CN217361573U - Semiconductor resistor of horizontal installation - Google Patents
Semiconductor resistor of horizontal installation Download PDFInfo
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- CN217361573U CN217361573U CN202220224549.9U CN202220224549U CN217361573U CN 217361573 U CN217361573 U CN 217361573U CN 202220224549 U CN202220224549 U CN 202220224549U CN 217361573 U CN217361573 U CN 217361573U
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- semiconductor resistor
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- lead
- horizontally mounted
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Abstract
The utility model discloses a semiconductor resistor of horizontal installation, including semiconductor resistor chip and two at least lead wire holders, the semiconductor resistor chip passes through lead wire holder and PCB board electric connection, and each lead wire holder is together cooperated in order to maintain semiconductor resistor chip height on the PCB board and restrict semiconductor resistor chip's vibration. The utility model provides a semiconductor resistor of horizontal installation, under the prerequisite that satisfies X, Y, Z triaxial vibration requirement, the device assembly demand of higher density is satisfied with less assembly space.
Description
Technical Field
The utility model relates to a resistance especially relates to a semiconductor resistor of horizontal installation.
Background
In the electronic technology application scenario, there are often scenarios with dual technical requirements for current and resistance, which often contradict each other and can only be solved by increasing the volume. For example, in the application of the power type NTC, the requirement of large steady-state current is required to be met, and the requirement of a certain resistance value on the suppression of surge current is also required to be met; the requirements of overvoltage reliability and protection of a rear-stage power device by low residual voltage are met in the application of the piezoresistor; in the application of PTC thermistors, the current limiting requirements of a certain resistor are also met, and the action time requirements of a certain current are also met. The above requirements are all expected to satisfy the conflicting design requirements by providing a single product with a larger size by a manufacturer, but the product with the larger size has certain limitation in the installation space, or cannot satisfy the X, Y, Z triaxial vibration requirement due to height, or excessively occupies the space of the PCB board when the flitch is installed, and has great uncertainty in the over-high fault ratio due to the individual non-uniformity when the split-type parallel connection is used. Therefore, on the premise of meeting the requirement of X, Y, Z on three-axis vibration, the requirement of assembling devices with higher density is met by using smaller assembling space, and the horizontal-mounted semiconductor resistor has research and development requirements.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a semiconductor resistor of horizontal installation, under the prerequisite that satisfies X, Y, Z triaxial vibration requirement, the device assembly demand of higher density is satisfied with usable less assembly space.
The purpose of the utility model is realized by adopting the following technical scheme:
a horizontally mounted semiconductor resistor comprising:
the semiconductor resistor chip is electrically connected with the PCB through the lead supports, and the lead supports are matched together to maintain the height of the semiconductor resistor chip on the PCB and limit the vibration of the semiconductor resistor chip.
Furthermore, two electrode surfaces are arranged on the semiconductor resistor chip, and the lead wire support is electrically connected with the two electrode surfaces of the semiconductor resistor chip respectively.
Further, the two electrode surfaces are respectively arranged on the upper side and the lower side of the semiconductor resistor chip, and the lead wire support is respectively electrically connected with the two electrode surfaces of the semiconductor resistor chip and respectively arranged on the upper side and the lower side of the semiconductor resistor chip.
Further, each lead support is respectively connected with the semiconductor resistance chip in a welding mode.
Further, each lead support is in an inverted L shape, a Z shape or a J shape.
Furthermore, each lead wire bracket is provided with a limiting clamping block.
Further, each lead support all includes connecting portion, supporting part and installation department, the supporting part passes through connecting portion and semiconductor resistor chip electric connection, the supporting part passes through installation department and PCB board electric connection.
Further, the semiconductor resistor chip further comprises an encapsulating layer, and the encapsulating layer is used for encapsulating the semiconductor resistor chip and each lead support.
Further, the semiconductor resistor chip comprises an insulating layer, wherein the insulating layer is used for coating the semiconductor resistor chip and each lead support.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the semiconductor resistor chip is arranged on the PCB through the two lead supports, and the lead supports are matched together to maintain the height of the semiconductor resistor chip on the PCB and limit the vibration of the semiconductor resistor chip, so that the requirement of assembling devices with higher density can be met by using smaller assembling space on the premise of meeting the X, Y, Z triaxial vibration requirement.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor resistor which is horizontally mounted according to a preferred embodiment of the present invention, wherein the number of upper lead frames and the number of lower lead frames of the semiconductor resistor are respectively one and are in an inverted "L" shape;
FIG. 2 is a schematic cross-sectional view of FIG. 1;
FIG. 3 is a schematic top view of the structure of FIG. 1;
fig. 4 is a schematic structural view of a horizontally mounted semiconductor resistor according to a preferred embodiment of the present invention, which is provided with an upper lead frame and two lower lead frames, and both of which are in an inverted "L" shape;
FIG. 5 is a schematic top view of the structure of FIG. 4;
fig. 6 is a schematic top view of a horizontally mounted semiconductor resistor according to a preferred embodiment of the present invention, which has two upper lead frames and one lower lead frame, and is in an inverted "L" shape;
fig. 7 is a schematic top view of a horizontally mounted semiconductor resistor according to a preferred embodiment of the present invention, which has two upper lead frames and two lower lead frames, and is in an inverted "L" shape;
fig. 8 is a schematic cross-sectional view of a horizontally mounted semiconductor resistor according to a preferred embodiment of the present invention, in which the number of the upper lead frame and the lower lead frame is one and both are in a "Z" shape;
fig. 9 is a schematic cross-sectional view of a horizontally mounted semiconductor resistor according to a preferred embodiment of the present invention, in which the number of the upper lead frame and the lower lead frame is one and both are in the shape of "]".
In the figure: 1. a semiconductor resistor chip; 2. an electrode surface; 3. a limiting clamping block; 4. a connecting portion; 5. a support portion; 6. an installation part; 7. an encapsulation layer; 8. an insulating layer; 9. an upper lead wire bracket; 10. and a lower lead support.
Detailed Description
This section will describe in detail the embodiments of the present invention, the preferred embodiments of which are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can visually and vividly understand each technical feature and the whole technical solution of the present invention, but it cannot be understood as a limitation to the scope of the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means is one or a plurality of means, a plurality of means is two or more, and the terms greater than, less than, exceeding, and the like are understood as excluding the number, and the terms greater than, less than, within, and the like are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1 to 9, a preferred embodiment of the present invention provides a horizontally mounted semiconductor resistor, which includes a semiconductor resistor chip 1 and at least two lead frames, the semiconductor resistor chip 1 is electrically connected to a PCB through the lead frames, and each lead frame is cooperated to maintain the height of the semiconductor resistor chip 1 on the PCB and limit the vibration of the semiconductor resistor chip 1, so that the requirement of X, Y, Z for assembling higher density devices can be satisfied with a smaller assembly space on the premise of satisfying the requirement of three-axis vibration.
In practical implementation, the number of the lead frames may be two, three or four, and the lead frames are connected to different positions on the semiconductor resistor chip 1, so that the height of the semiconductor resistor chip 1 on the PCB board can be maintained and the vibration of the semiconductor resistor chip 1 can be limited.
As a preferred embodiment of the present invention, it may also have the following additional technical features:
in the present embodiment, the semiconductor resistor chip 1 is a semiconductor resistor chip having an area larger than 1 square centimeter, and may be a semiconductor ceramic resistor chip. More specifically, it may be a varistor chip, a PTC thermistor chip, or an NTC thermistor chip. Therefore, the two lead supports are matched, so that the large-size semiconductor resistor chip 1 can be effectively supported, the height of the semiconductor resistor chip on the PCB can be maintained, the vibration of the semiconductor resistor chip can be limited, and the requirement of assembling devices on the PCB can be met. In this embodiment, the semiconductor resistor chip 1 is provided with two non-polarized electrode surfaces 2, and the lead frame is electrically connected to the two electrode surfaces 2 of the semiconductor resistor chip 1. Therefore, the semiconductor resistor chip 1 and the PCB can be electrically connected effectively.
In the present embodiment, the two electrode surfaces 2 are respectively disposed on the upper side and the lower side of the semiconductor resistor chip 1, and the lead frames are respectively electrically connected to the two electrode surfaces 2 of the semiconductor resistor chip 1 and respectively disposed on the upper side and the lower side of the semiconductor resistor chip 1. In this way, the lead frames can be matched together to maintain the height of the semiconductor resistor chip 1 on the PCB and limit the vibration of the semiconductor resistor chip 1.
Specifically, the two lead frames are the upper lead frame 9 and the lower lead frame 10, respectively, and in the implementation, the number of the upper lead frame 9 and the lower lead frame 10 may be set to one or two respectively, so as to maintain the height of the semiconductor resistor chip 1 with different sizes on the PCB board and limit the vibration of the semiconductor resistor chip 1.
In this embodiment, each lead frame is welded with the semiconductor resistor chip 1 respectively, and the semiconductor resistor chip 1 is effectively mounted on the PCB board through the lead frames, so that the stability of the connection structure between each lead frame and the semiconductor resistor chip 1 can be improved, and the semiconductor resistor chip 1 and the PCB board can be effectively electrically connected.
In this embodiment, each lead wire bracket is provided with a limiting clamping block 3, which can facilitate the effective connection between the lead wire bracket and the PCB.
In this embodiment, each lead frame is in an inverted "L" shape, which is beneficial to increasing the contact area between each lead frame and the semiconductor resistor chip 1, so as to better maintain the height of the semiconductor resistor chip 1 on the PCB and limit the vibration of the semiconductor resistor chip 1. On the premise of meeting the X, Y, Z triaxial vibration requirement, the horizontally-mounted semiconductor resistor can meet the assembly requirement of a device with higher density by using a smaller assembly space.
In specific implementation, each lead frame is in a zigzag shape, so that the contact area between each lead frame and the semiconductor resistor chip 1 and the contact area between each lead frame and the PCB can be further increased, the height of the semiconductor resistor chip 1 on the PCB can be better maintained, and the vibration of the semiconductor resistor chip 1 can be better limited. The horizontally-mounted semiconductor resistor can meet the assembly requirement of a device with higher density by using a smaller assembly space on the premise of meeting the requirement of X, Y, Z on three-axis vibration.
As another embodiment, each lead frame may also be in a "]" shape, which may further increase the contact area between each lead frame and the semiconductor resistor chip 1 and the PCB.
Of course, the lead frame in the horizontally mounted semiconductor resistor may be a combination of inverted "L" shaped, "Z" shaped and "h" shaped lead frames, which is beneficial to improving the applicability.
In the present embodiment, each lead frame includes a connection portion 4, a support portion 5 and a mounting portion 6, the support portion 5 is electrically connected to the semiconductor resistor chip 1 through the connection portion 4, and the support portion 5 is electrically connected to the PCB board through the mounting portion 6. Thus, the semiconductor resistor chip 1 can be effectively electrically connected with the PCB through the lead bracket, the height of the semiconductor resistor chip 1 on the PCB can be maintained, and the vibration of the semiconductor resistor chip 1 can be limited.
Specifically, when each lead frame is in the shape of "]", the connecting portion 4 and the mounting portion 6 are parallel to each other, and the supporting portion 5 is perpendicular to the connecting portion 4 and the mounting portion 6, respectively, and more specifically, the length of the connecting portion 4 is greater than that of the mounting portion 6, which is beneficial to increase the contact area between each lead frame and the semiconductor resistor chip 1.
In this embodiment, spacing fixture block 3 sets up on installation department 6, and installation department 6 realizes that lead wire support and PCB board are effectively connected fixedly through spacing fixture block 3 and the cooperation of PCB integrated circuit board hub connection.
In other embodiments, each lead frame can be welded on the PCB through the limiting fixture 3.
In this embodiment, the horizontally mounted semiconductor resistor further includes an encapsulating layer 7, and the encapsulating layer 7 is used for encapsulating the semiconductor resistor chip 1 and each lead frame, so that the stability of the connection structure between the semiconductor resistor chip 1 and each lead frame can be improved, and a better protection effect can be achieved.
In this embodiment, the horizontally mounted semiconductor resistor further includes an insulating layer 8, and the insulating layer 8 is used for covering the semiconductor resistor chip 1 and each lead frame, so as to facilitate a better insulating effect. Specifically, the insulating layer 8 is a heat shrinkable tube, which is advantageous for enhancing the insulating property.
In a more preferred embodiment, the insulating layer 8 is used to coat the semiconductor ceramic resistor chip coated with the encapsulating layer 7, so that after the encapsulating layer 7 fixes the structures of the semiconductor resistor chip 1 and each lead frame, the insulating layer 8 is coated, which is beneficial to improving the manufacturing efficiency and further improving the insulating property.
In this embodiment, the method for manufacturing the horizontally mounted semiconductor resistor is as follows:
firstly, punching lead wire brackets with different sizes and limiting heights according to the requirements of users, wherein a limiting clamping block 3 is arranged on each lead wire bracket;
printing tin paste with corresponding size on the semiconductor resistor chip 1 with large size;
placing an upper lead support 9, the semiconductor resistor chip 1 brushed with the tin paste and a lower lead support 10 in the designed tool in sequence, and fixedly feeding the upper lead support, the semiconductor resistor chip 1 brushed with the tin paste and the lower lead support into a welding furnace for welding;
putting the semiconductor resistor chip 1 welded with the lead support into a special frame, cleaning, encapsulating, curing and printing to obtain a finished product;
fifthly, after the finished product is subjected to pressure-resistant pin cutting, sleeving a heat-shrinkable tube on the product with higher insulation and pressure resistance for packaging and delivery.
The above additional technical features can be freely combined and used in superposition by those skilled in the art without conflict.
The above is only the preferred embodiment of the present invention, as long as the technical solution of the purpose of the present invention is realized by the substantially same means, all belong to the protection scope of the present invention.
Claims (9)
1. A horizontally mounted semiconductor resistor, comprising:
the semiconductor resistor chip comprises a semiconductor resistor chip (1) and at least two lead supports, wherein the semiconductor resistor chip (1) is electrically connected with a PCB (printed circuit board) through the lead supports, and the lead supports are matched together to maintain the height of the semiconductor resistor chip (1) on the PCB and limit the vibration of the semiconductor resistor chip (1).
2. A horizontally mounted semiconductor resistor as claimed in claim 1, characterized in that the semiconductor resistor chip (1) is provided with two electrode surfaces (2), and the lead frames are electrically connected to the two electrode surfaces (2) of the semiconductor resistor chip (1), respectively.
3. A horizontally mounted semiconductor resistor as claimed in claim 2, characterized in that the two electrode surfaces (2) are arranged on the upper side and the lower side of the semiconductor resistor chip (1), respectively, and the lead frames are electrically connected to the two electrode surfaces (2) of the semiconductor resistor chip (1) and arranged on the upper side and the lower side of the semiconductor resistor chip (1), respectively.
4. A horizontally mounted semiconductor resistor as claimed in claim 1, characterized in that the lead frames are each soldered to the semiconductor resistor chip (1).
5. The horizontally mounted semiconductor resistor of claim 1 wherein each of the lead frames is in the shape of an inverted "L" or "Z" or "]".
6. The horizontally mounted semiconductor resistor as claimed in claim 1, wherein each of the lead frames is provided with a position-limiting latch (3).
7. The horizontally mounted semiconductor resistor as claimed in claim 1, wherein each lead frame comprises a connecting portion (4), a supporting portion (5) and a mounting portion (6), the supporting portion (5) is electrically connected with the semiconductor resistor chip (1) through the connecting portion (4), and the supporting portion (5) is electrically connected with the PCB board through the mounting portion (6).
8. The horizontally mounted semiconductor resistor as claimed in claim 1, further comprising an encapsulating layer (7), the encapsulating layer (7) being used to encapsulate the semiconductor resistor chip (1) and the respective lead frames.
9. A horizontally mounted semiconductor resistor as claimed in claim 1, further comprising an insulating layer (8), said insulating layer (8) being adapted to encapsulate the semiconductor resistor chip (1) and the respective lead frames.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220224549.9U CN217361573U (en) | 2022-01-26 | 2022-01-26 | Semiconductor resistor of horizontal installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220224549.9U CN217361573U (en) | 2022-01-26 | 2022-01-26 | Semiconductor resistor of horizontal installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217361573U true CN217361573U (en) | 2022-09-02 |
Family
ID=83045033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220224549.9U Active CN217361573U (en) | 2022-01-26 | 2022-01-26 | Semiconductor resistor of horizontal installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217361573U (en) |
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2022
- 2022-01-26 CN CN202220224549.9U patent/CN217361573U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230425 Address after: 414000 Fugang Road, Junshan Industrial Development Zone, Yueyang City, Hunan Province Patentee after: HUNAN JINYANG ELECTRONICS CO.,LTD. Address before: Room 918, Zhongai Garden Office Building, Intersection of Longzhu 7th Road and Longyuan Road, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN JINYANG ELECTRONIC Co.,Ltd. |
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| TR01 | Transfer of patent right |