the bottom end of the limiting ring 13 and distributed circumferentially at the bottom end of the limiting ring 13. The top of organism base 1 is equipped with recess 11, and recess 11 is annular, and the bottom of spacing ring 13 is placed in recess 11, and the one end and the spacing ring 13 bottom fixed connection of second spring 12, the tank bottom fixed connection of the other end and recess 11.
When in use, the silicon wafer is placed on the machine body base 1 and is positioned in the limiting ring 13, and the limiting ring 13 is looped on the outer wall of the silicon wafer. Starting the air cylinder 4, driving the motor 6 and the polishing head 7 to move downwards to the upper surface of the silicon wafer by the air cylinder 4, enabling the polishing head 7 to contact with the top of the limiting ring 13 at the same time, and compressing the second spring 12 at the bottom end of the limiting ring 13 until the top of the limiting ring 13 and the top of the silicon wafer are at the same horizontal height, and similarly, compressing the first spring 10 at the bottom end of the polishing head 7 to enable the movable ball 8 to move upwards in the movable groove 9 along the vertical direction. The motor 6 is started, the motor 6 drives the polishing head 7 to polish the silicon wafer, at this time, the polishing head 7 and the silicon wafer cannot damage the upper surface of the silicon wafer due to the strength of rotation force due to the elastic force of the first spring 10 and the rolling effect of the movable ball 8, the extrusion force is reduced, and meanwhile the limiting rings 13 under the elastic force of the second spring 12 respectively clamp and limit the silicon wafer from the upper side and the lower side, so that the silicon wafer is prevented from sliding, and the polishing effect is affected.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a silicon chip polishing equipment, includes organism base (1), organism base (1) top is equipped with supporting leg (2) and roof (3), roof (3) are located supporting leg (2) top, its characterized in that still includes:
the polishing assembly is positioned between the machine body base (1) and the top plate (3) and comprises rolling elements and first elastic elements, the rolling elements and the first elastic elements are driven by a first power source to move along the vertical direction, and the polishing assembly is driven by a second power source to rotate, so that friction impact when the polishing assembly is in contact with a silicon wafer is reduced;
the clamping assembly is positioned below the polishing assembly and comprises a second elastic element, and the second elastic element is matched with the polishing assembly to play a role in limiting and extruding the silicon wafer in the Z-axis direction in a three-dimensional system.
2. The silicon wafer polishing apparatus as set forth in claim 1, wherein: the polishing assembly further comprises a polishing head (7), wherein the first power source and the second power source are both positioned above the polishing head (7), and the second power source is positioned between the first power source and the polishing head (7).
3. The silicon wafer polishing apparatus as set forth in claim 2, wherein: the first power source drives the second power source and the polishing head (7) to synchronously move along the vertical direction, and an output shaft of the second power source drives the polishing head (7) to coaxially rotate.
4. The silicon wafer polishing apparatus as set forth in claim 2, wherein: the rolling element comprises a movable ball (8) and a movable groove (9), wherein the movable ball (8) is positioned in the movable groove (9), the movable groove (9) is uniformly distributed on the circumference at the bottom of the polishing head (7), and the diameter of a notch of the movable groove (9) is smaller than that of the movable ball (8) and is used for limiting the movable ball (8) to move out of the movable groove (9).
5. The silicon wafer polishing apparatus as set forth in claim 4, wherein: the first elastic element comprises a first spring (10), and the first spring (10) is positioned in the movable groove (9) and is connected with the movable ball (8).
6. The silicon wafer polishing apparatus as set forth in claim 1, wherein: the clamping assembly further comprises a limiting ring (13), the second elastic element comprises a second spring (12), and the second spring (12) is located at the bottom end of the limiting ring (13) and distributed circumferentially at the bottom end of the limiting ring (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321033508.2U CN219925626U (en) | 2023-05-04 | 2023-05-04 | Silicon wafer polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321033508.2U CN219925626U (en) | 2023-05-04 | 2023-05-04 | Silicon wafer polishing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219925626U true CN219925626U (en) | 2023-10-31 |
Family
ID=88500627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321033508.2U Active CN219925626U (en) | 2023-05-04 | 2023-05-04 | Silicon wafer polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219925626U (en) |
-
2023
- 2023-05-04 CN CN202321033508.2U patent/CN219925626U/en active Active
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| GR01 | Patent grant |