CN217387128U

CN217387128U - Semiconductor packaging clamping structure

Info

Publication number: CN217387128U
Application number: CN202221035507.7U
Authority: CN
Inventors: 刘祥坤
Original assignee: Xinpeng Semiconductor Technology Rudong Co ltd
Current assignee: Xinpeng Semiconductor Technology Rudong Co ltd
Priority date: 2022-05-01
Filing date: 2022-05-01
Publication date: 2022-09-06
Anticipated expiration: 2032-05-01

Abstract

The utility model discloses a semiconductor packaging clamping structure in the technical field of semiconductor packaging, which comprises a stand column, a cross beam, a vertical pipe, a circular plate, a through transverse groove, arc-shaped blocks, a connecting pipe, a rubber sucker, a three-way pipe, a check valve, a pressing air cock, a first electric mortise lock, a moving ring and a manual telescopic rod, wherein the first electric mortise lock is electrically extended to push the moving ring to move downwards, so that the four arc-shaped blocks move relatively under the pulling action of the manual telescopic rod, the outer sides of wafers are abutted by using a sponge pad, and meanwhile, when the wafers are placed, the rubber sucker is extruded and deformed to shrink, the air in the inner cavity of the rubber sucker is reduced after the check valve exhausts, and the wafers are adsorbed by negative pressure; when needing to dismantle, second electric mortiser lock drive push rod makes the carriage release lever press down the air cock, and the rubber suction cup inner chamber admits air, and wafer and rubber suction cup separation, first electric mortiser lock lose the electricity shrink, and the shift ring shifts up, and manual telescopic link promotes the outside removal of arc piece, and convenient operation is swift.

Description

Semiconductor packaging clamping structure

Technical Field

The utility model relates to a semiconductor package technical field specifically is a semiconductor package clamping structure.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. In the process, the top of the semiconductor is generally subjected to plastic packaging by using a plastic sealing cover, and then the semiconductor is processed by using various high-end processes to manufacture a chip. The utility model provides a current fixture causes the damage to the surface of wafer easily to the fixed of wafer to cause unnecessary cost loss, the urgent need in the event production design a clamping device who satisfies actual demand, based on this, the utility model discloses a semiconductor package clamping structure, with the solution above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor package clamping structure to need to design a clamping device's that satisfies actual demand problem in solving the production that proposes in the above-mentioned background art urgently.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor packaging clamping structure comprises four upright posts with through holes and arranged in a rectangular shape, wherein the upper parts of the outer walls of the four upright posts are sequentially fixedly connected through cross beams, vertical pipes are uniformly fixed at the left side of a cavity formed by the four cross beams at intervals, a circular plate is horizontally and rotatably clamped in an inner cavity of each vertical pipe, four penetrating transverse grooves are uniformly and circularly arranged on the surface of the circular plate at intervals, arc-shaped blocks with sponge pads on the inner wall are installed on the penetrating transverse grooves through sliding clamping I-shaped sliding blocks, a connecting pipe is vertically and rotatably installed in the center of each circular plate, rubber suction cups are installed above the inner cavities of the connecting pipes through fixing hole blocks in a protruding mode, three-way pipes are installed at the bottoms of the rubber suction cups through pipelines, check valves and pressing air nozzles are respectively installed at the lateral ports and the bottom ports of the three-way pipes, and first electric mortice locks are fixed at the bottoms of the circular plates, the outer wall below slip of connecting pipe has cup jointed the shift ring, the spring bolt and the shift ring slip joint of first electric mortiser lock, rotate between the outer wall of shift ring and the I shape slider bottom and install manual telescopic link.

Preferably, a shearing circular groove is formed in the upper portion of the inner wall of the vertical pipe, a clamping ring is coaxially fixed above an inner cavity of the shearing circular groove through a common bolt, a plurality of pairs of universal balls are symmetrically fixed to the outer side of the upper surface and the outer side of the circular plate in the central symmetry mode, the universal balls are connected between the clamping ring and the bottom of the shearing circular groove in a sliding clamping mode through circular grooves, and a butterfly bolt facing the circular plate penetrates through the outer wall of the vertical pipe in a threaded mode.

Preferably, a chamfer is arranged above the spongy cushion.

Preferably, two around the right side install the second electric mortiser lock through fixed diaphragm between the inner wall of stand, there is the push rod through square hole piece horizontal sliding mounting between the spring bolt tip of second electric mortiser lock and the diaphragm, the vertical fixation has the carriage release lever that extends to connecting tube inner chamber on the push rod, press the air cock press the briquetting bottom and be fixed with right angle trapezoidal piece, the top of carriage release lever and the inclined plane laminating of right angle trapezoidal piece.

Preferably, the top of carriage release lever is provided with the shear plane on parallel right angle trapezoidal piece inclined plane, be fixed with the ball link joint of laminating right angle trapezoidal piece inclined plane on the shear plane.

Preferably, the upper surface of removal ring is provided with the round chute of type of falling T, the smooth inslot slip joint of type of falling T has the type of falling T piece, the top of the type of falling T piece is connected with the spring bolt of first electric mortiser lock.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses an electric extension is got to the first electric mortiser lock and is promoted the shift ring to move down, makes four arc pieces relative movement under the pulling effect of manual telescopic link, utilizes the foam-rubber cushion to contradict to the outside of wafer, and simultaneously when placing the wafer, the rubber suction cup extrusion warp the shrink, makes the rubber suction cup inner chamber air reduce after the check valve exhausts, and the negative pressure adsorbs the wafer; when needs are dismantled, second electric mortiser lock drive push rod makes the carriage release lever press and presses the air cock, and the rubber suction cup inner chamber admits air, and wafer and rubber suction cup separation, the shrink of losing electricity of first electric mortiser lock, the shift ring shifts up, and manual telescopic link promotes the outside removal of arc piece, and the device can the wafer of multiple model of centre gripping through adjusting manual telescopic link, and convenient operation is swift.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view of the standpipe of FIG. 1;

fig. 3 is a front view of fig. 1.

In the drawings, the components represented by the respective reference numerals are listed below:

1-upright column, 2-cross beam, 3-vertical tube, 4-round plate, 5-through transverse groove, 6-arc block, 7-connecting tube, 8-second electric plug lock, 9-push rod, 10-moving rod, 11-rubber sucker, 12-three-way tube, 13-one-way valve, 14-pressing air nozzle, 15-first electric plug lock, 16-moving ring, 17-manual telescopic rod, 30-shearing circular groove, 31-snap ring and 32-butterfly bolt.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a semiconductor packaging clamping structure comprises four upright posts 1 with through holes, which are distributed in a rectangular shape, the through holes are utilized for integral fixation, the upper parts of the outer walls of the four upright posts 1 are fixedly connected through cross beams 2 in sequence, vertical tubes 3 are uniformly fixed at the left side of a cavity formed by the four cross beams 2 at intervals, an inner cavity of each vertical tube 3 is horizontally and rotatably clamped with a circular plate 4, four through transverse grooves 5 are uniformly and circularly arranged on the surface of each circular plate 4 at intervals, arc-shaped blocks 6 with sponge cushions on the inner walls are arranged on the through transverse grooves 5 through sliding clamping I-shaped sliding blocks, chamfers are arranged above the sponge cushions, parts are convenient to clamp and clamp, a connecting pipe 7 is vertically and rotatably arranged in the center of each circular plate 4, a rubber suction cup 11 is convexly arranged above the inner cavity of the connecting pipe 7 through a fixing hole block, a three-way pipe 12 is arranged at the bottom of each rubber suction cup 11 through a pipeline, a check valve 13 and a pressing air tap 14 are respectively arranged at the side port and the bottom port of the three-way pipe 12, the bottom of plectane 4 is fixed with first electric mortiser lock 15, and the outer wall below of connecting pipe 7 slides to be cup jointed and moves ring 16, and the spring bolt of first electric mortiser lock 15 slides with moving ring 16 and connects, specifically is: an inverted T-shaped smooth groove is formed in the upper surface of the moving ring 16, an inverted T-shaped block is slidably clamped in the inverted T-shaped smooth groove, the top of the inverted T-shaped block is connected with a bolt of the first electric mortise lock 15, a manual telescopic rod 17 is rotatably arranged between the outer wall of the moving ring 16 and the bottom of the I-shaped sliding block, the manual telescopic rod 17 can be controlled to stretch and retract by adjusting a limit knob on the manual telescopic rod 17, the position of the arc-shaped block 6 on the transverse through groove 5 is further changed, and when the moving ring 16 moves downwards, the four arc-shaped blocks 6 can clamp wafers of various sizes;

the shearing circular groove 30 is arranged above the inner wall of the vertical pipe 3, a clamping ring 31 is coaxially fixed above the inner cavity of the shearing circular groove 30 through a common bolt, a plurality of pairs of universal balls are symmetrically fixed at the outer sides of the upper surface and the lower surface of the circular plate 4, the universal balls are slidably clamped between the clamping ring 31 and the bottom of the shearing circular groove 30 through circular grooves, a butterfly bolt 32 which is opposite to the circular plate 4 is screwed through the outer wall of the vertical pipe 3, the circular plate 4 can be conveniently taken out by disassembling the common bolt and the butterfly bolt 32, and meanwhile, the steering of the circular plate 4 can be manually adjusted to deflect the four arc-shaped blocks 6 so as to avoid collision with the end part of a clamp for clamping a plastic sealing cover or a base plate;

install second electric mortiser lock 8 through fixed diaphragm between two stand 1's the inner wall around the right side, there is push rod 9 through square hole piece horizontal sliding mounting between the spring bolt tip of second electric mortiser lock 8 and the diaphragm, and the vertical fixation has the carriage release lever 10 that extends to connecting pipe 7 inner chamber on the push rod 9, presses the pressure piece bottom of air cock 14 to be fixed with right angle trapezoidal piece, and the top of carriage release lever 10 specifically is with the inclined plane laminating of right angle trapezoidal piece: the top of carriage release lever 10 is provided with the shear plane on parallel right angle trapezoidal piece inclined plane, is fixed with the ball link joint on laminating right angle trapezoidal piece inclined plane on the shear plane, reduces wearing and tearing, makes lateral shifting's carriage release lever 10 can be stable with the inclined plane laminating of right angle trapezoidal piece.

Use the utility model relates to a during semiconductor package clamping structure: the wafer to be packaged is vertically placed on the middle part of a rubber sucker 11, the rubber sucker 11 is contracted and deformed by middle pressing, when the wafer is attached to a circular plate 4, air is discharged through a one-way valve 13, the rubber sucker 11 adsorbs the wafer under negative pressure, then a movable ring 16 moves downwards by electric extension of a first electric plug lock 15, a manual telescopic rod 17 drives an arc-shaped block 6 to move relatively, the wafer is clamped, and finally packaging is carried out, after packaging is completed, the first electric plug lock 15 is powered off, the movable ring 16 moves upwards, the manual telescopic rod 17 pushes the arc-shaped block 6 to move outwards, a second electric plug lock 8 is powered on to extend, a push rod 9 drives a movable rod 10 to move leftwards, because the top of the movable rod 10 is attached to a right-angled trapezoidal block installed on a pressing air nozzle 14, when the movable rod 10 moves leftwards, the right-angled trapezoidal block moves upwards to press the pressing air nozzle 14, the rubber sucker 11 is inflated, and the wafer is separated from the rubber sucker 11, and taking down the wafer.

It is worth noting that: the electric mortiser lock that adopts in this scheme is LY-01 circular telegram elongation type, and it can work through step-down rectifier and manual switch connection commercial power, belongs to current mature technology, no longer explains its electric connection relation and specific circuit structure herein again.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended to aid in the description of the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a semiconductor package clamping structure, includes four stands (1) that have the through-hole that are the rectangle and distribute, its characterized in that: the four upright posts (1) are fixedly connected through cross beams (2) in sequence above the outer wall, vertical pipes (3) are uniformly fixed at the left side of a cavity formed by the four cross beams (2) at intervals, circular plates (4) are horizontally and rotatably clamped in the inner cavity of each vertical pipe (3), four through transverse grooves (5) are circularly arranged at the uniform intervals on the surfaces of the circular plates (4), arc-shaped blocks (6) with sponge pads on the inner wall are installed on the through transverse grooves (5) through sliding clamping I-shaped sliders, connecting pipes (7) are vertically and rotatably installed in the centers of the circular plates (4), rubber suction cups (11) are installed above the inner cavities of the connecting pipes (7) in a protruding mode through fixing hole blocks, three-way pipes (12) are installed at the bottoms of the rubber suction cups (11) through pipelines, check valves (13) and pressing air nozzles (14) are respectively installed at the side direction and bottom ports of the three-way pipes (12), the bottom of plectane (4) is fixed with first electric mortiser lock (15), the outer wall below of connecting pipe (7) slides and has cup jointed removal ring (16), the spring bolt and the removal of first electric mortiser lock (15) slip joint, it installs manual telescopic link (17) to rotate between the outer wall of removal ring (16) and the I shape slider bottom.

2. The semiconductor package clamping structure of claim 1, wherein: the improved vertical pipe shear is characterized in that a shear circular groove (30) is formed in the upper portion of the inner wall of the vertical pipe (3), a clamping ring (31) is coaxially fixed above an inner cavity of the shear circular groove (30) through a common bolt, a plurality of pairs of universal balls are symmetrically fixed on the outer sides of the upper surface and the lower surface of the circular plate (4) in the center, the universal balls are slidably clamped between the clamping ring (31) and the bottom of the shear circular groove (30) through circular grooves, and the outer wall of the vertical pipe (3) is connected with a butterfly bolt (32) which is opposite to the circular plate (4) in a penetrating and screwed mode.

3. The semiconductor package clamping structure of claim 1, wherein: a chamfer is arranged above the spongy cushion.

4. The semiconductor package clamping structure of claim 1, wherein: two around the right side install second electric mortiser lock (8) through fixed diaphragm between the inner wall of stand (1), there is push rod (9) through square hole piece horizontal sliding mounting between the spring bolt tip of second electric mortiser lock (8) and the diaphragm, vertically fixed has carriage release lever (10) that extend to connecting pipe (7) inner chamber on push rod (9), press the pressing block bottom of air cock (14) and be fixed with right angle trapezoidal piece, the top of carriage release lever (10) and the inclined plane laminating of right angle trapezoidal piece.

5. The semiconductor package clamping structure of claim 4, wherein: the top of carriage release lever (10) is provided with the shear plane on parallel right angle trapezoidal piece inclined plane, be fixed with the ball link joint of laminating right angle trapezoidal piece inclined plane on the shear plane.

6. The semiconductor package clamping structure of claim 1, wherein: the upper surface of removal ring (16) is provided with the round chute of type of falling T, the smooth inslot slip joint of type of falling T has the type of falling T piece, the top of the type of falling T piece is connected with the spring bolt of first electric mortiser lock (15).