CN220292412U - PCBA module with auxiliary heat dissipation mechanism - Google Patents
PCBA module with auxiliary heat dissipation mechanism Download PDFInfo
- Publication number
- CN220292412U CN220292412U CN202223417635.0U CN202223417635U CN220292412U CN 220292412 U CN220292412 U CN 220292412U CN 202223417635 U CN202223417635 U CN 202223417635U CN 220292412 U CN220292412 U CN 220292412U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- shell
- air
- fan
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 14
- 230000007246 mechanism Effects 0.000 title claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims description 41
- 239000004065 semiconductor Substances 0.000 claims description 14
- 210000003437 trachea Anatomy 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000000428 dust Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 238000005457 optimization Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model discloses a PCBA module with an auxiliary heat dissipation mechanism, which comprises a shell, wherein a cover plate is hinged to the left side of the top of the shell, a PCBA module main body is fixedly connected to the bottom of the inner wall of the shell, through holes are formed in the top of the cover plate and the periphery of the shell, a first fan is fixedly connected to the bottom of the cover plate, a working box is fixedly connected to the bottom of the shell, an air inlet is formed in the right side of the working box, an air pump is fixedly connected to the bottom of the inner wall of the working box, an air inlet valve of the air pump is communicated with the air inlet, a water tank is fixedly connected to the top of the inner wall of the working box, a snake-shaped air pipe is fixedly connected to the inside of the water tank, an air outlet valve of the air pump is communicated with an air inlet of the snake-shaped air pipe, a beryllium copper radiating fin is fixedly connected to the inside of the water tank, and the right side of the beryllium copper radiating fin extends to the right side of the working box. The utility model has the advantages of good heat dissipation effect and dust prevention.
Description
Technical Field
The utility model relates to the technical field of PCBA modules, in particular to a PCBA module with an auxiliary heat dissipation mechanism.
Background
The PCBA board is a printed circuit board assembly and comprises a PCB and electrical components arranged on the PCB, the manufacturing is convenient, the cost is low, a large amount of heat is generated when the electrical components on the PCBA board work and are applied to various electrical appliances, the internal temperature of the equipment rises rapidly, if the heat is not emitted in time, the equipment can continuously heat, the electrical components can lose efficacy due to overheating, and the reliability of the electronic equipment is reduced.
Traditional PCBA module with supplementary cooling mechanism generally dispels the heat to electrical components through connecting extra radiator, and these radiators are mostly by support frame and radiator fan constitution, utilize the radiator fan rotation to produce the air current to increase PCBA module surface's air flow rate, and then reach radiating purpose, this mode can appear following problem when the heat dissipation:
first, this way, dust in the external environment can accumulate on the surface of the PCBA module, thereby impeding the dissipation of the PCBA module temperature.
And secondly, when the temperature of the air near the PCBA module is higher, the temperature of the air flow generated by the radiator at the moment is also higher, and the radiator blows hot air to the PCBA module at the moment.
Disclosure of Invention
In order to solve the problems in the prior art, the utility model aims to provide a PCBA module with an auxiliary heat dissipation mechanism, which has the advantages of good heat dissipation effect and dust prevention.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a PCBA module with supplementary cooling mechanism, includes the shell, the left side at shell top articulates there is the apron, the bottom fixedly connected with PCBA module main part of shell inner wall, the opening has all been seted up around the top of apron and the shell, the first fan of bottom fixedly connected with of apron, the bottom fixedly connected with working tank of shell, the air inlet has been seted up on the right side of working tank, the bottom fixedly connected with air pump of working tank inner wall, the intake valve and the air inlet intercommunication of air pump, the top fixedly connected with water tank of working tank inner wall, the inside fixedly connected with snakelike trachea of water tank, the gas outlet of air pump communicates with the air inlet of snakelike trachea, the inside fixedly connected with beryllium copper fin of water tank, the right side of beryllium copper fin extends to the right side of working tank, the right side of working tank passes through support frame fixedly connected with second fan, the bottom fixedly connected with cooling tank of working tank inner wall, the gas outlet extends to the inside of cooling tank, the inside fixedly connected with semiconductor fin of cooling tank, the gas outlet extends to the inside of cooling tank, the semiconductor fin has the left side to the air outlet through the opening between the left side of cooling tank, the back is provided with the hose.
As the preferable mode of the utility model, the left side of the working box is fixedly connected with a wind bin, the inside of the wind bin is fixedly connected with a third fan, and the right side of the top of the wind bin is provided with an air inlet.
Preferably, the surface of the cooling box is fixedly connected with a heat insulation layer.
Preferably, the surfaces of the first fan, the second fan and the third fan motor are fixedly connected with a protective cover.
As the preferable mode of the utility model, the inside of the cooling box is fixedly connected with a baffle plate, and the top of the baffle plate and the top of the inner wall of the cooling box are fixedly connected with baffle plates.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the PCBA module main body is arranged at the bottom of the inner wall of the shell, then the cover plate is closed by an operator, then the air pump is started, the air pump conveys air in the external environment into the coiled pipe, then the water in the water tank cools the air, then the second fan is started, so that the air flow rate on the surface of the beryllium copper radiating fin is increased, the beryllium copper radiating fin is cooled, the water in the water tank is cooled, then the air enters the cooling box, then the semiconductor radiating fin is started, so that the right side of the semiconductor radiating fin refrigerates, so that the air in the cooling box is cooled, then the first fan is started, so that the low-temperature air is conveyed to the surface of the PCBA module main body, so that the PCBA module main body is cooled, the air flow blown to the surface of the PCBA module main body is ensured to be the lower-temperature air, and the device is provided with a plurality of dustproof nets, so that the air flow is filtered.
2. According to the utility model, the left side of the semiconductor radiating fin can be subjected to cooling treatment by arranging the wind bin and the third fan.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the structure of the present utility model.
In the figure: 1. a housing; 2. a cover plate; 3. a through port; 4. a first fan; 5. a PCBA module body; 6. a working box; 7. an air inlet; 8. an air pump; 9. a water tank; 10. a serpentine trachea; 11. beryllium copper cooling fins; 12. a second fan; 13. a cooling box; 14. a semiconductor heat sink; 15. an air outlet; 16. a wind bin; 17. a third fan; 18. a thermal insulation layer; 19. a partition plate; 20. a baffle; 21. a protective cover; 22. a dust-proof net.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 2, a PCBA module with auxiliary heat dissipation mechanism, which comprises a housing 1, the left side at shell 1 top articulates there is apron 2, the bottom fixedly connected with PCBA module main part 5 of shell 1 inner wall, opening 3 has all been seted up around the top of apron 2 and shell 1, the first fan 4 of bottom fixedly connected with of apron 2, the bottom fixedly connected with work box 6 of shell 1, the air inlet 7 has been seted up on the right side of work box 6, the bottom fixedly connected with air pump 8 of work box 6 inner wall, the intake valve and the air inlet 7 intercommunication of air pump 8, the top fixedly connected with water tank 9 of work box 6 inner wall, the inside fixedly connected with snakelike air pipe 10 of water tank 9, the gas outlet 15 and the air inlet 7 intercommunication of snakelike air pipe 10 of water tank 9, the inside fixedly connected with beryllium copper fin 11, the right side of beryllium copper fin 11 extends to the right side of work box 6, the right side of work box 6 is fixedly connected with second fan 12 through the support frame, the bottom fixedly connected with cooling box 13 of work box 6 inner wall, the gas outlet 15 of snakelike air pipe 10 extends to the inside of cooling box 13, the inside cooling box 13 is fixedly connected with semiconductor fin 14, the inside cooling box 15 is connected with semiconductor fin 15 through the inside of left side 13, the inside cooling box 15 is connected with the air outlet 15 is connected with the back through the semiconductor fin 3, the back is set up through the air outlet 15.
Referring to fig. 1, a wind bin 16 is fixedly connected to the left side of the working box 6, a third fan 17 is fixedly connected to the inside of the wind bin 16, and an air inlet hole is formed in the right side of the top of the wind bin 16.
As a technical optimization scheme of the present utility model, the left side of the semiconductor heat sink 14 can be cooled by the arrangement of the air bin 16 and the third fan 17.
Referring to fig. 1, a thermal insulation layer 18 is fixedly connected to the surface of the cooling tank 13.
As a technical optimization of the present utility model, the heat exchange speed between the inside of the cooling tank 13 and the outside environment can be reduced by the provision of the heat insulating layer 18.
Referring to fig. 1, the surfaces of the motors of the first fan 4, the second fan 12 and the third fan 17 are fixedly connected with a protective cover 21.
As a technical optimization scheme of the present utility model, the protection cover 21 can protect the first fan 4, the second fan 12 and the third fan 17.
Referring to fig. 1, a partition plate 19 is fixedly connected to the inside of the cooling tank 13, and a baffle 20 is fixedly connected to the top of the partition plate 19 and the top of the inner wall of the cooling tank 13.
As a technical optimization scheme of the utility model, the arrangement of the baffle 20 and the baffle 19 can prolong the residence time of the gas discharged from the serpentine pipe 10 in the cooling box 13, thereby cooling the gas flow.
The working principle and the using flow of the utility model are as follows: when the PCBA module body 5 is used, an operator installs the bottom of the inner wall of the shell 1, then the operator closes the cover plate 2, then the air pump 8 is started, the air pump 8 conveys the air in the external environment into the coiled pipe, then the water in the water tank 9 cools the air, then the second fan 12 is started, thereby increasing the air flow rate of the surface of the beryllium copper radiating fins 11, thereby cooling the water in the water tank 9, then the air enters the cooling box 13, then the semiconductor radiating fins are started, the right side of the semiconductor radiating fins 14 refrigerates, thereby cooling the air in the cooling box 13, then the first fan 4 is started, so that the low-temperature air is conveyed to the surface of the PCBA module body 5, thereby cooling the PCBA module body 5, ensuring the air flow blown to the surface of the PCBA module body 5 to be the lower-temperature air, and the PCBA module body 5 is provided with a plurality of dustproof nets 22, thereby filtering the air flow.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. PCBA module with supplementary heat dissipation mechanism, including shell (1), its characterized in that: the utility model discloses a cooling device for the PCB module, including shell (1), air inlet (7) are seted up on the left side at shell (1), the bottom fixedly connected with PCBA module main part (5) at shell (1) inner wall, opening (3) have all been seted up around the top of apron (2) and shell (1), the bottom fixedly connected with first fan (4) of apron (2), the bottom fixedly connected with work box (6) at shell (1), air inlet (7) have been seted up on the right side of work box (6), the bottom fixedly connected with air pump (8) at work box (6) inner wall, the intake valve and air inlet (7) intercommunication of air pump (8), the top fixedly connected with water tank (9) of work box (6) inner wall, the inside fixedly connected with snakelike trachea (10) of water tank (9), the air outlet (15) and air inlet (7) intercommunication of snakelike trachea (10) of air pump (8), the inside fixedly connected with beryllium copper piece (11), the right side of beryllium copper piece (11) extends to work box (6) on the right side, cooling box (6) on the right side is connected with cooling box (13) on the right side fixedly connected with cooling box (6), the air outlet (15) of snakelike trachea (10) extend to the inside of cooling tank (13), the inside fixedly connected with semiconductor fin (14) of cooling tank (13), the left side of semiconductor fin (14) extends to the left side of work box (6), the back of cooling tank (13) is provided with gas outlet (15), through the hose intercommunication between gas outlet (15) and opening (3) at apron (2) top.
2. The PCBA module having an auxiliary heat dissipation mechanism as defined in claim 1, wherein: the left side fixedly connected with wind storehouse (16) of work box (6), the inside fixedly connected with third fan (17) in wind storehouse (16), the inlet port has been seted up on the right side at wind storehouse (16) top.
3. The PCBA module having an auxiliary heat dissipation mechanism as defined in claim 1, wherein: the surface of the cooling box (13) is fixedly connected with a heat insulation layer (18).
4. The PCBA module having an auxiliary heat dissipation mechanism as defined in claim 1, wherein: the surfaces of the motors of the first fan (4), the second fan (12) and the third fan (17) are fixedly connected with a protective cover (21).
5. The PCBA module having an auxiliary heat dissipation mechanism as defined in claim 1, wherein: the inside fixedly connected with baffle (19) of cooling tank (13), the top of baffle (19) and the top of cooling tank (13) inner wall all fixedly connected with baffle (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223417635.0U CN220292412U (en) | 2022-12-20 | 2022-12-20 | PCBA module with auxiliary heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223417635.0U CN220292412U (en) | 2022-12-20 | 2022-12-20 | PCBA module with auxiliary heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220292412U true CN220292412U (en) | 2024-01-02 |
Family
ID=89342082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223417635.0U Active CN220292412U (en) | 2022-12-20 | 2022-12-20 | PCBA module with auxiliary heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220292412U (en) |
-
2022
- 2022-12-20 CN CN202223417635.0U patent/CN220292412U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |