CN217283057U - Photographic sensitive component, camera shooting module and electronic equipment - Google Patents

Abstract

The utility model discloses a photosensitive assembly makes a video recording, photosensitive assembly makes a video recording includes: a carrier plate; the packaging piece is connected with the carrier plate and is provided with a first bearing surface; the through groove is formed on the first bearing surface; the photosensitive chip is arranged on the carrier plate and positioned in the through groove; the optical filter is arranged on the first bearing surface, covers the through groove to form a closed space, and is provided with a second bearing surface, the second bearing surface faces the first bearing surface, and the first bearing surface is connected with the second bearing surface; the channel is positioned in the packaging piece and/or the optical filter and is communicated with the closed space and the external environment; and the filling piece is arranged in the channel and closes the channel, and the filling piece is made of a hydrophobic breathable material. Through set up hydrophobic ventilative material in the passageway, make the sensitization subassembly of making a video recording can satisfy carminative demand, can avoid debris such as granule dust to get into again pollute in the sensitization subassembly of making a video recording the sensitization chip.

Description

Photographic sensitive component, camera shooting module and electronic equipment

Technical Field

The utility model relates to an image device technical field, in particular to photosensitive assembly makes a video recording, module and electronic equipment make a video recording.

Background

When the camera module is assembled, firstly, glue is dispensed on the bracket, then the optical filter is attached to the bracket, then the bracket is assembled on a circuit board with a photosensitive chip, then baking and thermosetting are carried out, and finally, the lens is assembled on the bracket. Because the support, the circuit board and the optical filter form a closed cavity, an air escape hole is required to be arranged on the support for exhausting air, and the cavity is communicated with the external environment through the air escape hole to achieve the balance of air pressure. Before assembling the lens, glue is required to be dotted in the air escape hole to seal the air escape hole.

In order to reduce the height of the camera module, the current support is directly formed on a circuit board by adopting a molding and packaging process, and electronic devices such as gold threads, capacitors and the like are packaged inside the support, so that the space structure of the support is narrow and difficult to set air escape holes.

SUMMERY OF THE UTILITY MODEL

The utility model provides a photosensitive assembly makes a video recording, module and electronic equipment make a video recording can solve the unable carminative problem in bonding back between light filter and the support among the current module of making a video recording.

In order to achieve the above purpose, the utility model provides the following technical scheme:

in a first aspect, a photographic photosensitive assembly is provided, which includes: the device comprises a carrier plate, a photosensitive chip, a packaging piece, an optical filter and a filling piece; the carrier plate comprises a carrier plate top surface and a carrier plate bottom surface which are arranged in a back-to-back manner; the photosensitive chip is provided with a photosensitive surface, the photosensitive chip is arranged on the support plate, and the photosensitive surface and the top surface of the support plate are arranged in the same direction; the packaging piece is provided with the first bearing surface and a through groove formed in the first bearing surface, the through groove penetrates through the packaging piece, the packaging piece is arranged on the top surface of the carrier plate, the first bearing surface and the top surface of the carrier plate are arranged in the same direction, and the through groove is arranged corresponding to the photosensitive chip; the optical filter is provided with a second bearing surface, the optical filter is arranged on the first bearing surface and covers the through groove to form a closed space, the second bearing surface and the first bearing surface are arranged oppositely, the first bearing surface is connected with the second bearing surface, and the light sensing surface of the light sensing chip is positioned in the closed space; the packaging piece and/or the optical filter are/is provided with a channel, and the channel is communicated with the closed space and the external environment; the filling piece is made of hydrophobic breathable material and is arranged in the channel and used for sealing the channel.

The camera shooting photosensitive assembly ensures that the closed space can pass through the channel on the basis of exhausting, and the channel is filled with hydrophobic breathable materials, so that gas can be allowed to pass through, dust can be prevented from entering the channel, and moisture can be prevented from entering the channel.

In some embodiments, the passage opening of the passage connecting with the exterior of the enclosure is located at the first bearing surface.

The through groove is formed on the first bearing surface, so that the first bearing surface is adjacent to the closed space, and the channel opening is arranged on the first bearing surface, which is beneficial to shortening the length of the channel, the structural complexity can be reduced, and the product yield can be improved.

In some embodiments, the first bearing surface is provided with a first concave portion, the second bearing surface is provided with a second concave portion opposite to the first concave portion in the direction perpendicular to the first bearing surface, and the first concave portion and the second concave portion are communicated to form the channel.

By the arrangement, the thickness of the channel in the direction perpendicular to the first bearing surface can be increased, so that the exhaust capacity of the channel is improved, and the condition that the local thickness of a single part is smaller is avoided

In some embodiments, the first bearing surface is provided with a first concave portion, and the first concave portion and the optical filter surround to form the channel; or the second bearing surface is provided with a second concave part, and the second concave part and the packaging piece surround to form the channel.

With the arrangement, when the concave part is positioned on the first bearing surface, the structural complexity of the optical filter can be reduced; when the concave part is positioned on the second carrying surface, the structural complexity of the packaging piece can be reduced, so that other devices or circuits on the carrier plate can be avoided.

In some embodiments, a boss is disposed on the first bearing surface, the boss is spaced from an edge of the through slot, and the step includes a notch, and the notch communicates with the channel.

With such an arrangement, even if the first concave portion or the second concave portion is completely shielded at the interface between the optical filter and the package, the channel can be ensured to be communicated with the external environment.

In some embodiments, the filler is flush with the first bearing surface in a direction perpendicular to the first bearing surface; or, in the direction perpendicular to the first bearing surface, the filling piece is flush with the second bearing surface.

By the arrangement, the assembling flatness of the optical filter when the optical filter is installed on the packaging part can be improved, and in addition, when the optical filter is fixedly connected with the packaging part through glue, the glue does not need to avoid the first concave part or the second concave part.

In some embodiments, the channel comprises at least a portion that is bent.

With this arrangement, the filling member is prevented from moving within the passage in the direction of extension of the passage.

In some embodiments, the channel is a plurality of channels and is symmetrically disposed about the photosensitive chip.

By the arrangement, the stress of the optical filter is balanced in the assembling process, the optical filter is prevented from inclining, and the situation that the optical filter is broken due to uneven stress can also be avoided.

In a second aspect, a camera module is provided, which includes a lens and the above camera photosensitive assembly, and the photosensitive chip is disposed on an image side of the lens.

Compared with the prior art, the camera shooting module has the same advantages as the camera shooting photosensitive assembly, and the description is omitted.

In a third aspect, an electronic device is provided, which includes a housing and the camera module of the second aspect, wherein the camera module is disposed in the housing.

Compared with the prior art, the advantages of the electronic equipment and the camera module are the same, and are not described herein again.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a cross-sectional view of the first embodiment of the camera module of fig. 1 taken along the Y-axis through the optical axis of the lens.

Fig. 3 is a schematic view of an image pickup photosensitive assembly according to a first embodiment of the present application.

FIG. 4 is a cross-sectional view taken along line I-I of the imaging photosensitive assembly of FIG. 3.

Fig. 5 is an exploded view of the imaging photosensitive assembly of fig. 4 in the Z-axis direction.

Fig. 6 is an enlarged view of fig. 5 at H.

Fig. 7 is a schematic view of the image sensing module of fig. 3 with the filter removed.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. As used herein, the terms "left", "right", "upper", "lower", and the like are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

It should be noted that references to "top," "bottom," and other aspects of the present application are made with reference to the orientation of fig. 2, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation, and therefore should not be considered limiting of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 100 may be an electronic product with a camera function, such as a mobile phone, a tablet computer, a notebook computer, a car machine, a point of sale terminal (POS), or a wearable device. The wearable device may be an intelligent bracelet, an intelligent watch, augmented reality (R) glasses, Virtual Reality (VR) glasses, or the like. In the embodiment of the present application, the electronic device 100 is a mobile phone as an example.

For convenience of description, the width direction of the electronic device 100 is defined as an X-axis direction, the length direction of the electronic device 100 is defined as a Y-axis direction, the thickness direction of the electronic device 100 is defined as a Z-axis direction, and the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

In this embodiment, the mobile phone 100 includes a housing 10, a display module 20, a camera module 30, and an image processor 70. The camera module 30 and the image processor 70 are installed in the housing, the display module 20 is installed on one side of the housing, the camera module 30 can be a front camera, one end of the camera is located in a non-display area of the display module 20, the camera can also be a rear camera, and one end of the camera is located on one side of the housing back to the display module 20.

The housing 10 includes a middle frame 11 and a rear cover 12, and the rear cover 12 is fixed to one side of the middle frame 11. The frame 11 and the rear cover 12 may be fixed to each other in an assembling manner, or may be integrally formed structural members. The display module 20 is mounted on one side of the casing 10 opposite to the back cover 12; that is, the display module 20 and the rear cover 12 are fixed to opposite sides of the bezel 11, respectively. The display module 20 is used for operating the mobile phone and displaying an operation interface, pictures or videos.

In the electronic apparatus 100 shown in the embodiment, the camera module 30 is located on a side of the electronic apparatus 100 close to the display module 20, and is used as a front camera module 30 of the electronic apparatus 100. The camera module 30 and the image processor 70 are mounted inside the housing 10 below or at the top of the display module 20. The inside of the housing 10 is the inside of the electronic device 100. The non-display area of the display module 20 is provided with a light-transmitting area 201, and light outside the electronic device 100 can enter the electronic device 100 through the light-transmitting area 201. The camera module 30 is located below the display module 20 and collects light outside the electronic device 100 through the light-transmitting area 201, and forms corresponding image data. The image processor 70 is electrically connected to the camera module 30, and the image processor 70 is configured to obtain image data from the camera module 30 and process the image data. The image data processed by the image processor 70 may be displayed on the display module 20, stored in a built-in memory of the electronic device 100, or stored in a cloud via the electronic device 100.

In other embodiments, the camera module 30 may also be located on a side of the electronic device 100 away from the display module 20, and used as a rear camera module 30 of the electronic device 100. At this time, the rear cover 12 is provided with a camera hole, and the camera module 30 collects light outside the electronic device 100 through the camera hole of the rear cover 12. In other words, the camera module 30 can be used as both the front camera module 30 of the electronic device 100 and the rear camera module 30 of the electronic device 100. Alternatively, the electronic apparatus 100 may include a plurality of (two or more) camera modules 30, at least one camera module 30 serving as a front camera module 30 of the electronic apparatus 100, and at least one camera module 30 serving as a rear camera module 30 of the electronic apparatus 100.

It should be noted that the position of the camera module 30 in the electronic device 100 in fig. 1 is only an optional example, that is, the optical axis of the camera module 30 is parallel to the Z axis. In other embodiments, the optical axis direction of the camera module 30 may also be perpendicular to the Z-axis, which is not specifically limited in this application.

Referring to fig. 2, a cross-sectional view of the camera module of fig. 1 along the Y-axis through the optical axis of the lens according to the first embodiment.

The camera module 30 includes a camera module 40, a lens 50, an auto focus motor 55, an anti-shake motor 60, and a housing 65. The casing 65 serves as a housing of the camera module 30, and the camera photosensitive assembly 40, the lens 50, the auto-focus motor 55, and the anti-shake motor 60 are all mounted in the casing 65.

Specifically, the housing 65 is provided with an accommodating space 651 therein for protection and support. The image capturing photosensitive assembly 40, the lens 50, the auto focus motor 55, and the anti-shake motor 60 are all disposed in the accommodating space 651. The auto-focus motor 55 is fixedly connected to the housing 65, and is disposed around and fixedly connected to the periphery of the lens 50, and the anti-shake motor 60 is disposed between the periphery of the image-capturing photosensitive element 40 and the auto-focus motor 55, so that the image-capturing photosensitive element 40 and the lens 50 and the housing 65 are disposed at an interval. It is understood that the image pickup photosensitive assembly 40 is suspended in the accommodating space 651 by the anti-shake motor 60, and is located at the bottom side of the lens 50 in the Z-axis direction.

The lens 50 is used for receiving an external light signal and imaging on the image pickup photosensitive assembly 40. The autofocus motor 55 is used to drive the lens 50 to move in the Z-axis direction, so as to realize the function of automatically focusing the lens 50 upon acquiring the optical signal. The anti-shake motor 60 is used to drive the image-pickup photosensitive assembly 40 to move in the X-Y direction to counter the effect of shake on the image quality.

The photosensitive assembly 40 of making a video recording that the embodiment of this application provided includes: a carrier plate; the packaging piece is connected with the carrier plate and is provided with a first bearing surface; the through groove is formed on the first bearing surface; the chip is arranged on the carrier plate and is positioned in the through groove; the optical filter is arranged on the first bearing surface, covers the through groove to form a closed space, and is provided with a second bearing surface, the second bearing surface faces the first bearing surface, and the first bearing surface is connected with the second bearing surface; a passage communicating the enclosed space with an external environment; and the filling piece is arranged in the channel and is made of a hydrophobic breathable material.

The photosensitive assembly 40 that makes a video recording that this application is shown is equipped with the passageway, and the passageway intussuseption is filled with hydrophobic ventilative material, can be when toasting the solidification with gas in the enclosure is got rid of, has the dust to pass through during can avoiding again the passageway gets into the enclosure. And need not set up on the support and flee the gas pocket, can reduce the module height of making a video recording, need not occupy the support space again.

The image pickup photosensitive assembly 40 described in the present application will be described in detail with reference to the accompanying drawings by specific embodiments.

Referring to fig. 3 to 5, fig. 3 is a schematic diagram of a photographic photosensitive assembly according to a first embodiment of the present application, fig. 4 is a cross-sectional view taken along line I-I of the photographic photosensitive assembly of fig. 3, and fig. 5 is an exploded view of the photographic photosensitive assembly of fig. 4 in a Z-axis direction.

The image pickup photosensitive assembly 40 includes a carrier 41, a photosensitive chip 43, an electronic component 45, a package 47, and a filter 49. The carrier 41 is used for carrying the photosensitive chip 43, the electronic component 45, the package 47 and the filter 49. The package 47 fixes the photosensitive chip 43 and the electronic component 45 on the carrier 41, the photosensitive chip 43 and the filter 49 are spaced apart from each other, and the photosensitive chip 43 and the electronic component 45 are arranged in parallel.

In the present embodiment, the carrier 41 has a substantially square plate structure and includes an outer frame plate 411 and a bottom plate 412. The outer frame plate 411 is a hard circuit board and includes a first top surface 4111 and a first bottom surface 4112 which are opposite to each other, and a first through groove T1 penetrating through the first top surface 4111 and the first bottom surface 4112 is formed in the middle of the outer frame plate 411; the base 412 is a metal plate, and the base 412 includes a second top surface 4121 and a second bottom surface 4122, it is understood that the first top surface 4111 is a top surface of the carrier and the second bottom surface 4122 is a bottom surface of the carrier. The outer frame plate 411 is stacked on the top side of the bottom plate 412, the first bottom surface 4112 is fixedly connected to the periphery of the second top surface 4121, the outer frame plate 411 provides an electrical connection base, the bottom plate 412 ensures the overall structural strength of the carrier plate 41, and the bottom plate 412 covers one end of the first through slot T1. The first through groove T1 is used for accommodating the photosensitive chip 43, and the overall thickness of the carrier plate 41 and the photosensitive chip 43 after assembly is smaller, which is beneficial to miniaturization design.

In other embodiments, the carrier 41 may also be a single-layer rigid circuit board, and is provided with blind holes for accommodating the photosensitive chips 43, so as to reduce the structural complexity. The above description is only one possible embodiment of the present application, and the present application is not limited thereto.

In the present embodiment, the photosensitive chip 43 is substantially a square plate structure, and the photosensitive chip 43 has a photosensitive surface; the photosensitive chip 43 is mounted in the first through slot T1, has a gap with the outer frame plate 411, and is fixed on the second top surface 4121 of the bottom plate 412; the photosensitive surface is arranged in the same direction as the top surface of the carrier plate, that is, the photosensitive surface is perpendicular to the Z-axis direction and faces the same side as the first top surface 4111; the photo sensor chip 43 is electrically connected to the outer frame plate 411 by a gold wire a, one end of which is connected to the first top surface 4111, and the other end of which is connected to a periphery of the top surface of the photo sensor chip 43. In other embodiments, the gap is not required and is not limiting. The carrier plate 41 may be configured without the bottom plate 412, and only by providing an adhesive in the gap between the photosensitive chip 43 and the outer frame plate 411, so that the chip 43 is fixed in the first through groove T1.

The electronic component 45 is mounted on the first top surface 4111 and electrically connected to the outer frame plate 411. The electronic component 45 may be an electronic device such as a capacitor, a resistor, and a diode, and is not limited herein.

In the embodiment, the package 47 is made of epoxy resin and is directly formed on the top side of the carrier 41 by a molding process, and the gold wire a and the electronic component 45 are both embedded in the package 47, so as to protect the package gold wire a and the electronic component 45. In addition, the use of the molding packaging process is beneficial to reducing the overall thickness of the image pickup photosensitive assembly 40, and is in line with the trend of miniaturization development of current portable devices.

The package 47 has a substantially flat structure and includes a third top surface 471 and a third bottom surface 472 opposite to each other, and a second through groove T2 extending through the third top surface 471 and the third bottom surface 472. The second through groove T2 includes a first sub through groove T21 and a second sub through groove T22 that communicate with each other. In the Z-axis direction, the first sub through groove T21 is formed by the third top surface 471 of the package 47 being recessed toward the third bottom surface 472. The first sub through slot T21 includes a through slot bottom wall 473 and a through slot sidewall 475 surrounding the through slot bottom wall 473. The second sub-through groove T22 penetrates through the through groove bottom wall 473 and the third bottom surface 472 in the Z-axis direction, the first sub-through groove T21 and the second sub-through groove T22 are communicated with the through groove bottom wall 473 and the second through groove T2, and the opening of the second sub-through groove T22 on the through groove bottom wall 473 and the through groove side wall 474 are arranged at an interval so as to flow out the bearing space for the optical filter 49 in the first sub-through groove T21.

The through groove bottom wall 473 specifically refers to the remaining portion of the bottom of the inner wall surface of the first sub through groove T21 after the second sub through groove T22 is formed, and surrounds the second sub through groove T22. In this embodiment, the through-groove bottom wall 473 is the first supporting surface for supporting the optical filter 49. In other embodiments, the optical filter may also be mounted on the third top surface 471, and the third top surface 471 is the first supporting surface.

The third bottom surface 472 is provided with a protrusion 475 at a periphery of the second through groove T2, the protrusion 475 divides the third bottom surface 472 into a first area 472a and a second area 472b, and the first area 472a is a portion between the protrusion 475 and the second through groove T2.

The package 47 is mounted on the carrier 41, the third bottom surface 472 is connected to the first top surface 4111, the third top surface 471 faces away from the outer frame plate 411, the third bottom surface 472 is connected to the outer frame plate 411, and the first through slot T1 is opposite to and communicates with the second through slot T2. The protrusion 475 extends into a gap between the photo chip 43 and the outer frame plate 411 to tightly bond the photo chip 43 and the outer frame plate 411, thereby improving the stability of the overall structure. The first region 472a abuts against and is connected to the periphery of the surface of the photosensitive chip 43 receiving the light, and the second region 472b is connected to the first top surface 4111; the light passes through the first through slot T1 and the second through slot T2 and is incident on the photo sensor chip 43. The light incident to the photo chip 43 is converted into an electrical signal by the photo chip 43, and the photo chip 43 transmits the electrical signal to the image processor 70 to be converted into a digital signal.

The wall surface of the through groove bottom wall 473 is provided with a recess E for exhaust. The recess E is formed by the through groove bottom wall 473 being recessed inward in the Z-axis direction, and the recess E extends to the through groove side wall 474, and one end of the recess E remote from the groove side wall communicates with the second sub through groove T22, which may be understood as the recess E penetrating through the groove side wall of the second sub through groove T22 in the X-axis direction.

Referring to fig. 6 and 7 together, fig. 6 is an enlarged view of fig. 5 at H, and fig. 7 is a schematic structural view of the image capturing photosensitive assembly of fig. 3 with the filter removed.

In one embodiment, the through-slot bottom wall 473 is provided with a boss 476 extending along the Y-axis direction, i.e., in the X-axis direction, the through-slot bottom wall 473 and the boss 476 are arranged in a step-like manner. The partial channel sidewall 474 connects to the boss 476. In this embodiment, two opposite sides of the second through groove T2 are respectively provided with a boss 476, and the two bosses 476 can limit the filter 49 in the X-axis direction, thereby reducing the assembly deviation.

It will also be appreciated that the boss 476 is a portion that is recessed from the third top surface 471 of the enclosure 47, and that the boss 476 is higher in the Z-axis direction than the through groove bottom wall 473 of the first sub-through groove T21. In this embodiment, the boss 476 avoids the recess E, and it is understood that the notch D is provided to divide the boss 476 into two parts, and the recess E extends into the notch D.

In this embodiment, the recessed portion E is a long through groove with a substantially S-shaped structure (two bent portions in the extending direction). The concave portion E may also be an L-shaped structure (having a bend in the extending direction), a linear shape, or other shapes, or may be other shapes other than a strip shape, as long as it is ensured that the enclosed space can be communicated with the external environment through the channel, and the channel can be provided with a hydrophobic air-permeable material, which is not limited herein. It will be appreciated that the recess is a curved elongate through slot.

The recess E may have a curved elongated through groove or a plurality of curved elongated through grooves. In the present embodiment, the recess E includes two elongated through grooves arranged at intervals, that is, a first sub-recess E1 and a second sub-recess E2 which are parallel to each other. The advantage of such a design is that the plurality of recesses E provides both sufficient air flowability and avoids the problem of low local structural stability due to the too wide single through slot.

In the present embodiment, the first sub-concave portion E1 and the second sub-concave portion E2 each have a depth of 0.04mm in the Z-axis direction and a width of 0.2mm in the Y-axis direction, and have a pitch of 0.4mm in the Y-axis direction. The above parameters are only one practicable way and are not limiting to the present application.

The filter 49 is disposed on the through groove bottom wall 473, and the filter 49 covers the second through groove T2 to form a closed space. The filter 49 covers the recess E and surrounds the recess E to form the channel, which communicates the enclosed space with the outside. In this embodiment, the filter 49 is an infrared cut filter for filtering infrared light and only allowing visible light to be incident on the light sensing chip 43, and in other embodiments, the filter 49 may also be an infrared band pass filter.

The filter 49 is a generally flat plate structure, and includes a top filter surface 491 and a bottom filter surface 492 which are opposite to each other, and the bottom filter surface 492 faces the second through groove T2. The periphery of the filter bottom surface 492 is fixedly connected to the through groove bottom wall 473, and closes the groove opening of the second through groove T2 away from the photosensitive chip 43, which can be understood as the filter bottom surface 492 being the second bearing surface. Specifically, the filter bottom surface 492 is stacked on the through-groove bottom wall 473, and the two are fixedly connected by the adhesive b to firmly adhere the filter 49 on the package 47, so as to prevent dust from falling on the photosensitive surface of the photosensitive chip 43. When the camera module is in the baking and curing process stage, water vapor in the colloid b can be gathered in the closed space, original gas in the closed space can expand due to high temperature, the channel can discharge the gas in the closed space to the outside, so that the gas pressure in the closed space is effectively controlled, and the situation that other parts are displaced due to overhigh gas pressure in the closed space is avoided.

The first sub-concave portion E1 and the second sub-concave portion E2 are spaced from each other, so that the filter 49 is prevented from being broken at a position corresponding to the concave portion E due to uneven force applied thereto during assembly. In addition, the boss 476 limits the filter 49 outside the notch D, so as to avoid the recess E from being completely covered by the filter 49, and it can be understood that the recess E in the notch D is a channel port of the channel, which enables the channel to be always communicated with the outside.

In other embodiments, in the case that the notch D is not provided, only the filter 49 needs to keep a distance from the through-groove sidewall 474 and only cover a part of the concave portion E, which can be understood as that the uncovered concave portion E is a channel opening of the channel, so that other parts of the concave portion E still communicate with the outside, and thus it can be ensured that the channel is not completely sealed, and the channel can have an exhaust function.

In other embodiments, the recess E may be disposed on the bottom surface 492 of the filter 49. For example, the concave portion E may be provided to extend in a direction parallel to X-Y, and one end of the concave portion E may penetrate through the peripheral sidewall of the filter 4 and the other end may extend to be connected to the closed space. With this arrangement, the design flexibility can be improved, and the structural complexity of the package 47 can be reduced.

In other embodiments, one concave portion E may be provided on each of the through groove bottom wall 473 and the filter bottom surface 492, and the through groove bottom wall 473 and the filter bottom surface 492 are overlapped in the Z-axis direction, so that the thickness of the passage in the Z-axis direction can be increased, the exhaust capacity of the passage can be increased, and the situation that the local thickness of a single component is slightly smaller can be avoided; the two concave portions E may not completely overlap each other, that is, only a small part of the two concave portions E may overlap each other in the Z-axis direction, so long as the two concave portions E communicate with each other.

In this embodiment, in order to ensure air exhaust and prevent dust from entering the closed space, a filling member c is further disposed in the passage, and the filling member c closes the passage. The filling piece c is made of a hydrophobic breathable material, and can allow air to pass through, prevent dust from entering and prevent moisture from entering. The filler c closes the channel, that is, the filler c fills the inside of the channel or fills at least a certain section of the cross section of the channel in the extending direction of the channel.

In this embodiment, the filling member c is a hydrophobic air-permeable film, and the filling member c is cut into a shape corresponding to the shape of the concave portion E in advance and can be directly placed into the concave portion E. In addition, the thickness of the filler c in the Z direction is 0.04mm, i.e., the thickness of the filler c is the same as the depth of the recess E, which enables the filler c to fill the recess E just flush with the through-groove bottom wall 473. So set up, colloid b can encircle photosensitive chip 43 and paint to leading to groove diapire 473 in succession and need not to dodge concave part E, has reduced the complexity of some glue processes, has improved the roughness that light filter 49 installed on groove diapire 473, and then has improved the yields.

In other embodiments, the filling member c may be a paint having fluidity. The filling member c is poured into the concave part E, and the filling member c and the concave part E are leveled in the Z-axis direction and then cured, so that the filling member with fluidity can meet the design requirements of various shapes of the concave part E.

It should be noted that when the recess E is a curved elongated through groove (having at least one bend), dust can be prevented from directly entering the enclosed space before filling the recess E; in addition, when the filling member c is a hydrophobic and breathable film, the elongated through groove (at least having one bend) with the curved concave portion E prevents the filling member c from moving along the extending direction of the concave portion E, and even if the filling member c is not installed in the concave portion c in a bonding manner, the filling member c does not run out of the channel, thereby greatly reducing the complexity of the assembly process.

In other embodiments, there may be two recesses E, and the cover plate 49 covers the recesses E to form two of the channels. For example, two recesses E are respectively located at two positions of the through groove bottom surface 473 opposing the photosensitive chip 43, or two recesses E are respectively located at two positions of the filter bottom surface 492 opposing the photosensitive chip 43. With such an arrangement, in the process of mounting the optical filter 49 on the groove bottom wall 473, the acting force applied to the optical filter 49 can reach a force balance state, so that the optical filter is not easy to incline or break, and the yield is improved.

The above description is only a part of the examples and embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a sensitization subassembly of making a video recording which characterized in that, sensitization subassembly of making a video recording includes: the device comprises a carrier plate, a photosensitive chip, a packaging piece, an optical filter and a filling piece;

the carrier plate comprises a carrier plate top surface and a carrier plate bottom surface which are arranged in a back-to-back manner;

the photosensitive chip is provided with a photosensitive surface, the photosensitive chip is arranged on the support plate, and the photosensitive surface and the top surface of the support plate are arranged in the same direction;

the packaging piece is provided with a first bearing surface and a through groove formed on the first bearing surface, the through groove penetrates through the packaging piece, the packaging piece is arranged on the top surface of the carrier plate, the first bearing surface and the top surface of the carrier plate are arranged in the same direction, and the through groove is arranged corresponding to the photosensitive chip;

the optical filter is provided with a second bearing surface, the optical filter is arranged on the first bearing surface and covers the through groove to form a closed space, the second bearing surface and the first bearing surface are oppositely arranged, the first bearing surface is connected with the second bearing surface, and the light sensing surface of the light sensing chip is positioned in the closed space;

the packaging piece and/or the optical filter are/is provided with a channel, and the channel is communicated with the closed space and the external environment;

the filling piece is made of hydrophobic breathable material and arranged in the channel and used for sealing the channel.

2. A camera photosensitive assembly according to claim 1, wherein a passage opening of said passage which connects with the exterior of said enclosed space is located on said first bearing surface.

3. A camera photosensitive assembly according to claim 1, wherein the first bearing surface is provided with a first concave portion in a direction perpendicular to the first bearing surface, the second bearing surface is provided with a second concave portion opposite to the first concave portion, and the first concave portion and the second concave portion are communicated to form the passage.

4. The image capturing and sensing assembly of claim 1, wherein the first bearing surface has a first recess, and the first recess and the filter enclose the channel; or

The second bearing surface is provided with a second concave part, the second concave part extends to the peripheral side of the optical filter, the second concave part penetrates through the peripheral side wall of the optical filter, and the second concave part and the packaging piece surround to form the channel.

5. A camera photosensitive assembly according to any one of claims 1 to 4, wherein a boss is provided on the first bearing surface, the boss being spaced from the edge of the through slot, the boss including a gap, the gap communicating with the channel.

6. The image-capturing and image-sensing assembly of claim 4, wherein the filler member is flush with the first bearing surface in a direction perpendicular to the first bearing surface; or, in the direction perpendicular to the first bearing surface, the filling piece is flush with the second bearing surface.

7. A photographic sensitive assembly according to claim 2, wherein at least a portion of the channel is in a folded configuration.

8. A camera photosensitive assembly according to claim 2, wherein said channels are plural and are symmetrically disposed about said photosensitive chip.

9. A camera module comprising a lens and the camera photosensitive assembly according to any one of claims 1 to 8, wherein the photosensitive chip is disposed on an image side of the lens.

10. An electronic device comprising a housing and the camera module of claim 9, wherein the camera module is disposed within the housing.

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