CN217334061U - Semiconductor diode mounting framework - Google Patents
Semiconductor diode mounting framework Download PDFInfo
- Publication number
- CN217334061U CN217334061U CN202220625217.1U CN202220625217U CN217334061U CN 217334061 U CN217334061 U CN 217334061U CN 202220625217 U CN202220625217 U CN 202220625217U CN 217334061 U CN217334061 U CN 217334061U
- Authority
- CN
- China
- Prior art keywords
- semiconductor diode
- main part
- outer side
- diode main
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor diode mounting framework, which comprises a semiconductor diode main body, wherein a metal tube is mounted on the outer side of the semiconductor diode main body, heat conducting fins which are uniformly distributed are integrally formed on the outer side of the metal tube, a mounting sleeve is mounted on the outer side of the metal tube, and one side of the heat conducting fins, which is far away from the metal tube, penetrates through and extends to the outer side of the mounting sleeve; the top joint that the installation cover includes the bottom plate has the apron, the tubular metal resonator is located the bottom plate and is located between the apron. The utility model discloses a, restriction semiconductor diode main part wire's position of buckling and radian when the increase is frictional to protect the wire position, reduce the cracked probability of wire and can effectually play the protection radiating action to the semiconductor diode main part, improve the life and the service reliability of semiconductor diode main part, strengthen the installation stability of semiconductor diode main part.
Description
Technical Field
The utility model relates to a semiconductor diode technical field specifically is a semiconductor diode installation framework.
Background
A semiconductor diode generally refers to a diode, which is an electronic device made of a semiconductor material (silicon, selenium, germanium, etc.) and has a unidirectional conductivity in which the diode is turned on when a forward voltage is applied to an anode and a cathode of the diode, and is turned off when a reverse voltage is applied to the anode and the cathode. Therefore, the on and off of the diode is equivalent to the on and off of the switch; the diode is one of the most recently produced semiconductor devices, and has a very wide application, and particularly, in various electronic circuits, a diode and components such as a resistor, a capacitor, an inductor, and the like are reasonably connected to form circuits with different functions, so that various functions such as rectification of alternating current, detection of modulation signals, amplitude limitation and clamping, and voltage stabilization of power supply voltage can be realized.
The existing semiconductor diode mounting structure is designed only aiming at the firmness of fixation, has poor protection capability on the semiconductor diode and is easily influenced by external factors, so that technical personnel provide a mounting framework to solve the problems.
SUMMERY OF THE UTILITY MODEL
To the relevant problem that exists among the prior art, the utility model aims at providing a semiconductor diode installs framework.
In order to achieve the above purpose, the utility model adopts the following technical scheme.
A semiconductor diode mounting framework comprises a semiconductor diode main body, wherein a metal tube is mounted on the outer side of the semiconductor diode main body, heat conducting fins which are uniformly distributed are integrally formed on the outer side of the metal tube, a mounting sleeve is mounted on the outer side of the metal tube, and one side, far away from the metal tube, of each heat conducting fin penetrates through the mounting sleeve and extends to the outer side of the mounting sleeve;
the installation cover includes that the top joint of bottom plate has the apron, the tubular metal resonator is located the bottom plate and is located between the apron, the front of bottom plate and the homogeneous integrated into one piece in the back have fixed otic placode.
As a further description of the above technical solution:
the integrated shaping of the left and right sides at bottom plate top has the backup pad, the left and right sides of apron all is provided with logical groove, the backup pad forms the through-hole with the space that leads to the inslot wall, the both ends of semiconductor diode main part extend to the outside of installing the cover through the through-hole.
As a further description of the above technical solution:
the top of the mounting sleeve and the inner top wall of the through groove are fixedly connected with rubber pads, and the rubber pads are located on the inner sides of the through holes.
As a further description of the above technical solution:
a gap is formed between the metal pipe and the inner wall of the cover plate, and the top of the heat-conducting fin penetrates through the cover plate and extends to the outer side of the cover plate.
As a further description of the above technical solution:
the top fixedly connected with evenly distributed's of bottom plate telescopic link, the top fixedly connected with bracing piece of telescopic link, the top and the semiconductor diode main part contact of bracing piece, the spring has been cup jointed on the telescopic link, the top and the bracing piece contact of spring.
Compared with the prior art, the utility model has the advantages of:
(1) this scheme, through setting up the tubular metal resonator and the contact of semiconductor diode main part, and with heat conduction to the heat conduction piece on, through heat conduction piece increase heat radiating area, the radiating effect is improved, the result of use of semiconductor diode main part is improved, through bottom plate and apron block, can wrap up the semiconductor diode main part, thereby can improve the protective effect to the semiconductor diode main part, then install the semiconductor diode main part fixedly through fixed otic placode, can effectually play the protection radiating effect to the semiconductor diode main part, improve the life and the reliability in utilization of semiconductor diode main part, the installation stability of reinforcing semiconductor diode main part.
