CN220962931U - High-power modular resistor - Google Patents
High-power modular resistor Download PDFInfo
- Publication number
- CN220962931U CN220962931U CN202322610238.3U CN202322610238U CN220962931U CN 220962931 U CN220962931 U CN 220962931U CN 202322610238 U CN202322610238 U CN 202322610238U CN 220962931 U CN220962931 U CN 220962931U
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- China
- Prior art keywords
- resistor
- mounting groove
- high power
- groove cavity
- shell
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- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000011810 insulating material Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000007650 screen-printing Methods 0.000 claims abstract description 6
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 9
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 4
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 claims description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Abstract
The utility model discloses a high-power modular resistor, which comprises a shell, binding posts and a resistor piece, wherein the shell is provided with a mounting groove cavity, the binding posts are arranged on the shell, the resistor piece is provided with a substrate made of heat-conducting insulating materials and resistor strips formed on the surface of the substrate through a screen printing process, and the number of the resistor strips is at least two and is in parallel connection; the resistor piece is fixedly arranged in the mounting groove cavity in an outward manner of the resistor strip, the resistor strip is electrically connected with the binding post, and silicon rubber is filled between the substrate and the mounting groove cavity. The resistor has the advantages of simple and reasonable structure, small volume, easy manufacture, low manufacturing cost, firm formation of the resistor tape, no inductance, wide resistance range, high power, high voltage resistance, good heat dissipation effect, long service life, easy installation and use, and the like, and has wide application range.
Description
Technical Field
The utility model relates to the technical field of resistors, in particular to a high-power modular resistor.
Background
The high-power non-inductive resistor in the current market is mostly designed by adopting the following structure: the resistor comprises a shell, a binding post arranged on the shell and a resistance plate arranged in the shell, wherein the resistance plate is electrically connected with the binding post. The resistor is small in size, high in power and convenient to install and connect.
However, the existing high-power non-inductive resistor has the following defects in production and application: 1) The resistance board in the existing resistor adopts a three-layer structure, namely: the resistance board is composed of a ceramic plate, a copper plate and a circuit board which are arranged in a laminated mode, and is complex in structure and high in manufacturing cost. 2) The circuit board in the resistance board generally adopts a single-circuit structure, and once a circuit has a problem, the whole resistance board cannot be used, so that the service life is not ideal.
In view of this, the present utility model has been made.
Disclosure of Invention
In order to overcome the defects, the utility model provides a high-power modular resistor which has the advantages of simple and reasonable structure, small volume, easiness in manufacturing, low manufacturing cost, firm forming of a resistor strip, no inductance, wide resistance range, high power, high voltage resistance, good heat dissipation effect, long service life, easiness in installation and use and the like, and is wide in application range.
The technical scheme adopted by the utility model for solving the technical problems is as follows: the high-power modular resistor comprises a shell, binding posts and a resistor piece, wherein the shell is provided with a mounting groove cavity, the binding posts are arranged on the shell, the resistor piece is provided with a substrate made of a heat-conducting insulating material and resistor strips formed on the surface of the substrate through a screen printing process, and the number of the resistor strips is at least two and is in parallel connection; in addition, the resistance piece is fixedly arranged in the mounting groove cavity in a mode that the resistance belt faces outwards, the resistance belt is electrically connected with the binding post, and silicon rubber is filled and sealed between the base plate and the mounting groove cavity.
As a further improvement of the present utility model, the substrate is any one of an aluminum nitride plate, a beryllium oxide plate, an aluminum nitride ceramic plate, and a beryllium oxide ceramic plate.
As a further improvement of the present utility model, the substrate is an aluminum nitride plate or a beryllium oxide plate.
As a further improvement of the present utility model, the shape of the resistance belt adopts any one of a wavy line, a circular spiral shape and a square spiral shape.
As a further improvement of the utility model, the resistance belt is made of silver or silver-palladium alloy.
As a further improvement of the utility model, a conductive connecting piece is arranged in the mounting groove cavity, and the resistor is electrically connected with the binding post through the conductive connecting piece.
As a further improvement of the utility model, the conductive connection is a copper wire.
As a further improvement of the utility model, the binding post is provided with a copper nut;
the shell is also provided with a wrapping part, the wrapping part is arranged outside the mounting groove cavity, and the wrapping part is tightly wrapped outside the copper nut part;
In addition, the shell is also provided with a mounting hole.
As a further improvement of the utility model, the mounting groove cavity, the wrapping part, the mounting hole and the binding post are integrated by an injection molding process.
As a further improvement of the utility model, the resistor is glued in the mounting groove cavity.
The beneficial effects of the utility model are as follows: compared with the prior art, 1) the utility model improves the structure of the resistor element in the resistor, which is characterized in that: ① The resistor piece is provided with a substrate made of a heat-conducting insulating material and a resistor belt formed on the surface of the substrate through a screen printing process; based on the resistor structure, on one hand, the structure of the product is further simplified, the whole volume of the resistor is reduced, the manufacturing process of the product is simplified, and the production cost is reduced; on the other hand, the resistor has the advantages of firm forming of the resistor tape (circuit), no inductance, wide resistance range, high power, good heat dissipation effect and the like, and the performance of the resistor is greatly improved and expanded. ② The resistor belts are configured into at least two and are in parallel connection; therefore, when one of the resistance bands is in a problem, the resistor can be used continuously, so that the service life of the resistor is prolonged to a certain extent, and the cost loss is reduced. 2) According to the utility model, the silicon rubber is filled and sealed between the resistor piece and the mounting groove cavity of the shell, so that the voltage resistance of the resistor can be greatly improved, and the resistor has high voltage resistance.
Drawings
FIG. 1 is a schematic diagram of a high power modular resistor according to the present utility model at a first viewing angle;
FIG. 2 is a schematic diagram of a high power modular resistor according to the present utility model at a second viewing angle;
Fig. 3 is a schematic structural view of the housing according to the present utility model.
The following description is made with reference to the accompanying drawings:
1. A housing; 10. a mounting groove cavity; 11. a wrapping portion; 12. a mounting hole; 2. binding posts; 3. a resistive member; 30. a substrate; 31. a resistive band; 32. a connection end; 4. conductive connection.
Detailed Description
The preferred embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.
Example 1:
Referring to fig. 1 to 3, the present utility model provides a high-power module resistor, which mainly includes a housing 1, a terminal 2, and a resistor 3, wherein the housing 1 is provided with a mounting groove 10, the terminal 2 is disposed on the housing 1, the resistor 3 has a substrate 30 made of a heat-conductive insulating material and a resistor strip 31 formed on a surface of the substrate 30 by a screen printing process, and the resistor strips 31 are configured to be at least two and are connected in parallel; in addition, the resistor 3 is fixedly disposed in the mounting groove cavity 10 in such a manner that the resistor strip 31 faces outward, the resistor strip 31 is electrically connected to the terminal 2, and silicone rubber is encapsulated between the substrate 30 and the mounting groove cavity 10.
Compared with the prior art, 1) the utility model improves the structure of the resistor element in the resistor, which is characterized in that: ① The resistor piece is provided with a substrate made of a heat-conducting insulating material and a resistor belt formed on the surface of the substrate through a screen printing process; based on the resistor structure, on one hand, the structure of the product is further simplified, the whole volume of the resistor is reduced, the manufacturing process of the product is simplified, and the production cost is reduced; on the other hand, the resistor has the advantages of firm forming of the resistor tape (circuit), no inductance, wide resistance range, high power, good heat dissipation effect and the like, and the performance of the resistor is greatly improved and expanded. ② The resistor belts are configured into at least two and are in parallel connection; therefore, when one of the resistance bands is in a problem, the resistor can be used continuously, so that the service life of the resistor is prolonged to a certain extent, and the cost loss is reduced. 2) According to the utility model, the silicon rubber is filled and sealed between the resistor piece and the mounting groove cavity of the shell, so that the voltage resistance of the resistor can be greatly improved, and the resistor has high voltage resistance.
The specific structure of the high power module type resistor according to the present utility model will be described in detail.
First, the resistor 3 is concerned.
With continued reference to fig. 1, in this embodiment, the substrate 30 is preferably any one of an aluminum nitride plate, a beryllium oxide plate, an aluminum nitride ceramic plate, and a beryllium oxide ceramic plate. The four boards have the characteristics of high heat conductivity, low dielectric constant, low dielectric loss, excellent electrical insulation and the like, and can be used as ideal materials for high-density and high-power circuit substrates and packages.
Further preferably, the substrate 30 is an aluminum nitride plate or a beryllium oxide plate.
In this embodiment, preferably, the resistor tape 31 is made of silver or silver-palladium alloy. The shape of the resistor belt 31 is any one of a wavy line, a circular spiral shape and a square spiral shape, and fig. 1 shows a case that the resistor belt 31 is a wavy line, and of course, the utility model is not limited to the above three shapes, and can be designed according to the product requirement.
In this embodiment, preferably, the structure for electrically connecting the resistor strip 31 and the terminal post 2 is as follows: referring to fig. 3, a conductive connecting member 4 is disposed in the mounting groove 10, and the resistor strip 31 is electrically connected to the terminal 2 through the conductive connecting member 4.
And further preferably, the resistor strip 31 is electrically connected to the post 2 through the conductive connecting member 4 by: referring to fig. 1, since at least two of the resistor strips 31 are connected in parallel, two connection ends 32 are printed on the substrate 30 at the same time when the resistor strips 31 are manufactured, and at least two of the resistor strips 31 are connected in parallel between the two connection ends 32; referring to fig. 3 again, two conductive connecting pieces 4 are disposed in the mounting groove 10, one ends of the two conductive connecting pieces 4 are respectively connected with the two connecting ends 32, and the other ends of the two conductive connecting pieces 4 are respectively connected with the two binding posts 2.
