CN211164732U

CN211164732U - Fixing clamp for wafer cutting machine

Info

Publication number: CN211164732U
Application number: CN201921631485.9U
Authority: CN
Inventors: 乔金彪
Original assignee: Suzhou Superlight Microelectronics Co ltd
Current assignee: Suzhou Superlight Microelectronics Co ltd
Priority date: 2019-09-28
Filing date: 2019-09-28
Publication date: 2020-08-04
Anticipated expiration: 2029-09-28

Abstract

The utility model discloses a fixing clamp for a wafer cutting machine, which comprises a base, wherein a groove with an upward opening is arranged inside the base, a lifting plate is arranged below the inside of the groove, an upward pushing device for driving the lifting plate to lift is arranged below the inside of the base, clamping plates are arranged on two sides of the inside of the groove, push-pull cylinders for driving the clamping plates to move horizontally are arranged on two sides of the base, dense balls are arranged on the inner walls of the clamping plates, each push-pull cylinder comprises a cylinder body and a cylinder rod, the utility model is provided with the upward pushing device, when the cutting of a wafer column exposed above the clamp is finished, the lifting plate can be pushed upwards through the upward pushing device, the wafer column positioned inside the groove is pushed upwards when the lifting plate is lifted, and then the part of the wafer column positioned inside the groove can be pushed out by the groove until the whole wafer column is cut, so as to ensure that the wafer columns are cut completely each time without generating waste materials.

Description

Fixing clamp for wafer cutting machine

Technical Field

The utility model relates to a wafer cutting technical field specifically is a mounting fixture for wafer cutting machine.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular, the wafer is a basic material for manufacturing a semiconductor chip, and the wafer is a product obtained by cutting a wafer cylinder by a cutting machine, polishing and grinding the wafer cylinder;

during cutting, a clamp is required to be used for clamping, the stability of a crystal cylinder cannot be guaranteed in the clamping process of the existing clamp, the existing clamp cannot be fixed from multiple directions, and the clamp cannot be suitable for crystal cylinders with different thicknesses, so that wafers with different sizes cannot be produced, and although some clamps can clamp, the disassembly and assembly are troublesome, and the working efficiency is influenced;

for this reason, the patent with application number 201721207148.8 proposes an adjustable clamp of a wafer cutting machine, which inserts the lower end of a wafer cylinder into the inside of a groove by providing the groove, and then uses a clamping tool to clamp the lower end of the wafer cylinder, so that the clamping is stable, but after the wafer cylinder exposed outside the groove is cut, the wafer cylinder inside the groove cannot be cut, and waste materials are generated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a mounting fixture for wafer cutting machine to expose among the solution prior art after the outside wafer post cutting of anchor clamps is accomplished, the inside wafer post of its recess can't be cut, can produce the waste material problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a mounting fixture for wafer cutting machine, includes the base, the inside of base is provided with the ascending recess of opening, the inside below of recess is provided with the lifter plate, the inside below of base is installed and is used for driving the pusher that the lifter plate goes up and down.

Preferably, clamping plates are arranged on two sides of the inner portion of the groove, and push-pull cylinders used for driving the clamping plates to move horizontally are mounted on two sides of the base.

Preferably, the inner wall of the clamping plate is provided with dense balls.

Preferably, the push-pull cylinder includes a cylinder block and a cylinder rod, one end of the cylinder block is inserted into the cylinder rod, and the other end of the cylinder block is inserted into the groove and fixed to the side of the clamp plate.

Preferably, the pushing-up device comprises a lower barrel and an upper barrel, the lower end of the upper barrel is inserted into the lower barrel, a containing groove with a downward opening is formed in the upper barrel, and racks are arranged on two sides of the containing groove.

Preferably, the position that the inside of lower section of thick bamboo is close to the upper end is provided with two intermeshing's gear, and the gear is located the inside and the rack toothing of holding tank, the externally mounted of lower section of thick bamboo has the motor that is used for drive gear.

Preferably, still including erecting the support, erect the support mounting in the top of base, erect the top of support and install the lateral frame, the middle part of lateral frame has passed from the top down and has had the depression bar, and the lower extreme of depression bar is fixed with the pressure head, and the upper end of depression bar is fixed with the limiting plate, and the latter half circumference of depression bar outside overlaps and be equipped with the spring.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses set up the push-up device, after the wafer post cutting of exposing above anchor clamps is accomplished, can upwards promote the lifter plate through the push-up device, upwards promote when the lifter plate rises and be located the inside wafer post of recess, and then the wafer post is located the inside part of recess and can be released the recess and cut, and is accomplished by the cutting until the wafer post is whole to guarantee that the equal cutting of wafer post at every turn is thorough, does not produce the waste material.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the connection between the lifter plate and the pushing-up device of the present invention;

fig. 3 is a schematic structural view of the pushing-up device of the present invention;

fig. 4 is a schematic structural view of the clamp plate and the push-pull cylinder according to the present invention.

In the figure: 1. a base; 2. a groove; 3. a push-pull cylinder; 31. a cylinder block; 32. a cylinder rod; 4. a splint; 5. a push-up device; 51. a lower barrel; 52. feeding the cylinder; 53. a motor; 54. a rack; 55. a gear; 56. accommodating grooves; 6. a lifting plate; 7. a ball bearing; 8. a vertical support; 9. a transverse bracket; 10. a pressure head; 11. a spring; 12. a limiting plate; 13. a pressure lever.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 and 4, in an embodiment of the present invention, a fixing clamp for a wafer cutting machine includes a base 1, a groove 2 with an upward opening is formed in the base 1, the groove 2 can accommodate a clamp plate 4, a wafer column is placed between the two clamp plates 4, the clamp plates 4 are disposed on two sides of the inner portion of the groove 2, and dense balls 7 are disposed on the inner wall of the clamp plate 4, so that the wafer column can be clamped after the two clamp plates 4 are clamped, and the wafer column can move up and down under the action of an external force due to the action of the balls 7 after being clamped, and can rotate (the wafer column does not rotate because of no rotational force applied thereto);

as shown in fig. 1 and 4, a push-pull cylinder 3 for driving the clamp plates 4 to move horizontally is installed on each side of the base 1, the push-pull cylinder 3 includes a cylinder block 31 and a cylinder rod 32, one end of the cylinder block 31 is inserted into the cylinder rod 32, and the other end of the cylinder block 31 is inserted into the groove 2 and fixed to the side surfaces of the clamp plates 4, and the cylinder block 31 can make the two clamp plates 4 approach each other or move away from each other by pushing or pulling the cylinder rod 32;

referring to fig. 1 and 2, a lifting plate 6 is disposed below the inside of the groove 2, a pushing device 5 for driving the lifting plate 6 to lift is mounted below the inside of the base 1, the pushing device 5 can lift the lifting plate 6, and when the lifting plate 6 is lifted upwards, the wafer column on the upper surface of the lifting plate 6 can be pushed to lift;

as shown in fig. 2 and fig. 3, the pushing-up device 5 includes a lower barrel 51 and an upper barrel 52, the lower end of the upper barrel 52 is inserted into the lower barrel 51, an accommodating groove 56 with a downward opening is formed in the upper barrel 52, racks 54 are respectively disposed on two sides of the inside of the accommodating groove 56, two gears 55 engaged with each other are disposed in the lower barrel 51 near the upper end, the gears 55 are located inside the accommodating groove 56 and engaged with the racks 54, a motor 53 for driving the gears 55 is mounted on the outside of the lower barrel 51, the motor 53 can drive one of the gears 55 to rotate, and then the two gears 55 can rotate simultaneously, and when the gears 55 rotate, the upper barrel 52 can be driven to move up and down due to the action of the racks 54, so as to realize the lifting of the lifting plate;

referring to fig. 1, a vertical support 8 is installed above a base 1, a transverse support 9 is installed above the vertical support 8, a pressure rod 13 penetrates through the middle of the transverse support 9 from top to bottom, a pressure head 10 is fixed at the lower end of the pressure rod 13, a limiting plate 12 is fixed at the upper end of the pressure rod 13, a spring 11 is sleeved outside the circumference of the lower half portion of the pressure rod 13, when a wafer cylinder is placed in a groove 2, the upper end of the wafer cylinder upwards jacks up the pressure head 10, the spring 11 is compressed at the moment, and the pressure head 10 plays a role of pressing the upper end of the wafer cylinder, so that the wafer cylinder is locked more firmly; when the position of the wafer column is locked, the wafer column is firstly inserted into the groove 2 until the lower end of the line of the wafer column is positioned on the upper surface of the lifting plate 6, when the wafer column is placed in the groove 2, the upper end of the wafer column upwards jacks up the pressure head 10, the spring 11 is compressed at the moment, the pressure head 10 plays a role of pressing the upper end of the wafer column, so that the locking of the wafer column is firmer, then the push-pull cylinder 3 is used for pushing the clamping plates 4, the two clamping plates 4 are used for locking the wafer column, the cutting machine above the wafer column starts to cut, when the wafer column exposed above the clamp is cut, the motor 53 is driven to drive one gear 55 to rotate by the driving motor 53, the two gears 55 can rotate simultaneously, the upper cylinder 52 can be driven to move up and down by the action of the rack 54 when the gear 55 rotates, so as to realize the lifting of the lifting plate 6, the wafer column is pushed up when the lifting, at the moment, the part of the wafer column positioned in the groove 2 can be pushed out of the groove 2 for cutting until the wafer column is completely cut.

The utility model discloses a theory of operation and use flow: when the position of the wafer column is locked, the wafer column is firstly inserted into the groove 2 until the lower end of the line of the wafer column is positioned on the upper surface of the lifting plate 6, when the wafer column is placed in the groove 2, the upper end of the wafer column upwards jacks up the pressure head 10, the spring 11 is compressed at the moment, the pressure head 10 plays a role of pressing the upper end of the wafer column, so that the locking of the wafer column is firmer, then the push-pull cylinder 3 is used for pushing the clamping plates 4, the two clamping plates 4 are used for locking the wafer column, the cutting machine above the wafer column starts to cut, when the wafer column exposed above the clamp is cut, the motor 53 is driven to drive one gear 55 to rotate by the driving motor 53, the two gears 55 can rotate simultaneously, the upper cylinder 52 can be driven to move up and down by the action of the rack 54 when the gear 55 rotates, so as to realize the lifting of the lifting plate 6, the wafer column is pushed up when the lifting, at the moment, the part of the wafer column positioned in the groove 2 can be pushed out of the groove 2 for cutting until the wafer column is completely cut.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a mounting fixture for wafer cutting machine, includes base (1), its characterized in that: the lifting device is characterized in that a groove (2) with an upward opening is formed in the base (1), a lifting plate (6) is arranged below the inner portion of the groove (2), and a pushing-up device (5) used for driving the lifting plate (6) to lift is installed below the inner portion of the base (1).

2. The fixing jig for the wafer cutting machine according to claim 1, characterized in that: clamping plates (4) are arranged on two sides of the inner portion of the groove (2), and push-pull cylinders (3) used for driving the clamping plates (4) to move horizontally are mounted on two sides of the base (1).

3. The fixing jig for the wafer cutting machine according to claim 2, characterized in that: dense balls (7) are arranged on the inner wall of the clamping plate (4).

4. The fixing jig for the wafer cutting machine according to claim 2, characterized in that: the push-pull cylinder (3) comprises a cylinder body (31) and a cylinder rod (32), one end of the cylinder body (31) is inserted into the cylinder rod (32), and the other end of the cylinder body (31) is inserted into the groove (2) and fixed with the side face of the clamping plate (4).

5. The fixing jig for the wafer cutting machine according to claim 1, characterized in that: the push-up device (5) comprises a lower barrel (51) and an upper barrel (52), the lower end of the upper barrel (52) is inserted into the lower barrel (51), an accommodating groove (56) with a downward opening is formed in the upper barrel (52), and racks (54) are arranged on two sides of the inside of the accommodating groove (56).

6. The fixing jig for the wafer cutting machine according to claim 5, characterized in that: the inside position that is close to the upper end of lower section of thick bamboo (51) is provided with two intermeshing's gear (55), and gear (55) are located the inside and the rack (54) meshing of holding tank (56), the externally mounted of lower section of thick bamboo (51) has motor (53) for drive gear (55).

7. The fixing jig for the wafer cutting machine according to claim 5, characterized in that: still including erecting support (8), erect support (8) and install the top at base (1), erect the top of support (8) and install lateral frame (9), the middle part from the top of lateral frame (9) has passed depression bar (13) from the top down, and the lower extreme of depression bar (13) is fixed with pressure head (10), and the upper end of depression bar (13) is fixed with limiting plate (12), and the outside cover of the latter half circumference of depression bar (13) is equipped with spring (11).