(2) Through bottom plate and apron upper supporting plate and the concatenation formation through-hole that leads to the groove, make things convenient for the wire at semiconductor diode main part both ends to pass through, make things convenient for the installation of semiconductor diode main part to use, can contact with the wire of semiconductor diode main part through the rubber pad, restriction semiconductor diode main part wire when increasing friction buckle position and radian to protect the wire position, reduce the cracked probability of wire, the protecting effect is better.
Drawings
FIG. 1 is a front sectional view of the present invention;
FIG. 2 is a schematic side view of the present invention;
fig. 3 is a schematic structural diagram of the cover plate of the present invention.
The reference numbers in the figures illustrate:
1. a semiconductor diode body; 2. a metal tube; 3. a heat conductive sheet; 4. installing a sleeve; 41. a base plate; 42. a cover plate; 43. fixing the ear plate; 5. a support plate; 6. a through groove; 7. a through hole; 8. a rubber pad; 9. a telescopic rod; 10. a support bar; 11. a spring.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention;
referring to fig. 1 to 3, in the present invention, a semiconductor diode mounting structure includes a semiconductor diode main body 1, a metal tube 2 is mounted on an outer side of the semiconductor diode main body 1, heat conducting fins 3 are uniformly distributed on an outer side of the metal tube 2, a mounting sleeve 4 is mounted on an outer side of the metal tube 2, and one side of the heat conducting fins 3 away from the metal tube 2 penetrates and extends to an outer side of the mounting sleeve 4;
the mounting sleeve 4 comprises a cover plate 42 clamped at the top of the bottom plate 41, the metal tube 2 is positioned between the cover plates 42 and the bottom plate 41, and a fixed lug plate 43 is integrally formed on the front surface and the back surface of the bottom plate 41.
The utility model discloses in, through setting up the contact of tubular metal resonator 2 and semiconductor diode main part 1, and with heat conduction to conducting strip 3 on, increase heat radiating area through conducting strip 3, the heat dissipation effect is improved, the result of use of semiconductor diode main part 1 is improved, through bottom plate 41 and apron 42 block, can wrap up semiconductor diode main part 1, thereby can improve the protective effect to semiconductor diode main part 1, then install semiconductor diode main part 1 through fixed otic placode 43 and fix, can effectually play the protection radiating effect to semiconductor diode main part 1, improve the life and the service reliability of semiconductor diode main part 1, strengthen the installation stability of semiconductor diode main part 1.
Please refer to fig. 1-3, wherein: the left and right sides at bottom plate 41 top homogeneous body shaping has backup pad 5, and the left and right sides of apron 42 all is provided with logical groove 6, and backup pad 5 forms through-hole 7 with the space that leads to the groove 6 inner wall, and the both ends of semiconductor diode main part 1 are passed through-hole 7 and are extended to the outside of installing sleeve 4.
The utility model discloses in, form through-hole 7 through bottom plate 41 and apron 42 upper supporting plate 5 and the concatenation that leads to groove 6, make things convenient for the wire at 1 both ends of semiconductor diode main part to pass through, make things convenient for the installation of semiconductor diode main part 1 to use.
Please refer to fig. 1-3, wherein: the top of the mounting sleeve 4 and the inner top wall of the through groove 6 are fixedly connected with rubber pads 8, and the rubber pads 8 are located on the inner sides of the through holes 7.
The utility model discloses in, can contact with the wire of semiconductor diode main part 1 through rubber pad 8, restriction semiconductor diode main part 1 wire when increasing the friction position of buckling and radian to protect the wire position, reduce the cracked probability of wire, the protecting effect is better.
Please refer to fig. 1 and fig. 2, wherein: a gap is formed between the metal pipe 2 and the inner wall of the cover plate 42, and the top of the heat conducting fin 3 penetrates through and extends to the outer side of the cover plate 42.
The utility model discloses in, make things convenient for the circulation of inside air through the space for heat-conduction between semiconductor diode main part 1 and the tubular metal resonator 2 improves the radiating effect.
Please refer to fig. 1, in which: the top fixedly connected with evenly distributed's of bottom plate 41 telescopic link 9, the top fixedly connected with bracing piece 10 of telescopic link 9, the top and the contact of semiconductor diode main part 1 of bracing piece 10 have cup jointed spring 11 on the telescopic link 9, spring 11's top and the contact of bracing piece 10.
The utility model discloses in, spring 11 on the telescopic link 9 provides elasticity, with the contact of bracing piece 10 jack-up with semiconductor diode main part 1 to accomplish the support laminating to semiconductor diode main part 1, can play certain cushioning effect simultaneously, further strengthen the protective capacities to the contact of semiconductor diode main part 1.
The working principle is as follows: through setting up the contact of tubular metal resonator 2 and semiconductor diode main part 1, and with heat conduction to on the conducting strip 3, increase heat radiating area through conducting strip 3, the radiating effect is improved, the result of use of semiconductor diode main part 1 is improved, through bottom plate 41 and apron 42 block, can wrap up semiconductor diode main part 1, thereby can improve the protective effect to semiconductor diode main part 1, then install semiconductor diode main part 1 fixedly through fixed otic placode 43, can effectually play the protection radiating effect to semiconductor diode main part 1, improve the life and the reliability in utilization of semiconductor diode main part 1, strengthen the installation stability of semiconductor diode main part 1.
The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.
Claims (5)
1. A semiconductor diode mounting architecture comprising a semiconductor diode body (1), characterized in that: the semiconductor diode comprises a semiconductor diode main body (1), wherein a metal tube (2) is installed on the outer side of the semiconductor diode main body (1), heat conducting fins (3) which are uniformly distributed are integrally formed on the outer side of the metal tube (2), an installation sleeve (4) is installed on the outer side of the metal tube (2), and one side, far away from the metal tube (2), of each heat conducting fin (3) penetrates through and extends to the outer side of the installation sleeve (4);
the top joint that installing sleeve (4) includes bottom plate (41) has apron (42), tubular metal resonator (2) are located bottom plate (41) and are located between apron (42), the front and the back homogeneous body shaping of bottom plate (41) have fixed otic placode (43).
2. A semiconductor diode mounting architecture according to claim 1, wherein: the equal integrated into one piece in the left and right sides at bottom plate (41) top has backup pad (5), the left and right sides of apron (42) all is provided with logical groove (6), backup pad (5) and the space that leads to groove (6) inner wall form through-hole (7), the both ends of semiconductor diode main part (1) are passed through-hole (7) and are extended to the outside of installing sleeve (4).
3. A semiconductor diode mounting architecture according to claim 2, wherein: the top of the mounting sleeve (4) and the inner top wall of the through groove (6) are fixedly connected with rubber pads (8), and the rubber pads (8) are located on the inner sides of the through holes (7).
4. A semiconductor diode mounting architecture according to claim 1, wherein: a gap is formed between the metal pipe (2) and the inner wall of the cover plate (42), and the top of the heat conducting fin (3) penetrates through and extends to the outer side of the cover plate (42).
5. A semiconductor diode mounting architecture according to claim 1, wherein: the top fixedly connected with evenly distributed's of bottom plate (41) telescopic link (9), the top fixedly connected with bracing piece (10) of telescopic link (9), the top and the semiconductor diode main part (1) contact of bracing piece (10), spring (11) have been cup jointed on telescopic link (9), the top and the bracing piece (10) contact of spring (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220625217.1U CN217334061U (en) | 2022-03-21 | 2022-03-21 | Semiconductor diode mounting framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220625217.1U CN217334061U (en) | 2022-03-21 | 2022-03-21 | Semiconductor diode mounting framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217334061U true CN217334061U (en) | 2022-08-30 |
Family
ID=83001365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220625217.1U Active CN217334061U (en) | 2022-03-21 | 2022-03-21 | Semiconductor diode mounting framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217334061U (en) |
-
2022
- 2022-03-21 CN CN202220625217.1U patent/CN217334061U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN217334061U (en) | Semiconductor diode mounting framework | |
| CN212033009U (en) | Semiconductor packaging structure | |
| CN213462428U (en) | Circuit board heat radiation structure | |
| CN215580924U (en) | Novel energy-saving transformer rectifier | |
| CN210143224U (en) | Charger shell utilizing air convection to cool naturally | |
| CN219476497U (en) | Capacitor with base structure | |
| CN214043780U (en) | Quick radiating car battery box | |
| CN220829954U (en) | Inverter fast recovery diode | |
| CN213991172U (en) | Standard TYPE-C charger control circuit board | |
| CN220383425U (en) | Efficient heat dissipation and electromagnetic interference shielding device suitable for plateau environment | |
| CN214068719U (en) | Plastic package diode with good heat dissipation and diode chip protection | |
| CN214957200U (en) | Mobile phone battery with high-efficiency heat dissipation performance | |
| CN211655495U (en) | Assembled insulating cylinder device | |
| CN220108556U (en) | GPS remote acquisition control terminal shell with heat radiation structure | |
| CN215008201U (en) | MOS pipe that radiating effect is good | |
| CN210925618U (en) | Brake resistor for frequency converter | |
| CN210039931U (en) | Novel self-protection three-phase capacitor | |
| CN213519409U (en) | Box-packed SMD piezo-resistor | |
| CN219087641U (en) | Power management module | |
| CN215988384U (en) | Energy storage inductance base structure | |
| CN210405770U (en) | Circuit board with edge-covering and heat-dissipating functions | |
| CN219833980U (en) | Rectifier with protection component | |
| CN212810301U (en) | Diode rectifier module with anti-stress structure | |
| CN221079830U (en) | Heat radiation structure of capacitor | |
| CN212230417U (en) | Electronic chip with constant temperature function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |