CN217214714U - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN217214714U CN217214714U CN202220709301.1U CN202220709301U CN217214714U CN 217214714 U CN217214714 U CN 217214714U CN 202220709301 U CN202220709301 U CN 202220709301U CN 217214714 U CN217214714 U CN 217214714U
- Authority
- CN
- China
- Prior art keywords
- light emitting
- emitting chip
- supply line
- power supply
- display module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The application provides a display module and a display device, relates to the technical field of display, and is used for solving the technical problems of complex packaging process and high cost of the existing Mini LED display module; the printed circuit board comprises a first bearing surface, the driving wafer and the LED light-emitting chips are arranged on the first bearing surface and are packaged on the printed circuit board through the packaging layer; and each LED light-emitting chip is respectively in signal connection with a driving wafer, and the driving wafer is used for controlling the LED light-emitting chips to emit light. According to the display module and the display device, the LED light-emitting chips and the driving wafers are arranged on the first bearing surface of the printed circuit board, and the light-emitting chips and the driving wafers can be packaged together in an integrated packaging mode, so that the packaging process of the display module is simplified, and the packaging cost is saved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
A Mini Light Emitting Diode (Mini LED) display device has significant advantages in brightness, contrast, color reduction capability, and the like, and is widely applied to an ultra-large-sized display device.
The Mini LED display device comprises electronic components such as a printed circuit board, LED light-emitting chips, a driving wafer, a resistor, a capacitor and the like, wherein the printed circuit board comprises a lamp surface and a driving surface which are oppositely arranged, the LED light-emitting chips are arranged on the lamp surface of the printed circuit board, and the electronic components such as the driving wafer, the resistor, the capacitor and the like are arranged on the driving surface of the printed circuit board.
However, the driving wafer needs to be packaged before being connected to the printed circuit board, and the LED light emitting chips also need to be packaged after being connected to the printed circuit board, which makes the Mini LED display module package more complicated.
SUMMERY OF THE UTILITY MODEL
In view of the foregoing problems, embodiments of the present application provide a display module and a display device, which can reduce the difficulty in packaging a Mini LED display module, so as to save the manufacturing cost of the display module.
In order to achieve the above object, the embodiments of the present application provide the following technical solutions:
a first aspect of the embodiments of the present application provides a display module, which includes a printed circuit board, a driving wafer, a packaging layer, and a plurality of LED light emitting chips; the printed circuit board comprises a first bearing surface, the driving wafer and the LED light-emitting chips are arranged on the first bearing surface and are packaged on the printed circuit board through the packaging layer; and each LED light-emitting chip is respectively in signal connection with the driving wafer, and the driving wafer is used for controlling the LED light-emitting chips to emit light.
By the arrangement, the LED light-emitting chip and the driving wafer are arranged on the first bearing surface of the printed circuit board, and the packaging layer can package the LED light-emitting chip and the driving wafer. The light-emitting chip and the driving wafer can be packaged together in an integrated packaging manner; the driving wafer does not need to be packaged independently, so that the packaging process of the display module is simplified, the packaging carrier plate, the plastic package material and the packaging test process of the driving wafer are saved, and the manufacturing cost of the display module is saved.
Moreover, the circuit on the printed circuit board can be simplified, the number of laser drilling or preset blind holes on the circuit board is reduced, the layer number and the specification of the printed circuit board are reduced, the processing difficulty of the board level of the board layer is reduced, the yield is greatly improved, and the manufacturing cost of the printed circuit board can be reduced.
In some embodiments of the present application, the plurality of LED light emitting chips are arranged on the first carrying surface in an array; the printed circuit board is provided with a plurality of power supply line groups, each power supply line group comprises a plurality of power supply lines, and each power supply line group is used for supplying current to the LED light-emitting chips located on the same row or the same column.
In some embodiments of the present application, the plurality of LED light emitting chips include a red light emitting chip, a green light emitting chip, and a blue light emitting chip; each of the supply line groups includes a first supply line, a second supply line, a third supply line, and a common supply line; one electrode of each of the red light emitting chip, the green light emitting chip and the blue light emitting chip is connected with the common power supply line; the other electrode of the red light emitting chip is in communication with the first power supply line, the other electrode of the green light emitting chip is in communication with the second power supply line, and the other electrode of the blue light emitting chip is in communication with the third power supply line.
In some embodiments of the present application, the first supply line, the second supply line, the third supply line, and the common supply line are provided with a circuit pad, respectively; the driving wafer is provided with electrode bonding pads which correspond to the circuit bonding pads one to one; the printed circuit board is provided with a plurality of welding wires, one ends of the welding wires are connected with the electrode bonding pads, and the other ends of the welding wires are connected with the circuit bonding pads.
In some embodiments of the present application, a first driving wafer, a second driving wafer, a third driving wafer and a fourth driving wafer are disposed on the first carrying surface; the electrode pad of the first driving wafer is connected with the circuit pad in the common power supply line through the bonding wire; the electrode pad of the second driving wafer is connected with the circuit pad in the first power supply line through the bonding wire; the electrode pad of the third driving wafer is connected with the circuit pad in the second power supply line through the bonding wire; the electrode pad of the fourth drive wafer is connected with the circuit pad in the third power supply line through the bonding wire; preferably, the first carrying surface is provided with a transfer pad, and the transfer pad is located between each electrode pad and the corresponding circuit pad, and is connected in series through the bonding wire.
In some embodiments of the present application, the red light emitting chip, the green light emitting chip, and the blue light emitting chip are all normally mounted chips; or the red light emitting chip, the green light emitting chip and the blue light emitting chip are all flip chips; or the red light emitting chip is a normally-installed chip, and the green light emitting chip and the blue light emitting chip are flip chips.
In some embodiments of the present application, the printed circuit board is provided with a die attach pad for fixing each of the LED light emitting chips; when the red light emitting chip is a normally-installed chip, silver adhesive is arranged between the red light emitting chip and the die bonding pad and is connected together through the silver adhesive; when the green light emitting chip and the blue light emitting chip are positively mounted chips, insulating glue is arranged among the green light emitting chip, the blue light emitting chip and the die bonding pad and is connected together through the insulating glue; when the red light emitting chip, the green light emitting chip and the blue light emitting chip are flip chips, solder paste is arranged among the red light emitting chip, the green light emitting chip, the blue light emitting chip and the die bonding pad and is connected together through the solder paste.
In some embodiments of the present application, the bonding wire and the first power supply line, the second power supply line, the third power supply line and the common power supply line are one or a combination of a gold wire, a copper wire, a palladium copper wire, a silver wire and a gold silver alloy wire, respectively.
In some embodiments of the present application, the printed circuit board further includes a second carrying surface opposite to the first carrying surface; the display module further comprises a board-to-board connector arranged on the second bearing surface, and the board-to-board connector is connected to the circuit of the printed circuit board.
In some embodiments of the present application, the printed circuit board is a four-layer through-hole board or a double-sided board. According to the arrangement, compared with a printed circuit board adopting six layers of one stage, six layers of two stages or eight layers of two stages in the related art, as the driving wafer and the LED light-emitting chips are arranged on the first bearing surface, the internal circuits of the printed circuit board are greatly reduced, the processing difficulty of the board layer and the board stage is reduced, the yield is greatly improved, and the manufacturing cost of the printed circuit board is reduced, so that the manufacturing cost of the display module is reduced.
A second aspect of the embodiments of the present application provides a display device, which includes a frame, a back plate, and a plurality of display modules described in the first aspect; the back plate is arranged on the surrounding frame and forms an installation space of the display module; the display modules are arranged in the installation space in an array mode, the backboard is provided with a power supply module, and the power supply module is electrically connected with the display modules.
In addition to the technical problems solved by the embodiments of the present disclosure, the technical features constituting the technical solutions, and the advantages brought by the technical features of the technical solutions described above, other technical problems that can be solved by the display module and the display device provided by the embodiments of the present disclosure, other technical features included in the technical solutions, and advantages brought by the technical features will be further described in detail in the detailed description.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is an exploded schematic view of a display device provided in an embodiment of the present application;
fig. 2 is a top view of a display module according to an embodiment of the present disclosure;
FIG. 3 is an enlarged view of the point A in FIG. 1;
FIG. 4 is a schematic view illustrating the connection between a driver wafer and die attach pads according to an embodiment of the present invention;
fig. 5 is a first schematic view illustrating the installation of a red light emitting chip, a green light emitting chip, and a blue light emitting chip according to an embodiment of the present application;
fig. 6 is a second schematic view illustrating the installation of a red light emitting chip, a green light emitting chip, and a blue light emitting chip according to an embodiment of the present disclosure.
