CN217158220U

CN217158220U - Double-sided etched ultra-dense LED support

Info

Publication number: CN217158220U
Application number: CN202220704080.9U
Authority: CN
Inventors: 付桂花; 马洪毅
Original assignee: Shanxi Gaoke Huaxing Electronic Technology Co ltd
Current assignee: Shanxi Gaoke Huaxing Electronic Technology Co ltd
Priority date: 2021-12-02
Filing date: 2022-03-29
Publication date: 2022-08-09
Anticipated expiration: 2032-03-29

Abstract

The utility model relates to the field of LED supports, and discloses a double-sided etched ultra-dense LED support, which comprises a frame body, wherein the upper surface and the lower surface of the frame body form a convex step-shaped structure through etching, the step-shaped structure on the upper surface is used for die bonding, and the step-shaped structure on the lower surface is used as a welding leg; welding layers are arranged on the upper surfaces of the upper step-shaped structure and the lower step-shaped structure; the side surfaces of the upper step-shaped structure and the lower step-shaped structure are rough etched surfaces; the utility model discloses a two-sided step form that two-sided etching formed, the plastic-sealed body can be fine forms the parcel to the upper surface functional area, guarantees good gas tightness, has solved the poor problem of etching process preparation Mini LED support gas tightness, is favorable to increasing product reliability simultaneously.

Description

Double-sided etched ultra-dense LED support

Technical Field

The utility model relates to a LED support specifically is a super close LED support of two-sided etching.

Background

At present, the traditional TOP LED support metal structure adopts a punch forming process, and when the miniature packaging size is developed to be below 1mm, the processing precision of a punching process cannot meet the process requirement of mass production. The TOP LED packaging is extended to the range of the Mini LED by adopting an etching process, namely, an RGB device packaging structure below 1mm is realized, and the display LED is expanded to the display range P1.0 mm. However, the air tightness of the LED bracket manufactured by the current etching process cannot meet the requirement, and a gap can be formed after packaging so that moisture can enter, thereby affecting the service life of internal functional parts.

SUMMERY OF THE UTILITY MODEL

The utility model overcomes prior art's is not enough, provides a super close LED support of two-sided etching. The problem of poor air tightness of a Mini LED bracket manufactured by a single-sided etching process is solved.

A double-sided etched ultra-dense LED bracket comprises a frame body, wherein the upper surface and the lower surface of the frame body form a convex step-shaped structure through etching, the step-shaped structure on the upper surface is used for die bonding, and the step-shaped structure on the lower surface is used as a welding leg; welding layers are arranged on the upper surfaces of the upper step-shaped structure and the lower step-shaped structure; the side surfaces of the upper step-shaped structure and the lower step-shaped structure are rough etched surfaces.

Further, the upper and lower surfaces of the frame body are etched to form outer connecting rods at the edges of the frame body, and the distance between the outer connecting rods and the horizontal surface of the stepped structure of the lower surface is 0.02-0.08 cm.

Furthermore, the frame body is a rectangular metal frame, and the outer connecting rods are positioned at four top corners of the frame body.

Furthermore, the horizontal plane distance between the outer connecting rod and the upper surface step-shaped structure is 0.03-0.08 cm.

Furthermore, the welding layer is a silver-plated welding layer formed by an electroplating method.

Furthermore, the LED support is integrally packaged by adopting a deep light-transmitting material after die bonding and wire bonding.

Further, the deep light-transmitting material is black or brown light-transmitting plastic.

Further, the stepped structure of the upper surface includes a first functional region where the red wafer is disposed and a second functional region where the blue and green wafers are disposed.

In order to achieve the above purpose, the present invention is achieved by the following technical solutions.

The utility model discloses produced beneficial effect does for prior art:

1. the utility model discloses a two-sided step form that two-sided etching formed, the plastic-sealed body can be fine forms the parcel to the upper surface functional area, guarantees good gas tightness.

2. The utility model discloses a select two specific upper and lower surface plating welding layers, the perpendicular surface between the upper and lower two planes remains the coarse etching face, can guarantee to closely combine with plastic packaging material, guarantees good gas tightness.

3. The utility model discloses directly adopt dark integrative encapsulation of printing opacity material, saved base plate preparation and bowl cup preparation, saved the cost greatly, the light that the front chip sent directly jets out the packaging body through bottom electro-silvering layer reflection and chip surface light.

4. The outer connecting rod and the surfaces of 4 SMT mounting welding feet on the back surface form 0.02-0.08 steps, so that even if slight burrs are generated by cutting, the outer connecting rod cannot be connected with the welding feet; meanwhile, the 4 outer connecting rods and the upper surface of the internal functional area form 0.03-0.08 steps, and even if gap moisture enters between the outer connecting rods and the plastic package body, internal functional parts cannot be affected.

5. The utility model discloses the functional area design is special two segmentations, separately arranges red wafer and blue-green wafer, reduces the heat gathering, is favorable to increasing product reliability.

Drawings

Fig. 1 is a top view of the front surface of the bracket according to the present invention.

Fig. 2 is a side view of fig. 1.

Fig. 3 is a top view of the reverse side of the bracket according to the present invention.

Fig. 4 is a side view of fig. 3.

FIG. 5 is a side view of a double-sided etched stent plated solder layer.

FIG. 6 is a top view of a double-sided etched support after die bonding and wire bonding.

Fig. 7 is a side view of fig. 6.

Fig. 8 is a side view of the molded stent.

Fig. 9 is a schematic view of the stent after cutting.

In the figure, 1 is a metal sheet, 2 is an upper step surface, 3 is a lower step surface, 4 is an external connecting rod, 5 is a first functional area, 6 is a second functional area, 7 is a red chip, 8 is a blue chip, 9 is a green chip, 10 is a dark transparent plastic, 11 is a front etching area, 12 is a welding layer, and 13 is a welding line.

Detailed Description

In order to make the technical problem, technical scheme and beneficial effect that the utility model will solve more clearly understand, combine embodiment and attached drawing, it is right to go on further detailed description the utility model discloses. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. The technical solution of the present invention is described in detail below with reference to the embodiments and the drawings, but the scope of protection is not limited thereto.

The embodiment provides a double-sided etched ultra-dense LED bracket, wherein the double-sided etching process is the conventional etching process, and the specific process steps are etching frame → electroplating → die bonding → bonding wire → plastic packaging → cutting; for the etching of the frame, a rectangular metal sheet 1 is adopted, the upper surface of the metal sheet 1 is etched to form a front etching area 11, the front etching area 11 comprises an upper step surface 2 (refer to fig. 1 and 2) protruding out of the upper surface, the lower surface of the metal sheet 1 is etched to form a lower step surface 3 (refer to fig. 3 and 4) protruding out of the lower surface, and meanwhile, four outer connecting rods 4 are formed at four corners of the metal sheet 1 through double-sided etching; wherein, the upper step surface 2 of the upper surface is used for die bonding, and the lower step surface 3 of the lower surface is used as a welding leg; the vertical distance between the outer connecting rod 4 and the horizontal surface of the lower step 3 is 0.02-0.08cm, so that even if slight burrs are generated by cutting, the connection with the welding feet cannot be caused; meanwhile, the four outer connecting rods 4 and the upper surface of the upper step surface 2 serving as the inner functional area form 0.03-0.08 steps, and even if gap moisture enters between the outer connecting rods 4 and the plastic package body, the inner functional parts are not affected. And the two sides are etched to form a step shape, so that the plastic package body can well wrap the functional area on the upper surface, and good air tightness is ensured.

Then, plating a silver welding layer 12 on the horizontal surfaces of the upper step surface 2 and the lower step surface 3 by adopting an electroplating method (refer to fig. 5); the vertical surfaces of the upper step surface 2 and the lower step surface 3 are not electroplated, a rough etched surface is reserved, the side surface is a rough etched surface, and the side surface can be tightly combined with a plastic package material, so that good air tightness is ensured. The upper step surface 2 formed by the etching process includes the first functional region 5 and the second functional region 6, the red wafer 7 is disposed on the first functional region 5, and the blue wafer 8 and the green wafer 9 are disposed on the second functional region 6, and this arrangement method can reduce heat accumulation, which is advantageous for increasing product reliability.

After die bonding and wire bonding are completed (see fig. 6 and 7), the semiconductor device is integrally packaged with dark transparent plastic 10 (see fig. 8), and then cut (see fig. 9). The dark transparent plastic can be black or brown transparent plastic, so that the substrate manufacturing and bowl and cup manufacturing are omitted, and the cost is greatly saved. The light that the positive chip sent directly jets out the packaging body through bottom electro-silvering layer reflection and chip surface light, forms 4 SMT and pastes dress leg behind 3 electro-silvering layers of lower step face. The embodiment solves the problem of poor air tightness of the Mini LED bracket manufactured by the etching process, and is suitable for the production of the miniature LED.

The above description is for further details of the present invention with reference to specific preferred embodiments, and it should not be understood that the embodiments of the present invention are limited thereto, and it will be apparent to those skilled in the art that the present invention can be implemented in a plurality of simple deductions or substitutions without departing from the scope of the present invention, and all such alterations and substitutions should be considered as belonging to the present invention, which is defined by the appended claims.

Claims

1. A double-sided etched ultra-dense LED bracket comprises a frame body and is characterized in that the upper surface and the lower surface of the frame body are etched to form convex step-shaped structures, the step-shaped structures on the upper surface are used for die bonding and wire bonding, and the step-shaped structures on the lower surface are used as SMT (surface mount technology) mounting welding feet; welding layers are arranged on the upper surfaces of the upper step-shaped structure and the lower step-shaped structure; the side surfaces of the upper step-shaped structure and the lower step-shaped structure are rough etched surfaces.

2. The double-sided etched ultra-dense LED bracket as claimed in claim 1, wherein the upper and lower surfaces of the frame body are etched to form outer connection bars at edges of the frame body, and the outer connection bars are spaced from horizontal surfaces of the stepped structure of the lower surface by 0.02-0.08 cm.

3. The double-sided etched ultra-dense LED bracket as claimed in claim 2, wherein the frame body is a rectangular metal frame, and the outer connecting rods are located at four corners of the frame body.

4. The double-sided etched ultra-dense LED support according to claim 2, wherein the horizontal distance between the outer connecting rods and the stepped structure on the upper surface is 0.03-0.08 cm.

5. The double-sided etched ultra-dense LED support according to claim 1, wherein the solder layer is a silver-plated solder layer formed by electroplating.

6. The double-sided etched ultra-dense LED support according to claim 1, wherein the LED support is integrally packaged with a deep light-transmitting material after die bonding and wire bonding.

7. The double-sided etched ultra-dense LED support according to claim 6, wherein the deep light-transmitting material is black or brown light-transmitting plastic.

8. The double-sided etched ultra-dense LED holder as claimed in claim 1, wherein the stepped structure of the upper surface includes a first functional region and a second functional region, the red wafer is disposed in the first functional region, and the blue and green wafers are disposed in the second functional region.