CN217305808U - Radiator structure and computer mainframe including the same - Google Patents

Abstract

The application provides a radiator structure, includes first subassembly, second subassembly and the third subassembly that connects gradually along first direction, first subassembly with the third subassembly is used for connecting the RAM card, the second subassembly is used for connecting CPU, first subassembly includes first connecting portion and first radiating part. The second assembly comprises a second connecting part and a second heat dissipation part, and the air inlet side of the second heat dissipation part faces the air outlet side of the first heat dissipation part. The third assembly comprises a third connecting part and a third heat dissipation part, and the third heat dissipation part is arranged at one end of the third heat dissipation part along the second direction. This application has improved the radiating efficiency of radiator through the mode of establishing ties the heat dissipation wind channel of each subassembly, and then has optimized the service environment of CPU and memory. This application provides a host computer simultaneously.

Description

Radiator structure and computer mainframe including the same

technical field

The present application relates to the technical field of computer hardware, and in particular, to a radiator structure and a computer host including the same.

Background technique

In computer hardware, a memory card and a CPU (Central Processing Unit, central processing unit) will generate a lot of heat during operation, causing the temperature of related components to rise, affecting performance and life. At present, fans are usually used to dissipate heat, so as to cool the components that are prone to heat.

However, with the continuous upgrading of computer hardware, the performance of components is gradually improved, and the heat generation efficiency in operation is also getting higher and higher, and it is gradually unable to meet the heat dissipation needs only through traditional fan heat dissipation.

Utility model content

In view of the above content, it is necessary to propose a radiator structure and a computer host including the same to solve the above problems.

An embodiment of the present application provides a heat sink structure, including a first component, a second component and a third component connected in sequence along a first direction, the first component and the third component are used for connecting a memory card, the The second component is used for connecting to the CPU. The first component includes a first connection part and a first heat dissipation part, the first heat dissipation part is arranged at one end of the first connection part along the second direction, and the first connection part The part is used for connecting the memory card, and along the second direction, the cross-sectional area of the first heat dissipation part is smaller than that of the first connection part. The second direction is arranged at an angle to the first direction.

The second assembly includes a second connection part and a second heat dissipation part, the air inlet side of the second heat dissipation part is disposed toward the air outlet side of the first heat dissipation part, and the second heat dissipation part is arranged along the second heat dissipation part. The direction is set on one side of the second connection part, and the second connection part is used for connecting the CPU. The second heat dissipation part includes a plurality of heat dissipation fins arranged along the second direction.

The third assembly includes a third connection part and a third heat dissipation part, the air outlet side of the second heat dissipation part is disposed toward the air intake side of the third heat dissipation part, and the third heat dissipation part is arranged along the second heat dissipation part. The direction is set at one end of the third heat dissipation part, and the third connection part is used for connecting the memory card. Along the second direction, the cross-sectional area of the third heat dissipation portion is larger than that of the third connection portion.

In a possible implementation manner, the second component further includes a heat pipe arranged along the second direction, one end of the heat pipe is connected to the second connection portion, and the other end of the heat pipe penetrates the heat dissipation fin.

In a possible implementation manner, the first heat dissipation part includes a first fan, and an air outlet side of the first fan is disposed toward the first connection part.

In a possible implementation manner, the second heat dissipation part includes a second fan, and an air outlet side of the second fan is disposed toward the third component.

In a possible implementation manner, a concave portion is provided on a side of the heat dissipation fin close to the second fan, and the concave portion is used to expand the heat dissipation area.

In a possible implementation manner, the third heat dissipation portion includes a third fan, and an air outlet side of the third fan is disposed toward the third connection portion.

In a possible implementation manner, an end of the third connecting portion away from the third heat dissipation portion is provided with an opening, and the opening communicates with the third heat dissipation portion and is used for air discharge from the heat dissipation portion.

An embodiment of the present application further proposes a computer host, including the above-mentioned radiator structure, where a memory card and a CPU are connected to the radiator structure.

In a possible implementation manner, the computer host further includes a fourth fan disposed on the side of the third component away from the second component, and the suction direction of the fourth fan is from the third component Pull out on one side.

In a possible implementation manner, the computer host further includes a network card interface disposed on a side of the third component away from the third heat dissipation portion, and the network card interface and the third connection portion are arranged at intervals.

The radiator structure proposed in this application, by arranging the air inlet and air outlet sides of the first, second and third heat dissipation parts in sequence, makes the first, second and third components form an internal series air duct, which makes full use of the The internal space of the radiator improves the heat dissipation effect, reduces the space occupation, and has the beneficial effects of high heat dissipation efficiency and low space occupation.

Description of drawings

FIG. 1 is a schematic structural diagram of a heat sink structure according to a first embodiment of the present application.

FIG. 2 is a schematic diagram of the internal structure of the heat sink structure shown in FIG. 1 .

FIG. 3 is a schematic side view of the structure of the second component in the heat sink structure shown in FIG. 1 .

FIG. 4 is a schematic structural diagram of a structure part of a heat sink in a computer host according to a second embodiment of the present application.

FIG. 5 is a schematic diagram of a heat dissipation wind direction in the computer host shown in FIG. 4 .

Description of main component symbols

Heatsink Structure 100

first component 10

first connection part 11

first heat sink 12

Second component 20

second connection part 21

second heat sink 22

cooling fins 221

Recess 2211

second fan 222

hot pipe 23

Third component 30

third connection part 31

Opening 311

third heat sink 32

computer mainframe 200

Fourth fan 300

NIC interface 400

CPU 500

memory card 600

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outer", clockwise, "counterclockwise" The relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore Can not be construed as a limitation to the application. In addition, the terms "first" and "second" are only used for description purposes, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus , the features defined with "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more , unless otherwise specifically defined.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level less than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Referring to FIG. 1 and FIG. 2 , a first embodiment of the present application provides a heat sink structure 100 , including a first component 10 , a second component 20 and a third component 30 connected in sequence along the first direction A. The first component The assembly 10 and the third assembly 30 are used for connecting the memory card 600, the second assembly 20 is used for connecting the CPU 500, the first assembly 10 includes a first connecting part 11 and a first heat dissipation part 12, and the first heat dissipation part 12 is along the second direction B is disposed at one end of the first connection portion 11 , the first connection portion 11 is used for connecting the memory card 600 , and along the second direction B, the cross-sectional area of the first heat dissipation portion 12 is smaller than that of the first connection portion 11 . The second direction B is arranged at an angle to the first direction A.

The second assembly 20 includes a second connection portion 21 and a second heat dissipation portion 22 , the air inlet side of the second heat dissipation portion 22 is disposed toward the air outlet side of the first heat dissipation portion 12 , and the second heat dissipation portion 22 is disposed along the second direction B at the On one side of the second connection part 21 , the second connection part 21 is used to connect the CPU 500 to conduct the heat generated by the CPU 500 to the second heat dissipation part 22 . The second heat dissipation portion 22 includes a plurality of heat dissipation fins 221 arranged along the second direction B. As shown in FIG.

The third assembly 30 includes a third connection portion 31 and a third heat dissipation portion 32 , the air outlet side of the second heat dissipation portion 22 is disposed toward the air intake side of the third heat dissipation portion 32 , and the third heat dissipation portion 32 is disposed along the second direction B on the At one end of the third heat dissipation portion 32 , the third connection portion 31 is used for connecting the memory card 600 . Along the second direction B, the cross-sectional area of the third heat dissipation portion 32 is larger than that of the third connection portion 31 .

It should be explained that, the bottom of the first connecting portion 11 can be connected to a plurality of memory cards 600, and the bottom of the third connecting portion 31 can be connected to a plurality of memory cards 600. In this embodiment, both the first connecting portion 11 and the third connecting portion 31 can be Four memory cards 600 are respectively connected, and the memory cards 600 are arranged in parallel along the second direction B, so that the airflows all dissipate heat in the same direction.

Since the cross-sectional area of the first connecting portion 11 along the first direction A is larger than that of the first heat dissipation portion 12, the cross-sectional area of the air outlet side of the first heat dissipation portion 12 is smaller than the cross-sectional area of the air intake side of the first connection portion 11, Based on the Venturi principle, the air pressure on the air outlet side of the first heat dissipation portion 12 is lower than the air pressure on the air inlet side of the first connecting portion 11 , so the airflow tends to flow upward from the bottom of the connecting portion. Similarly, in the second direction B, the cross-sectional area of the side close to the first component 10 of the second heat dissipation portion 22 is larger than the cross-sectional area of the side close to the third assembly 30 , and the air pressure on the air inlet side of the second heat dissipation portion 22 is smaller than the air pressure on the air inlet side of the second heat dissipation portion 22 . Wind side, so that the air flow from the side of the first component 10 to the third component 30 tends to flow, and the cross-sectional area of the third heat dissipation portion 32 along the first direction A is larger than that of the third connection portion 31 . To sum up, in the whole radiator structure 100, the airflow flows along the first connecting part 11, the first heat dissipation part 12, the second heat dissipation part 22, the third heat dissipation part 32, and the third connecting part 31 in sequence, so as to make full use of the internal The space is used for heat dissipation, thereby effectively improving the heat dissipation efficiency of the second heat dissipation portion 22 .

Referring to FIGS. 2 and 3 , in one embodiment, the second component 20 further includes a heat pipe 23 arranged along the second direction B. One end of the heat pipe 23 is connected to the second connecting portion 21 , and the other end penetrates the heat dissipation fin 221 . One end of the heat pipe 23 connected to the second connection portion 21 is attached to the CPU 500 to conduct the heat generated during the operation of the CPU 500 to the heat dissipation fins 221 to improve the heat dissipation effect of the CPU 500 .

In one embodiment, the first heat dissipation portion 12 includes a first fan, and the air outlet side of the first fan is disposed toward the first connecting portion 11 . In this embodiment, the first fan makes the air flow from the memory card 600 along the first Direction A flows upwards.

In one embodiment, the second heat dissipation portion 22 includes a second fan 222 , and the air outlet side of the second fan 222 is disposed toward the third component 30 . In this embodiment, the second fan 222 makes air flow from the first heat dissipation portion 12 . The air outlet side flows to the air inlet side of the third heat dissipation portion 32 , and the air flow passes through the heat dissipation fins 221 during this period, so that the heat dissipation efficiency of the second heat dissipation portion 22 is improved.

In one embodiment, a concave portion 2211 is formed on the side of the heat dissipation fin 221 close to the second fan 222 , and the concave portion 2211 is used to expand the heat dissipation area.

In one embodiment, the third heat dissipation part 32 includes a third fan, and the air outlet side of the third fan is disposed toward the third connection part 31 . In this embodiment, the third fan makes the air flow from the outlet of the second heat dissipation part 22 The wind side flows to the third connection part 31 to dissipate heat to the memory card 600 connected to the third connection part 31 .

In one embodiment, an opening 311 is provided at one end of the third connecting portion 31 away from the third heat dissipation portion 32 , and the opening 311 communicates with the third heat dissipation portion 32 for air discharge from the heat dissipation portion to improve heat dissipation efficiency.

Referring to FIG. 4 , an embodiment of the present application further provides a computer host 200 , which includes the above heat sink structure 100 , and the heat sink structure 100 is connected with a memory card 600 and a CPU 500 .

Referring to FIG. 5 , in one embodiment, the computer host 200 further includes a fourth fan 300 , which is disposed on the side of the third element 30 away from the second element 20 , and the air inlet side of the fourth fan 300 faces the third element 30 side settings. In this embodiment, the fourth fan 300 is disposed on the casing of the computer host 200 , and can draw the air flowing in the radiator structure 100 to the outside of the computer host 200 , thereby accelerating the airflow in the radiator structure 100 and improving the heat dissipation efficiency. The dashed arrow in the figure indicates the flow direction of the heat dissipation airflow. The airflow direction of the heat dissipation starts from the first connection part 11 and flows through the first heat dissipation part 12 , the second heat dissipation part 22 , the third heat dissipation part 32 and the third connection part 31 . The entire radiator structure 100 conducts sufficient heat dissipation to avoid the occurrence of dead heat dissipation and improve heat dissipation efficiency. At the same time, a part of the wind flows out from the third heat dissipation part 32 through the fourth fan 300, which improves the air circulation inside and outside the computer host 200, effectively reduces the internal temperature, and further enhances the heat dissipation efficiency.

In one embodiment, the computer host 200 further includes a network card interface 400 disposed on a side of the third component 30 away from the third heat dissipation portion 32 , and the network card interface 400 and the third connection portion 31 are spaced apart. Since the heat sink structure 100 in this embodiment has excellent heat dissipation efficiency, the distance between the network card interface 400 and the third heat dissipation part 32 can be reduced while still ensuring the temperature requirements of each element, thereby achieving the beneficial effect of reducing space occupation. .

It will be apparent to those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Accordingly, the embodiments should be considered in all respects to be exemplary, and not restrictive.

The above embodiments are only used to illustrate the technical solutions of the present application and not to limit them. Although the present application has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced. Without departing from the spirit and scope of the technical solutions of the present application.

Claims (10)

1. The utility model provides a radiator structure, includes first subassembly, second subassembly and the third subassembly that connects gradually along first direction, first subassembly with the third subassembly is used for connecting the RAM card, the second subassembly is used for connecting CPU, its characterized in that:

the first assembly comprises a first connecting part and a first heat radiating part, the first heat radiating part is arranged at one end of the first connecting part along a second direction, the first connecting part is used for connecting the memory card, and the sectional area of the first heat radiating part is smaller than that of the first connecting part along the second direction; the second direction is disposed at an angle to the first direction;

the second assembly comprises a second connecting part and a second heat dissipation part, the air inlet side of the second heat dissipation part faces the air outlet side of the first heat dissipation part, the second heat dissipation part is arranged on one side of the second connecting part along the second direction, and the second connecting part is used for connecting the CPU; the second heat sink part comprises a plurality of heat sink fins arranged along the second direction;

the third assembly comprises a third connecting part and a third heat dissipation part, the air outlet side of the second heat dissipation part faces the air inlet side of the third heat dissipation part, the third heat dissipation part is arranged at one end of the third heat dissipation part along the second direction, and the third connecting part is used for connecting the memory card; the sectional area of the third heat sink member is larger than that of the third connecting member in the second direction.

2. The heat sink structure as claimed in claim 1, wherein the second component further comprises a heat pipe arranged in the second direction, one end of the heat pipe being connected to the second connection portion, and the other end thereof penetrating the heat radiation fin.

3. The heat sink structure as claimed in claim 1, wherein the first heat sink portion includes a first fan, and an air outlet side of the first fan is disposed toward the first connection portion.

4. The heat sink structure of claim 1 wherein the second heat sink portion comprises a second fan, the air outlet side of the second fan being disposed toward the third component.

5. The heat sink structure as claimed in claim 4, wherein a side of the heat dissipating fin close to the second fan is provided with a recess for enlarging a heat dissipating area.

6. The heat sink structure as claimed in claim 1, wherein the third heat sink portion includes a third fan, and an air outlet side of the third fan is disposed toward the third connecting portion.

7. The heat sink structure as claimed in claim 1, wherein an opening is disposed at an end of the third connecting portion away from the third heat sink portion, and the opening is communicated with the third heat sink portion for exhausting air out of the heat sink portion.

8. A computer host, characterized by comprising the heat sink structure of any one of claims 1 to 7, wherein the heat sink structure is connected with a memory card and a CPU.

9. The host computer of claim 8, further comprising a fourth fan disposed on a side of the third module facing away from the second module, wherein a suction direction of the fourth fan is drawn from the side of the third module.

10. The host computer of claim 8, further comprising a network card interface disposed on a side of the third component facing away from the third heat sink portion, wherein the network card interface is spaced apart from the third connecting portion.

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