CN217135652U

CN217135652U - Micro-power consumption ultra-high sensitivity microphone

Info

Publication number: CN217135652U
Application number: CN202220196381.5U
Authority: CN
Inventors: 钱万进
Original assignee: Shenzhen Guobang Electronic Technology Co ltd
Current assignee: Shenzhen Guobang Electronic Technology Co ltd
Priority date: 2022-01-20
Filing date: 2022-01-20
Publication date: 2022-08-05
Anticipated expiration: 2032-01-20

Abstract

The utility model provides a little consumption ultra high sensitivity microphone, including PCB board and housing, the annular has been seted up to the axle center department of PCB board top outer wall, and the welding of the axle center department of ring tank bottom inner wall has an equipment section of thick bamboo, and the welding of the axle center department of equipment section of thick bamboo top inner wall has a loudspeaker cover, and the top of loudspeaker cover inside wall bonds and has the filter screen. The utility model discloses sound packaging mode before the rectilinear flip-chip of MEMS chip, the sensitivity and the SNR of device have been increased, collocation use between loudspeaker cover and the acoustic cover, make the sound of advancing can MEMS chip direct contact in comparatively confined environment, fine promotion MEMS chip's sensitivity, the reference column is pegged graft in the inside of constant head tank under the effect of spacing dish and spring, it can be more firm to make to be connected between housing and the PCB board, and when the shifting block drove the reference column along the spout and removes to the post inslot side, the reference column withdraws from the constant head tank, make the housing be convenient for dismantle more.

Description

Micro-power consumption ultra-high sensitivity microphone

Technical Field

The utility model belongs to the technical field of the microphone technique and specifically relates to a little consumption ultra-high sensitivity microphone.

Background

The microphone can convert voice signals of people into corresponding electric signals, and is widely applied to mobile phones, computers, telephones, cameras, video cameras and the like. The traditional electret condenser microphone adopts Teflon as a vibration film, and cannot bear the high temperature of nearly 300 ℃ in a reflow soldering process of a printed circuit board, so that the traditional electret condenser microphone can only be assembled manually independently from the assembly of an integrated circuit, and the production cost is greatly increased.

At present, most microphones in the prior art adopt a back-to-back voice packaging mode, after a device and a PCB are mounted, the sensitivity and the signal-to-noise ratio of the microphone are affected, the sensitivity of the microphone device is reduced, and the power consumption of the device when the microphone is used is increased. Therefore, a micro-power consumption ultra-high sensitivity microphone is needed to solve the above problems.

Disclosure of Invention

An object of the utility model is to overcome prior art's not enough, adapt to reality needs, provide a little consumption ultra high sensitivity microphone of structural design novelty.

In order to realize the utility model discloses a purpose, the utility model discloses the technical scheme who adopts does:

the design is a micro-power-consumption microphone with ultrahigh sensitivity, which comprises a PCB (printed Circuit Board) and a housing, wherein an annular groove is formed in the axle center of the outer wall of the top of the PCB, an equipment cylinder is welded in the axle center of the inner wall of the bottom of the annular groove, a horn cover is welded in the axle center of the inner wall of the top of the equipment cylinder, a filter screen is bonded at the top of the inner side wall of the horn cover, a sound cover is bonded at the bottom of the outer side wall of the horn cover, a groove is formed in the axle center of the inner wall of the bottom of the sound cover, an MEMS (micro electro mechanical System) chip is bonded in the axle center of the outer wall of the bottom of the sound cover, the MEMS chip is welded on the inner wall of the bottom of the annular groove through a copper leg wire, an ASIC chip is welded on one side of the inner wall of the bottom of the annular groove, and the ASIC chip and the MEMS chip are electrically connected through a wiring.

The welding has the holding ring on the bottom outer wall of housing, and the holding ring is pegged graft in the inside of annular, it has the sealing washer to bond between holding ring and the annular.

An engaging groove is formed in the axis of the outer wall of the top of the housing, and a ring plate is bonded inside the engaging groove.

The outer wall of the top of the ring plate is provided with sound holes distributed in an annular structure at equal intervals, and the inner side wall of each sound hole is bonded with a dust filter screen.

The bottom welding of housing lateral wall has the equidistance to be the protruding foot that the annular structure distributes, and has all seted up the constant head tank on the both sides outer wall of holding ring.

The post groove has all been seted up to the both sides of annular inside wall, and the inside in post groove is pegged graft and is had the reference column, the reference column is located the welding of the one end of post inslot portion and has spacing dish, and the welding has the spring on the opposite side outer wall that the reference column was kept away from to spacing dish, the reference column is pegged graft under the effect of spacing dish and spring in the inside of constant head tank.

The PCB board is close to and offers the spout that is linked together between the post groove on the top outer wall in post groove, and the reference column is located the welding of the top outer wall in post groove and has the shifting block that runs through the spout.

The beneficial effects of the utility model reside in that:

(1) through the loudspeaker cover that sets up, the sound packaging mode before the rectilinear flip-chip of MEMS chip has increased the sensitivity and the SNR of device, and the collocation between loudspeaker cover and the sound cover is used, makes the sound of advancing can MEMS chip direct contact in comparatively confined environment, fine promotion the sensitivity of device, and the promotion of microphone device sensitivity can reduce effectively because of the lower consumption increase that causes of microphone device sensitivity.

(2) Through the housing, the housing can play a good protective role to the equipment cylinder, so that the service life of an electronic element can be effectively prolonged, and the compactness and the stability of the fit between the housing and the inner wall of the bottom of the ring groove are well improved through the sealing ring.

(3) Through the reference column that sets up, the reference column is pegged graft in the inside of constant head tank under the effect of spacing dish and spring for be connected more firmly between housing and the PCB board, and when the shifting block drove the reference column along the spout and move to the post inslot side, the reference column withdrawed from the constant head tank, makes the housing be convenient for dismantle more, rational in infrastructure, convenient operation is fit for promoting.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present design;

FIG. 2 is a schematic diagram of the explosive structure in the present design;

FIG. 3 is a schematic view of the horn cover structure of the present design;

fig. 4 is a partial structural diagram of the present design.

In the figure: 1. a PCB board; 2. a housing; 3. a ring groove; 4. a positioning ring; 5. a seal ring; 6. a convex foot; 7. a fitting groove; 8. a ring plate; 9. a sound hole; 10. a dust filter screen; 11. an equipment barrel; 12. a horn cover; 13. filtering with a screen; 14. an acoustic enclosure; 15. an ASIC chip; 16. a groove; 17. an MEMS chip; 18. positioning a groove; 19. a column groove; 20. a spring; 21. a positioning column; 22. a limiting disc; 23. a chute; 24. and (5) shifting blocks.

Detailed Description

The invention will be further described with reference to the following figures and examples:

a micro-power consumption ultra-high sensitivity microphone, refer to figures 1 to 4, comprises a PCB (printed Circuit Board) 1 and a housing 2, wherein a ring groove 3 is arranged at the axis of the outer wall of the top of the PCB 1, an equipment cylinder 11 is welded at the axis of the inner wall of the bottom of the ring groove 3, a horn cover 12 is welded at the axis of the inner wall of the top of the equipment cylinder 11, a filter screen 13 is adhered at the top of the inner wall of the horn cover 12, a sound cover 14 is adhered at the bottom of the outer wall of the horn cover 12, a groove 16 is arranged at the axis of the inner wall of the bottom of the sound cover 14, an MEMS chip 17 is adhered at the axis of the outer wall of the bottom of the sound cover 14, the MEMS chip 17 is welded on the inner wall of the bottom of the ring groove 3 through a copper leg wire, an ASIC chip 15 is welded at one side of the inner wall of the bottom of the ring groove 3 close to the MEMS chip 17, the ASIC chip 15 is electrically connected with the MEMS chip 17 through a wire, a vertical type forward sound packaging mode of the MEMS chip 17 is adopted, the sensitivity and the signal-to-noise ratio of the device are increased, the horn cover 12 and the acoustic cover 14 are used in a matched manner, so that the forward sound can be directly contacted with the MEMS chip 17 in a closed environment, and the sensitivity of the MEMS chip 17 is well improved.

Further, welding has holding ring 4 on the bottom outer wall of housing 2 in this design, and holding ring 4 pegs graft in the inside of annular 3, and it has sealing washer 5 to bond between holding ring 4 and the annular 3, and the fine compactness and the stability of laminating between housing 2 and the 3 bottom inner walls of annular of promotion of sealing washer 5.

Further, the axle center department of housing 2 top outer wall has seted up in this design and has agreed with groove 7, and the inside bonding that agrees with groove 7 has ring plate 8, sets up the equidistance on ring plate 8's the top outer wall and is the sound hole 9 that the loop configuration distributes, and bonds on the inside wall of sound hole 9 and have dust filter screen 10, dust filter screen 10 can effectual isolated dust pass the inside that sound hole 9 got into housing 2, avoids the dust to get into the problem that leads to electronic component short circuit sensitivity to reduce.

Further, the bottom welding of 2 lateral walls of housing has the protruding foot 6 that the equidistance is the annular structure and distributes in this design, and all seted up constant head tank 18 on the both sides outer wall of holding ring 4, column groove 19 has all been seted up to the both sides of 3 inside walls of annular, and peg graft in the inside of column groove 19 has reference column 21, reference column 21 is located the welding of the inside one end of column groove 19 has spacing dish 22, and the welding has spring 20 on spacing dish 22 keeps away from the opposite side outer wall of reference column 21, peg graft in the inside of constant head tank 18 under spacing dish 22 and spring 20's effect, make to be connected between housing 2 and the PCB board 1 can be more firm.

Further, offer the spout 23 that is linked together between 19 with the post groove on the top outer wall that PCB board 1 is close to post groove 19 in this design, and reference column 21 is located the welding on the top outer wall of post groove 19 and has a shifting block 24 that runs through spout 23, and when shifting block 24 drove reference column 21 along spout 23 and moves to post groove 19 inboard, reference column 21 withdrawed from constant head tank 18 for housing 2 is convenient for dismantle more.

To sum up the utility model discloses a theory of operation does: when this micro-power consumption ultra-high sensitivity microphone uses, reference column 21 pegs graft in the inside of constant head tank 18 under spacing dish 22 and spring 20's effect, it can be more firm to make to be connected between housing 2 and the PCB board 1, and shifting block 24 drives when reference column 21 moves to post 19 inboard along spout 23, reference column 21 withdraws from constant head tank 18, make housing 2 be convenient for dismantle more, housing 2 can play fine guard action to equipment section of thick bamboo 11, thereby can effectual extension electronic component's life, sound encapsulation mode is advanced in MEMS chip 17's rectilinear flip-chip, the sensitivity and the SNR of device have been increased, collocation use between loudspeaker cover 12 and the acoustic cover 14, make the sound of advancing can MEMS chip 17 direct contact in comparatively confined environment, fine promotion MEMS chip 17's sensitivity.

The embodiment of the present invention discloses a preferred embodiment, but not limited thereto, and those skilled in the art can easily understand the spirit of the present invention according to the above embodiment, and make different extensions and changes, but do not depart from the spirit of the present invention, all of which are within the protection scope of the present invention.

Claims

1. The utility model provides a little consumption ultra-high sensitivity microphone, includes PCB board (1) and housing (2), its characterized in that, annular (3) have been seted up to the axle center department of PCB board (1) top outer wall, and the axle center department welding of annular (3) bottom inner wall has an equipment section of thick bamboo (11), the welding of the axle center department of equipment section of thick bamboo (11) top inner wall has loudspeaker cover (12), and the top of loudspeaker cover (12) inside wall bonds and has filter screen (13), the bottom of loudspeaker cover (12) lateral wall bonds and has sound cover (14), and the axle center department of sound cover (14) bottom inner wall sets up fluted (16), the axle center bonding of sound cover (14) bottom outer wall has MEMS chip (17), and MEMS chip (17) pass through copper leg wire welding on the bottom inner wall of annular (3), the welding of one side that annular (3) bottom inner wall is close to MEMS chip (17) has ASIC chip (15), and the ASIC chip (15) and the MEMS chip (17) are electrically connected through a wire.

2. A micro-power ultra-high sensitivity microphone as claimed in claim 1, wherein: the welding has holding ring (4) on the bottom outer wall of housing (2), and inside at annular (3) is pegged graft in holding ring (4), it has sealing washer (5) to bond between holding ring (4) and annular (3).

3. The micro-power ultra-high sensitivity microphone according to claim 1, wherein: an engagement groove (7) is formed in the axis of the outer wall of the top of the housing (2), and a ring plate (8) is bonded inside the engagement groove (7).

4. A micro-power ultra-high sensitivity microphone as claimed in claim 3, wherein: the sound holes (9) distributed in an annular structure at equal intervals are formed in the outer wall of the top of the annular plate (8), and a dust filtering net (10) is bonded on the inner side wall of each sound hole (9).

5. The micro-power ultra-high sensitivity microphone according to claim 2, wherein: the bottom welding of housing (2) lateral wall has protruding foot (6) that the equidistance is the annular structure and distributes, and all seted up constant head tank (18) on the both sides outer wall of holding ring (4).

6. The micro-power ultra-high sensitivity microphone according to claim 5, wherein: column groove (19) have all been seted up to the both sides of annular (3) inside wall, and the inside of column groove (19) is pegged graft and is had reference column (21), reference column (21) are located the inside one end welding of column groove (19) and have spacing dish (22), and spacing dish (22) keep away from the welding on the opposite side outer wall of reference column (21) have spring (20), reference column (21) are pegged graft in the inside of constant head tank (18) under the effect of spacing dish (22) and spring (20).

7. The micro-power ultra-high sensitivity microphone according to claim 6, wherein: a sliding groove (23) communicated with the column groove (19) is formed in the outer wall of the top, close to the column groove (19), of the PCB (1), and a shifting block (24) penetrating through the sliding groove (23) is welded on the outer wall of the top, located in the column groove (19), of the positioning column (21).