CN217283833U - Anti-gravity heat superconducting plate and heat dissipation module - Google Patents

Abstract

The utility model relates to an anti gravity heat superconducting plate and heat dissipation module is that the horizontal direction heat conduction rate to solving current like product is slower, and the temperature uniformity is relatively poor, the relatively poor technical problem of heat-sinking capability and design. The plate body of the heat superconducting plate is of a composite plate type structure and comprises a first plate and a second plate, one side of the first plate is attached to one side of the second plate, the first plate and one side of the second plate are connected into a whole and provided with a filling port, a heat superconducting pipeline channel is arranged at the attaching position and is a closed pipeline, and heat transfer working medium is filled in the heat superconducting pipeline channel. The structure design key points are that the heat superconducting pipeline channel is formed by stamping grooves which are respectively arranged at the joint and the extension of a first plate and a second plate and are distributed at equal intervals, and the stamping grooves at the joint are mutually communicated and have height difference; the punching groove is a channel of a plate body of the heat superconducting pipeline, which forms a mutual channel of heat transfer working media, and the channels are mutually communicated and have certain small potential difference.

Description

Anti-gravity heat superconducting plate and heat dissipation module

Technical Field

The utility model relates to a board-like heat abstractor is an anti gravity heat superconducting plate and heat dissipation module.

Background

The heat dissipation device is used for quickly dissipating heat in equipment parts such as mechanical equipment, a metal cabinet, a circuit board and the like so as to ensure the normal work of the equipment parts, and comprises a heat dissipation fan, a heat dissipation plate, a cooling tower, a condensate pipe, a heat superconducting plate and the like. The radiator with the heat source arranged above the radiator generally adopts a metal radiator, such as a heat sink, utilizes the linear heat conduction characteristic of metal to transfer heat, has low heat conduction coefficient, but cannot meet the increasing high power density requirements of components such as a CPU, an IGBT and the like. Meanwhile, when a common phase change radiator works, such as an expansion plate, a heat pipe, a VC (polyvinyl chloride) and the like, because of gravity, phase change working media are arranged below channels in the heat dissipation plate, a heat source can effectively transfer heat and dissipate heat only below the heat dissipation plate. For this reason, some of the temperature equalizing plates are designed to adopt an antigravity structure, such as application number 202011047841.X disclosed in chinese patent literature, publication date 2021.07.20, utility model name "inflatable heat equalizing structure capable of resisting gravity"; further, as disclosed in chinese patent document No. 202022178116.8, publication No. 2021.06.11, the name of utility model "antigravity inflation type temperature equalizing plate". However, the products and the like are applied to less heat superconducting plates, have slower heat conduction rate in the horizontal direction, poorer temperature uniformity, lower heat transfer capability in the horizontal direction and poorer heat dissipation capability, and are difficult to expand to the application occasions and ranges of horizontal heat transfer.

Disclosure of Invention

In order to overcome the defects, the utility model aims to provide an anti-gravity heat superconducting plate and a heat dissipation module to the field, so that the horizontal direction heat conduction rate of the existing heat superconducting plate and the heat dissipation module is slower, the temperature uniformity is poorer, the horizontal direction heat transfer capacity is lower, the heat dissipation capacity is poorer, and the technical problems of the application occasion and the range of horizontal heat transfer are difficultly expanded. The purpose is realized by the following technical scheme.

The utility model provides a thermal superconducting plate and heat dissipation module of anti gravity, this thermal superconducting plate's plate body is compound plate formula structure, and the plate body includes first panel and second panel, and one side of first panel is laminated with one side of second panel simultaneously, and one side that first panel and second panel are even as an organic whole is equipped with fills the notes mouth, laminating department is equipped with thermal superconducting pipeline channel, thermal superconducting pipeline channel is closed pipeline, thermal superconducting pipeline channel intussuseption is filled with heat transfer working medium. The heat superconducting pipeline channel is respectively arranged at the joint of the first plate and the second plate and at the extension of the first plate and the second plate, and is provided with stamping grooves distributed at equal intervals, and the stamping grooves at the joint are mutually communicated and have a height difference. The punching groove is a channel of a mutual channel of heat transfer working media formed by the heat superconducting pipeline channels of the plate body, so that the heat superconducting pipeline channels in the plate body are formed to have specific shapes, are mutually communicated and have certain small potential difference.

The punching groove of first panel is the protruding pipeline channel in condensation area, the punching groove of second panel is the protruding pipeline channel in evaporation area, the protruding pipeline channel in condensation area sets up in one side of first panel promptly, the protruding pipeline channel in evaporation area sets up in the second panel opposite side of the protruding pipeline channel symmetry in condensation area, the protruding pipeline channel in condensation area in the middle of the plate body laminates with the protruding pipeline channel stack in evaporation area, heat superconducting pipe way sets up in the protruding one side of the protruding pipeline channel in condensation area and the protruding one side laminating department of the protruding pipeline channel in evaporation area. The heat superconducting pipeline is formed by a blowing process or a stamping welding process, a heat superconducting pipeline channel which has a specific shape and is communicated with each other and has a certain tiny potential difference is formed inside the plate body, and the heat superconducting pipeline channel is divided into an evaporation region convex pipeline channel and a condensation region convex pipeline channel; because after first panel and second panel integrated into one piece, certain little height potential difference is formed to evaporation zone protruding pipeline channel and condensation zone protruding pipeline channel, and the evaporation zone protruding pipeline channel of low potential difference is heated and is evaporated, and the working medium phase transition becomes gaseous, flows to the protruding pipeline channel of condensation zone of height potential difference, and then the condensation becomes liquid and flows back to evaporation zone protruding pipeline channel again, and the week begins the circulation.

The raised pipeline channels in the condensation area of the first plate are formed by circular protrusions at the rectangular grooves and are in hexagonal honeycomb equidistant arrays. The above is a specific structural embodiment of the rectangular groove of the first plate.

The evaporation area protruding pipeline channel of the second plate is formed by circular protrusions at the rectangular groove and is in a hexagonal honeycomb equidistant array. The above is a specific structural embodiment of the rectangular groove of the second plate.

The two sides of the first plate are symmetrically provided with condensation area raised pipeline channels, the middle of the second plate is provided with evaporation area raised pipeline channels, and the evaporation area raised pipeline channels of the plate body are superposed and attached to the condensation area raised pipeline channels on the two sides. The above is another structural embodiment of the first plate and the second plate.

The outer side of the first plate is provided with a heat source, and the outer side of the second plate is provided with fins. The above is a specific embodiment, and the specific heat dissipation is implemented through the heat source and the fins.

The utility model has reasonable structural design, fast heat conduction rate, good temperature uniformity, especially strong horizontal heat transfer capability and various structural forms; it is suitable for being used as a gravity-resistant heat superconducting plate and a heat dissipation module and further improving similar products.

Drawings

Fig. 1 is a schematic perspective view of an embodiment of the present invention, in which a dotted line is a second plate structure.

Fig. 2 is a schematic cross-sectional view of fig. 1, with the framing portion enlarged.

Fig. 3 is a schematic perspective view of a second embodiment of the present invention, in which the dotted line is a second plate structure and a heat source is added.

Fig. 4 is a schematic view of a modified structure of fig. 3, in which fins are added.

Fig. 5 is a schematic diagram of a three-dimensional structure according to an embodiment of the present invention, and the dotted line in the diagram is a second plate structure.

Fig. 6 is a schematic view of a modified structure of fig. 5, in which a heat source is added.

Fig. 7 is a schematic view of a modified structure of fig. 6, with fins added.

Fig. 8 is a schematic diagram of the exploded structure of fig. 7.

Reference numbers and designations: 1. plate body, 101, first panel, 102, second panel, 103, heat superconducting pipe way channel, 104, condensation zone protruding pipeline channel, 105, fill port, 106, evaporation zone protruding pipeline channel, 2, heat source, 3, fin.

Detailed Description

The structure and use of the invention will now be further described with reference to the accompanying drawings.

As shown in fig. 1 and fig. 2, in the first embodiment, the plate body 1 is a composite plate structure, and includes a first plate 101 and a second plate 102, a heat superconducting pipeline channel 103 having a specific shape and a certain small potential difference is formed inside the plate body, the heat superconducting pipeline channel 103 is a closed pipeline, a heat transfer medium is filled in the heat superconducting pipeline channel 103, and the heat superconducting pipeline channel is divided into an evaporation region convex pipeline channel 106 and a condensation region convex pipeline channel 104; after the first plate 101 and the second plate 102 are integrally formed, a certain tiny difference in height is formed between the evaporation area convex pipeline channel 106 and the condensation area convex pipeline channel 104, the evaporation area convex pipeline channel 106 with the difference in height is heated and evaporated, the working medium changes phase into gas, flows to the condensation area convex pipeline channel 104 with the difference in height, is condensed into liquid, and flows back to the evaporation area convex pipeline channel 106, and the liquid circulates around the evaporation area convex pipeline channel.

As an example, the heat transfer medium is a fluid, preferably a gas, or a liquid, or a mixture of a gas and a liquid.

As an example, the heat superconducting pipeline channels 103 are formed by a blowing process or a stamping welding process, and are in a hexagonal honeycomb shape, a crisscross mesh shape, a plurality of U-shapes connected end to end in series, and the shapes of the U-shapes may be a diamond shape, a triangular shape, a circular shape, or a combination of any one or more of the shapes.

As an example, the material of the plate body (i.e., the first plate material 101 and the second plate material 102) should be a material with good thermal conductivity; preferred materials are copper, copper alloys, aluminum alloys, titanium alloys, or any combination of any of the above.

As shown in fig. 3 and fig. 4, in the second embodiment, the plate body 1 and the fins 3 are effectively combined (by gluing, welding, etc.) to form a heat dissipation module, and the heat source 1 is disposed on the heat dissipation module, so that the heat transfer and dissipation capacity is improved when the heat dissipation module is horizontally placed, and the heat dissipation resistance is reduced. As an example, the fins 3 generally adopt natural cooling or air cooling or radiation heat dissipation as a heat dissipation structure, adopt a water cooling manner to dissipate heat, and are provided with a water cooling plate related structure as required, which is not described herein any more.

As shown in fig. 5-8, in the third embodiment, a heat source 1 and 2 fins 3 are effectively combined (glued, welded, etc.) to form a multi-stage heat dissipation module, that is, an evaporation region raised pipeline channel 106 and two condensation region raised pipeline channels 104, so that the bidirectional condensation reflow structure can greatly improve the efficiency of phase-change heat exchange of the working medium, thereby enhancing the heat dissipation capability of the heat dissipation module and reducing the heat dissipation thermal resistance. Meanwhile, the plate body 1 is formed by two or more evaporation area raised pipeline channels 106 and two or more condensation area raised pipeline channels 104, and then is effectively combined with the plurality of fins 3 to form a multistage heat dissipation module, so that the problem of difficulty in heat transfer and heat dissipation when a plurality of heat sources are horizontally arranged above the heat dissipation plate is solved, the junction temperatures of the multistage heat sources are reduced, and the like, and the description is omitted. As an example, the fin 3 generally adopts natural cooling or air cooling or radiation cooling as a heat dissipation structure, adopts a water cooling manner for heat dissipation, and is provided with a water cooling plate related structure as required, which is not described herein again.

Claims (6)

1. A plate body (1) of the anti-gravity heat superconducting plate is of a composite plate type structure and comprises a first plate (101) and a second plate (102), one side of the first plate is attached to one side of the second plate, a filling opening (105) is formed in one side, connected with the second plate, of the first plate, a heat superconducting pipeline channel (103) is arranged at the attaching position, the heat superconducting pipeline channel is a closed pipeline, and heat transfer media are filled in the heat superconducting pipeline channel; the heat superconducting pipeline is characterized in that the heat superconducting pipeline channel (103) is formed by stamping grooves which are respectively arranged at the joint of the first plate (101) and the second plate (102) and extend outwards and are distributed at equal intervals, and the stamping grooves at the joint are mutually communicated and have height difference.

2. The gravity-resistant heat superconducting plate according to claim 1, wherein the stamping groove of the first plate (101) is a condensation region convex pipeline channel (104), the stamping groove of the second plate (102) is an evaporation region convex pipeline channel (106), i.e. the condensation region convex pipeline channel is disposed on one side of the first plate, the evaporation region convex pipeline channel is disposed on the other side of the second plate symmetrical to the condensation region convex pipeline channel, the condensation region convex pipeline channel in the middle of the plate body (1) is overlapped with the evaporation region convex pipeline channel, and the heat superconducting pipeline channel (103) is disposed at the position where the convex side of the condensation region convex pipeline channel is overlapped with the convex side of the evaporation region convex pipeline channel.

3. The gravity-resistant heat superconducting plate according to claim 2, wherein the condensation region convex pipe channels (104) of the first plate (101) are formed by circular protrusions at rectangular grooves in a hexagonal honeycomb equidistant array.

4. The gravity-resistant heat superconducting plate according to claim 2 or 3, wherein the evaporation region convex pipe channels (106) of the second plate (102) are formed by circular protrusions at rectangular grooves in a hexagonal honeycomb equidistant array.

5. The gravity-resistant heat superconducting plate according to claim 2, wherein the first plate (101) is symmetrically provided with condensation region convex pipeline channels (104) on two sides, the second plate (102) is provided with evaporation region convex pipeline channels (106) in the middle, and the evaporation region convex pipeline channels of the plate body (1) are superposed and attached with the condensation region convex pipeline channels on two sides.

6. A heat sink module of a gravity resistant heat superconducting plate according to claim 1, wherein the first plate (101) is provided with a heat source (2) on the outside thereof, and the second plate (102) is provided with fins (3) on the outside thereof.

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