CN217167056U

CN217167056U - Novel instrument of high efficiency bonding wire

Info

Publication number: CN217167056U
Application number: CN202220095231.5U
Authority: CN
Inventors: 夏善宇; 张渊; 万波; 闵正红
Original assignee: Zhejiang Paidaxin Integrated Circuit Co ltd
Current assignee: Zhejiang Paidaxin Integrated Circuit Co ltd
Priority date: 2022-01-14
Filing date: 2022-01-14
Publication date: 2022-08-12
Anticipated expiration: 2032-01-14

Abstract

The utility model discloses a novel instrument of high efficiency bonding wire, including first spring clamp and second spring clamp, first spring clamp includes first punch holder, first lower plate, can dismantle the connection and be in the PCB board at first lower plate chuck position and the probe of setting on the PCB board, the second spring clamp includes second punch holder, second lower plate and installs the row's needle on the second punch holder, pass through signal line connection between probe and the row's needle. The utility model discloses avoided using tin wire, flatiron, copper wire, inhale tin ware etc. and connected the back test, in integrated circuit engineering debugging, only need according to solder joint interval adjustment down, the spring clamp directly clip can, reduced the connect time of PCB board, convenient to use is swift, has improved the efficiency of integrated circuit engineering debugging work, reaches the cushioning effect through the drop-shaped probe simultaneously, protects the PCB soft board, and control cost is lower, and production technology is simpler, has improved production efficiency.

Description

Novel instrument of high efficiency bonding wire

Technical Field

The utility model relates to a bonding wire test technical field especially relates to a novel instrument of high efficiency bonding wire.

Background

In the integrated circuit engineering debugging, the traditional tin flying wire feeding needs a certain time, and if the measuring point is too small, the welding wire on the PCB is not firm, and the debugging working progress is slowed. The PCB is possibly polluted by tin coating on the PCB soft board for many times, so that samples are polluted, and once the debugging times are too many, the capacitive resistance components on the periphery of welding points are also influenced. To this end, we propose a new tool for high efficiency wire bonding.

Disclosure of Invention

The utility model provides a novel instrument of high efficiency bonding wire, aim at can help the quick bonding wire of tester to reach the effect of circuit test through this bonding wire instrument, realize reaching the purpose of debugging under the condition of not going up tin to save the welded time and carry out better test work, efficiency improves greatly.

In order to realize the technical purpose, the technical effect is achieved, the utility model discloses a realize through following technical scheme:

the utility model provides a novel instrument of high efficiency bonding wire, includes first spring clamp and second spring clamp, first spring clamp includes first punch holder, first lower plate, can dismantle the connection and be in the PCB board at first lower plate chuck position and the probe of setting on the PCB board, the second spring clamp includes second punch holder, second lower plate and installs the row's needle on the second punch holder, pass through signal line connection between probe and the row's needle.

Preferably, in the above novel tool for high-efficiency wire bonding, the bottom end of the pin header is set to be a pin header end, and the pin header end is arranged in a drop shape.

Based on the above, arrange the terminal structure of needle and set up rationally, the probe reaches the cushioning effect, protects the PCB soft board, and the staff's of being convenient for detection operation.

Preferably, among the above-mentioned novel instrument of high efficiency bonding wire, still include the row needle inserted block, the installation screw is seted up to the bottom of row needle inserted block, the second lower plate passes through the bolt fastening and connects row needle inserted block, all seted up on the roof of row needle inserted block and the lateral wall with the hole that row needle matches.

Based on the above, through the arrangement of the pin header insertion block, the pin header tail end of the pin header can be protected, the phenomenon of firing pin between the pin header tail end and the second lower clamping plate is avoided, through the arrangement of the side hole, the test wire body penetrates through the side hole to be electrically connected with the pin header tail end in a butting mode, the pin header can be matched for detection operation according to connection corresponding to the measuring point, and connection and test of other wire bodies are achieved.

Preferably, in the above-mentioned novel instrument of high efficiency bonding wire, establish to H type clamp through round pin axle and torsional spring swing joint between first punch holder and the first lower plate, establish to H type clamp through round pin axle and torsional spring swing joint between second punch holder and the second lower plate, the thickness of first lower splint is less than first punch holder, the thickness of second punch holder and second lower splint is established to unanimity.

Based on the above, the overall structure of first spring clamp and second spring clamp sets up rationally, and the H type clamp body is convenient for use.

Preferably, in the novel tool for bonding wires with high efficiency, the top of the probe penetrates through the first upper clamping plate and extends to the upper side, and the top of the pin header penetrates through the second upper clamping plate and extends to the upper side.

Based on the above, the concrete structure of probe and row needle sets up rationally, is convenient for the grafting of dupont line.

Preferably, in the above novel tool for high-efficiency wire bonding, the top of each of the first upper plate and the second upper plate is provided with a convex pressing block, and the first upper plate, the first lower plate, the second upper plate and the second lower plate are all made of transparent acrylic plates.

Based on the aforesaid, the structure material of first spring clamp and second spring clamp sets up rationally, and transparent material is easily observed and has insulating nature, and intensity is high, and convenient to use presses the operation.

Preferably, in the above-mentioned novel instrument of high efficiency bonding wire, be the symmetry on the PCB board and seted up the installation screw, first splint pass through bolt-up connection PCB board.

Based on the above, the dismounting and the changing of the PCB can be realized.

The utility model has the advantages that: the utility model provides a device of quick bonding wire, do not adopt traditional tinning bonding wire's method, traditional flatiron operation has been avoided, scald and the possibility that welds the pollution PCB board many times, and the cost is lower, avoided using the tin line, the flatiron, the copper wire, inhale tin ware etc. and connect the after-test, in integrated circuit engineering debugging, only need according to solder joint interval regulation down, the spring clamp directly clip can, the connection time of PCB board has been reduced, high durability and convenient use, the efficiency of integrated circuit engineering debugging work has been improved, reach the cushioning effect through drop-shaped probe simultaneously, protect the PCB soft board, and control cost is lower, production technology is simpler, and production efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of a first upper clamping plate and a first lower clamping plate in the

embodiment

1 and 2 of the invention;

fig. 2 is a schematic structural view of a second upper splint and a second lower splint according to embodiment 1 of the present invention;

fig. 3 is a schematic structural view of the second upper splint and the second lower splint according to embodiment 2 of the present invention.

Reference numbers in the figures: 1. a first upper splint; 2. a first lower splint; 3. a PCB board; 4. a probe; 5. arranging needles; 51. arranging the tail ends of the pins; 6. a pin header plug block; 10. a second upper splint; 20. and a second lower splint.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Embodiment 1, please refer to fig. 1 and 2, this embodiment is a novel tool for high-efficiency wire bonding, including a first spring clamp and a second spring clamp, the first spring clamp includes a first upper clamp 1, a first lower clamp 2, a probe 4 detachably connected to a chuck of the first lower clamp 2 and a PCB 3, the PCB 3 is symmetrically provided with mounting screw holes, the first lower clamp 2 is connected to the PCB 3 through a bolt, so as to realize the dismounting and replacement of the PCB 3, the second spring clamp includes a second upper clamp 10, a second lower clamp 20 and a pin header 5 mounted on the second upper clamp 10, and the probe 4 and the pin header 5 are connected by a dupont line signal.

The preferred, the bottom of row's needle 5 is established to row needle end 51, and row needle end 51 is the drop form setting, and row needle end 51's structure sets up rationally, and the probe reaches cushioning effect, protects the PCB soft board, and the staff's of being convenient for detection operation.

Specific first spring clamp and second spring clamp as follows, establish into H type clamp through round pin axle and torsional spring swing joint between first punch holder 1 and the first lower plate 2, establish into H type clamp through round pin axle and torsional spring swing joint between second punch holder 10 and the second lower plate 20, the thickness of first lower plate 2 is less than first punch holder 1, the thickness of second punch holder 10 and second lower plate 20 is established to unanimity, the overall structure of first spring clamp and second spring clamp sets up rationally, H type clamp convenient to use.

Simultaneously the top of probe 4 is the first punch holder 1 of passing through of run-through and extends to the above, and the top of arranging needle 5 is the second punch holder 10 of passing through of run-through and extends to the top, and the concrete structure of probe 4 and row needle 5 sets up rationally, the grafting of the dupont line of being convenient for.

It should be noted that the top of first punch holder 1 and second punch holder 10 all is equipped with the protruding pressing block of form, and first punch holder 1, first lower plate 2, second punch holder 10 and second lower plate 20 all establish to transparent ya keli panel, and the structure material of first spring clamp and second spring clamp sets up rationally, and transparent material easily observes and has insulating nature, and intensity is high, and convenient to use presses the operation.

In embodiment 2, referring to fig. 3, the structures of the first spring clamp and the second spring clamp are the same as those of embodiment 1, except that a pin header block 6 detachably connected to the second lower clamp plate 20 of the second spring clamp is installed, and the pin header block 6 functions to protect the pin header end 51, and can perform detection operation by matching the pin header 5 according to the connection corresponding to the measurement point, thereby working flexibly and improving the use efficiency.

Specifically, the installation screw is seted up to the bottom of pin header plug 6, second lower plate 20 passes through bolt fastening connection pin header plug 6, all set up the hole that matches with pin header 5 on the roof of pin header plug 6 and the lateral wall, through the setting of pin header plug 6, can play the function of a protection to pin header end 51 of pin header 5, avoid taking place the phenomenon of striker between pin header end 51 and second lower plate 20, and through the setting in lateral part hole, the test line body passes the lateral part hole can realize conflict electric connection with pin header end 51, can match pin header 5 according to the connection that the measurement point corresponds and carry out detection operation, realize the connection and the test of other line bodies.

Based on the

embodiments

1 and 2, when the device is used, the detection distance of the probes 4 is adjusted according to the distance between the measuring points to be welded, the measuring points are clamped by the spring clamps, the other measuring points are clamped by the springs on the other side, the device can be connected through a DuPont wire, if an oscilloscope is required to capture measuring point signals, the spring clamp on one side can be removed, and the signal capturing operation is realized; the wire bonding tool can help a tester to rapidly bond wires to achieve the effect of circuit testing, and achieve the purpose of debugging under the condition of no tin application, so that the welding time is saved, better testing work is carried out, and the efficiency is greatly improved. The pin header plug 6 added in embodiment 2 can be plugged with a corresponding detection line body on a corresponding jack at the side of the pin header plug 6 according to the debugging requirements of the integrated circuit engineering, the test line body passes through a side hole to be electrically connected with the pin header end 51, and then the pin header 5 can be matched for detection according to the connection corresponding to the detection point, so as to realize the connection and the test of other line bodies. In conjunction with the above,

embodiments

1 and 2 can be used in integrated circuit engineering debugging from the best and according to the detection requirements.

To sum up the utility model provides a device of quick bonding wire does not adopt traditional method of going up tin bonding wire, traditional flatiron operation has been avoided, scald and the possibility of many times welding pollution PCB board, and the cost is lower, avoided using the tin wire, the flatiron, the copper wire, inhale tin ware etc. and connect the back test, in integrated circuit engineering debugging, only need according to solder joint interval regulation down, the spring clamp directly clip can, the connection time of PCB board has been reduced, high durability and convenient use, the efficiency of integrated circuit engineering debugging work has been improved, reach the cushioning effect through water droplet shape probe simultaneously, protect the PCB soft board, control cost is lower, production technology is simpler, and production efficiency is improved.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a novel instrument of high efficiency bonding wire, its characterized in that includes first spring clamp and second spring clamp, first spring clamp includes first punch holder (1), first punch holder (2), can dismantle the connection and be in PCB board (3) at first punch holder (2) chuck position and probe (4) of setting on PCB board (3), the second spring clamp includes second punch holder (10), second punch holder (20) and row's needle (5) of installing on second punch holder (10), through signal line connection between probe (4) and row's needle (5).

2. The novel tool for high efficiency wire bonding according to claim 1, wherein the bottom end of the pin header (5) is provided as a pin header tip (51), and the pin header tip (51) is provided in a drop shape.

3. The novel tool for high-efficiency wire bonding is characterized by further comprising a pin header insert (6), wherein a mounting screw hole is formed in the bottom of the pin header insert (6), the second lower clamping plate (20) is fixedly connected with the pin header insert (6) through a bolt, and holes matched with the pins (5) are formed in the top wall and the side wall of the pin header insert (6).

4. The novel tool for high-efficiency wire bonding is characterized in that the first upper clamping plate (1) and the first lower clamping plate (2) are movably connected through a pin shaft and a torsion spring and are set as an H-shaped clamp body, the second upper clamping plate (10) and the second lower clamping plate (20) are movably connected through a pin shaft and a torsion spring and are set as an H-shaped clamp body, the thickness of the first lower clamping plate (2) is smaller than that of the first upper clamping plate (1), and the thicknesses of the second upper clamping plate (10) and the second lower clamping plate (20) are set to be consistent.

5. The new tool for high efficiency wire bonding according to claim 1, characterized in that the top of the probe (4) is through-passing through the first upper clamp plate (1) and extends to the upper side, and the top of the pin header (5) is through-passing through the second upper clamp plate (10) and extends to the upper side.

6. The novel tool for high-efficiency wire bonding is characterized in that a convex pressing block is arranged at the top of each of the first upper clamping plate (1) and the second upper clamping plate (10), and the first upper clamping plate (1), the first lower clamping plate (2), the second upper clamping plate (10) and the second lower clamping plate (20) are all made of transparent acrylic plates.

7. The novel tool for high-efficiency wire bonding is characterized in that the PCB (3) is symmetrically provided with mounting screw holes, and the first lower clamp plate (2) is fixedly connected with the PCB (3) through bolts.