CN217361548U

CN217361548U - Shell structure of integrated SIP encapsulation

Info

Publication number: CN217361548U
Application number: CN202220097353.8U
Authority: CN
Inventors: 马健中; 刘刚; 詹英祺; 洪火峰
Original assignee: Tongchuan Jiufang Xunda Microwave System Co ltd
Current assignee: Zhongkedi High System Technology Co.,Ltd.
Priority date: 2022-01-14
Filing date: 2022-01-14
Publication date: 2022-09-02
Anticipated expiration: 2032-01-14

Abstract

The utility model provides a shell structure of integrated SIP encapsulation relates to integrated SIP encapsulation technical field, including casing and locating component, the bottom of casing is stained with the bottom plate, the bottom of casing is close to four corners and has all seted up the draw-in groove, the both sides surface of casing is close to both sides edge and has all seted up two locating holes. The utility model discloses, the fixture block is fixed in the bottom plate top, and inside the draw-in groove of seting up simultaneously the fixture block bottom the casing, be connected between casing and the bottom plate further consolidate on the basis of glue encapsulation, avoid when glue can't play fixed effect, the casing drops from the bottom plate top easily to increase the life of chip, make simultaneously through locating lever, locating hole and can dismantle between fixture block and the draw-in groove, satisfy the demand of separation casing and bottom plate, make the utility model discloses an it is more convenient to use to the inside radiator unit that is provided with of casing can absorb the heat when chip operation, increases the utility model discloses a practicality.

Description

Shell structure of integrated SIP encapsulation

Technical Field

The utility model relates to an integrated SIP encapsulation technical field especially relates to the shell structure of integrated SIP encapsulation.

Background

The SIP package is a package scheme in which a plurality of functional wafers, including functional wafers such as a processor and a memory, are integrated into one package according to factors such as an application scenario and the number of layers of a package substrate, thereby realizing a basic complete function.

But among the prior art, be connected through the fixed glue between package shell and the chip bottom plate, glue can reduce the stickness gradually after long-time the use, leads to package shell to drop from the chip bottom plate top, and packaging structure damages, can't be playing the effect of protection chip, consequently, need improve on the basis of the shell structure of current integrated SIP encapsulation.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that exists among the prior art, increase the steadiness of being connected between shell and the chip bottom plate.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the shell structure integrated with SIP packaging comprises a shell and a positioning assembly, wherein a bottom plate is adhered to the bottom of the shell, clamping grooves are formed in the bottom of the shell close to four corners, two positioning holes are formed in the outer surfaces of two sides of the shell close to the edges of the two sides, eight positioning holes are respectively communicated with the four clamping grooves, the four clamping blocks extend into the four clamping grooves respectively, two first grooves are formed in the outer surface of one side of each clamping block, springs are fixed on the inner surface walls of the eight first grooves, connecting rods are fixed at one ends of the eight springs, one ends of the eight connecting rods extend out of the eight first grooves respectively, circular plates are fixed at one ends of the eight connecting rods, and positioning rods are movably sleeved on the outer surfaces of the eight connecting rods and the eight circular plates, the outer surface of the positioning rod is connected with the inner surface walls of the eight positioning holes in a clamped mode respectively, a second groove is formed in the outer surface of one side of the positioning rod, circular sliding grooves are formed in the inner surface walls of the second groove in the circumferential direction, the outer surface of the connecting rod is connected with the inner surface walls of the eight second grooves in a sliding mode respectively, and the outer surface of the circular plate is embedded with the inner surface walls of the eight circular sliding grooves in a sliding mode respectively.

As a preferred embodiment, the bottoms of the four clamping blocks are fixedly connected with the top of the bottom plate.

The technical effect of adopting the further scheme is as follows: the clamping block is connected with the bottom plate to fix the shell above the bottom plate.

As a preferred embodiment, the bottom of casing is close to both sides edge and all is fixed with the sealing strip, the top of bottom plate is close to both sides edge and has all seted up the third recess, two the surface of sealing strip is connected with the interior table wall block of two third recesses respectively.

The technical effect of adopting the further scheme is as follows: the sealing strip is clamped in the third groove to increase the sealing performance when the shell is connected with the bottom plate.

As a preferred embodiment, a thermally conductive plate is secured between the inner facing walls of the housing near the top edge.

The technical effect of adopting the further scheme is as follows: the heat conducting plate absorbs the heat emitted by the chip during operation.

In a preferred embodiment, a placement groove is formed in the bottom of the heat conducting plate, and a condensation pipe is fixed inside the placement groove.

The technical effect of adopting the further scheme is as follows: the condenser pipe is fixed inside the standing groove, and the condenser pipe contacts with the chip, plays the radiating effect.

As a preferred embodiment, the top of the housing near both side edges is provided with heat dissipation openings.

The technical effect of adopting the further scheme is as follows: the heat dissipation performance of the shell is further improved through the heat dissipation port.

Compared with the prior art, the utility model has the advantages and positive effects that,

the utility model discloses in, the fixture block is fixed in the bottom plate top, and the fixture block is connected between casing and the bottom plate further on the basis of glue encapsulation inside the draw-in groove of seting up bottom the casing simultaneously, avoids when glue can't play fixed effect, and the casing drops from the bottom plate top easily to increase the life of chip, make and dismantle between fixture block and the draw-in groove through locating lever, locating hole simultaneously, satisfy the demand of separation casing and bottom plate, make the utility model discloses an it is more convenient to use to the inside radiator unit that is provided with of casing can absorb the heat when chip moves, increases the utility model discloses a practicality.

Drawings

Fig. 1 is a schematic perspective view of a housing structure of an integrated SIP package provided by the present invention;

fig. 2 is an exploded view of a positioning assembly of the integrated SIP encapsulated housing structure provided by the present invention;

fig. 3 is a rear exploded view of a positioning assembly of the integrated SIP encapsulated housing structure provided by the present invention;

fig. 4 is a schematic bottom view of a housing of an integrated SIP package housing structure provided in the present invention;

fig. 5 is a schematic perspective view of a bottom plate of an integrated SIP package housing structure provided by the present invention.

Illustration of the drawings:

1. a housing; 2. a base plate; 3. a card slot; 4. positioning holes; 5. a positioning assembly; 51. a clamping block; 52. a first groove; 53. a spring; 54. a connecting rod; 55. a circular plate; 56. positioning a rod; 57. a second groove; 58. a circular chute; 6. a seal strip; 7. a third groove; 8. a heat conducting plate; 9. a placement groove; 10. a condenser tube; 11. and a heat dissipation port.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the present invention provides a technical solution: an integrated SIP packaged shell structure comprises a shell 1 and a positioning component 5, wherein a bottom plate 2 is adhered to the bottom of the shell 1, clamping grooves 3 are formed in the bottom of the shell 1 close to four corners, two positioning holes 4 are formed in the outer surfaces of two sides of the shell 1 close to the edges of the two sides, eight positioning holes 4 are respectively communicated with four clamping grooves 3, the positioning component 5 comprises four clamping blocks 51, the four clamping blocks 51 respectively extend into the four clamping grooves 3, two first grooves 52 are formed in the outer surface of one side of each clamping block 51, springs 53 are fixed on the inner surface walls of the eight first grooves 52, connecting rods 54 are fixed at one ends of the eight springs 53, one ends of the eight connecting rods 54 respectively extend to the outer portions of the eight first grooves 52, circular plates 55 are fixed at one ends of the eight connecting rods 54, and positioning rods 56 are movably sleeved on the outer surfaces of the eight connecting rods 54 and the eight circular plates 55, the surface of eight locating levers 56 is connected with the interior table wall block of eight locating holes 4 respectively, second recess 57 has all been seted up to one side surface of eight locating levers 56, the interior table wall of eight second recesses 57 all is the circumferencial direction and has all seted up circular spout 58, the surface of eight connecting rods 54 respectively with the interior table wall sliding connection of eight second recesses 57, the surface of eight plectanes 55 respectively with the interior table wall sliding of eight circular spouts 58 inlay and establish, the bottom of four fixture blocks 51 all with bottom plate 2's top fixed connection.

In this embodiment, when the housing 1 is connected to the bottom plate 2, the fixture block 51 extends into the slot 3, the positioning rod 56 is compressed into the first groove 52 by the inner wall of the slot 3, so that the fixture block 51 smoothly extends into the slot 3 until the positioning rod 56 coincides with the positioning hole 4, the spring 53 drives the positioning rod 56 to bounce forward, and engage with the positioning hole 4, so as to fix the fixture block 51 and the slot 3 together, the two positioning holes 4 of the present invention have different sizes, the diameter of the lower positioning hole 4 is smaller than that of the upper positioning hole 4, the two positioning rods 56 are similar, so as to avoid the engagement between the upper positioning rod 56 and the lower positioning hole 4, the positioning rod 56 is movably connected with the circular plate 55 and the connecting rod 54 through the circular chute 58, the second groove 57, so that the positioning rod 56 can rotate, the positioning blocks are fixed on both sides of the positioning rod 56, and after the positioning rod 56 is contracted into the first groove 52 and rotated, the positioning rod 56 and the positioning hole 4 are not overlapped, so that the positioning rod 56 cannot be bounced to be engaged with the positioning hole 4.

Example 2

As shown in fig. 1, fig. 4 and fig. 5, the bottom of casing 1 is close to both sides edge and all is fixed with sealing strip 6, the top of bottom plate 2 is close to both sides edge and has all seted up third recess 7, the surface of two sealing strips 6 is connected with the interior table wall block of two third recesses 7 respectively, it is fixed with heat-conducting plate 8 to be close to top edge between the interior table wall of casing 1, standing groove 9 has been seted up to heat-conducting plate 8's bottom, the inside of standing groove 9 is fixed with condenser pipe 10, the top of casing 1 is close to both sides edge and has all seted up thermovent 11.

In this embodiment, sealing strip 6 is connected with third recess 7, increases the leakproofness between casing 1 and the bottom plate 2, avoids having liquid from the gap infiltration of both connections, causes the influence to inside chip, and condenser pipe 10 fixes inside the standing groove 9 that the heat-conducting plate 8 bottom was seted up, makes condenser pipe 10 bottom and heat-conducting plate 8 bottom be in same level, both simultaneously with the chip contact, play the radiating effect.

The working principle is as follows:

as shown in fig. 1, 2, 3, 4 and 5, when the casing 1 is fixed on the bottom plate 2, the existing glue adheres to both sides of the bottom of the casing 1, when the glue fixes the casing 1 and the bottom plate 2, the four fixture blocks 51 extend into the four slots 3 respectively, the positioning rod 56 is engaged with the positioning hole 4, the fixture blocks 51 are connected with the slots 3 to complete the packaging, the heat conducting plate 8 and the condenser tube 10 are contacted with the chip, the heat conducting plate 8 and the condenser tube 10 absorb the heat dissipated during the operation of the chip to avoid the chip from overheating, the heat dissipating port 11 is formed to contact the heat conducting plate 8 with the outside air, the heat dissipating performance is further increased, when the casing 1 and the bottom plate 2 need to be disassembled, the positioning rod 56 is pressed towards the inside of the slot 3, because the elastic positioning rod 56 of the spring 53 is contracted into the first groove 52, and then the positioning rod 56 is rotated through the circular chute 58, the circular plate 55, the second groove 57 and the connecting rod 54, make locating lever 56 card inside draw-in groove 3, even loosen locating lever 56 spring 53 can not kick-back, operate eight locating levers 56 in proper order, alright follow bottom plate 2 top and take off casing 1, accomplish dismantlement work.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may use the above-mentioned technical contents to change or modify the equivalent embodiment into equivalent changes to be applied in other fields, but all those persons do not depart from the technical contents of the present invention, and any simple modification, equivalent change and modification made to the above embodiments according to the technical matters of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims

1. Integrated SIP encapsulated shell structure, including casing (1) and locating component (5), its characterized in that: the bottom of the shell (1) is adhered with the bottom plate (2), the bottom of the shell (1) close to four corners is provided with clamping grooves (3), the outer surfaces of two sides of the shell (1) close to two side edges are provided with two positioning holes (4), eight positioning holes (4) are respectively communicated with four clamping grooves (3), the positioning assembly (5) comprises four clamping blocks (51), the four clamping blocks (51) respectively extend into the four clamping grooves (3), the outer surface of one side of each of the four clamping blocks (51) is provided with two first grooves (52), springs (53) are fixed on the inner surface walls of the eight first grooves (52), one ends of the eight springs (53) are respectively fixed with a connecting rod (54), one ends of the eight connecting rods (54) respectively extend to the outer parts of the eight first grooves (52), one ends of the eight connecting rods (54) are respectively fixed with a circular plate (55), eight the equal movable sleeve of surface of connecting rod (54) and eight plectane (55) is equipped with locating lever (56), eight the surface of locating lever (56) is connected with the interior table wall block of eight locating holes (4) respectively, eight second recess (57) have all been seted up to one side surface of locating lever (56), eight circular spout (58) have all been seted up to the interior table wall of second recess (57) all is the circumferencial direction, eight the surface of connecting rod (54) respectively with the interior table wall sliding connection of eight second recesses (57), eight the surface of plectane (55) is inlayed with the interior table wall sliding of eight circular spout (58) respectively and is established.

2. The integrated SIP package housing structure of claim 1, wherein: the bottoms of the four clamping blocks (51) are fixedly connected with the top of the bottom plate (2).

3. The housing structure of an integrated SIP package of claim 1, characterized in that: the bottom of casing (1) is close to both sides edge and all is fixed with sealing strip (6), third recess (7), two have all been seted up near both sides edge in the top of bottom plate (2) the surface of sealing strip (6) is connected with the interior table wall block of two third recesses (7) respectively.

4. The integrated SIP package housing structure of claim 1, wherein: a heat-conducting plate (8) is fixed between the inner surface walls of the shell (1) near the top edge.

5. The integrated SIP package housing structure of claim 4, wherein: the heat conduction plate is characterized in that a placing groove (9) is formed in the bottom of the heat conduction plate (8), and a condensation pipe (10) is fixed inside the placing groove (9).

6. The integrated SIP package housing structure of claim 1, wherein: the top of the shell (1) is provided with heat dissipation ports (11) close to the edges of the two sides.