CN217404896U - Fingerprint identification subassembly, fingerprint identification module and electronic equipment - Google Patents
Fingerprint identification subassembly, fingerprint identification module and electronic equipment Download PDFInfo
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- CN217404896U CN217404896U CN202123153612.9U CN202123153612U CN217404896U CN 217404896 U CN217404896 U CN 217404896U CN 202123153612 U CN202123153612 U CN 202123153612U CN 217404896 U CN217404896 U CN 217404896U
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Abstract
The application provides a fingerprint identification subassembly, fingerprint identification module and electronic equipment, this fingerprint identification subassembly includes: the fingerprint identification chip is provided with a first surface and a second surface which are mutually deviated, and a through hole penetrating through the first surface and the second surface is formed in the fingerprint identification chip; the wafer welding pad is arranged on the first surface; and the rewiring layer is arranged on the second surface, extends into the through hole and is electrically connected with the wafer welding pad. This application realizes and sets up the electric connection at the wafer pad of fingerprint identification chip opposite side in extending to the through-hole that runs through the fingerprint identification chip through making the rewiring layer that is located fingerprint identification chip one side, compares in the routing encapsulation among the prior art, can reduce the size of fingerprint identification subassembly on the thickness vertical direction for fingerprint identification chip subassembly can be applicable to the less electronic equipment of size.
Description
Technical Field
The application relates to the technical field of fingerprint identification, particularly, relate to a fingerprint identification subassembly, fingerprint identification module and electronic equipment.
Background
Among the prior art, when encapsulating the fingerprint identification subassembly, adopt the mode of routing encapsulation usually, however, the routing encapsulation leads to the fingerprint identification subassembly the size great, can't be applicable to like the less electronic equipment of sizes such as earphone, bracelet, wrist-watch.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the application is to provide a fingerprint identification subassembly, fingerprint identification module and electronic equipment for improve among the prior art the great problem that can't be applicable to the less electronic equipment of size of fingerprint identification subassembly size.
The application provides a fingerprint identification subassembly, includes: the fingerprint identification chip is provided with a first surface and a second surface which are mutually deviated, and a through hole penetrating through the first surface and the second surface is formed in the fingerprint identification chip; the wafer welding pad is arranged on the first surface; and the rewiring layer is arranged on the second surface, extends into the through hole and is electrically connected with the wafer welding pad.
This application is through making the rewiring layer that is located fingerprint identification chip one side surface extend to in the through-hole that runs through the fingerprint identification chip, realize with the electric connection of the wafer pad that sets up in fingerprint identification chip opposite side surface, compare in the routing encapsulation among the prior art, can reduce the size of fingerprint identification subassembly on the thickness vertical direction for fingerprint identification chip subassembly can be applicable to the less electronic equipment of size.
In one embodiment, the fingerprint identification chip includes the fingerprint identification induction zone, be provided with on the fingerprint identification chip the thickness of the one end of through-hole is less than the thickness at the position that the fingerprint identification induction zone corresponds.
This application is through making the thickness that is provided with the one end of through-hole on the fingerprint identification chip be less than the thickness of the position that the fingerprint identification induction zone corresponds, can reduce the preparation degree of difficulty of through-hole.
In an embodiment, the second surface has a slope structure, and the slope structure is connected between the end provided with the through hole and a portion corresponding to the fingerprint identification sensing area.
This application is provided with the one end of through-hole and the position that the fingerprint identification induction zone corresponds through adopting the slope structure to connect, can reduce stress and gather, promotes the structural stability of fingerprint identification subassembly.
In an embodiment, the fingerprint identification assembly further includes an electrical adapting component, and the electrical adapting component is disposed on a side of the redistribution layer away from the fingerprint identification chip, and is electrically connected to a line of the redistribution layer.
This application is convenient for realize the fingerprint identification subassembly through setting up the electricity switching part and be used for connecting the electric connection between the circuit board of terminal equipment.
In one embodiment, the electrical transfer component is a conductive post.
This application is through adopting leading electrical pillar as electric switching part, helps reducing the thickness of fingerprint identification subassembly.
In one embodiment, the number of the electrical switching components is multiple, and the redistribution layer includes multiple wires; the number of the electric switching components, the number of the leads and the number of the through holes are consistent; one end of each conducting wire is electrically connected with one electric switching component, and the other end of each conducting wire extends into one through hole to be electrically connected with one wafer welding pad.
In an embodiment, the plurality of electrical connection components, the plurality of wires, and the plurality of through holes are symmetrically disposed with respect to a center line of the fingerprint identification chip in a width direction.
This application helps guaranteeing the structural stability of fingerprint identification subassembly through making electric switching part, wire and through-hole be the axisymmetric setting respectively.
In one embodiment, the electrical connectors are disposed in axial symmetry with respect to a center line of the fingerprint identification chip in the length direction.
This application is through making electric switching part still be axisymmetric setting for fingerprint identification chip length direction's central line, helps reducing the width of fingerprint identification subassembly, and then reduces the size of fingerprint identification subassembly in width direction.
In one embodiment, the fingerprint identification assembly further comprises a packaging component, and the packaging component is used for packaging the fingerprint identification chip, the redistribution layer and the electrical connection component; the end face, far away from the fingerprint identification chip, of the electric connecting part is exposed out of the packaging part.
This application helps protecting each part of fingerprint identification subassembly through setting up the encapsulation part, exposes from the encapsulation part through the terminal surface that makes electric switching part keep away from the fingerprint identification chip, can avoid the encapsulation part to influence the electricity between electric switching part and the circuit board that is used for connecting terminal equipment to be connected.
In one embodiment, when the fingerprint identification chip includes a fingerprint identification sensing area, the first surface includes an upper surface of the fingerprint identification sensing area, and the upper surface of the fingerprint identification sensing area is exposed from the package component.
This application exposes from the encapsulation part through the upper surface that makes the fingerprint identification induction zone for the fingerprint identification subassembly is when using, and the fingerprint identification induction zone can be directly and glass apron contact, helps promoting fingerprint identification's sensitivity.
In one embodiment, the thickness of the fingerprint identification component is between 0.44mm and 0.68 mm.
The thickness control of this application through with the fingerprint identification subassembly is between 0.44mm ~ 0.68mm, can reduce the fingerprint identification subassembly as far as possible when guaranteeing the normal use of fingerprint identification subassembly to terminal equipment's thickness's influence, helps realizing terminal equipment's frivolousization.
In one embodiment, the electrical adapter includes an adapter plate and a weld; the adapter plate comprises a dielectric layer, circuit layers and electric connecting holes, wherein the circuit layers are arranged on two sides of the dielectric layer, and the electric connecting holes are arranged in the dielectric layer and used for electrically connecting the circuit layers on two sides of the dielectric layer; the welding piece is arranged between the adapter plate and the rewiring layer and used for electrically connecting the circuit layer and the rewiring layer.
This application is through adopting keysets and welding as the electricity switching part, helps promoting the structural strength of fingerprint identification subassembly.
In one embodiment, the fingerprint identification assembly further comprises an adhesive layer arranged between the adapter plate and the rewiring layer, the adhesive layer is provided with a plurality of through holes, and the welding piece is filled in the through holes.
This application can make keysets and chip bonding through the tie coat, promotes the structural stability of fingerprint identification subassembly.
In one embodiment, the fingerprint identification assembly further comprises a packaging component, and the packaging component is used for packaging the fingerprint identification chip, the rewiring layer and the bonding layer.
In an embodiment, when the fingerprint identification chip includes the fingerprint identification sensing area, the first surface includes an upper surface of the fingerprint identification sensing area, and the upper surface of the fingerprint identification sensing area is exposed from the package component.
In an embodiment, the fingerprint identification assembly further includes a packaging component, the packaging component is used for packaging the fingerprint identification chip, the redistribution layer and the electrical connection component, the position identification assembly has a third surface parallel to the first surface, and an area ratio of the third surface to the first surface is smaller than 1.3.
In one embodiment, the area ratio of the third surface to the first surface is between 1.1 and 1.3.
The application also provides a fingerprint identification module, include: the fingerprint identification component; and the circuit board is electrically connected with the redistribution layer of the fingerprint identification component.
The application also provides an electronic device, including aforementioned fingerprint identification module.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present disclosure.
Fig. 2 is a layout diagram of a plurality of electronic adapter components, a plurality of wires, and a plurality of through holes, which are symmetrically disposed respectively according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present application, in which a package member encloses a fingerprint identification chip.
Fig. 4 is a schematic structural diagram of a fingerprint identification assembly according to an embodiment of the present application, in which an electrical adapter includes an adapter plate and a welding member.
Fig. 5 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present application.
An icon: fingerprint identification component-10; fingerprint identification chip-11; wafer pad-12; a rewiring layer-13; a first surface-111; a second surface-113; a through-hole-112; fingerprint identification sensing zone-114; an electrical interface-14; a wire-131; a package component-15; a third surface-101; an adapter plate-141; a weldment-142; a second adhesive layer-16; a fingerprint identification module-100; a circuit board-20; a connector-30; a reinforcing plate-40.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
In the description of the present application, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, and are only used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used solely to distinguish one from another, and are not to be construed as indicating or implying relative importance.
It should also be noted that, unless expressly stated or limited otherwise, the terms "disposed" and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Referring to fig. 1, a fingerprint identification device 10 is provided according to an embodiment of the present application. The fingerprint identification device 10 may include a fingerprint identification chip 11, a wafer pad 12 disposed on the fingerprint identification chip 11, and a redistribution layer 13.
The fingerprint identification chip 11 may be an optical fingerprint identification chip, a capacitive fingerprint identification chip or a radio frequency fingerprint identification chip, etc.
The fingerprint identification chip 11 has a first surface 111 and a second surface 113 facing away from each other.
The fingerprint identification chip 11 is provided with a through hole 112 penetrating through the first surface 111 and the second surface 113.
The wafer pads 12 are disposed on the first surface 111.
The redistribution layer 13 is disposed on the second surface 113, and extends into the through hole 112 to be electrically connected to the wafer pad 12.
By means of the through hole 112, the redistribution layer 13 on the second surface 113 of the fingerprint identification chip 11 extends into the through hole 112 to be electrically connected with the wafer bonding pad 12 on the first surface 111 of the fingerprint identification chip 11, so that the wafer bonding pad 12 is electrically connected with a circuit board for connecting terminal equipment through the redistribution layer 13.
In some embodiments of the present application, the through hole 112 may be located at one end of the fingerprint recognition chip 11. In other embodiments of the present application, the through holes 112 may be located at both ends of the fingerprint recognition chip 11.
The fingerprint identification chip 11 may include a fingerprint identification sensing area 114.
The thickness of the end of the chip 11 where the through hole 112 is formed may be smaller than the thickness of the corresponding portion of the sensing region 114.
This application can reduce the preparation degree of difficulty of through-hole 112 through making the thickness that is provided with the tip of through-hole 112 less than the thickness of the position that fingerprint identification induction zone 114 corresponds.
In some embodiments of the present application, at least one of the first surface 111 and the second surface 113 has a slope structure. The slope structure is connected between the end portion provided with the through hole 112 and the portion corresponding to the fingerprint identification sensing area 114. By adopting the slope structure to connect the end portion provided with the through hole 112 and the portion corresponding to the fingerprint identification sensing area 114, stress concentration can be reduced, and the structural stability of the fingerprint identification assembly 10 is improved. In the embodiment shown in fig. 1, the second surface 113 has a ramp structure 115.
In some embodiments of the present application, the fingerprint identification assembly 10 may also include an electrical switch component 14. The electrical switching component 14 is disposed on the side of the redistribution layer 13 away from the fingerprint identification chip 11, and is electrically connected to the lines of the redistribution layer 13. Thus, the wafer pads 12 can be electrically connected to the circuit board for connecting the terminal equipment through the redistribution layer 13 and the electrical interposer 14 extending into the through holes 112.
In some embodiments of the present application, the electrical interposer 14 is a conductive post. By using the conductive posts as the electrical contact element 14, the height of the conductive posts can be controlled to a smaller extent than by using other contact structures (e.g., circuit board + solder) as the electrical contact element, thereby facilitating a reduction in the thickness of the fingerprint identification assembly 10.
Illustratively, the thickness of the fingerprint identification assembly 10 may be between 0.44mm and 0.68 mm. The thickness can be the thickness of the fingerprint identification component 10 that does not have the encapsulation part, also can be the thickness of the fingerprint identification component 10 that has the encapsulation part, through the thickness control of the fingerprint identification component 10 after will encapsulating between 0.44mm ~ 0.68mm, can be when guaranteeing the normal use of fingerprint identification component 10, reduce after terminal equipment (for example, electronic equipment such as earphone, wrist-watch, bracelet) is packed into to fingerprint identification component 10, the influence that causes terminal equipment's thickness, help realizing terminal equipment's frivolousness.
In some embodiments of the present application, the number of the electrical switching components 14 (or the conductive pillars) is multiple, the redistribution layer 13 may include multiple conductive wires, and the fingerprint identification chip 11 may also be provided with multiple through holes 112. The number of electrical transition members 14, conductors and vias 112 is the same. One end of each conductive line is electrically connected to one electrical transfer component 14, and the other end of each conductive line extends into a via 112 to be electrically connected to one wafer pad 12.
In some embodiments of the present application, the plurality of through holes 112 may be arranged in a row along the width direction of the fingerprint recognition chip 11. The plurality of wafer pads 12 may be arranged in the same manner as the plurality of through holes 112, thereby helping to ensure the rational layout of the components of the fingerprint identification device 10 and further helping to reduce the size of the fingerprint identification device 10.
In some embodiments of the present application, the plurality of electrical switching components 14, the plurality of wires of the redistribution layer 13, and the plurality of through holes 112 may be disposed in axial symmetry. The electrical adapter part 14, the wires of the redistribution layer 13 and the through holes 112 in the fingerprint identification chip 11 are respectively arranged in an axial symmetry manner, which is helpful for ensuring the structural stability of the fingerprint identification assembly 10.
In some embodiments of the present application, the electrical connectors 14, the wires and the through holes 112 may be disposed in axial symmetry with respect to a center line of the fingerprint identification chip 11 in a width direction (a direction perpendicular to the inward facing direction of fig. 1). In one embodiment, the plurality of electrical connectors 14 are disposed in axial symmetry with respect to the center line of the width direction of the fingerprint identification chip 11, the plurality of wires are disposed in axial symmetry with respect to the center line of the width direction of the fingerprint identification chip 11, and the plurality of through holes 112 are disposed in axial symmetry with respect to the center line of the width direction of the fingerprint identification chip 11, the plurality of wires may have different lengths, and each wire may extend along the length direction of the fingerprint identification chip 11, and the wires are disposed in parallel with each other.
In another embodiment, referring to fig. 2, the electrical adapting members 14, the conductive wires and the through holes 112 may be disposed in an axial symmetry manner with respect to a center line of the fingerprint identification chip 11 in a width direction (a direction perpendicular to the inward facing direction of fig. 1), and the electrical adapting members 14 may be disposed in an axial symmetry manner with respect to a center line of the fingerprint identification chip 11 in a length direction. In this manner, the structural stability of the fingerprint identification assembly 10 may be further ensured.
Referring again to FIG. 1, in some embodiments of the present application, the fingerprint identification assembly 10 further includes a package component 15. The package member 15 encapsulates the fingerprint identification chip 11, the redistribution layer 13 and the electrical connection member 14, and an end surface of the electrical connection member 14 away from the fingerprint identification chip 11 is exposed from the package member 15. By providing the package member 15, it is helpful to protect the components (e.g., the fingerprint identification chip 11, the redistribution layer 13, the electrical connection member 14, etc.) of the fingerprint identification assembly 10 from the external environment, and at the same time, the structural strength of the fingerprint identification assembly 10 is increased, and at the same time, by exposing the end surface of the electrical connection member 14 away from the fingerprint identification chip 11 from the package member 15, it is possible to prevent the package member 15 from affecting the electrical connection between the electrical connection member 14 and the circuit board for connecting the terminal device.
In some embodiments of the present application, the fingerprint recognition chip 11 may be wrapped in a package member 15, as shown in fig. 3. At this time, the fingerprint recognition chip 11 may be a capacitive fingerprint recognition chip.
In some embodiments of the present application, as shown in fig. 1, the first surface 111 may include an upper surface of the fingerprint sensing area 114, and the upper surface of the fingerprint sensing area 114 is exposed from the package part 15. Expose from encapsulation part 15 through the upper surface that makes fingerprint identification induction zone 114, can make fingerprint identification subassembly 10 when using, even the top is provided with glass apron, display screen, also can have better penetrability for the signal that comes from the finger can directly reach the induction zone, helps promoting fingerprint identification's sensitivity. In this case, the fingerprint recognition chip 11 may be a capacitive fingerprint recognition chip, an optical fingerprint recognition chip, an ultrasonic fingerprint recognition chip, or the like.
It can be understood that, since the through hole 112 is provided in the fingerprint identification chip 11, the redistribution layer 13 is extended to the through hole 112 to achieve electrical connection with the wafer pad 12, so that the planar size of the packaged fingerprint identification component 10 is reduced to be as close to the planar size of the fingerprint identification chip 11 as possible. In some embodiments of the present application, the fingerprint identification device 10 has a third surface 101 parallel to the first surface 111, and the ratio of the area of the third surface 101 to the area of the first surface 111 is less than 1.3.
It should be noted that, when the fingerprint identification chip 11 is wrapped in the package component 15, the third surface 101 may be an exposed surface of the package component 15 close to the first surface 111, or a surface formed by an end surface of the electrical adapting component 14 far from the fingerprint identification chip 11 and a surface of the package component 15 flush with the end surface. When the upper surface of the sensing area 114 of the fingerprint identification chip is exposed from the package member 15, the third surface 101 may be a surface formed by an end surface of the electrical connection member 14 far away from the fingerprint identification chip 11 and a surface of the package member 15 flush with the end surface.
Further, the area ratio of the third surface 101 to the first surface 111 is between 1.1 and 1.3.
In some embodiments of the present application, as shown in fig. 4, the electrical interposer 14 may include an interposer 141 and a solder 142. The interposer 141 includes a dielectric layer, a circuit layer disposed on both sides of the dielectric layer, and an electrical connection hole disposed in the dielectric layer for electrically connecting the circuit layer on both sides of the dielectric layer. The wiring layer of the interposer 141 adjacent to the redistribution layer 13 is electrically connected to the redistribution layer 13, and may be electrically connected by solder balls, for example. The solder 142 is provided on the interposer 141 on a side away from the redistribution layer 13 for electrical connection with a circuit board to which the terminal device is connected. By using the adapter plate and the weld as electrical adapter members, the structural strength of the fingerprint identification assembly 10 is facilitated to be improved.
Further, the fingerprint recognition assembly 10 may further include a first adhesive layer (not shown) disposed between the interposer 141 and the redistribution layer 13, and a second adhesive layer 16 disposed between the electrical interposer 14 and a circuit board for connecting the terminal device. The first adhesive layer may be provided with a plurality of first perforations. The first through holes are used for providing solder balls for connecting the redistribution layer 13 and the wiring layer of the interposer 141. The second adhesive layer 16 is provided with a plurality of perforations, and the weldment is filled in the perforations. At this time, the package member 15 packages the fingerprint identification chip 11, the rewiring layer 13, and the first adhesive layer. Can make adapter plate 141 and chip bonding through first tie coat, can make adapter plate 141 and the circuit board that is used for connecting terminal equipment be connected through the second tie coat, promote fingerprint identification subassembly 10's structural stability.
Referring to fig. 5, based on the same inventive concept, an embodiment of the present application further provides a fingerprint identification module 100, including: the aforementioned fingerprint identification assembly 10; and a circuit board 20 electrically connected to the redistribution layer 13 of the fingerprint recognition assembly 10. In this embodiment, the circuit board 20 is electrically connected to the redistribution layer 13 through the electrical interposer 14. The circuit board 20 may be a flexible circuit board, which helps to reduce the overall thickness of the fingerprint identification module 100, and makes the applicability of the fingerprint identification module 100 stronger.
In this embodiment, the fingerprint identification module 100 may further include a connector 30 electrically connected to the circuit board 20 and electrically connected to the fingerprint identification module 10 through the circuit board 20. The connector 30 is used for electrically connecting the fingerprint identification module 100 and the terminal device.
It is understood that the fingerprint recognition module 100 may further include a reinforcing plate 40. The stiffener 40 is disposed on a side of the circuit board 20 away from the fingerprint identification module 10 for providing sufficient structural strength to the fingerprint identification module 100.
Based on the same inventive concept, an embodiment of the present application further provides an electronic device, which includes the fingerprint identification module 100. The fingerprint identification module 100 may be disposed inside the electronic device and connected to a processor of the electronic device through a signal. Fingerprint identification module 100 is used for discerning user's fingerprint to give the treater with the discernment result transmission. The processor is used for carrying out corresponding processing (such as electronic unlocking, electronic payment and the like) according to the identification result. The electronic device can be a wireless earphone, a smart watch, a bracelet and other wearable devices.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (17)
1. A fingerprint identification assembly, comprising:
the fingerprint identification chip is provided with a first surface and a second surface which are deviated from each other, and a through hole penetrating through the first surface and the second surface is formed in the fingerprint identification chip;
the wafer welding pad is arranged on the first surface;
the rewiring layer is arranged on the second surface, extends into the through hole and is electrically connected with the wafer welding pad;
the assembly further comprises an electrical switching component, wherein the electrical switching component is arranged on one side, away from the fingerprint identification chip, of the redistribution layer and is electrically connected with a circuit of the redistribution layer; the number of the electrical transfer components is multiple, and the redistribution layer comprises a plurality of wires; the number of the electric switching components, the number of the leads and the number of the through holes are consistent; one end of each conducting wire is electrically connected with one electric switching component, and the other end of each conducting wire extends into one through hole to be electrically connected with one wafer welding pad.
2. The fingerprint identification assembly of claim 1, wherein the fingerprint identification chip comprises a fingerprint identification sensing area, and a thickness of an end of the fingerprint identification chip on which the through hole is disposed is smaller than a thickness of a portion corresponding to the fingerprint identification sensing area.
3. The fingerprint identification assembly of claim 2, wherein the second surface has a ramp structure connected between an end at which the through hole is disposed and a location corresponding to the fingerprint identification sensing area.
4. The fingerprint identification assembly of claim 1, wherein the electrical interposer is a conductive post.
5. The fingerprint identification assembly of claim 1, wherein the plurality of electrical vias, the plurality of conductive lines, and the plurality of vias are each disposed in axial symmetry with respect to a centerline of the fingerprint identification chip in a width direction.
6. The fingerprint identification assembly of claim 5, wherein the plurality of electrical contact elements are disposed in axial symmetry with respect to a centerline of the fingerprint identification chip in a lengthwise direction.
7. The fingerprint identification assembly of any one of claims 4 to 6, further comprising a packaging component, said packaging component encapsulating said fingerprint identification chip, said redistribution layer, and said electrical interposer component; the end face, far away from the fingerprint identification chip, of the electrical switching component is exposed out of the packaging component.
8. The fingerprint identification assembly of claim 7, wherein when the fingerprint identification chip includes a fingerprint identification sensing area, the first surface includes an upper surface of the fingerprint identification sensing area, the upper surface of the fingerprint identification sensing area being exposed from the package component.
9. The fingerprint identification assembly of any one of claims 1 to 6, wherein the fingerprint identification assembly has a thickness of between 0.44mm and 0.68 mm.
10. The fingerprint identification assembly of claim 1, wherein the electrical interposer includes an interposer and a weld; the adapter plate comprises a dielectric layer, circuit layers and electric connecting holes, wherein the circuit layers are arranged on two sides of the dielectric layer, and the electric connecting holes are arranged in the dielectric layer and used for electrically connecting the circuit layers on two sides of the dielectric layer; the welding piece is arranged between the adapter plate and the rewiring layer and used for electrically connecting the circuit layer and the rewiring layer.
11. The fingerprint identification assembly of claim 10, further comprising an adhesive layer disposed between the interposer and the redistribution layer, the adhesive layer being provided with a plurality of perforations, the weld filling the perforations.
12. The fingerprint identification assembly of claim 11, further comprising an encapsulation component encapsulating the fingerprint identification chip, the redistribution layer, and the adhesive layer.
13. The fingerprint identification assembly of claim 12, wherein the fingerprint identification sensing zone is exposed from the package component when the first surface includes the fingerprint identification sensing zone.
14. The assembly of any of claims 1-6 and 10-11, further comprising a packaging component configured to package the chip, the redistribution layer, and the electrical interposer component, wherein the assembly has a third surface parallel to the first surface, and wherein a ratio of an area of the first surface to the third surface is less than 1.3.
15. The fingerprint identification assembly of claim 14, wherein an area ratio of said first surface to said third surface is between 1.1 and 1.3.
16. The utility model provides a fingerprint identification module which characterized in that includes:
the fingerprint identification assembly of any one of claims 1 to 15;
and the circuit board is electrically connected with the rewiring layer of the fingerprint identification assembly.
17. An electronic device comprising the fingerprint recognition module of claim 16.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123153612.9U CN217404896U (en) | 2021-12-14 | 2021-12-14 | Fingerprint identification subassembly, fingerprint identification module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123153612.9U CN217404896U (en) | 2021-12-14 | 2021-12-14 | Fingerprint identification subassembly, fingerprint identification module and electronic equipment |
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| Publication Number | Publication Date |
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| CN217404896U true CN217404896U (en) | 2022-09-09 |
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| CN202123153612.9U Active CN217404896U (en) | 2021-12-14 | 2021-12-14 | Fingerprint identification subassembly, fingerprint identification module and electronic equipment |
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Address after: 201-1, 2nd Floor, Building 4, No. 188 Rixin Road, Binhai Science and Technology Park, Binhai New Area, Tianjin, 300450 Patentee after: Tianjin Jihao Technology Co.,Ltd. Address before: 100082 Z, 17th floor, No. 1, Zhongguancun Street, Haidian District, Beijing Patentee before: Beijing Jihao Technology Co.,Ltd. |