CN217331223U

CN217331223U - Testing device for testing stress and warpage of thin film

Info

Publication number: CN217331223U
Application number: CN202123282215.1U
Authority: CN
Inventors: 刘敏; 赵海明; 仇成功; 左万胜; 胡新星; 唐建平; 王丽多; 袁松; 钮应喜
Original assignee: Anhui Changfei Advanced Semiconductor Co ltd
Current assignee: Anhui Changfei Advanced Semiconductor Co ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-08-30
Anticipated expiration: 2031-12-24

Abstract

The utility model discloses a testing arrangement for film stress and warpage test, device are annular support, the support position of inwards extending is established to the support inboard, it is equipped with at least threely to support the position, it is used for supporting the piece that awaits measuring to support the position, be equipped with the spout on the support, be equipped with the guide rail in the spout, be equipped with the scale on the guide rail, the spout is placed along the guide rail to gliding instruction piece in the support, instruct the piece lower surface be equipped with guide rail complex slider. The utility model discloses testing arrangement's instruction piece slides to testing at the same groove of horizontally, has ensured that stress test goes on under the same condition, has improved the repeatability of stress test result, reduces the piece landing that the human factor leads to, causes the piece, improves the profit.

Description

Testing device for testing stress and warpage of thin film

Technical Field

The utility model relates to a stress test technical field.

Background

After the film is deposited on the substrate, the film is in a strain state, if the film is distinguished by the direction of bending deformation of the substrate caused by the film stress, the stress can be divided into tensile stress and compressive stress, the tensile stress is that when the film is stressed to stretch outwards, the substrate is compressed inwards, the film surface is concave downwards, the film tends to shrink due to the action of the tensile stress, and if the tensile stress of the film layer exceeds the elastic limit of the film, the film can be cracked, even peeled off the substrate and tilted.

The compressive stress is in an opposite state, the film surface generates a convex phenomenon, and the film tends to expand towards the surface under the action of the compressive stress. If the compressive stress is at its limit, the film may curl inward toward the substrate, causing the film to blister. The method for testing the film stress has diversity, and a radius of curvature method is commonly used, and the difference of the inverse of the radius of curvature can be obtained by testing the radius of curvature of the substrate and the film substrate, and the result of the stress can be obtained by a formula. When the stress of the film is tested, the distance between the clamp and the epitaxial wafer cannot be ensured in each testing process, so that the repeatability of a stress testing result is low. In addition, the supporting point and the epitaxial wafer have a small contact area, so that the epitaxial wafer is easy to slide off, fragments are caused, and the cost is increased.

Disclosure of Invention

The utility model aims to solve the technical problem that realize a can be more accurate, high-efficient test film stress's device.

In order to realize the purpose, the utility model discloses a technical scheme be: the utility model provides a testing arrangement for film stress and warpage test, the device is annular support, the support inboard is established the support position of inside extension, it is equipped with at least three to support the position, it is used for supporting the piece that awaits measuring to support the position, be equipped with the spout on the support, be equipped with the guide rail in the spout, be equipped with the scale on the guide rail, the spout has been placed along the gliding instruction piece of guide rail to the support, instruct the piece lower surface be equipped with guide rail complex slider.

The indicating block is of a rectangular structure, a convex block protrudes towards the inner side of the support, and the sliding block is of an inverted trapezoidal structure which gradually becomes thicker upwards.

The guide rail in the spout is equipped with two, the lower surface of instruction piece is equipped with two and guide rail complex slider.

The support position is equipped with threely, and adjacent contained angle is 120 degrees.

The support position includes fixed block, connecting rod and bracket, the support inboard is equipped with the embedded groove that is used for imbedding the fixed block, fixed block and bracket are connected to the connecting rod, the arc structure of bracket for being located the support.

At least one inwards concave groove is formed in the inner side of the support.

The support, the supporting position and the sliding block are all made of aluminum alloy materials.

The utility model discloses testing arrangement's instruction piece slides to testing at the same groove of horizontally, has ensured that stress test goes on under the same condition, has improved the repeatability of stress test result, reduces the piece landing that the human factor leads to, causes the piece, improves the profit.

Drawings

The following brief descriptions of the contents expressed by each figure and the marks in the figures in the specification of the present invention are as follows:

FIG. 1 is a schematic structural diagram of a testing device for testing stress and warpage of a thin film;

FIG. 2 is a schematic diagram of an indicator block structure;

the labels in the above figures are: 1. a support; 2. a groove; 3. a support position; 4. a fixed block; 5. a connecting rod; 6. A bracket; 7. an indication block; 8. a bump; 9. a guide rail; 10. a slider; 11. a chute.

Detailed Description

The following description of the embodiments of the present invention, with reference to the accompanying drawings, will be made in further detail for the purpose of promoting a more complete, accurate and thorough understanding of the inventive concepts and technical solutions of the present invention, such as the shapes and structures of the various components, the mutual positions and connections between the various components, the functions and operating principles of the various components, the manufacturing processes, and the methods for operating and using the components.

The film stress testing device mainly comprises three parts, including a bracket 1, a supporting position 3 and a slide block 10, the components are preferably made of aluminum alloy, the support 1 is of an annular structure, the inner ring is provided with at least one inwards-recessed groove 2, the two inwards-recessed grooves are generally symmetrically arranged, the to-be-tested wafer can be conveniently taken down, the inner side of the support 1 is provided with inwards-extending support positions 3, the structures of the support positions 3 are the same, in order to ensure that the support is reliable, generally, the support positions 3 are arranged at three equal included angles, each support position comprises a fixing block 4, a connecting rod 5 and a bracket 6, an embedding groove used for embedding the fixing block 4 is formed in the inner side of the support 1, the connecting rod 5 is connected with the fixing block 4 and the bracket 6, the bracket 6 is of an arc-shaped structure located in the support 1, the bracket 6 is used for supporting a wafer to be tested, the bracket 6 preferably has a step structure, so that the wafer can be placed on a step, and an original point contact mode is improved into a surface contact mode.

In order to make the position of placing at every turn keep unanimous and accurate, be equipped with spout 11 on the support 1, spout 11 is to the inboard opening of support 1, be equipped with guide rail 9 in the spout 11, be equipped with the scale on the guide rail 9, spout 11 has been placed along guide rail 9 to the gliding instruction piece 7 of support 1, instruct 7 lower surfaces of piece to be equipped with guide rail 9 complex slider 10, as shown in fig. 2, the slider is the structure of falling the trapezium that upwards becomes thick gradually, slider 10 is the structure that can wrap up guide rail 9, make instruction piece 7 can steadily accurate slip, know the accurate position of piece through observing the scale, for it is more stable to remove, guide rail 9 in the spout 11 is preferred to be set up two, the lower surface of instruction piece 7 is equipped with two and guide rail 9 complex slider 10.

The whole instruction piece 7 is rectangular structure, and the inboard protrusion that has to support 1 has the lug 8 for the contact piece edge, and the lug 8 also is preferred to be provided with two, and the device is through increasing the guide rail 9 that has the ruling, and reducible uncertain factor is to the influence of piece stress test result, improves the repeatability of stress test result under the same condition. By increasing the contact surface with the sheet, the probability of fragments is reduced, and the profit is improved.

During operation, the assembled test tray is placed on the clamping plug of the test tray, and the vacuum suction pen sucking the wafer is inclined by a certain angle by an operator and placed on the step-type supporting position 3. The indicator block 7 is slid to the same horizontal score line for testing, ensuring that the test is performed under equivalent conditions.

The present invention has been described above with reference to the accompanying drawings, and it is to be understood that the invention is not limited to the specific embodiments described above, and that the invention is not limited to the specific embodiments described above, but rather is intended to cover various insubstantial modifications of the inventive method and solution, or its application to other applications without modification.

Claims

1. A testing device for testing stress and warpage of a film is characterized in that: the device is annular support, the support inboard is established the support position of inside extension, it is equipped with at least three to support the position, it is used for supporting the tablet that awaits measuring to support the position, be equipped with the spout on the support, be equipped with the guide rail in the spout, be equipped with the scale on the guide rail, the spout is placed along the gliding instruction piece of guide rail to the support, instruct the piece lower surface be equipped with guide rail complex slider.

2. The testing device for thin film stress and warpage testing according to claim 1, wherein: the indicating block is of a rectangular structure, a convex block protrudes towards the inner side of the support, and the sliding block is of an inverted trapezoidal structure which gradually becomes thicker upwards.

3. The testing device for thin film stress and warpage testing according to claim 2, wherein: the guide rail in the spout is equipped with two, the lower surface of instruction piece is equipped with two and guide rail complex slider.

4. A test apparatus for thin film stress and warpage testing as claimed in claim 1, 2 or 3, wherein: the support position is equipped with threely, and adjacent contained angle is 120 degrees.

5. The testing device for thin film stress and warpage testing according to claim 4, wherein: the support position includes fixed block, connecting rod and bracket, the support inboard is equipped with the embedded groove that is used for imbedding the fixed block, fixed block and bracket are connected to the connecting rod, the arc structure of bracket for being located the support.

6. The testing device for thin film stress and warpage testing according to claim 1 or 5, wherein: at least one inwards concave groove is formed in the inner side of the support.

7. The testing apparatus for thin film stress and warpage testing as recited in claim 6, wherein: the support, the supporting position and the sliding block are all made of aluminum alloy materials.