And still more preferably, the conductive connecting piece 4 is a copper wire, and two ends of the copper wire are respectively welded and fixedly connected with the connecting end 32 and the binding post 2.
Next, the connection between the housing 1, the post 2 and the resistor 3 is performed.
In this embodiment, preferably, the structure for implementing that the binding post 2 is disposed on the housing 1 is as follows: with continued reference to fig. 2, the post 2 has a copper nut; the shell 1 is further provided with a wrapping part 11, the wrapping part 11 is arranged outside the mounting groove cavity 10, and the wrapping part 11 is tightly wrapped outside the copper nut part.
Further preferably, the mounting groove cavity 10, the wrapping portion 11 and the terminal post 2 are formed into a unitary structure by an injection molding process. The processing mode is simple, easy to operate and firm in combination.
In this embodiment, preferably, the resistor element 3 is fixedly disposed in the mounting groove cavity 10, and has the following structure: the resistor 3 is glued and fixed in the mounting groove cavity 10.
In addition, a mounting hole 12 is provided in the housing 1, so that the whole high-power module resistor is connected and fixed with other devices. Of course, it is understood that the mounting hole 12 and the mounting groove cavity 10, the wrapping portion 11, etc. are integrally formed together by injection molding.
In summary, the resistor has the advantages of simple and reasonable structure, small volume, easy manufacture, low manufacturing cost, firm formation of the resistor strip, no inductance, wide resistance range, high power, high voltage resistance, good heat dissipation effect, long service life, easy installation and use, and the like, and has wide application range.
In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The foregoing description is only of a preferred embodiment of the utility model, which can be practiced in many other ways than as described herein, so that the utility model is not limited to the specific implementations disclosed above. While the foregoing disclosure has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes and modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. Any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present utility model without departing from the technical solution of the present utility model still falls within the scope of the technical solution of the present utility model.
Claims (10)
1. A high power modular resistor, characterized by: the anti-theft device comprises a shell (1), binding posts (2) and a resistor piece (3), wherein the shell (1) is provided with a mounting groove cavity (10), the binding posts (2) are arranged on the shell (1), the resistor piece (3) is provided with a base plate (30) made of a heat-conducting insulating material and resistor strips (31) formed on the surface of the base plate (30) through a screen printing process, and the number of the resistor strips (31) is at least two and in parallel connection; in addition, the resistor piece (3) is fixedly arranged in the mounting groove cavity (10) in a mode that the resistor belt (31) faces outwards, the resistor belt (31) is electrically connected with the binding post (2), and silicon rubber is filled and sealed between the substrate (30) and the mounting groove cavity (10).
2. The high power modular resistor of claim 1, wherein: the substrate (30) is any one of an aluminum nitride plate, a beryllium oxide plate, an aluminum nitride ceramic plate and a beryllium oxide ceramic plate.
3. The high power modular resistor of claim 2, wherein: the substrate (30) is made of aluminum nitride plate or beryllium oxide plate.
4. The high power modular resistor of claim 1, wherein: the shape of the resistor belt (31) adopts any one of a wavy line, a circular spiral shape and a square spiral shape.
5. The high power modular resistor of claim 1, wherein: the resistor belt (31) is made of silver or silver-palladium alloy.
6. The high power modular resistor of claim 1, wherein: the mounting groove cavity (10) is internally provided with a conductive connecting piece (4), and the resistor strip (31) is electrically connected with the binding post (2) through the conductive connecting piece (4).
7. The high power modular resistor of claim 6, wherein: the conductive connecting piece (4) adopts copper wires.
8. The high power modular resistor of claim 1, wherein: the binding post (2) is provided with a copper nut;
The shell (1) is also provided with a wrapping part (11), the wrapping part (11) is arranged outside the mounting groove cavity (10), and the wrapping part (11) is tightly wrapped outside the copper nut part;
in addition, the shell (1) is also provided with a mounting hole (12).
9. The high power modular resistor of claim 8, wherein: the mounting groove cavity (10), the wrapping part (11), the mounting hole (12) and the binding post (2) are integrated through an injection molding process.
10. The high power modular resistor of claim 1, wherein: the resistor (3) is glued and fixed in the mounting groove cavity (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322610238.3U CN220962931U (en) | 2023-09-26 | 2023-09-26 | High-power modular resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322610238.3U CN220962931U (en) | 2023-09-26 | 2023-09-26 | High-power modular resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220962931U true CN220962931U (en) | 2024-05-14 |
Family
ID=90981831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322610238.3U Active CN220962931U (en) | 2023-09-26 | 2023-09-26 | High-power modular resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220962931U (en) |
-
2023
- 2023-09-26 CN CN202322610238.3U patent/CN220962931U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |