CN217305808U

CN217305808U - Radiator structure and computer host comprising same

Info

Publication number: CN217305808U
Application number: CN202220171230.4U
Authority: CN
Inventors: 王其盖; 杨桂芳; 王海芸
Original assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2022-01-21
Filing date: 2022-01-21
Publication date: 2022-08-26
Anticipated expiration: 2032-01-21

Abstract

The application provides a radiator structure, includes first subassembly, second subassembly and the third subassembly that connects gradually along first direction, first subassembly with the third subassembly is used for connecting the RAM card, the second subassembly is used for connecting CPU, first subassembly includes first connecting portion and first radiating part. The second assembly comprises a second connecting part and a second heat dissipation part, and the air inlet side of the second heat dissipation part faces the air outlet side of the first heat dissipation part. The third assembly comprises a third connecting part and a third heat dissipation part, and the third heat dissipation part is arranged at one end of the third heat dissipation part along the second direction. This application has improved the radiating efficiency of radiator through the mode of establishing ties the heat dissipation wind channel of each subassembly, and then has optimized the service environment of CPU and memory. This application provides a host computer simultaneously.

Description

Radiator structure and computer host comprising same

Technical Field

The application relates to the technical field of computer hardware, in particular to a radiator structure and a computer host comprising the same.

Background

In computer hardware, a memory card and a Central Processing Unit (CPU) generate a large amount of heat during operation, which causes temperature rise of related components and affects service performance and life. At present, the fan is usually adopted to dissipate heat, so that the components easy to generate heat are cooled.

However, with the continuous upgrade of computer hardware, the performance of components is gradually improved, the heating efficiency in operation is also higher and higher, and the heat dissipation requirement cannot be met gradually only by the conventional fan heat dissipation.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide a heat sink structure and a computer host including the same to solve the above problems.

The embodiment of the application provides a radiator structure, include first subassembly, second subassembly and the third subassembly that connects gradually along first direction, first subassembly with the third subassembly is used for connecting the memory card, the second subassembly is used for connecting CPU, first subassembly includes first connecting portion and first heat dissipation part, first heat dissipation part is located along the second direction the one end of first connecting portion, first connecting portion are used for connecting the memory card, and follow the second direction, the sectional area of first heat dissipation part is less than first connecting portion. The second direction is disposed at an angle to the first direction.

The second assembly comprises a second connecting part and a second radiating part, the air inlet side of the second radiating part faces the air outlet side of the first radiating part, the second radiating part is arranged on one side of the second connecting part along the second direction, and the second connecting part is used for connecting the CPU. The second heat sink includes a plurality of heat sink fins arranged along the second direction.

The third subassembly includes third connecting portion and third heat dissipation part, the play wind side orientation of second heat dissipation part the air inlet side setting of third heat dissipation part, the third heat dissipation part is followed the second direction is located the one end of third heat dissipation part, the third connecting portion are used for connecting the memory card. The sectional area of the third heat sink member is larger than that of the third connecting member in the second direction.

In a possible embodiment, the second assembly further includes a heat pipe arranged along the second direction, one end of the heat pipe is connected to the second connection portion, and the other end of the heat pipe penetrates through the heat dissipation fin.

In a possible embodiment, the first heat sink part includes a first fan, and an air outlet side of the first fan is disposed toward the first connection part.

In one possible embodiment, the second heat sink part includes a second fan, and the air outlet side of the second fan is disposed toward the third component.

In a possible embodiment, a side of the heat dissipation fin close to the second fan is provided with a recess for enlarging a heat dissipation area.

In one possible embodiment, the third heat sink part includes a third fan, and an air outlet side of the third fan is disposed toward the third connecting part.

In a possible implementation manner, an opening is provided at one end of the third connecting portion, which is far away from the third heat dissipation portion, and the opening is communicated with the third heat dissipation portion and used for exhausting air out of the heat dissipation portion.

The embodiment of the present application further provides a computer host, including the heat sink structure as described above, the heat sink structure is connected with a memory card and a CPU.

In a possible implementation manner, the computer host further includes a fourth fan disposed on a side of the third component facing away from the second component, and a suction direction of the fourth fan is to be drawn out from the side of the third component.

In a possible implementation manner, the host computer further includes a network card interface, which is disposed on a side of the third component away from the third heat sink portion, and the network card interface and the third connecting portion are disposed at an interval.

The radiator structure that this application provided, through with the first, second, third radiating part advance, go out the wind side and correspond the setting in proper order, make first, second, third subassembly form the wind channel of inside series connection, make full use of the inner space of radiator, realized radiating effect's improvement, also reduced the space simultaneously and occupy, have the beneficial effect that high radiating efficiency, low space occupy.

Drawings

Fig. 1 is a schematic structural view of a heat sink structure according to a first embodiment of the present application.

Fig. 2 is a schematic view of the internal structure of the heat sink structure shown in fig. 1.

Fig. 3 is a side view of a second component of the heat sink structure shown in fig. 1.

Fig. 4 is a schematic structural diagram of a heat sink structure in a computer host according to a second embodiment of the present application.

Fig. 5 is a schematic diagram of a heat dissipation direction in the computer host shown in fig. 4.

Description of the main elements

Heat sink structure 100

First assembly 10

First connection part 11

First heat sink member 12

Second component 20

Second connecting part 21

Second heat sink member 22

Heat dissipating fins 221

Depressed portion 2211

Second fan 222

Heat pipe 23

Third assembly 30

Third connecting portion 31

Opening 311

Third heat sink 32

Computer host 200

Fourth fan 300

Network card interface 400

CPU 500

Memory card 600

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus should not be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically, electrically or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1 and 2, a first embodiment of the present application provides a heat sink structure 100, including a first component 10, a second component 20, and a third component 30 sequentially connected along a first direction a, where the first component 10 and the third component 30 are used to connect a memory card 600, the second component 20 is used to connect a CPU 500, the first component 10 includes a first connection portion 11 and a first heat dissipation portion 12, the first heat dissipation portion 12 is disposed at one end of the first connection portion 11 along a second direction B, the first connection portion 11 is used to connect the memory card 600, and a cross-sectional area of the first heat dissipation portion 12 along the second direction B is smaller than that of the first connection portion 11. The second direction B is arranged at an angle to the first direction a.

The second assembly 20 includes a second connecting portion 21 and a second heat sink portion 22, the air inlet side of the second heat sink portion 22 is disposed toward the air outlet side of the first heat sink portion 12, the second heat sink portion 22 is disposed on one side of the second connecting portion 21 along the second direction B, and the second connecting portion 21 is used for connecting the CPU 500 so as to conduct the heat generated by the CPU 500 to the second heat sink portion 22. The second heat sink member 22 includes a plurality of heat sink fins 221 arranged along the second direction B.

The third component 30 includes a third connecting portion 31 and a third heat sink 32, the air outlet side of the second heat sink 22 is disposed toward the air inlet side of the third heat sink 32, the third heat sink 32 is disposed at one end of the third heat sink 32 along the second direction B, and the third connecting portion 31 is used for connecting the memory card 600. The sectional area of the third heat sink member 32 is larger than that of the third connecting member 31 in the second direction B.

It should be explained that the bottom of the first connecting portion 11 can be connected to a plurality of memory cards 600, the bottom of the third connecting portion 31 can be connected to a plurality of memory cards 600, in this embodiment, the first connecting portion 11 and the third connecting portion 31 can be connected to 4 memory cards 600 respectively, and the memory cards 600 are arranged in parallel along the second direction B, so that the airflow can dissipate heat along the same direction.

Since the sectional area of the first heat sink member 11 is larger than the sectional area of the first heat sink member 12 in the first direction a, and the sectional area of the first heat sink member 12 on the air outlet side is smaller than the sectional area of the first heat sink member 11 on the air inlet side, the air pressure on the air outlet side of the first heat sink member 12 is smaller than the air pressure on the air inlet side of the first heat sink member 11 based on the venturi principle, and thus the airflow tends to flow upward from the bottom of the connection member. Similarly, in the second direction B, the sectional area of the second heat sink piece 22 on the side close to the first component 10 is larger than the sectional area of the side close to the third component 30, the air pressure of the air inlet side of the second heat sink piece 22 is smaller than the air outlet side, so that the airflow has a tendency to flow toward the third component 30 from the side of the first component 10, and the sectional area of the third heat sink piece 32 in the first direction a is larger than the third connecting portion 31. As described above, in the entire heat sink structure 100, the airflow flows along the first connection portion 11, the first heat sink portion 12, the second heat sink portion 22, the third heat sink portion 32, and the third connection portion 31 in sequence, and the internal space is fully utilized to dissipate heat, thereby effectively improving the heat dissipation efficiency of the second heat sink portion 22.

Referring to fig. 2 and 3, in an embodiment, the second assembly 20 further includes a heat pipe 23 disposed along the second direction B, one end of the heat pipe 23 is connected to the second connection portion 21, and the other end of the heat pipe 23 penetrates through the heat dissipation fin 221. One end of the heat pipe 23 connected to the second connecting portion 21 is attached to the CPU 500, so as to conduct heat generated during the operation of the CPU 500 to the heat dissipation fins 221, thereby improving the heat dissipation effect on the CPU 500.

In one embodiment, the first heat sink portion 12 includes a first fan, and an air outlet side of the first fan is disposed toward the first connecting portion 11.

In an embodiment, the second heat sink portion 22 includes a second fan 222, and the air outlet side of the second fan 222 faces the third component 30, in this embodiment, the second fan 222 makes the airflow flow from the air outlet side of the first heat sink portion 12 to the air inlet side of the third heat sink portion 32, and the airflow passes through the heat sink fins 221 during the flowing, so that the heat dissipation efficiency of the second heat sink portion 22 is improved.

In one embodiment, a concave portion 2211 is disposed on one side of the heat sink fins 221 close to the second fan 222, and the concave portion 2211 is used for enlarging a heat dissipation area.

In an embodiment, the third heat sink portion 32 includes a third fan, and an air outlet side of the third fan is disposed toward the third connecting portion 31, in the embodiment, the third fan enables air to flow from the air outlet side of the second heat sink portion 22 to the third connecting portion 31, so as to dissipate heat of the memory card 600 connected to the third connecting portion 31.

In an embodiment, an opening 311 is disposed at an end of the third connecting portion 31 away from the third heat sink portion 32, and the opening 311 is communicated with the third heat sink portion 32 for exhausting air from the heat sink portion to improve the heat dissipation efficiency.

Referring to fig. 4, an embodiment of the present invention further provides a computer host 200, including the heat sink structure 100 as above, where the heat sink structure 100 is connected to a memory card 600 and a CPU 500.

Referring to fig. 5, in an embodiment, the computer host 200 further includes a fourth fan 300 disposed on a side of the third component 30 away from the second component 20, and an air inlet side of the fourth fan 300 is disposed toward a side of the third component 30. In this embodiment, the fourth fan 300 is disposed on the housing of the computer host 200, and can draw the airflow flowing in the heat sink structure 100 to the outside of the computer host 200, so as to accelerate the flow rate of the airflow in the heat sink structure 100 and improve the heat dissipation efficiency. In the figure, the dashed arrows indicate the flow direction of the heat dissipation airflow, and the flow direction of the heat dissipation airflow starts from the first connecting portion 11 and flows through the first heat dissipation portion 12, the second heat dissipation portion 22, the third heat dissipation portion 32 and the third connecting portion 31, so that the whole heat dissipation structure 100 is fully cooled, thereby avoiding heat dissipation dead corners and improving heat dissipation efficiency. Meanwhile, a part of the air flows out of the third heat sink 32 through the fourth fan 300, so that the circulation of the air inside and outside the computer host 200 is improved, the internal temperature is effectively reduced, and the heat dissipation efficiency is further enhanced.

In an embodiment, the computer host 200 further includes a network card interface 400 disposed on a side of the third component 30 away from the third heat sink portion 32, and the network card interface 400 and the third connecting portion 31 are disposed at an interval. Because the heat sink structure 100 in this embodiment has excellent heat dissipation efficiency, the distance between the network card interface 400 and the third heat dissipation portion 32 is reduced, and the requirements of each element on temperature can be ensured, thereby achieving the beneficial effect of reducing the occupied space.

It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive.

Although the present application has been described in detail with reference to preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present application.

Claims

1. The utility model provides a radiator structure, includes first subassembly, second subassembly and the third subassembly that connects gradually along first direction, first subassembly with the third subassembly is used for connecting the RAM card, the second subassembly is used for connecting CPU, its characterized in that:

the first assembly comprises a first connecting part and a first heat radiating part, the first heat radiating part is arranged at one end of the first connecting part along a second direction, the first connecting part is used for connecting the memory card, and the sectional area of the first heat radiating part is smaller than that of the first connecting part along the second direction; the second direction is disposed at an angle to the first direction;

the second assembly comprises a second connecting part and a second heat dissipation part, the air inlet side of the second heat dissipation part faces the air outlet side of the first heat dissipation part, the second heat dissipation part is arranged on one side of the second connecting part along the second direction, and the second connecting part is used for connecting the CPU; the second heat sink part comprises a plurality of heat sink fins arranged along the second direction;

the third assembly comprises a third connecting part and a third heat dissipation part, the air outlet side of the second heat dissipation part faces the air inlet side of the third heat dissipation part, the third heat dissipation part is arranged at one end of the third heat dissipation part along the second direction, and the third connecting part is used for connecting the memory card; the sectional area of the third heat sink member is larger than that of the third connecting member in the second direction.

2. The heat sink structure as claimed in claim 1, wherein the second component further comprises a heat pipe arranged in the second direction, one end of the heat pipe being connected to the second connection portion, and the other end thereof penetrating the heat radiation fin.

3. The heat sink structure as claimed in claim 1, wherein the first heat sink portion includes a first fan, and an air outlet side of the first fan is disposed toward the first connection portion.

4. The heat sink structure of claim 1 wherein the second heat sink portion comprises a second fan, the air outlet side of the second fan being disposed toward the third component.

5. The heat sink structure as claimed in claim 4, wherein a side of the heat dissipating fin close to the second fan is provided with a recess for enlarging a heat dissipating area.

6. The heat sink structure as claimed in claim 1, wherein the third heat sink portion includes a third fan, and an air outlet side of the third fan is disposed toward the third connecting portion.

7. The heat sink structure as claimed in claim 1, wherein an opening is disposed at an end of the third connecting portion away from the third heat sink portion, and the opening is communicated with the third heat sink portion for exhausting air out of the heat sink portion.

8. A computer host, characterized by comprising the heat sink structure of any one of claims 1 to 7, wherein the heat sink structure is connected with a memory card and a CPU.

9. The host computer of claim 8, further comprising a fourth fan disposed on a side of the third module facing away from the second module, wherein a suction direction of the fourth fan is drawn from the side of the third module.

10. The host computer of claim 8, further comprising a network card interface disposed on a side of the third component facing away from the third heat sink portion, wherein the network card interface is spaced apart from the third connecting portion.