CN217308110U - Power module and electronic equipment - Google Patents
Power module and electronic equipment Download PDFInfo
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- CN217308110U CN217308110U CN202123139882.4U CN202123139882U CN217308110U CN 217308110 U CN217308110 U CN 217308110U CN 202123139882 U CN202123139882 U CN 202123139882U CN 217308110 U CN217308110 U CN 217308110U
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- power module
- heat dissipation
- baffle
- air duct
- radiator
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 57
- 238000005070 sampling Methods 0.000 claims description 29
- 239000003990 capacitor Substances 0.000 claims description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/20—Active power filtering [APF]
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a power module, comprising: the heat dissipation fan, the heat dissipation air duct and the radiator; the heat dissipation air duct is established for detaining cover body structure on the PCB board of power module, and will radiator on the PCB board covers, the heat dissipation air duct is detained and is established back on the PCB board the first end in heat dissipation air duct is as the air intake the second end in heat dissipation air duct is as the air outlet, wherein, radiator fan's air-out side is just right the air intake guides the air current of radiator fan output through the heat dissipation air duct for more air current flows through the radiator has improved the radiating efficiency of radiator.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a power module with high power density and electronic equipment.
Background
In the prior art, the low power Active Power Filter (APF)/Static Var Generator (SVG) is commonly specified as 10KVAR, 30KVAR, 50KVAR, 100KVAR, 150 KVAR. The IGBT module scheme is generally adopted at 50KVAR and above, and the IGBT single tube scheme can be adopted at 30KVAR and below.
Currently, most of common IGBT single tubes are TO-247 packaged. The TO-247 package is a screw-on package, the maximum specification of which is 650V/75A. The IGBT has larger parasitic parameters, and at most two IGBT devices are connected in parallel for use. The applicant finds that after the single IGBT tube in the prior art is used for a long time, the radiator can not rapidly radiate heat, and the temperature of the single IGBT tube is too high.
Disclosure of Invention
In view of this, the present invention provides a power module to prevent the module temperature from being too high.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
a power module, comprising:
the heat dissipation fan, the heat dissipation air duct and the radiator;
the heat dissipation air duct is arranged in a buckling mode and is of a cover body structure on a PCB of the power module and covers a radiator on the PCB, the heat dissipation air duct is arranged behind the PCB in a buckling mode, the first end of the heat dissipation air duct serves as an air inlet, the second end of the heat dissipation air duct serves as an air outlet, and the air outlet side of the heat dissipation fan is opposite to the air inlet.
Optionally, the power module includes: the material of the heat dissipation air duct is an acrylic plate.
Optionally, in the power module, the power supply and the sampling board of the power module and the driving core board are mounted on the PCB of the power module in an inserting manner.
Optionally, in the power module, the power module further includes a bus capacitor capacity expansion plate, a plurality of bus capacitors are disposed on the bus capacitor capacity expansion plate, and the bus capacitor capacity expansion plate is used for expanding the capacity of the bus capacitor of the power module.
Optionally, the power module further includes a baffle, each side of each heat sink is provided with a baffle, and an extending direction of the baffle is consistent with an extending direction of the heat dissipation air duct, so that the air output by the heat dissipation fan passes through the heat dissipation fins of the heat sink.
Optionally, in the power module, the baffle includes a first baffle and a second baffle;
one side of each radiator is provided with a first baffle;
the second baffle is arranged between the first baffles, and the end part of the second baffle is connected with the end part of the first baffle adjacent to the second baffle.
Optionally, in the power module, a gap with a preset height is formed between the second baffle and the PCB of the power module.
Optionally, in the power module, the power module further includes:
a current sensor and a temperature sensor;
the current sensor is used for sampling current at a current sampling position in the power module and sending the acquired current data to a sampling plate of the power module;
the temperature sensor is used for sampling the temperature of the temperature sampling position in the power module and sending the collected temperature data to the sampling plate of the power module.
An electronic device, which is applied with the power module.
Based on the above technical solution, the power module provided in the embodiment of the present invention includes: the heat dissipation fan, the heat dissipation air duct and the radiator; the heat dissipation air duct is established for detaining cover body structure on the PCB board of power module, and will radiator on the PCB board covers, the heat dissipation air duct is detained and is established back on the PCB board the first end in heat dissipation air duct is as the air intake the second end in heat dissipation air duct is as the air outlet, wherein, radiator fan's air-out side is just right the air intake guides the air current of radiator fan output through the heat dissipation air duct for more air current flows through the radiator has improved the radiating efficiency of radiator.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a power module according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a power module according to another embodiment of the disclosure;
fig. 3 is a schematic structural diagram of a power module according to another embodiment of the disclosure;
fig. 4 is a schematic structural diagram of a power module according to another embodiment of the disclosure;
fig. 5 is a schematic structural diagram of a power module according to another embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In view of the problem of the too high temperature of the single tube of IGBT among the prior art, this application has set up a power module, through set up the heat dissipation wind channel between the radiator fan and the radiator of power module, through the wind channel of dispelling the heat to the sealing of radiator fan output drainage, make the amount of wind that flows through the radiator increases, has improved the radiating efficiency, has realized the rapid cooling of radiator to guarantee that the temperature of this power module keeps in controllable within range.
Referring to fig. 1, a power module disclosed in an embodiment of the present application may include:
a heat radiation fan 1, a heat radiation air channel 2 and a heat radiator 3;
the heat dissipation air duct is a cover body structure buckled on a PCB of the power module and covers a radiator on the PCB, so that the radiator is located in the heat dissipation air duct, the heat dissipation air duct is buckled on the PCB, the PCB is arranged at the bottom of the heat dissipation air duct, the first end of the heat dissipation air duct is used as an air inlet, the second end of the heat dissipation air duct is used as an air outlet, and the air outlet side of the heat dissipation fan is right opposite to the air inlet.
When radiator fan during operation, radiator fan output's wind by the air intake flows into the heat dissipation wind channel pass in the heat dissipation wind channel the heat of radiator is taken away, then flows out via the air outlet the heat dissipation wind channel, in this scheme, it is right through the heat dissipation wind channel the wind direction of the wind of radiator fan output is injectd, makes the amount of wind that radiator fan provided can more pass the radiator for the radiator can rapid cooling.
In the technical scheme disclosed in the embodiment of the application, the material in heat dissipation wind channel can be selected by oneself according to user's demand, and is optional, if consider in this scheme that adopt the metal material as heat dissipation wind channel, it may be right signal in the power module produces the interference, consequently, in this scheme, heat dissipation wind channel preferred is ya keli board material or ceramic material.
Considering the trend of chip miniaturization development, in this scheme, in order to improve the integrated level of chip, in this scheme, the power of power module and sampling board 4 can be for inserting the PCB board, through with power and sampling board set up to insert the PCB board, have saved the area of the PCB bottom plate of power module, improve power density. The power supply and the sampling plate are used for generating a power supply for the single chip microcomputer and the current sensor to use, and meanwhile, sampling signals of the temperature sensor and the current sensor inside the power module are obtained and are sampled, processed and protected through the built-in single chip microcomputer.
In a similar way, in order to improve the integration level of the chip, in the technical scheme disclosed in the embodiment of the present application, the driving power supply and the driving isolation circuit of the power module are arranged on the driving core board, the driving core board is used for inserting the PCB board, and the driving core board is arranged to be inserted into the PCB board, so that the area of the PCB bottom board of the power module is saved.
In the technical scheme disclosed in another embodiment of the present application, under considering different scenes, the bus capacitance's that the power module used variation in size, in order to make the power module can adapt to more scenes, in this scheme, can set up a bus capacitance dilatation board 5 in the power module, 5 are provided with multiunit bus capacitance on the bus capacitance dilatation board, with through bus capacitance dilatation board is used for carrying out the dilatation to the bus capacitance of power module, the quantity of the bus capacitance on the bus capacitance dilatation board and the specification of electric capacity can be set for according to user's demand by oneself. For example, when the power module is used as a 30KVAR type, the bus capacitor flash board upper 5 does not need to be connected, and when the power module is used as a 50KVAR type, the bus capacitor flash board upper 5 needs to be connected, and the bus capacitor flash board upper 5 is connected through a dc terminal on the power module, thereby ensuring a bus capacitor capacitance value of the power module.
In the technical scheme disclosed in the embodiment of the application, the IGBT module in the power module can be fixed on the side surface of the radiator through screws, and the heat generated by the IGBT module is conducted to the radiator through the substrate to be radiated.
In order to enable the airflow provided by the heat dissipation fan to act on the radiator more effectively, in the scheme, a plurality of baffles can be arranged in the heat dissipation air duct, each side of the radiator is provided with the baffle, the extending direction of the baffles is consistent with the extending direction of the heat dissipation air duct, and under the action of the baffles, more air provided by the heat dissipation fan penetrates through the radiating fins of the radiator as much as possible.
In the present solution, the baffles comprise a first baffle 6 and a second baffle 7;
one side of each radiator is provided with a first baffle; the second baffle is arranged between the first baffles, the second baffle is arranged on one side of the air inlet of the air duct, and the end part of the second baffle is connected with the end part of the first baffle adjacent to the second baffle. The first baffle is an internal acrylic baffle which is close to the radiator, and a gap can be arranged between the first baffle and the radiator for enabling wind to pass through the radiator from the inside of the air duct. The second baffle plate can also be an acrylic plate, is a transverse baffle plate and is used for preventing wind from passing through a gap between the radiators, ensuring that the wind completely enters and exits from the air duct of the radiators and improving the heat dissipation effect.
In the technical scheme disclosed in another embodiment of the present application, one side of the second baffle close to the PCB of the power module is not fully closed, so that part of the wind passes through the surface of the single IGBT tube of the power module, and is radiated by the single tube side surface. Through this kind of wind channel design, guarantee the forced air cooling radiating effect of preferred.
Through the above-mentioned scheme that this application embodiment discloses, through the heat dissipation wind channel that sets up cover body structure, except can guaranteeing the forced air cooling radiating effect, can also play the effect of keeping apart the dust for the dust that the fan blew into is difficult for falling into on the PCB board of power magic clan, thereby has improved the reliability of the PCB circuit of power module.
In the technical solution disclosed in another embodiment of the present application, in order to ensure the reliability of the power module, referring to fig. 1, the power module may further include a current sensor 8 and a temperature sensor, the current sensor is configured to perform current sampling on a current sampling position in the power module, and send the acquired current data to a sampling board of the power module, the current sensor may be a board-level current sensor, and the current sampling cost is reduced by sampling the board-level current sensor. The temperature sensor is used for sampling the temperature of the temperature sampling position in the power module and sending the collected temperature data to the sampling plate of the power module. The temperature sensor may be an NTC temperature sensor. The sampling board carries out fault analysis after obtaining current sampling signal and temperature sampling signal, when breaking down, directly blocks the PWM module in the power module, guarantees that the PWM module can not be because of overflowing with the machine that explodes of excess temperature. The response time can be set to about 20us, which is far shorter than the time for the control system to send out a stop instruction when detecting a fault, thereby ensuring the safe and reliable operation of the power module.
In the above-mentioned solution disclosed in the embodiment of the present application, the power module of 50KVAR shown in fig. 3 can be upwards compatible with the power module of 30KVAR shown in fig. 4 by externally connecting the bus capacitor expansion board and by changing the number of the bus capacitors, the number of the bus capacitors is reduced by reducing two parallel single tubes of the power module of 50KVAR in the prior art to a single tube, and the power module can also be downwards compatible with the power module of 10KVAR shown in fig. 5, so that three output capability schemes can be implemented by using the same power module.
In the existing production process, in order to ensure the product quality, continuous power test is required, a module is taken as an inverter, direct current input and alternating current output are carried out, and the product delivery quality is ensured after the module runs for several hours under the rated working condition. The conventional APF/SVG module has no direct-current side terminal, cannot be connected with a direct-current input end, and is inconvenient or impossible to carry out continuous power test. The direct current side terminal (the terminal used for connecting the bus capacitor expansion board) of the power module can be connected with a direct current input line besides the function of connecting the capacitor expansion board, so that continuous power test can be carried out, and the product delivery quality can be improved.
Corresponding to the device, the application also discloses electronic equipment applying the power module, and the electronic equipment can be applied with any one of the power modules. The electronic device may be a power supply device, a smart terminal device, or the like.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A power module, comprising:
the heat dissipation fan, the heat dissipation air duct and the radiator;
the heat dissipation air duct is arranged in a buckling mode and is of a cover body structure on a PCB of the power module and covers a radiator on the PCB, the heat dissipation air duct is arranged behind the PCB in a buckling mode, the first end of the heat dissipation air duct serves as an air inlet, the second end of the heat dissipation air duct serves as an air outlet, and the air outlet side of the heat dissipation fan is opposite to the air inlet.
2. The power module of claim 1, comprising: the material of the heat dissipation air duct is an acrylic plate.
3. The power module as claimed in claim 1, wherein the power and sampling board and the driving core board of the power module are mounted on the PCB board of the power module by means of insertion.
4. The power module of claim 1, further comprising a bus capacitor flash plate, wherein the bus capacitor flash plate is provided with a plurality of bus capacitors, and the bus capacitor flash plate is configured to flash the bus capacitors of the power module.
5. The power module according to claim 1, further comprising a baffle plate, wherein each side of each heat sink is provided with a baffle plate, and the extension direction of the baffle plate is consistent with the extension direction of the heat dissipation air duct, so that the air output by the heat dissipation fan passes through the heat dissipation fins of the heat sink.
6. The power module of claim 5, wherein the baffle comprises a first baffle and a second baffle;
one side of each radiator is provided with a first baffle;
the second baffle is arranged between the first baffles, and the end part of the second baffle is connected with the end part of the first baffle adjacent to the second baffle.
7. The power module of claim 6, wherein the second baffle plate has a gap of a predetermined height from a PCB of the power module.
8. The power module of claim 1, further comprising:
a current sensor and a temperature sensor;
the current sensor is used for sampling current at a current sampling position in the power module and sending the acquired current data to a sampling plate of the power module;
the temperature sensor is used for sampling the temperature of the temperature sampling position in the power module and sending the collected temperature data to the sampling plate of the power module.
9. An electronic device, characterized in that the power module of any one of claims 1-8 is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123139882.4U CN217308110U (en) | 2021-12-13 | 2021-12-13 | Power module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123139882.4U CN217308110U (en) | 2021-12-13 | 2021-12-13 | Power module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217308110U true CN217308110U (en) | 2022-08-26 |
Family
ID=82920381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123139882.4U Active CN217308110U (en) | 2021-12-13 | 2021-12-13 | Power module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217308110U (en) |
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2021
- 2021-12-13 CN CN202123139882.4U patent/CN217308110U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 311100 Floor 2, Building 1, No. 96, Longchuanwu Road, Donghu Street, Linping District, Hangzhou, Zhejiang Patentee after: Hangzhou Feishide Technology Co.,Ltd. Address before: 311100 2 / F, building 1, No. 96, longchuanwu Road, Donghu street, Yuhang District, Hangzhou City, Zhejiang Province Patentee before: HANGZHOU FIRSTACK TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |