CN217191161U

CN217191161U - Wafer cleaning device and cleaning equipment

Info

Publication number: CN217191161U
Application number: CN202122843198.8U
Authority: CN
Inventors: 王鑫; 管昌新; 刘旭华; 张锐; 李剑
Original assignee: Yangtze Memory Technologies Co Ltd
Current assignee: Yangtze Memory Technologies Co Ltd
Priority date: 2021-11-18
Filing date: 2021-11-18
Publication date: 2022-08-16
Anticipated expiration: 2031-11-18

Abstract

The embodiment of the application discloses a wafer cleaning device and cleaning equipment, wherein a wafer comprises an end face and a side face connected with the periphery of the end face; the wafer cleaning device comprises a cleaning tank, the cleaning tank comprises a bottom plate and a side plate arranged around the circumferential direction of the bottom plate, the side plate and the bottom plate are enclosed to form an accommodating space used for accommodating wafers, liquid discharge holes are formed in the side plate, the wafers are arranged along a preset direction, the extending direction of the liquid discharge holes is intersected with the preset direction, and the preset direction is perpendicular to the end face of the wafers. Through this design, can effectively rinse the wafer simultaneously, when reducing the liquid in the washing tank and discharging the washing tank through the outage, the wafer produces cracked risk because of the effort that receives is too big.

Description

Wafer cleaning device and cleaning equipment

Technical Field

The application relates to the technical field of semiconductor manufacturing, in particular to a wafer cleaning device and cleaning equipment.

Background

In a semiconductor manufacturing process, after a wafer is subjected to wet etching, a cleaning solution is required to clean a residual chemical solution on the surface of the wafer, for example, the wafer is usually placed in a cleaning tank to be cleaned, so as to reduce the influence of the residual chemical solution on a film on the surface of the wafer.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a wafer cleaning device and cleaning equipment, which can effectively clean a wafer and reduce the risk of breakage of the wafer due to overlarge acting force when liquid in a cleaning tank is discharged out of the cleaning tank through a liquid discharge hole.

In a first aspect, an embodiment of the present application provides a wafer cleaning apparatus, where a wafer includes an end surface and a side surface connected to a periphery of the end surface; the wafer cleaning device comprises a cleaning tank, the cleaning tank comprises a bottom plate and a side plate arranged around the circumferential direction of the bottom plate, the side plate and the bottom plate are enclosed to form an accommodating space used for accommodating wafers, liquid discharge holes are formed in the side plate, the wafers are arranged along a preset direction, the extending direction of the liquid discharge holes is intersected with the preset direction, and the preset direction is perpendicular to the end face of the wafers.

According to the wafer cleaning device disclosed by the embodiment of the application, after the cleaning solution in the cleaning tank flushes the end face and the side face of the wafer, the residual liquid medicine on the surface of the wafer is taken away from the surface of the wafer, and through the design of the liquid discharge holes, the liquid medicine and the cleaning solution are discharged out of the cleaning tank through the liquid discharge holes in the side plate, so that the surface of the wafer is effectively cleaned; the wafer is arranged in the containing space of the cleaning tank along the preset direction, and the extending direction of the liquid discharge hole is designed to be intersected with the preset direction, so that the flowing direction of the liquid in the cleaning tank when the liquid is discharged from the liquid discharge hole is intersected with the preset direction, the area of the end face of the wafer when the liquid in the cleaning tank is directly washed away when the liquid is discharged from the cleaning tank through the liquid discharge hole is effectively reduced, the acting force acting on the end face of the wafer when the liquid in the cleaning tank is discharged from the liquid discharge hole is effectively reduced, and the risk of breakage caused by overlarge acting force when the liquid in the cleaning tank is discharged from the cleaning tank through the liquid discharge hole is effectively reduced.

In some embodiments, the side plates include a first side plate and a second side plate which are oppositely arranged, the second side plate is parallel to the preset direction, the first side plate is provided with a liquid discharge hole, and/or the second side plate is provided with a liquid discharge hole.

Based on the above embodiment, the first side plate and the second side plate are disposed opposite to each other, and the second side plate is parallel to the predetermined direction, which is perpendicular to the end surface of the wafer, so that the first side plate and the second side plate are both vertical to the end surface of the wafer, and through arranging the liquid discharge hole on the first side plate, and/or the second side plate is provided with a liquid discharge hole, so that the flowing direction of the liquid in the cleaning tank when the liquid is discharged from the liquid discharge hole is vertical to the preset direction, the area of the end surface of the wafer directly washed by the liquid in the cleaning tank when the liquid is discharged from the cleaning tank through the liquid discharge hole is further reduced, thereby effectively reducing the acting force acting on the end surface of the wafer when the liquid in the cleaning tank is discharged out of the cleaning tank through the liquid discharge hole, thereby reducing the risk of cracking of the wafer caused by excessive force applied when the liquid in the cleaning tank is discharged out of the cleaning tank through the liquid discharge hole.

In some embodiments, the first side plate is provided with a drain hole, the second side plate is provided with a drain hole, and the drain hole on the first side plate and the drain hole on the second side plate are symmetrically arranged with respect to the preset direction.

Based on the above embodiment, the drain holes on the first side plate and the second side plate are designed to be positioned in a symmetrical arrangement with respect to the preset direction, so that the first acting force acting on the side surface of the wafer when the liquid in the cleaning tank is discharged through the drain holes on the first side plate and the second acting force acting on the side surface of the wafer when the liquid in the cleaning tank is discharged through the drain holes on the second side plate are positioned on the same straight line perpendicular to the preset direction, and the first acting force and the second acting force are equal in size and opposite in direction, so that the resultant force of the side surface of the wafer in the direction perpendicular to the preset direction is zero, the overall stress of the wafer is reduced, and the risk that the wafer is broken due to the overlarge acting force of the liquid in the cleaning tank is further reduced.

In some embodiments, the number of the liquid discharge holes on the first side plate is multiple, and the multiple liquid discharge holes are arranged at equal intervals along the preset direction, and/or the number of the liquid discharge holes on the second side plate is multiple, and the multiple liquid discharge holes are arranged at equal intervals along the preset direction.

Based on the above embodiment, the number of the liquid discharge holes on the first side plate is designed to be plural, and/or the number of the liquid discharge holes on the second side plate is designed to be plural, so that the number of the fluid which can be discharged out of the cleaning tank through the liquid discharge port is increased, the efficiency of the cleaning tank for discharging the cleaning liquid after cleaning the wafer is improved, and the cleaning efficiency of the cleaning tank is improved; through the design that a plurality of outage were arranged along the equidistance of predetermineeing the direction for when the washing liquid flowed out via the outage, form even stream bundle, the effort that makes the washing liquid that the wafer in the washing tank received is also comparatively even, so further reduces cracked risk of wafer when guaranteeing effectively abluent the wafer.

In some embodiments, the bottom plate is provided with a diversion hole, and the diversion hole is located in the middle of the bottom plate.

Based on above-mentioned embodiment, through having seted up the water conservancy diversion hole at the bottom plate, the liquid in the washing tank also can be via outside the water conservancy diversion hole discharge washing tank, further improves the flowing back efficiency of washing tank to improve the cleaning efficiency of washing tank.

In some embodiments, the wafer cleaning apparatus further includes a fixing member located in the accommodating space, the fixing member has a plurality of slots arranged along a predetermined direction, and a portion of the wafer is embedded in the slots.

Based on the above embodiment, the fixing part is arranged in the accommodating space of the cleaning tank, and the part of the wafer is embedded in the clamping groove of the fixing part, so that the wafer is stably placed in the accommodating space of the cleaning tank through the fixing part, and the cleaning liquid is ensured to effectively clean the residual liquid medicine on the surface of the wafer.

In some embodiments, the fixing member includes two oppositely disposed first fixing bars and two oppositely disposed second fixing bars, the two oppositely disposed first fixing bars are disposed along a preset direction, and each first fixing bar has a plurality of clamping grooves; two oppositely arranged second fixed rods are arranged along a preset direction, each second fixed rod is provided with a plurality of clamping grooves, and the second fixed rods are positioned on one side, far away from the bottom plate, of the first fixed rod; wherein, the interval between the axis of two second dead levers is greater than the interval between the axis of two first dead levers, and two second dead levers and two first dead levers all with the side butt of wafer.

Based on the embodiment, through the design of the first fixing piece and the second fixing piece, the abutting area of the wafer and the fixing piece in the abutting process is increased, the relative position between the wafer and the fixing piece is kept stable, the second fixing rod is located on one side, far away from the bottom plate, of the first fixing rod and abuts against the side face of the wafer, the first fixing rod and the second fixing rod are approximately arranged in a surrounding mode to form an arc-shaped groove which is externally tangent to the wafer, the wafer can be stably placed in the cleaning tank, and the cleaning liquid can be guaranteed to effectively clean the residual liquid medicine on the surface of the wafer.

In some embodiments, the wafer cleaning apparatus further includes a driving assembly connected to the fixing member to drive the fixing member to move up and down in the accommodating space.

Based on the embodiment, the part of the wafer is embedded in the clamping groove of the fixing piece, the driving assembly is connected with the fixing piece and drives the fixing piece to do lifting motion in the accommodating space, so that the wafer follows the fixing piece to do lifting motion in the accommodating space, and convenience of placing the wafer in the cleaning groove before the cleaning work is started and taking the wafer out of the cleaning groove after the cleaning work is finished is improved.

In some embodiments, the wafer cleaning apparatus further includes a shower connected to the side plate, and the extension direction of the shower is parallel to the predetermined direction.

Based on the embodiment, the extending direction of the spray pipe is designed to be parallel to the preset direction, and the preset direction is perpendicular to the end face of the wafer, so that the direction of the stream of the cleaning liquid sprayed out from the spray pipe is perpendicular to the side face of the wafer, the area of the end face of the wafer sprayed with the cleaning liquid directly is reduced, and the possibility of breakage of the wafer caused by the acting force of the cleaning liquid sprayed out from the spray pipe is reduced.

In a second aspect, an embodiment of the present application provides a cleaning apparatus, which includes the above wafer cleaning device.

Based on cleaning equipment in this application embodiment, when needing to wash the wafer, place the wafer in the accommodation space of washing tank, let in the washing liquid to the washing tank, after washing liquid in the washing tank scoured the terminal surface and the side of wafer, take away the remaining liquid medicine in wafer surface from the wafer surface, through the design of outage, the liquid medicine is along with the washing liquid via the outage discharge cleaning tank on the curb plate to the effective washing to wafer surface has been realized.

Based on the wafer cleaning device and the cleaning equipment provided by the embodiment of the application, after the cleaning solution in the cleaning tank washes the end face and the side face of the wafer, the residual liquid medicine on the surface of the wafer is taken away from the surface of the wafer, and through the design of the liquid discharge holes, the liquid medicine and the cleaning solution are discharged out of the cleaning tank through the liquid discharge holes in the side plates, so that the surface of the wafer is effectively cleaned; the wafer is arranged in the accommodation space of the cleaning tank along the preset direction, and the extending direction of the liquid discharge hole is designed to be intersected with the preset direction, so that the flowing direction of the liquid in the cleaning tank when the liquid is discharged from the liquid discharge hole is intersected with the preset direction, the area of the end surface of the wafer when the liquid in the cleaning tank is discharged from the liquid discharge hole is effectively reduced, the acting force acting on the end surface of the wafer when the liquid in the cleaning tank is discharged from the liquid discharge hole is effectively reduced, and the risk of breakage caused by overlarge acting force when the liquid in the cleaning tank is discharged from the cleaning tank through the liquid discharge hole is effectively reduced.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a sectional view of a related art cleaning tank;

FIG. 2 is a schematic view of a wafer cleaning apparatus according to an embodiment of the present application;

FIG. 3 is a schematic view of a wafer cleaning apparatus according to another embodiment of the present application;

FIG. 4 is a schematic view of a wafer cleaning apparatus according to another embodiment of the present application;

FIG. 5 is a cross-sectional view of a sink in one embodiment of the present application;

FIG. 6 is a schematic view of a wafer cleaning apparatus according to another embodiment of the present application;

FIG. 7 is a front view of a wafer placed on a fixture in one embodiment of the present application;

fig. 8 is a schematic view of a wafer placed on a fixture according to an embodiment of the present application.

Reference numerals: 11', a cleaning tank; 111', a base plate; 114', a back plate; 1123', drain holes; 20', a wafer; 201', end face of wafer;

10. a wafer cleaning device; 11. a cleaning tank; 111. a base plate; 1111. a flow guide hole; 112. a side plate; 1121. a first side plate; 1122. a second side plate; 1123. a liquid discharge hole; 113. a fixing member; 1131. a card slot; 1132. a first fixing lever; 1133. a second fixing bar; 12. a drive assembly; 121. a slide rail; 122. a connecting plate; 13. a spray pipe; 14. an accommodating space; 20. a wafer; 201. an end face of the wafer; 202. the side of the wafer; m, a preset direction.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It can be understood that after the wafer is placed in the cleaning tank for cleaning, the cleaning solution contains residual chemical solution on the surface of the wafer, and the cleaning solution needs to be discharged out of the cleaning tank in time, as shown in fig. 1, in the related art, usually, drain holes 1123 'are opened on the bottom plate 111' of the cleaning tank 11 'and the back plate 114' parallel to the end surface 201 'of the wafer, and the cleaning solution after cleaning the wafer 20' is discharged out of the cleaning tank 11 'through the drain holes 1123' on the bottom plate 111 'and the back plate 114'.

However, as shown in fig. 1, when the cleaning liquid is discharged through the liquid discharge holes 1123 ' of the back plate 114 ', a force F1 ' acting on the wafer 20 ' is generated, and when the cleaning liquid is discharged through the liquid discharge holes 1123 ' at the bottom, a force F2 ' acting on the wafer 20 ' is generated, and the forces F1 ' and F2 ' form a resultant force F ' acting on the wafer 20 ', and the wafer 20 ' may be broken due to the resultant force F ' being too large. Therefore, it is an urgent problem to effectively clean the wafer 20 ' and reduce the risk of the wafer 20 ' breaking due to excessive force applied thereto when the liquid in the cleaning tank 11 ' is discharged from the cleaning tank 11 ' through the drain hole 1123 '.

In order to solve the above-mentioned problems, a first aspect of the present invention provides a wafer cleaning apparatus 10, which can effectively clean the wafer 20 and reduce the risk of breakage of the wafer 20 due to excessive force applied to the wafer 20 when the liquid in the cleaning tank 11 is drained out of the cleaning tank 11 through the drain hole 1123.

The wafer 20 includes an end face 201 and a side face 202 connecting the periphery of the end face 201. The wafer cleaning device 10 comprises a cleaning tank 11, the cleaning tank 11 comprises a bottom plate 111 and a side plate 112 arranged around the circumference of the bottom plate 111, the side plate 112 and the bottom plate 111 enclose to form an accommodating space 14 for accommodating the wafer 20, the side plate 112 is provided with a liquid discharge hole 1123, the wafer 20 is arranged along a preset direction M, the extending direction of the liquid discharge hole 1123 is intersected with the preset direction M, and the preset direction M is perpendicular to the end surface 201 of the wafer.

According to the wafer cleaning apparatus 10 in the embodiment of the present application, after the cleaning solution in the cleaning tank 11 washes the end surface 201 and the side surface 202 of the wafer 20, the chemical solution remaining on the surface of the wafer 20 is carried away from the surface of the wafer 20, and through the design of the liquid discharge holes 1123, the chemical solution and the cleaning solution are discharged out of the cleaning tank 11 through the liquid discharge holes 1123 on the side plate 112, so as to effectively clean the surface of the wafer 20; the wafer 20 is arranged in the accommodating space 14 of the cleaning tank 11 along the preset direction M, and the extending direction of the liquid discharge hole 1123 is designed to intersect with the preset direction M, so that the flowing direction of the liquid in the cleaning tank 11 when the liquid is discharged from the liquid discharge hole 1123 intersects with the preset direction M, and the area of the end surface 201 of the wafer directly washed away when the liquid in the cleaning tank 11 is discharged from the cleaning tank 11 through the liquid discharge hole 1123 is effectively reduced, so that the acting force acting on the end surface 201 of the wafer when the liquid in the cleaning tank 11 is discharged from the cleaning tank 11 through the liquid discharge hole 1123 is effectively reduced, and the risk of breakage of the wafer 20 caused by the overlarge acting force when the liquid in the cleaning tank 11 is discharged from the cleaning tank 11 through the liquid discharge hole 1123 is effectively reduced.

The specific structure of the wafer cleaning apparatus 10 will be described with reference to fig. 2-8.

The wafer 20 is a silicon wafer used for fabricating silicon semiconductor circuits. The wafer 20 includes an end face 201201 and a side face connecting the periphery of the end face 201. for example, the wafer 20 includes two oppositely disposed circular end faces 201, the size of the circular end faces 201 may be 12 inches, and the side face 202 is between the two circular end faces 201 and connects with the two circular end faces 201.

As shown in fig. 2, the wafer cleaning apparatus 10 includes a cleaning tank 11.

The cleaning tank 11 is used as a component for accommodating the wafer 20 and the cleaning solution in the cleaning device, the cleaning tank 11 should be made of a material having good rigidity and corrosion resistance and rust resistance, the specific material of the cleaning tank 11 is not limited, and a designer can reasonably select the cleaning tank according to needs on the premise of saving cost as much as possible.

The cleaning tank 11 includes a bottom plate 111 and a side plate 112 circumferentially disposed around the bottom plate 111, and the side plate 112 and the bottom plate 111 enclose a containing space 14 for containing the wafer 20. The side plate 112 may be integrally formed on the periphery of the bottom plate 111 by injection molding, and the side plate 112 may also be connected to the periphery of the bottom plate 111 by gluing or welding. The side plate 112 and the bottom plate 111 surround to form an accommodating space 14 with an opening at one end, and the opening of the accommodating space 14 is located at the side of the side plate 112 opposite to the bottom plate 111.

The side plate 112 is provided with a drain hole 1123, for example, the hole section of the drain hole 1123 may be circular or rectangular, and when the hole section of the drain hole 1123 is circular, the diameter of the hole section may be 80 mm.

The wafers 20 are arranged along a predetermined direction M, the predetermined direction M is perpendicular to the end surface 201 of the wafer, that is, the number of the wafers 20 may be one or multiple, when the number of the wafers 20 is one, the wafers 20 are placed in the cleaning tank 11 along the predetermined direction M, and when the number of the wafers 20 is multiple, the wafers 20 are placed in the cleaning tank 11 along the predetermined direction M in a row. The predetermined direction M may be a direction passing through a center of the end surface 201 of the wafer and perpendicular to the end surface 201 of the wafer.

The direction of extension of the drain hole 1123 intersects the predetermined direction M, wherein the direction of extension of the drain hole 1123 is understood to be a direction parallel to the hole axis of the drain hole 1123. The extending direction of the liquid discharge holes 1123 intersects the predetermined direction M, i.e. the extending direction of the liquid discharge holes 1123 is not parallel to the predetermined direction M, or the extending direction of the liquid discharge holes 1123 includes at least a first component perpendicular to the predetermined direction M.

As shown in fig. 2-4, it will be appreciated that after cleaning the wafer 20, the cleaning solution contains residual chemical solution on the surface of the wafer 20, and it is necessary to discharge the cleaning tank 11 in time, considering that the liquid in the cleaning tank 11 will generate force to the wafer 20 when being discharged through the liquid discharge hole 1123 on the side plate 112, and the magnitude of the force depends on the relative position between the drain hole 1123 and the end surface 201 of the wafer, in order to reduce the magnitude of the force to which the wafer 20 is subjected during the cleaning process, in order to reduce the risk of breakage of the wafer 20 caused by excessive force generated when the liquid from the cleaning tank 11 flows toward the drain hole 1123, it is further designed that the side plate 112 comprises a first side plate 1121 and a second side plate 1122 which are oppositely arranged, the second side plate 1122 is parallel to the predetermined direction M, and the first side plate 1121 is provided with a drain hole 1123 and/or the second side plate 1122 is provided with a drain hole 1123. In the design, the first side plate 1121 and the second side plate 1122 are disposed opposite to each other, and the second side plate 1122 is parallel to the predetermined direction M, and the predetermined direction M is perpendicular to the end surface 201 of the wafer, so that both the first side plate 1121 and the second side plate 1122 are perpendicular to the end surface 201 of the wafer, and the first side plate 1121 is provided with the drain hole 1123, and/or the second side plate 1122 is provided with the drain hole 1123, so that the flow direction of the liquid in the cleaning tank 11 discharged through the drain hole 1123 is perpendicular to the predetermined direction M and parallel to the end surface 201 of the wafer, when the liquid in the cleaning tank 11 flows toward the drain hole 1123, the residual liquid medicine on the surface of the wafer 20 is taken away from the surface of the wafer 20, compared with the manner that the extending direction of the drain hole 1123 'is perpendicular to the end surface 201' of the wafer in the related art, the area of the end surface 201 of the wafer directly washed by the liquid in the cleaning tank 11 discharged through the drain hole 1123, thereby more effectively reducing the acting force acting on the end surface 201 of the wafer when the liquid in the cleaning tank 11 is discharged out of the cleaning tank 11 through the liquid discharge hole 1123, and further more reducing the risk of the wafer 20 cracking due to the excessive acting force when the liquid in the cleaning tank 11 is discharged out of the cleaning tank 11 through the liquid discharge hole 1123.

As shown in fig. 5, it can be understood that, when the first side plate 1121 and the second side plate 1122 are both provided with the drain holes 1123, the drain holes 1123 on the first side plate 1121 and the drain holes 1123 on the second side plate 1122 may be randomly distributed, for example, the drain holes 1121 on the first side plate and the drain holes 1123 on the second side plate 1122 may be arranged in a staggered manner along a direction perpendicular to the predetermined direction M. Considering that when the liquid in the cleaning tank 11 is drained through the drain holes 1123 on the side plates 112, the first force F1 is generated on the end surface 202 of the wafer when the cleaning liquid flows toward the drain holes 1123 on the first side plate 1121, and the second force F2 is generated on the end surface 202 of the wafer when the cleaning liquid flows toward the drain holes 1123 on the second side plate 1122, in order to reduce the influence of the first force F1 and the second force F2 on the wafer 20, it is further designed that the drain holes 1123 are formed on the first side plate 1121, the drain holes 1123 are formed on the second side plate 1122, and the drain holes 1123 on the first side plate 1121 and the drain holes 1123 on the second side plate 1122 are symmetrically arranged with respect to the predetermined direction M. In this design, the drain holes 1123 on the first side plate 1121 and the drain holes 1123 on the second side plate 1122 are designed to be symmetrically arranged with respect to the predetermined direction M, so that a first acting force acting on the end surface 202 of the wafer when the liquid in the cleaning tank 11 is discharged through the drain holes 1123 on the first side plate 1121 and a second acting force acting on the end surface 202 of the wafer when the liquid in the cleaning tank 11 is discharged through the drain holes 1123 on the second side plate 1122 are located on the same straight line perpendicular to the predetermined direction M, and the first acting force and the second acting force have the same magnitude and opposite directions, so that the resultant force of the end surface 202 of the wafer in the direction perpendicular to the predetermined direction M is zero, thereby reducing the overall force applied to the wafer 20, and further reducing the risk of the wafer 20 breaking due to the excessive acting force applied to the liquid in the cleaning tank 11.

As shown in fig. 6, it can be understood that when the liquid in the cleaning tank 11 is discharged out of the cleaning tank 11 through the liquid discharge holes 1123 on the side plate 112, the number of the liquid discharge holes 1123 formed on the side plate 112 directly affects the efficiency of discharging the liquid out of the cleaning tank 11, and in order to improve the efficiency of discharging the waste liquid from the cleaning tank 11, it is further designed that the number of the liquid discharge holes 1123 on the first side plate 1121 is plural, and the plurality of the liquid discharge holes 1123 are arranged at equal intervals along the predetermined direction M, and/or the number of the liquid discharge holes 1123 on the second side plate 1122 is plural, and the plurality of the liquid discharge holes 1123 are arranged at equal intervals along the predetermined direction M. For example, the first side plate 1121 may be provided with a plurality of drain holes 1123, while the second side plate 1122 is provided with one drain hole 1123 or the second side plate 1122 is not provided with a drain hole 1123; alternatively, the first side plate 1121 may be provided with a drain hole 1123 or the first side plate 1121 may not be provided with a drain hole 1123, while the second side plate 1122 is provided with a plurality of drain holes 1123; the first side plate 1121 and the second side plate 1122 may be provided with a plurality of drain holes 1123. In this design, by designing the number of the drain holes 1123 on the first side plate 1121 as plural, and/or by designing the number of the drain holes 1123 on the second side plate 1122 as plural, the number of the fluid that can be discharged out of the cleaning tank 11 through the drain holes 1123 is increased, the efficiency of the cleaning tank 11 for discharging the cleaning solution after cleaning the wafer 20 is improved, and the cleaning efficiency of the cleaning tank 11 is improved; through the design that a plurality of drain holes 1123 are arranged along predetermined direction M at equal intervals for when the washing liquid flows out through drain hole 1123, form even stream, make the effort of the washing liquid that wafer 20 in washing tank 11 received also comparatively even, further reduce the cracked risk of wafer 20 when guaranteeing effective washing to wafer 20.

It can be understood that the cleaning tank 11 can be provided with the liquid discharge hole 1123 only on the side plate 112, and in order to improve the efficiency of discharging the liquid in the cleaning tank 11 out of the cleaning tank 11 and improve the cleaning capability and cleaning efficiency of the cleaning tank 11, the bottom plate 111 is further provided with the flow guide hole 1111, and the flow guide hole 1111 is located in the middle of the bottom plate 111. The cross section of the flow guiding hole 1111 may be circular or rectangular, and when the cross section of the liquid discharging hole 1123 is circular, the center of the hole cross section is located at the center of the bottom plate 111. In this design, through having seted up water conservancy diversion hole 1111 at bottom plate 111, the liquid in washing tank 11 also can be outside through water conservancy diversion hole 1111 discharge washing tank 11, further improves the flowing back efficiency of washing tank 11 to improve the cleaning efficiency of washing tank 11.

As shown in fig. 7, considering that the cleaning solution washes the surface of the wafer 20 to generate a force during the cleaning process of the cleaning tank 11, in order to enhance the stability of the wafer 20 placed in the cleaning tank 11, the wafer cleaning apparatus 10 further includes a fixing member 113, the fixing member 113 is located in the accommodating space 14, the fixing member 113 has a plurality of slots 1131 arranged along the predetermined direction M, and a portion of the wafer 20 is embedded in the slots 1131. The wafer 20 may be in point contact with the groove wall surface of the pocket 1131, in line contact, or in surface contact. In the design, the fixing element 113 is disposed in the accommodating space 14 of the cleaning tank 11, and the portion of the wafer 20 is embedded in the clamping groove 1131 of the fixing element 113, so that the wafer 20 is stably placed in the accommodating space 14 of the cleaning tank 11 through the fixing element 113, thereby ensuring that the cleaning solution can effectively clean the residual liquid medicine on the surface of the wafer 20.

As shown in fig. 8, further, in order to improve the connection stability between the wafer 20 and the fixing member 113, the fixing member 113 further includes two oppositely disposed first fixing rods 1132 and two oppositely disposed second fixing rods 1133, the two oppositely disposed first fixing rods 1132 are disposed along the predetermined direction M, and each of the first fixing rods 1132 has a plurality of card slots 1131; two oppositely arranged second fixing bars 1133 are arranged along the preset direction M, each second fixing bar 1133 has a plurality of slots 1131, and the second fixing bars 1133 are located on one side of the first fixing bars 1132 away from the bottom plate 111; the distance between the central axes of the two second fixing rods 1133 is greater than the distance between the central axes of the two first fixing rods 1132, and the two second fixing rods 1133 and the two first fixing rods 1132 are both abutted to the end surface 201 of the wafer. That is, the first fixing rod 1132 and the second fixing rod 1133 enclose an arc-shaped groove for accommodating the wafer 20, and a curvature radius of the arc-shaped groove is substantially equal to a radius of the wafer 20. In the design, through the design of first fixing part 113 and second fixing part 113, the abutting area when wafer 20 abuts against fixing part 113 is increased, so that the relative position between wafer 20 and fixing part 113 is kept stable, second fixing rod 1133 is located on one side of first fixing rod 1132 away from bottom plate 111, and both the first fixing rod 1132 and the second fixing rod 1133 are abutted against end surface 201 of the wafer, so that first fixing rod 1132 and second fixing rod 1133 are approximately surrounded to form a groove circumscribed with wafer 20, so that wafer 20 can be stably placed in cleaning groove 11, and effective cleaning of the residual liquid medicine on the surface of wafer 20 by the cleaning liquid is ensured.

It is understood that the wafer 20 may be kept stationary relative to the cleaning tank 11, and in order to reduce the difficulty of the worker for placing and taking out the wafer 20, the wafer cleaning apparatus 10 further includes a driving assembly 12, wherein the driving assembly 12 is connected to the fixing member 113 to drive the fixing member 113 to move up and down in the accommodating space 14. Specifically, the driving assembly 12 includes a sliding rail 121, a connecting plate 122 and a driving member, the sliding rail 121 is disposed along a direction perpendicular to the preset direction M, the connecting plate 122 is connected to the fixing member 113 and slidably connected to the sliding rail 121, the driving member is connected to the connecting plate 122 to drive the connecting plate 122 to slide along the sliding rail 121, wherein the driving member may be a driving motor, and an output shaft of the driving motor is fixedly connected to the connecting plate 122. In the design, part of the wafer 20 is embedded in the clamping groove 1131 of the fixing member 113, the driving assembly 12 is connected with the fixing member 113 and drives the fixing member 113 to move up and down in the accommodating space 14, so that the wafer 20 moves up and down in the accommodating space 14 along with the fixing member 113, and convenience for a worker to place the wafer 20 in the cleaning tank 11 before the cleaning operation is started and take out the wafer 20 from the cleaning tank 11 after the cleaning operation is finished is improved.

It can be understood that cleaning tank 11 may be provided with a liquid inlet hole on side plate 112, and the cleaning solution may directly enter cleaning tank 11 through the liquid inlet hole to clean wafer 20, in order to improve the uniformity of the cleaning solution reaching the surface of wafer 20 and improve the liquid inlet efficiency, so that in a further design, wafer cleaning apparatus 10 further includes a spraying pipe 13 connected to side plate 112, and the extending direction of spraying pipe 13 is parallel to preset direction M. Wherein, a plurality of spray holes are arranged on the spray pipe 13, and the plurality of spray holes are arranged at equal intervals along the extending direction of the spray pipe 13. In this design, the extending direction of the spraying pipe 13 is designed to be parallel to the preset direction M, and the preset direction M is perpendicular to the end surface 201 of the wafer, so that most of the stream of the cleaning liquid sprayed out by the spraying pipe 13 is directly sprayed on the end surface 202 of the wafer, the area of the end surface 201 of the wafer directly sprayed by the cleaning liquid is reduced, and the possibility of breakage of the wafer 20 due to the acting force of the cleaning liquid sprayed out by the spraying pipe 13 is reduced.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer cleaning device, the wafer includes the terminal surface and connects the peripheral side of terminal surface, its characterized in that: the cleaning device comprises a cleaning tank, the cleaning tank comprises a bottom plate and a side plate arranged around the circumference of the bottom plate, the side plate and the bottom plate are enclosed to form an accommodating space for accommodating the wafer, the side plate is provided with a liquid discharge hole, the wafer is arranged along a preset direction, the extending direction of the liquid discharge hole is intersected with the preset direction, and the preset direction is perpendicular to the end face of the wafer.

2. The wafer cleaning apparatus as claimed in claim 1, wherein the side plates include a first side plate and a second side plate disposed opposite to each other, and the second side plate is parallel to the predetermined direction;

the first side plate is provided with the liquid discharge hole; and/or

The second side plate is provided with the liquid discharge hole.

3. The apparatus of claim 2, wherein the first side plate has the drain hole and the second side plate has the drain hole, and the drain hole on the first side plate and the drain hole on the second side plate are symmetrically disposed with respect to the predetermined direction.

4. The wafer cleaning apparatus of claim 2,

the first side plate is provided with a plurality of liquid discharge holes, and the plurality of liquid discharge holes are arranged at equal intervals along the preset direction; and/or

The number of the liquid discharge holes on the second side plate is multiple, and the liquid discharge holes are arranged at equal intervals along the preset direction.

5. The wafer cleaning apparatus as claimed in claim 1, wherein the bottom plate has a guiding hole, and the guiding hole is located at a middle portion of the bottom plate.

6. The wafer cleaning apparatus as claimed in claim 1, further comprising a fixing member located in the accommodating space, wherein the fixing member has a plurality of slots arranged along the predetermined direction, and a portion of the wafer is embedded in the slots.

7. The wafer cleaning apparatus of claim 6, wherein the fixture comprises:

the two first fixing rods are oppositely arranged and arranged along the preset direction, and each first fixing rod is provided with a plurality of clamping grooves;

two oppositely arranged second fixing rods are arranged along the preset direction, each second fixing rod is provided with a plurality of clamping grooves, and the second fixing rods are positioned on one side, away from the bottom plate, of the first fixing rod;

the distance between the central axes of the two second fixing rods is larger than the distance between the central axes of the two first fixing rods, and the two second fixing rods and the two first fixing rods are abutted to the side faces of the wafer.

8. The wafer cleaning apparatus as claimed in claim 6, further comprising a driving assembly connected to the fixing member for driving the fixing member to move up and down in the accommodating space.

9. The wafer cleaning apparatus as claimed in claim 1, wherein the wafer cleaning apparatus further comprises a shower connected to the side plate, and the shower extends in a direction parallel to the predetermined direction.

10. A cleaning apparatus comprising the wafer cleaning device according to any one of claims 1 to 9.