Description of reference numerals:
10-a printed circuit board;
11-die bond pad; 12-a circuit pad; 13-a relay pad;
20-driving the wafer;
21-electrode pads; 201-a first driver wafer; 202-a second drive wafer; 203-a third drive wafer; 204-fourth drive wafer;
30-LED light emitting chips;
31-red light emitting chip; 32-green light emitting chip; 33-a blue light emitting chip;
40-supply line group;
41-a first supply line; 42-a second supply line; 43-a third supply line; 44-common supply line;
50-welding line;
100-a display device;
110-a display module;
120-a back-plate;
130-a power supply module;
140-surrounding frame.
Detailed Description
As described in the background art, the Mini LED display module in the related art is complicated in packaging, which results in a problem of high manufacturing cost of the Mini LED display module, and the inventors have found that the reason for the problem is:
the Mini LED display module comprises a printed circuit board, an LED light-emitting chip, a driving wafer, a resistor, a capacitor and other electronic components, wherein the printed circuit board comprises a lamp surface and a driving surface which are arranged oppositely; the LED light-emitting chip is arranged on the lamp surface of the printed circuit board, and the LED light-emitting chip is required to be packaged in an integrated manner after being installed on the printed circuit board. Therefore, the whole manufacturing process of the LED display module needs two times of packaging, the packaging process is complex, and the packaging cost is high.
In order to solve the technical problems, the embodiment of the application provides a display module and a display device, the driving wafer and the LED light-emitting chips are mounted on the first carrying surface (lamp surface) of the printed circuit board, and after the driving wafer and the LED light-emitting chips are mounted, the LED light-emitting chips and the driving wafer can be packaged by only performing a packaging process once, so that the packaging process of the display module is simplified, the packaging carrier plate, the plastic package material and the packaging test process of the driving wafer can be saved, and the manufacturing cost of the display device is saved.
In order to make the aforementioned objects, features and advantages of the embodiments of the present application more comprehensible, embodiments of the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1, the present embodiment provides a display device 100, the display device 100 is a Mini LED display device, the Mini LED is also called a sub-millimeter Light Emitting Diode, and the pixel size of the Mini LED is between a Light Emitting Diode (LED) and a Micro LED.
The display device 100 in the embodiment of the present application may be a television, and the display device 100 includes a back plate 120, a power module 130, a frame 140, and a plurality of display modules 110, wherein the power module 130 is disposed on the back plate 120, and the power module 130 is electrically connected to each display module 110, and is configured to provide current to each display module 110. The back plate 120 is installed on the back of the surrounding frame 140, and the back plate 120 and the surrounding frame 140 form an installation space of the display module 110; the plurality of display modules 110 may be arranged in an array in the installation space; for example, the display module 110 may be mounted on the enclosure frame 140, and the display module 110 forms a display surface on the front surface of the enclosure frame 140, so that the display device 100 can display a screen when each display module 110 is turned on.
As shown in fig. 2 to 4, the display module 110 provided in the embodiment of the present disclosure includes a Printed Circuit Board 10 (PCB for short), a driving wafer 20 disposed on the PCB, a plurality of LED light emitting chips 30, a packaging layer, and other electronic components.
The printed circuit board 10 includes a first carrying surface and a second carrying surface opposite to each other, the first carrying surface may be a lamp surface of the printed circuit board 10, and the second carrying surface may be a driving surface of the printed circuit board 10. The driving wafer 20 is disposed on the first carrying surface, for example, the printed circuit board 10 is provided with a die bonding pad 11 for fixing the driving wafer 20, and the driving wafer 20 can be fixed on the die bonding pad 11 by an insulating adhesive or a silver adhesive. The driving wafer 20 is provided with a driving circuit therein, and is in signal connection with each LED light-emitting chip 30 through the driving circuit to control the LED light-emitting chips 30 to be turned on. It should be noted that, in the embodiment of the present application, the driving wafer 20 controls the light emitting amount of the LED light emitting chips 30 according to the scanning number of the printed circuit board 10.
The plurality of LED light emitting chips 30 in the embodiment of the present application are disposed on the first carrying surface, and the LED light emitting chips 30 are not only connected to the circuit on the printed circuit board 10 to access the current, but also connected to the driving circuit of the driving wafer 20, so that the driving wafer 20 controls the LED light emitting chips 30 to emit light.
In the embodiment of the present application, the LED light emitting chip 30 and the driving wafer 20 are both disposed on the first carrying surface of the printed circuit board 10, that is, the LED light emitting chip 30 and the driving wafer 20 are both disposed on the same side of the printed circuit board 10, and the package layer can package the LED light emitting chip and the driving wafer 20 together. Therefore, after the LED light emitting chips 30 and the driving wafer 20 are mounted on the printed circuit board 10, the display module 110 may be integrally packaged, for example, the display module 110 may be packaged by using epoxy resin, silicone resin, modified resin or ultraviolet curing glue (UV light curing glue), so as to complete the integrated packaging of the LED light emitting chips 30 and the driving wafer 20.
With such an arrangement, compared with the related art in which the driving wafer 20 and the LED light emitting chip 30 are respectively disposed on two sides of the printed circuit board 10, and the driving wafer 20 and the LED light emitting chip 30 need to be packaged respectively, in the embodiment of the present application, the display module 110 can be packaged in an integrated manner, so that the packaging process of the display module 110 is simplified, and the packaging carrier, the molding compound, and the packaging test process of the driving wafer 20 can be saved, thereby saving the manufacturing cost of the display device 100.
Moreover, the driving wafer 20 and the LED light emitting chips 30 are arranged on the same side of the printed circuit board 10 in the embodiment of the present application, so that the internal circuit on the printed circuit board 10 can be simplified, the number of laser holes or preset blind holes on the printed circuit board is reduced, the processing difficulty of the board level of the board layer is reduced, the yield is greatly improved, and the manufacturing cost of the printed circuit board is reduced accordingly, thereby reducing the manufacturing cost of the display module.
For example, the printed circuit board 10 of the embodiment of the present application may be a four-layer through hole board or a double-sided board, and compared with the printed circuit board 10 in the related art that six layers, one step, six layers, two steps or eight layers, two steps are adopted, the cost of the printed circuit board 10 can be reduced in the embodiment of the present application, so that the manufacturing cost of the display module 110 is reduced, and the cost of the printed circuit board 10 is reduced.
To sum up, the display module provided by the embodiment of the present application arranges the driving wafer 20 and the LED light emitting chips 30 at the same side of the printed circuit board 10, which not only can save the packaging cost of the display module 110, but also can select the printed circuit board 10 with lower cost to reduce the manufacturing cost of the display module, so that the Mini LED display device has more competitive advantages in the large-space display device market than the conventional small-space LED display device.
On the basis of the above embodiments, the plurality of LED light emitting chips 30 in the embodiments of the present application are arranged on the first carrying surface in an array, that is, the plurality of LED light emitting chips 30 are arranged on the first carrying surface in rows and/or columns. The power supply circuit on the printed circuit board 10 includes a plurality of power supply line groups 40, that is, a plurality of power supply line groups 40 are disposed on the first carrying surface, and each power supply line group 40 is used for supplying current to the LED light emitting chips 30 located in the same row or the same column.
Referring to fig. 2 and 3, the embodiment of the present application is described by taking an example that a plurality of LED light emitting chips 30 are arranged on a first carrying surface in a plurality of rows. Specifically, the first carrying surface is provided with a plurality of groups of power supply lines 40 along a first direction (a length direction of the printed circuit board 10 in fig. 1), the plurality of groups of power supply lines 40 are arranged on the first carrying surface at intervals, and a plurality of LED light emitting chips 30 are arranged on each group of power supply lines 40.
Each of the supply line groups 40 includes four supply lines, which are a first supply line 41, a second supply line 42, a third supply line 43, and a common supply line 44, respectively; the above-described plurality of LED light-emitting chips 30 arranged on each power supply line group 40 includes the red light-emitting chip 31, the green light-emitting chip 32, and the blue light-emitting chip 33, and one electrode of each of the red light-emitting chip 31, the green light-emitting chip 32, and the blue light-emitting chip 33 is connected to the common power supply line 44; the other electrode of the red light emitting chip 31 is connected to a first power supply line 41, the other electrode of the green light emitting chip 32 is connected to a second power supply line 42, and the other electrode of the blue light emitting chip 33 is connected to a third power supply line 43.
In other words, the two electrodes of the red light emitting chip 31 are connected to the common power supply line 44 and the first power supply line 41, respectively, and the two electrodes of the green light emitting chip 32 are connected to the common power supply line 44 and the second power supply line 42, respectively; two electrodes of the blue light emitting chip 33 are connected to a power supply circuit formed by the common power supply line 44 and the third power supply line 43, respectively.
In some embodiments, the first carrying surface is further provided with a plurality of bonding wires 50, the bonding wires 50 are used to connect the driving wafer 20 and the LED light emitting chips 30, that is, one end of each bonding wire 50 is connected to the driving wafer 20, and the other end of each bonding wire 50 is connected to the power supply line, so that the driving wafer 20 can control the LED light emitting chips 30 on the same power supply line to emit light.
Illustratively, each of the power supply lines is provided with a circuit pad 12, the drive wafer 20 is provided with a plurality of electrode pads 21, and the number of the electrode pads 21 may be equal to the number of the power supply lines. For example, one circuit pad 12 is provided in each power supply line, and the number of electrode pads 21 may be the same as the number of circuit pads 12.
The bonding wires 50 are used to connect the circuit pads 12 and the electrode pads 21, that is, one end of each bonding wire 50 is connected to the circuit pad 12, and the other end of each bonding wire 50 is connected to the electrode pad 21, so that the driving wafer 20 can control each LED light emitting chip 30 to emit light. The power supply line and the bonding wire 50 may be one or a combination of a gold wire, a copper wire, a palladium copper wire, a silver wire, and a gold-silver alloy wire. By such arrangement, the corrosion resistance of the bonding wire 50 and the power supply line can be improved, the resistance of the bonding wire can be reduced, and signal and current transmission can be facilitated.
In some embodiments, four driver wafers 20 may be disposed on the first carrying surface of the printed circuit board 10, and the electrode pads 21 in the four driver wafers 20 are respectively connected to the first power supplying line 41, the second power supplying line 42, the third power supplying line 43, and the common power supplying line 44. Alternatively, the printed circuit board 10 is provided with an integrated driver wafer, the integrated driver wafer is provided with a plurality of electrode pads 21, and the plurality of electrode pads 21 are respectively connected to the first power supply line 41, the second power supply line 42, the third power supply line 43, and the common power supply line 44, which is not limited in this embodiment.
Referring to fig. 2, a first driving wafer 201, a second driving wafer 202, a third driving wafer 203 and a fourth driving wafer 204 are disposed on the first carrying surface of the printed circuit board 10, wherein an electrode pad 21 of the first driving wafer 201 is connected to a circuit pad 12 in the common power supply line 44 through a bonding wire 50, so that the first driving wafer 201 is connected to a common electrode of each LED light emitting chip 30, for example, the common electrode is an anode.
The electrode pad 21 of the second driver wafer 202 is connected to the circuit pad 12 in the first power supply line 41 by a bonding wire 50, so that the electrode pad 21 of the second driver wafer 202 is connected to the cathode of the red light emitting chip 31; the electrode pad 21 of the third driver wafer 203 is connected to the circuit pad 12 in the second power supply line 42 by a bonding wire 50, so that the electrode pad 21 of the third driver wafer 203 is connected to the cathode of the green light emitting chip 32; the electrode pad 21 of the fourth drive wafer 204 and the circuit pad 12 in the third power supply line 43 are connected by a bonding wire 50, so that the electrode pad 21 of the fourth drive wafer 204 is connected to the cathode of the blue light emitting chip 33.
In some embodiments, to facilitate the connection of the power supply lines to the driver wafers 20 via the bonding wires 50, the connection is achieved via two bonding wires 50 by adding a transfer pad 13 in place when the driver wafer 20 is further away from the circuit pads 12 of the power supply lines; that is, the first carrying surface is further provided with a transfer pad 13, and the transfer pads 13 are located between each electrode pad 21 and its corresponding circuit pad 12, and are connected in series by bonding wires 50.
On the basis of the above embodiments, the red light emitting chip 31 in the embodiment of the present application may be a front-mount chip, and the green light emitting chip 32 and the blue light emitting chip 33 may both be flip chips; or the red light-emitting chip 31, the green light-emitting chip 32, and the blue light-emitting chip 33 may all be front-mount chips. With such a configuration, as the Mini LED display module 110 is applied to a large-sized display device, the distance between two adjacent LED light emitting chips 30 is increased, and a larger space is provided for arranging bonding wires. Therefore, in the embodiment of the present invention, the front-mounted chip is adopted as the part of the LED light emitting chip 30, and the cost of the front-mounted chip is lower than that of the flip chip, so that the manufacturing cost of the display module can be reduced. It is to be understood that, in some embodiments, the red light emitting chip 31, the green light emitting chip 32 and the blue light emitting chip 33 may be flip chips.
In some embodiments, in order to facilitate mounting of the LED light emitting chips 30 onto the printed circuit board 10, the printed circuit board 10 in the present embodiment is provided with die attach pads 11 for fixing the LED light emitting chips 30, and the LED light emitting chips 30 may be mounted on the die attach pads 11.
Referring to fig. 3, when the red light emitting chip 31, the green light emitting chip 32 and the blue light emitting chip 33 are normal chips, the red light emitting chip 31 is a normal chip with a vertical structure, one electrode of the red light emitting chip 31 is located at the top thereof, the other electrode is located at the bottom thereof, and the electrode located at the bottom thereof can be electrically connected to the die attach pad 11. Note that the electrode on the top thereof may be connected to the circuit pad 12 in the common power supply line 44 by a bonding wire 50.
Illustratively, silver paste is disposed between the red light emitting chip 31 and the die bonding pad 11, and is electrically connected through the silver paste, so that the electrode of the red light emitting chip 31 is electrically connected to the circuit pad 12 of the second power supply line 42. When the red light emitting chip 31 is poor, the red light emitting chip 31 can be taken down and the silver adhesive is repaired again, so that the repair cost can be saved.
The green and blue light-emitting chips 32 and 33 are horizontal-structured chips, and both electrodes of the green and blue light-emitting chips 32 and 33 are located on top thereof, wherein one electrode of the green and blue light-emitting chips 32 and 33 is connected to the circuit pad 12 located in the common power supply line 44, the other electrode of the green light-emitting chip 32 is connected to the circuit pad 12 of the second power supply line 42, and the other electrode of the blue light-emitting chip 33 is connected to the circuit pad 12 of the third power supply line 43.
Therefore, the green light emitting chip 32, the blue light emitting chip 33 and the corresponding die bonding pad 11 are provided with insulating glue therebetween and connected together through the insulating glue. When the green light emitting chip 32 and the blue light emitting chip 33 are loosened or defective, the green light emitting chip 32 and the blue light emitting chip 33 can be taken down, and the insulating glue is supplemented and reinforced; thus, the repair cost can be saved.
As shown in fig. 5, when the red light emitting chip 31 is a vertical structured front-mounted chip, the green light emitting chip 32 and the blue light emitting chip 33 are flip chips; the connection between each electrode of the red light emitting chip 31 and the circuit pad 12 of the common power supply line 44 and the circuit pad 12 of the first power supply line 41 is not described herein again.
When the green and blue light-emitting chips 32 and 33 are flip chips, two electrodes of the green and blue light-emitting chips 32 and 33 are directed toward the printed circuit board 10, wherein one electrode of the green and blue light-emitting chips 32 and 33 is connected to the circuit pad 12 on the common power supply line 44, the other electrode of the green light-emitting chip 32 is connected to the circuit pad 12 on the second power supply line 42, and the other electrode of the blue light-emitting chip 33 is connected to the circuit pad 12 on the third power supply line 43.
In some embodiments, solder paste is disposed between the blue light emitting chip 33 and the green light emitting chip 32 and the die attach pad 11 corresponding thereto, and each electrode in the blue light emitting chip 33 and the green light emitting chip 32 is connected to the corresponding die attach pad 11 through the solder paste.
In some embodiments, when the green light emitting chip 32 and the blue light emitting chip 33 are defective, the green light emitting chip 32 and the blue light emitting chip 33 can be removed and the solder paste can be repaired by laser welding, so that the repair cost can be saved.
As shown in fig. 6, when the red light-emitting chip 31, the green light-emitting chip 32, and the blue light-emitting chip 33 are flip chips, two electrodes of the red light-emitting chip 31, the green light-emitting chip 32, and the blue light-emitting chip 33 are directed toward the printed circuit board 10, wherein one electrode of the red light-emitting chip 31, the green light-emitting chip 32, and the blue light-emitting chip 33 is connected to the circuit pad 12 located at the common power supply line 44; the other electrode of the red light emitting chip 31 is connected to the circuit pad 12 in the first power supply line 41, the other electrode of the green light emitting chip 32 is connected to the circuit pad 12 of the second power supply line 42, and the other electrode of the blue light emitting chip 33 is connected to the circuit pad 12 of the third power supply line 43.
In some embodiments, solder paste is disposed between the red light emitting chip 31, the green light emitting chip 32, and the blue light emitting chip 33 and their corresponding die attach pads 11, and each electrode in the green light emitting chip 32 and the blue light emitting chip 33 is connected to the corresponding die attach pad 11 through the solder paste. When the red light emitting chip 31, the green light emitting chip 32 and the blue light emitting chip 33 are defective, the green light emitting chip 32 and the blue light emitting chip 33 can be taken down and the solder paste can be maintained by adopting a laser fusion welding mode, so that the repair cost can be saved.
It should be noted that the display module 110 provided in the embodiment of the present application further includes a resistor, a capacitor, and a board-to-board connector, and the resistor, the capacitor, and the board-to-board connector are all disposed on the second carrying surface of the printed circuit board 10.
In some embodiments, resistors, capacitors, board connectors and the like are disposed in the circuits of the second carrying surface of the printed circuit board 10, the printed circuit board 10 is provided with through holes penetrating through it, so that each electronic component disposed on the second carrying surface is communicated with the driving wafer 20 and the like disposed on the first carrying surface through the circuits disposed in the through holes; therefore, the internal circuit on the printed circuit board 10 can be simplified, thereby reducing the parasitic capacitance and improving the display effect of the Mini LED display device.
The embodiments or implementation modes in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
In general, terms should be understood at least in part by their use in context. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in the singular or may be used to describe a combination of features, structures, or characteristics in the plural, depending, at least in part, on the context. Similarly, terms such as "a" or "the" may also be understood to convey a singular use or to convey a plural use, depending at least in part on the context.
It should be readily understood that "on … …", "above … …" and "above … …" in this disclosure should be interpreted in its broadest sense such that "on … …" means not only "directly on something", but also includes the meaning of "on something" with intervening features or layers therebetween, and "above … …" or "above … …" includes not only the meaning of "above something" or "above" but also includes the meaning of "above something" or "above" with no intervening features or layers therebetween (i.e., directly on something).
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (11)
1. A display module is characterized by comprising a printed circuit board, a driving wafer, a packaging layer and a plurality of LED light-emitting chips;
the printed circuit board comprises a first bearing surface, the driving wafer and the LED light-emitting chips are arranged on the first bearing surface and are packaged on the printed circuit board through the packaging layer; and each LED light-emitting chip is respectively in signal connection with the driving wafer, and the driving wafer is used for controlling the LED light-emitting chips to emit light.
2. The display module assembly of claim 1, wherein the plurality of LED light emitting chips are arranged in an array on the first carrying surface;
the printed circuit board is provided with a plurality of power supply line groups, each power supply line group comprises a plurality of power supply lines, and each power supply line group is used for supplying current to the LED light-emitting chips located on the same row or the same column.
3. The display module of claim 2, wherein the plurality of LED light emitting chips comprise a red light emitting chip, a green light emitting chip, and a blue light emitting chip;
each of the supply line groups includes a first supply line, a second supply line, a third supply line, and a common supply line;
one electrode of each of the red light emitting chip, the green light emitting chip and the blue light emitting chip is connected with the common power supply line;
the other electrode of the red light emitting chip is in communication with the first power supply line, the other electrode of the green light emitting chip is in communication with the second power supply line, and the other electrode of the blue light emitting chip is in communication with the third power supply line.
4. The display module according to claim 3, wherein the first power supply line, the second power supply line, the third power supply line and the common power supply line are provided with a circuit pad, respectively;
the driving wafer is provided with electrode bonding pads which correspond to the circuit bonding pads one to one;
the printed circuit board is provided with a plurality of welding wires, one ends of the welding wires are connected with the electrode bonding pads, and the other ends of the welding wires are connected with the circuit bonding pads.
5. The display module assembly of claim 4, wherein the first carrying surface has a first driving wafer, a second driving wafer, a third driving wafer and a fourth driving wafer disposed thereon;
the electrode pad of the first driving wafer is connected with the circuit pad in the common power supply line through the bonding wire;
the electrode pad of the second driving wafer is connected with the circuit pad in the first power supply line through the bonding wire; the electrode pad of the third driving wafer is connected with the circuit pad in the second power supply line through the bonding wire; and the electrode pad of the fourth driving wafer is connected with the circuit pad in the third power supply line through the bonding wire.
6. The display module of claim 5,
the first bearing surface is provided with transfer bonding pads, and the transfer bonding pads are positioned between each electrode bonding pad and the corresponding circuit bonding pad and connected in series through the bonding wires.
7. The display module of claim 3, wherein the red light emitting chip, the green light emitting chip, and the blue light emitting chip are all normal-mounted chips; or
The red light emitting chip, the green light emitting chip and the blue light emitting chip are all flip chips; or
The red light emitting chip is a positive mounting chip, and the green light emitting chip and the blue light emitting chip are flip chips.
8. The display module assembly of claim 7, wherein the printed circuit board is provided with die attach pads for fixing the LED light emitting chips;
when the red light emitting chip is a normally-installed chip, silver adhesive is arranged between the red light emitting chip and the die bonding pad and is connected together through the silver adhesive;
when the green light emitting chip and the blue light emitting chip are positively mounted chips, insulating glue is arranged among the green light emitting chip, the blue light emitting chip and the die bonding pad and is connected together through the insulating glue;
when the red light emitting chip, the green light emitting chip and the blue light emitting chip are flip chips, solder paste is arranged among the red light emitting chip, the green light emitting chip, the blue light emitting chip and the die bonding pad and is connected together through the solder paste.
9. The display module according to claim 4, wherein the bonding wire and the first, second, third and common power supply lines are one or a combination of gold wire, copper wire, palladium copper wire, silver wire and gold silver alloy wire.
10. The display module assembly according to any one of claims 1 to 9, wherein the printed circuit board is a four-layer through-hole board or a double-sided board.
11. A display device, comprising a frame, a back plate and a plurality of display modules according to any one of claims 1 to 10;
the back plate is arranged on the surrounding frame and forms an installation space of the display module;
the display modules are arranged in the installation space in an array mode, the backboard is provided with a power supply module, and the power supply module is electrically connected with the display modules.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220709301.1U CN217214714U (en) | 2022-03-29 | 2022-03-29 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220709301.1U CN217214714U (en) | 2022-03-29 | 2022-03-29 | Display module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217214714U true CN217214714U (en) | 2022-08-16 |
Family
ID=82758235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220709301.1U Active CN217214714U (en) | 2022-03-29 | 2022-03-29 | Display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217214714U (en) |
-
2022
- 2022-03-29 CN CN202220709301.1U patent/CN217214714U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5350242B2 (en) | Light source device and liquid crystal display device including the same | |
| CN110060978B (en) | Mounting substrate and electronic device | |
| EP3128505B1 (en) | Mounting substrate and electronic device | |
| US10720413B2 (en) | LED package, LED module and method for manufacturing LED package | |
| US7766499B2 (en) | Light source unit, backlight unit and liquid crystal display including the same, and method thereof | |
| US20060220051A1 (en) | System and method for surface mountable display | |
| CN210167054U (en) | LED lamp bead and transparent LED display screen | |
| CN210403724U (en) | Light emitting diode packaging assembly | |
| CN210607242U (en) | Light emitting diode packaging assembly | |
| US7982317B2 (en) | Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module | |
| CN212461689U (en) | LED light-emitting device, LED display module and display equipment | |
| CN217214714U (en) | Display module and display device | |
| JP6527194B2 (en) | Display device | |
| CN110707203A (en) | Light emitting device, manufacturing method thereof and light emitting device module comprising light emitting device | |
| CN206497891U (en) | LED modules and LED package assemblings | |
| CN210692540U (en) | Active RGB light emitting diode pixel assembly | |
| CN113571627A (en) | Circuit board of LED display unit | |
| CN114582250A (en) | Light-emitting display device with high aperture ratio and manufacturing method thereof | |
| KR20210099112A (en) | Light emitting package assembly, light emitting module and display screen | |
| TWM591260U (en) | Active RGB light-emitting diode display carrier board | |
| CN210073846U (en) | Light emitting diode and lamp | |
| TWI773344B (en) | Light-emitting module and display device | |
| CN220585250U (en) | Micro-spacing laminated integrated packaging LED | |
| CN219799947U (en) | Light bar structure of Mini light-emitting chip and backlight module | |
| CN109755232B (en) | Four unification LED display module assembly of optimization type and display screen thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |