CN217280293U - Preparation production line of chip electronic component - Google Patents
Preparation production line of chip electronic component Download PDFInfo
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- CN217280293U CN217280293U CN202220215677.7U CN202220215677U CN217280293U CN 217280293 U CN217280293 U CN 217280293U CN 202220215677 U CN202220215677 U CN 202220215677U CN 217280293 U CN217280293 U CN 217280293U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a chip electronic component's preparation production line mainly includes that the strap unreels and drive mechanism, paper tape and unreel of sticky tape and drive mechanism, and the sticky tape advances in the paper tape top and both in step and bonds in moulding head department, and moulding head one side is equipped with stamping die, and the strap advances and passes moulding head and stamping die in proper order, and stamping die forms the sheetmetal to the strap punching press, the stamping die lower part is equipped with the removal slider and is used for carrying the sheetmetal, and the sticky tape bonds with the paper tape and carries the sheetmetal through the die mould station, goes up the chip station, heats the soldering tin station, and foot cutting sabot station forms the finished product. The utility model discloses regard as electronic component's single pin with the sheetmetal, the mode that carries is pasted through strap punching press and sticky tape is marchd, and through a series of automated processes such as die mould and chip welding, integration production obtains the finished product, and equipment cost is low, and is efficient.
Description
The technical field is as follows:
the utility model relates to an electronic component production facility technical field refers in particular to a chip electronic component's preparation production line.
Background art:
electronic components such as chip piezoresistors, thermistors, ceramic capacitors and the like are replacing the traditional electronic components encapsulated by epoxy resin in a large number, and the novel chip structure not only can save the installation space, but also is more convenient and firm to install. At present, a single-pin chip electronic component is generally formed by punching pins and then welding the pins and a chip after bending, and the processes are generally completed by a plurality of devices step by step, wherein manual participation is also needed, so that the efficiency is low, the manufacturing cost is high, and no device for integrated production of the chip electronic component is found on the market.
The invention content is as follows:
an object of the utility model is to prior art current situation, provide a chip electronic component's preparation production line, full flow integration automatic production, it is more high-efficient, economic.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model relates to a slice electronic component's preparation production line mainly includes that the strap unreels and drive mechanism, paper tape and unreel of sticky tape and drive mechanism, and the sticky tape advances in the paper tape top and both in step and bonds in moulding head department, and moulding head one side is equipped with stamping die, and the strap advances and passes moulding head and stamping die in proper order, and stamping die forms the sheetmetal to the strap punching press, the stamping die lower part is equipped with the removal slider and is used for carrying the sheetmetal, and the sticky tape bonds with the paper tape and carries the sheetmetal through the die mould station, goes up the chip station, heats the soldering tin station, and foot cutting sabot station forms the finished product.
Furthermore, a magnetic attraction mechanism is arranged on the movable sliding block, and the movable sliding block slides between the rubber pressing head and the stamping die.
Further, the metal belt and the paper belt or the adhesive tape run in a criss-cross manner.
Furthermore, the profiling station presses the middle of the metal sheet downwards to form an L shape, and holes are formed in the metal sheet.
Preferably, the chip feeding station adopts a vibrating disk, and a pushing rod driven by a cylinder and a positioning rod positioned on the metal sheet advancing path are arranged on one side of a discharge port of the chip feeding station.
Furthermore, a tin point station is additionally arranged at a front station of the chip loading station, a tin point is added on the metal sheet through the tin point station, the chip is loaded on the chip loading station and then enters the heating tin soldering station for solidification, and the heating tin soldering station adopts hot air tin soldering.
Furthermore, the adhesive tape and the paper tape are bonded together to carry the metal sheet to pass through an insulating paint feeding station and a drying station which are positioned at the rear stations of the heating and tin soldering station.
Furthermore, a paint groove is arranged in the insulating paint feeding station, a pressing wheel is arranged above the paint groove, the metal sheet which is carried by the adhesive tape and the paper tape and the back surface of the chip which is welded with the metal sheet are pressed down by the pressing wheel, the metal sheet is painted in the paint groove, and finally the metal sheet is solidified in the drying station.
Preferably, the adhesive tape and the paper tape are adhered together to carry the metal sheet to pass through a detection station which is arranged at a front station of the foot cutting and disc loading station.
Further, an assembly tape which advances reversely with the adhesive tape or the paper tape is arranged on one side of the pin cutting and disc loading station, and a material receiving mechanism is arranged between the pin cutting and disc loading station and the assembly tape to convey finished products; the receiving mechanism is specifically a receiving rod driven by a motor and an air cylinder for driving the receiving rod and the motor to move horizontally.
The beneficial effects of the utility model reside in that: the metal sheet is used as a single pin of the electronic element, the electronic element advances in a mode of metal belt stamping and adhesive tape pasting and carrying, and a finished product is obtained through a series of automatic processes such as profiling, chip welding, insulating layer on the back and the like in integrated production of a belt type assembly line, so that manual operation is not needed, and the electronic element is more efficient and economical.
Description of the drawings:
fig. 1 is a schematic structural view relating to the present invention;
fig. 2 is a schematic structural view of a metal sheet stamping and adhesive tape bonding station according to the present invention.
In the above drawings: the automatic soldering and sealing device comprises a gluing head 1, a stamping die 2, a movable sliding block 3, a profiling station 4, a tin dispensing station 5, an upper chip station 6, a heating and soldering station 7, an upper insulating paint station 8, a drying station 9, a foot cutting and disc loading station 10, an assembly belt 11, a material receiving rod 12, a magnetic suction mechanism 31, a pushing rod 61, a positioning rod 62, a paint groove 81, a pressing wheel 82 and a detection station 90.
The specific implementation mode is as follows:
the present invention will be described in further detail with reference to the accompanying drawings.
A production line for manufacturing chip electronic components mainly comprises a metal belt unwinding mechanism and a traction mechanism thereof, and a paper tape and a rubber tape unwinding mechanism and a traction mechanism thereof, wherein the metal belt is provided with a corresponding unwinding mechanism and a corresponding winding mechanism, a guide wheel is arranged in the middle for auxiliary traction, the paper tape and the rubber tape are respectively provided with a corresponding unwinding mechanism, the paper tape and the rubber tape are wound by a unified winding mechanism after being bonded, and the guide wheel is arranged in the middle for auxiliary traction. The metal belt is tin-plated iron belt.
Specifically, referring to fig. 1, the adhesive tape is arranged above the paper tape and the adhesive tape synchronously advances and is bonded at an adhesive pressing head 1, a stamping die 2 is arranged on one side of the adhesive pressing head 1, the metal tape advances to sequentially penetrate through the adhesive pressing head 1 and the stamping die 2, a metal sheet is formed by stamping the metal tape through the stamping die 2, a movable slider 3 is arranged on the lower portion of the stamping die 2 and used for conveying the metal sheet to the adhesive tape and paper tape bonding position, and the adhesive tape and the paper tape are bonded through the adhesive pressing head 1, so that the metal sheet is carried by the adhesive tape and the paper tape through a pressing station 4, a chip feeding station 6, a heating soldering station 7 and a foot cutting and tray loading station 10 to form a finished product.
The glue pressing head 1 is driven by the air cylinder to press from top to bottom, as shown in fig. 2, a bearing rubber track is arranged below the glue pressing head 1, the paper tape and the adhesive tape move above the bearing rubber track, when the punched metal sheet end part is conveyed to the bonding position of the adhesive tape and the paper tape by the movable sliding block 3, the glue pressing head 1 presses downwards to bond the adhesive tape and the paper tape, and meanwhile, the metal sheet end part is clamped and bonded on the paper tape.
Move and be equipped with magnetism on the slider 3 and inhale mechanism 31, magnetism inhales mechanism 31 and can adopt the electro-magnet, stamping die 2 punches to marching by step-by-step strap, and the sheetmetal that is formed by the punching press falls on moving the slider, then magnetism inhales mechanism 31 and adsorbs the sheetmetal, and moves slider 3 and passes through the cylinder drive and slide between moulding head 1 and stamping die 2 to this transports sheetmetal to the bonding position of sticky tape and paper tape, then magnetism inhales mechanism 31 and loses the electricity, moves slider 3 resetting and connects next sheetmetal.
The metal belt and the paper belt or the adhesive tape advance in an up-down crisscross mode, both advance in a stepping mode, and the metal sheets can be uniformly arranged on the paper belt at intervals through the movable sliding block 3 conveyed transversely, so that the progressive construction of each subsequent station is facilitated.
The metal sheet punched by the punching die 2 is strip-shaped, one end of the metal sheet is provided with a wafer, the strip-shaped metal sheet is used as a pin of an electronic element, the wafer can be used for welding a chip in the subsequent process, the front side and the back side of the chip are two poles, the single-pin surface-mounted electronic element formed in the way can be used as a piezoresistor, a thermistor, a ceramic capacitor and the like, one pole of the single-pin surface-mounted electronic element is connected with a PCB through the pin, and the other pole of the single-pin surface-mounted electronic element is connected with the PCB through the front side of the chip.
The metal sheet is pressed by the pressing station 4 mainly driven by an air cylinder, a bearing rail is arranged below the pressing station 4, the pressing station 4 is pressed downwards to the middle of the metal sheet to be L-shaped by utilizing the step position of the bearing rail, and after a chip is welded conveniently, the adhered end part of the metal sheet can be flush with the front surface of the chip as a pin. Meanwhile, the metal sheet is punched synchronously at the pressing station 4, and the hole position can be cut at the subsequent pin cutting and tray loading station 10, so that the end part of the metal sheet as a pin is provided with a semicircular groove, which is beneficial to welding or wire clamping of a PCB (printed circuit board).
The upper chip station 6 adopts a vibrating disk, and a pushing rod 61 driven by a cylinder and a positioning rod 62 positioned on the metal sheet advancing path are arranged on one side of a discharge port of the upper chip station 6. Specifically, the chips are supplied to the positions in place by the upper chip station 6, the pushing rods 61 push the chips to the wafers at the ends of the metal sheets at the corresponding positions, in order to ensure that the chip pushing positions are matched with the wafers, the positioning rods 62 erected above the positions are used for limiting the chip positions, namely when the pushing rods 61 push the chips against the positioning rods 62, the chip positions are matched with the wafers.
The chip can be directly sent to a heating soldering station 7 for soldering on the wafer, and the soldering mode can be used for soldering on the edge of the chip contacted with the wafer. In order to enable welding to be firmer, a tin spot welding station 5 is preferably additionally arranged at a front station of a chip feeding station 6, tin spots are added on a wafer at the end part of a metal sheet through the tin spot welding station 5, particularly, tin can be fed through automatic tin feeding equipment, then the wafer is fed on the chip feeding station 6 and then enters a heating tin welding station 7 for solidification, and the heating tin welding station 7 can adopt hot air tin welding, namely, the tin spots between the wafer and the chip are melted and solidified through hot air to connect the wafer and the chip.
The adhesive tape and the paper tape are bonded to carry the metal sheet to pass through an insulating paint feeding station 8 and a drying station 9, the insulating paint feeding station 8 and the drying station 9 are located at the rear position of the heating tin soldering station 7, and an upper surface sealing insulating layer is provided for the semi-finished product after the metal sheet and the chip are welded. Specifically, a paint groove 81 is arranged in the insulating paint feeding station 8, a pressing wheel 82 is arranged above the paint groove 81, the metal sheet which is carried by the adhesive tape and the paper tape and the back surface of the chip which is welded with the metal sheet are pressed down by the pressing wheel 82, the metal sheet is painted in the paint groove 81, and finally the metal sheet is dried and solidified in the drying station 9 through a high-temperature oven.
In order to ensure that the quality of the formed product is qualified, the adhesive tape and the paper tape are adhered to carry metal sheets to pass through a detection station 90, the detection station 90 is located at a front station of the foot cutting and tray loading station 10, namely, whether the product is qualified or not is detected through the detection station 90 before foot cutting and tray loading, and the product can be manually rejected or rejected through an automatic rejection mechanism if the product is unqualified. The detection station 90 may employ an automatic detector to perform contact detection on the product traveling path, where the automatic detector measures according to the product property, for example, the piezoresistor may detect its current, and the automatic detector is often applied in the prior art and is not described herein again.
The cutting foot tray loading station 10 is mainly characterized in that a cutting foot is carried out by a cutter driven by an air cylinder, the punching position on a metal sheet is cut off, an assembly belt 11 advancing in the reverse direction of an adhesive tape or a paper tape is arranged on one side of the cutting foot tray loading station 10, evenly distributed groove positions are arranged on the assembly belt 11, the assembly belt 11 is dragged by an unreeling and reeling mechanism corresponding to the assembly belt 11, a material receiving mechanism is further configured to convey finished products between the cutting foot tray loading station 10 and the assembly belt 11, and the material receiving mechanism is specifically a material receiving rod 12 driven by a motor and an air cylinder driving the material receiving rod 12 and the motor to translate. The end of the material receiving rod 12 is driven by a cylinder to enter the lower portion of a finished product chip at a corresponding position, after a metal sheet is cut at a pin cutting and tray loading station 10, the finished product falls on the material receiving rod 12, the cylinder resets to drive the material receiving rod 12 to return, then the material receiving rod 12 is driven by a motor to turn downwards, the finished product is placed in a groove position in the assembly belt 11, and the finished product is gradually sent out from the assembly belt 11 and is integrally sealed.
The material receiving rod 12 should be connected with a negative pressure air pipe, so that the end part of the material receiving rod 12 can generate negative pressure, and a finished product can be sucked when the material is received and transferred, so that the transferring position is accurate and smooth.
The present invention has been described in further detail with reference to the specific preferred embodiments, and the technical scope of the present invention is not limited to the contents of the description, and it is apparent to those skilled in the art that modifications and variations can be made in the above description, and all such modifications and variations should fall within the scope of the appended claims.
Claims (10)
1. A production line for manufacturing chip electronic components is characterized in that: mainly include the strap and unreel and drive mechanism, the paper tape unreels and drive mechanism with the sticky tape, and the sticky tape advances in paper tape top and both in step and bonds in moulding head (1) department, and moulding head (1) one side is equipped with stamping die (2), and the strap advances to pass moulding head (1) and stamping die (2) in proper order, and stamping die (2) form the sheetmetal to the strap punching press, stamping die (2) lower part is equipped with movable slider (3) and is used for carrying the sheetmetal, and the sticky tape bonds with the paper tape and carries the sheetmetal through die mould station (4), goes up chip station (6), heating soldering tin station (7), cuts foot sabot station (10) and forms the finished product.
2. The production line for a chip electronic component according to claim 1, characterized in that: the moving sliding block (3) is provided with a magnetic attraction mechanism (31), and the moving sliding block (3) slides between the rubber pressing head (1) and the stamping die (2).
3. The production line for chip electronic components according to claim 1 or 2, characterized in that: the metal belt and the paper belt or the adhesive tape move in a vertical crisscross mode.
4. The production line for a chip electronic component according to claim 1, characterized in that: and the profiling station (4) presses the middle part of the metal sheet downwards to form an L shape, and holes are formed in the metal sheet.
5. The production line for a chip electronic component according to claim 1, characterized in that: the chip feeding device is characterized in that the chip feeding station (6) adopts a vibrating disc, and a pushing rod (61) driven by an air cylinder and a positioning rod (62) positioned on a metal sheet advancing path are arranged on one side of a discharge port of the chip feeding station (6).
6. The production line for chip electronic components according to claim 1 or 5, characterized in that: the tin point soldering method is characterized in that a tin point soldering station (5) is additionally arranged at a front station of the chip mounting station (6), tin points are added on a metal sheet through the tin point soldering station (5), the metal sheet is cured in a heating tin soldering station (7) after a chip is mounted on the chip mounting station (6), and the heating tin soldering station (7) adopts hot air tin soldering.
7. The production line for a chip electronic component according to claim 1, characterized in that: the adhesive tape and the paper tape are bonded together to carry the metal sheet, and the metal sheet passes through an insulating paint feeding station (8) and a drying station (9), wherein the insulating paint feeding station (8) and the drying station (9) are arranged at a post-positioned station of a heating tin soldering station (7).
8. The production line for a chip electronic component according to claim 7, characterized in that: a paint groove (81) is formed in the insulating paint feeding station (8), a pressing wheel (82) is arranged above the paint groove (81), the metal sheet which is carried by the adhesive tape and the paper tape and is advanced, and the back surfaces of the chips welded with the metal sheet are pressed down by the pressing wheel (82), the metal sheet is painted in the paint groove (81), and finally the metal sheet is cured in the drying station (9).
9. The production line for chip electronic components according to claim 1, 7 or 8, characterized in that: the adhesive tape and the paper tape are bonded together to carry the metal sheet, and the metal sheet passes through a detection station (90), and the detection station (90) is located at a front station of the foot cutting and tray loading station (10).
10. The production line for a chip electronic component according to claim 1, characterized in that: an assembly belt (11) which advances reversely with the adhesive tape or the paper tape is arranged on one side of the foot cutting and disc loading station (10), and a material receiving mechanism is arranged between the foot cutting and disc loading station (10) and the assembly belt (11) to convey finished products; the receiving mechanism is specifically a receiving rod (12) driven by a motor and an air cylinder for driving the receiving rod (12) and the motor to move horizontally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220215677.7U CN217280293U (en) | 2022-01-26 | 2022-01-26 | Preparation production line of chip electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220215677.7U CN217280293U (en) | 2022-01-26 | 2022-01-26 | Preparation production line of chip electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217280293U true CN217280293U (en) | 2022-08-23 |
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ID=82901731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220215677.7U Active CN217280293U (en) | 2022-01-26 | 2022-01-26 | Preparation production line of chip electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217280293U (en) |
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2022
- 2022-01-26 CN CN202220215677.7U patent/CN217280293U/en active Active
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