CN220509379U

CN220509379U - A kind of cooling computer case

Info

Publication number: CN220509379U
Application number: CN202322210246.9U
Authority: CN
Inventors: 黄良福
Original assignee: Jiangxi Technical College Of Manufacturing
Current assignee: Jiangxi Technical College Of Manufacturing
Priority date: 2023-08-16
Filing date: 2023-08-16
Publication date: 2024-02-20
Anticipated expiration: 2033-08-16

Abstract

The utility model relates to the technical field of computer cases and discloses a heat-dissipation type computer case, which comprises a shell, wherein air inlets are formed in two sides of the shell, an air inlet fan is fixedly arranged on the inner wall of the air inlet on one side of the shell, an air outlet fan is fixedly arranged on the inner wall of the air inlet on the other side of the shell, a water tank is fixedly arranged at the bottom of the inner wall of the shell, a plurality of through holes are formed in the bottom of the shell, a heat dissipation mechanism is fixedly arranged at the bottom of the shell, and a cooling mechanism is fixedly arranged on one side of the shell.

Description

Heat dissipation type computer case

Technical Field

The utility model relates to the technical field of computer cabinets, in particular to a heat dissipation type computer cabinet.

Background

The case is used as a part of computer accessories and has the main functions of placing and fixing the computer accessories and supporting and protecting the computer accessories. In addition, the computer case has the important function of shielding electromagnetic radiation, and the existing case dissipates heat mainly through an air duct, namely an inlet fan and an outlet fan are arranged in the case, so that the circulation of air in the case is accelerated to take away heat, however, the external environment temperature of the case in summer is higher, and the effect of dissipating heat only through the air duct is poor, so that the heat dissipation type computer case is provided.

Disclosure of Invention

In order to overcome the above-mentioned drawbacks of the prior art, the present utility model provides a heat dissipation type computer case, so as to solve the problem that the heat dissipation effect of the existing computer case in the above-mentioned background art is poor in summer.

The utility model provides the following technical scheme: the utility model provides a heat dissipation type computer machine case, includes the shell, shell both sides all are equipped with the wind gap, shell one side wind gap inner wall fixed mounting has the inlet fan, shell opposite side wind gap inner wall fixed mounting has the outlet fan, shell inner wall bottom fixed mounting has the water tank, a plurality of perforation have been seted up to shell, water tank bottom, equal fixed mounting has the semiconductor refrigeration piece in its perforation, shell bottom fixed mounting has heat dissipation mechanism, shell one side fixed mounting has cooling mechanism, shell one side fixed mounting has the dust filter housing, cooling mechanism is located inside the dust filter housing, cooling mechanism front and back is equipped with water inlet and delivery port respectively, cooling mechanism water inlet fixedly connected with inlet tube, cooling mechanism delivery port fixedly connected with drain pipe, the inlet tube all runs through shell and water tank entering water tank inside with the drain pipe other end, water tank internally mounted has the water pump, water pump output and water piping connection, deposit into in the water tank has the antifreeze cooling liquid.

Further, the semiconductor refrigerating sheet is electrically connected with the switching power supply through the resistor, and the resistor controls the refrigerating temperature of the semiconductor refrigerating sheet to be zero-minus five degrees.

Further, the cooling mechanism comprises a plurality of cuboid plate boxes, two adjacent cuboid plate boxes are communicated through a connecting pipe, and a water inlet and a water outlet of the cooling mechanism are respectively formed in the side walls of the two outermost cuboid plate boxes.

Further, the connecting pipes are arranged at the top ends of the inner side surfaces of the two adjacent cuboid plate boxes.

Furthermore, the cuboid plate box and the connecting pipe are made of copper materials.

Further, cotton cloth is adhered to the outer surface of the water tank, and a collecting box is fixedly arranged at the bottom of the cooling mechanism on one side of the shell.

Further, the heat dissipation mechanism comprises a pallet, a plurality of holes are formed in the bottom of the pallet, heat dissipation fans are fixedly mounted on the inner walls of the holes, copper plates are arranged at the tops of the heat dissipation fans, and the tops of the copper plates are respectively adhered to the hot surfaces of the semiconductor refrigerating sheets.

Further, the water tank is including the box, box top fixed mounting has the apron, the apron top is equipped with the opening that runs through to the bottom, and its opening inner wall fixedly connected with poling, the screw cap has been cup jointed to poling inner wall top screw thread.

The utility model has the technical effects and advantages that:

according to the utility model, the cooling mechanism is arranged on one side of the original inlet fan, when the air outside the case passes through the dust filtering cover and needs to pass through the cooling mechanism, the air is blown into the case through the inlet fan, and the passing air can be cooled rapidly through the cooling mechanism, and then the air flow blown into the case through the inlet fan is cold air flow, so that a good cooling and heat dissipation effect is achieved for the inside of the case, the heat dissipation performance of the case is improved, and the problem of poor heat dissipation effect in summer is avoided.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is an exploded view of the overall structure of the present utility model;

FIG. 3 is a schematic side sectional view of the cooling mechanism of FIG. 2 according to the present utility model;

FIG. 4 is a schematic view of the heat dissipation mechanism of FIG. 2 according to the present utility model;

fig. 5 is a schematic view of the structure of the water tank in fig. 2 according to the present utility model.

The reference numerals are: 1. a housing; 2. an inlet fan; 3. a fan is arranged; 4. a water tank; 5. a cooling mechanism; 6. a water inlet pipe; 7. a drain pipe; 8. a water pump; 9. a heat dissipation mechanism; 10. a semiconductor refrigeration sheet; 11. a dust filter cover; 12. a collection box; 51. a rectangular plate box; 52. a connecting pipe; 91. a pallet; 92. a heat radiation fan; 93. copper plate; 41. a case; 42. a cover plate; 43. a screw cap; 44. and (5) penetrating the pipe.

Detailed Description

The following describes specific embodiments of the present utility model in detail with reference to the drawings.

Referring to fig. 1 and 2, the utility model provides a heat dissipation type computer case, which comprises a housing 1, both sides of the housing 1 are respectively provided with an air port, an air inlet fan 2 is fixedly arranged on the inner wall of the air port on one side of the housing 1, an air outlet fan 3 is fixedly arranged on the inner wall of the air port on the other side of the housing 1, a water tank 4 is fixedly arranged at the bottom of the inner wall of the housing 1, a plurality of through holes are formed in the bottoms of the housing 1 and the water tank 4, a semiconductor refrigerating sheet 10 is fixedly arranged in each through hole, a heat dissipation mechanism 9 is fixedly arranged at the bottom of the housing 1, a cooling mechanism 5 is fixedly arranged on one side of the housing 1, a dust filtering cover 11 is fixedly arranged on one side of the housing 1, the cooling mechanism 5 is positioned in the dust filtering cover 11, a water inlet and a water outlet are respectively arranged on the front side and the back of the cooling mechanism 5, a water inlet pipe 6 is fixedly connected with a water inlet pipe 6, a water outlet 7 is fixedly connected with the water outlet of the cooling mechanism 5, the water inlet pipe 6 and the other end of the water outlet pipe 7 penetrate through the housing 1 and the water tank 4 to enter the water tank 4, a water pump 8 is arranged in the water tank 4, an output end of the water pump 8 is connected with the water inlet 6, a cooling mechanism 5 is connected with the water inlet 6, and a cooling mechanism is fixedly arranged in the water inlet 5 and a water inlet 5.

Referring to fig. 2, the semiconductor refrigeration piece 10 is electrically connected with the switching power supply through a resistor, and the resistor controls the refrigeration temperature of the semiconductor refrigeration piece 10 to be zero to minus five degrees, so that freezing condition of the antifreezing coolant in the water tank 4 is avoided.

Referring to fig. 3, the cooling mechanism 5 includes a plurality of cuboid boxes 51, two adjacent cuboid boxes 51 are communicated through a connecting pipe 52, a water inlet and a water outlet of the cooling mechanism 5 are respectively formed in the side walls of two outermost cuboid boxes 51, after an antifreezing cooling liquid enters one cuboid box 51 through a water inlet pipe 6, the antifreezing cooling liquid can enter the other cuboid box 51 through the connecting pipe 52 until the last cuboid box 51 is discharged through a water outlet pipe 7, at this time, the plurality of cuboid boxes 51 are cooled, and when gas passes through the gaps of the plurality of cuboid boxes 51 and enters the air inlet fan 2, the gas passing through the cooling mechanism 5 has a larger contact surface, so that the gas cooling effect is better.

Referring to fig. 3, the plurality of connection pipes 52 are all positioned at the top end of the inner side surfaces of two adjacent cuboid plate boxes 51, so that the antifreeze coolant can be filled in one cuboid plate box 51 and then can enter the next cuboid plate box 51 through the connection pipes 52.

Referring to fig. 2, the rectangular plate box 51 and the connecting pipe 52 are made of copper, and the copper has good heat conduction property, so that the cooling speed of the rectangular plate box 51 and the connecting pipe 52 is high.

Referring to fig. 2, cotton cloth is adhered to the outer surface of the water tank 4, a collecting box 12 is fixedly installed at the bottom of the cooling mechanism 5 on one side of the shell 1, the influence of condensed water on the inner part of the shell 1 on the outer surface of the water tank 4 can be avoided through the cotton cloth, and when the temperature of the antifreezing cold liquid inside the cooling mechanism 5 is too low, the condensed water generated on the outer surface of the cooling mechanism 5 can be collected through the collecting box 12.

Referring to fig. 4, the heat dissipation mechanism 9 includes a platform 91, a plurality of holes are formed in the bottom of the platform 91, heat dissipation fans 92 are fixedly mounted on inner walls of the plurality of holes, copper plates 93 are respectively disposed on top of the plurality of heat dissipation fans 92, the top of the plurality of copper plates 93 are respectively adhered to hot surfaces of the plurality of semiconductor cooling fins 10, heat of the hot surfaces of the semiconductor cooling fins 10 is absorbed through the copper plates 93, and heat dissipation of the copper plates 93 can be performed through the heat dissipation fans 92.

Referring to fig. 5, the water tank 4 includes a tank body 41, a cover plate 42 is fixedly mounted at the top of the tank body 41, an opening penetrating to the bottom is formed at the top of the cover plate 42, a penetrating pipe 44 is fixedly connected to the inner wall of the opening, a screw cap 43 is screwed on the top end of the inner wall of the penetrating pipe 44, and antifreezing cooling liquid can be quickly added into the water tank 4 through the penetrating pipe 44 by unscrewing the screw cap 43.

The working principle of the utility model is as follows: the air is blown into the shell 1 through the air inlet fan 2, the air in the shell 1 is discharged through the air outlet fan 3, so that an air flue is formed in the shell 1 for radiating, on the basis, the antifreeze cooling liquid is stored in the water tank 4, the antifreeze cooling liquid in the water tank 4 can be refrigerated through the semiconductor refrigerating sheet 10, the heat of the heat surface of the semiconductor refrigerating sheet 10 can be radiated through the radiating mechanism 9, the antifreeze cooling liquid in the water tank 4 is pumped through the water pump 8 and is conveyed into the cooling mechanism 5 through the water inlet pipe 6, the temperature of the cooling mechanism 5 is lowered, the antifreeze cooling liquid in the cooling mechanism 5 can be discharged into the water tank 4 again through the water outlet pipe 7 for water circulation, when the air inlet fan 2 and the air outlet fan 3 are operated, after dust is filtered by the dust filtering cover 11, the outside air is blown into the shell 1 through the air inlet fan 2 after passing through the cooling mechanism 5, the temperature of the antifreeze cooling liquid is lowered, the temperature of the antifreeze cooling liquid can be cooled through the air flow, the air flow can be cooled down rapidly, and the air flow in the case is cooled by the air flow through the cooling mechanism 2 at the time, the air flow in the shell 1 is cold air, and the radiating effect of a case is improved.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. The present utility model is not limited to the above-described embodiments, and the above-described embodiments and descriptions merely illustrate the principles of the utility model, and various changes and modifications may be made therein without departing from the spirit and scope of the utility model, which is defined by the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A heat-dissipating computer case, including a casing (1). Air vents are provided on both sides of the casing (1). An inlet fan (2) is fixedly installed on the inner wall of the air vent on one side of the casing (1). The casing (1) (1) An outlet fan (3) is fixedly installed on the inner wall of the air outlet on the other side. It is characterized in that: a water tank (4) is fixedly installed on the bottom of the inner wall of the housing (1). There are openings at the bottom of the housing (1) and the water tank (4). There are multiple perforations, and semiconductor refrigeration chips (10) are fixedly installed in the perforations. A heat dissipation mechanism (9) is fixedly installed at the bottom of the housing (1), and a cooling mechanism (5) is fixedly installed on one side of the housing (1). ), a dust filter cover (11) is fixedly installed on one side of the housing (1), the cooling mechanism (5) is located inside the dust filter cover (11), and the cooling mechanism (5) is provided with water inlets on the front and back respectively. A water inlet pipe (6) is fixedly connected to the water outlet of the cooling mechanism (5), and a drainage pipe (7) is fixedly connected to the water outlet of the cooling mechanism (5). The water inlet pipe (6) and the drainage pipe (7) The other end penetrates the shell (1) and the water tank (4) and enters the inside of the water tank (4). A water pump (8) is installed inside the water tank (4). The output end of the water pump (8) is connected with the water inlet pipe (6). ) is connected, and the water tank (4) stores antifreeze coolant.

2. A heat-dissipating computer case according to claim 1, characterized in that: the semiconductor refrigeration piece (10) is electrically connected to the switching power supply through a resistor, and the resistor controls the cooling temperature of the semiconductor refrigeration piece (10). from zero degrees to minus five degrees.

3. A heat dissipation type computer case according to claim 1, characterized in that: the cooling mechanism (5) includes a plurality of cuboid plate boxes (51), and two adjacent cuboid plate boxes (51) pass through The connecting pipes (52) are connected, and the water inlet and outlet of the cooling mechanism (5) are respectively opened on the side walls of the two outermost rectangular parallelepiped boxes (51).

4. A heat-dissipating computer case according to claim 3, characterized in that the plurality of connecting pipes (52) are at the top positions of the inner sides of two adjacent rectangular parallelepiped boxes (51).

5. A heat-dissipating computer case according to claim 3, characterized in that: the cuboid box (51) and the connecting tube (52) are made of copper.

6. A heat-dissipating computer case according to claim 1, characterized in that: the outer surface of the water tank (4) is pasted with cotton cloth, and one side of the housing (1) is fixedly installed at the bottom of the cooling mechanism (5). There are collection boxes (12).

7. A heat dissipation computer case according to claim 1, characterized in that: the heat dissipation mechanism (9) includes a pallet (91), and a plurality of holes are provided at the bottom of the pallet (91). Cooling fans (92) are fixedly installed on the inner walls of the plurality of holes. Copper plates (93) are provided on the tops of the plurality of cooling fans (92). The tops of the plurality of copper plates (93) are respectively connected with the plurality of semiconductor refrigeration fins (10). ) hot side paste.

8. A heat-dissipating computer case according to claim 1, characterized in that: the water tank (4) includes a box body (41), and a cover plate (42) is fixedly installed on the top of the box body (41). , the top of the cover plate (42) is provided with an opening penetrating to the bottom, the inner wall of the opening is fixedly connected with a through pipe (44), and the top end of the inner wall of the through pipe (44) is threaded with a threaded cover (43).