CN217134390U

CN217134390U - Silicon chip burst shower nozzle and insert machine

Info

Publication number: CN217134390U
Application number: CN202220209688.4U
Authority: CN
Inventors: 任新刚; 鲁战锋; 张珊; 冯亚波; 迪大明; 成路
Original assignee: Longi Green Energy Technology Co Ltd
Current assignee: Longi Green Energy Technology Co Ltd
Priority date: 2022-01-25
Filing date: 2022-01-25
Publication date: 2022-08-05
Anticipated expiration: 2032-01-25

Abstract

The utility model provides a silicon wafer separating spray head and a wafer inserting machine, wherein the silicon wafer separating spray head comprises a spray head body fixed on the wafer inserting machine; in the length direction of the spray head body, the spray head body is divided into at least two subareas, and the two adjacent subareas are not communicated; on the width direction of shower nozzle body, the shower nozzle body includes relative first surface and second surface, is equipped with two at least water inlets that are used for connecting the water pipe of insert machine on the first surface, and a subregion sets up a water inlet, is equipped with a plurality of apopores on the second surface, and the apopore of each subregion communicates with the water inlet that corresponds respectively to pile up a plurality of silicon chips of placing and carry out water spray separation. Therefore, each subarea of the silicon wafer slicing spray head can independently spray water so as to enable the pressure of water outlets of each subarea to be consistent, and therefore the silicon wafer can be effectively sliced.

Description

Silicon chip burst shower nozzle and insert machine

Technical Field

The utility model relates to a photovoltaic technology field, concretely relates to silicon chip burst device and insert machine.

Background

Photovoltaic power generation has been increasingly emphasized and vigorously developed as one of green energy and main energy for human sustainable development. The silicon wafer is a main production material for photovoltaic power generation, the multi-wire cutting technology of the silicon wafer is an advanced silicon wafer processing technology at present, and a cutting edge material attached to a steel wire is driven by a steel wire moving at a high speed to rub a silicon rod so as to achieve a cutting effect.

In the manufacturing process of the silicon wafer, the silicon wafers cut by the silicon rod are stacked together and need to be separated and then inserted into the silicon wafer bearing box for transportation. At present, the method has two modes of horizontal slicing and vertical slicing, and the vertical slicing has wide application due to low cost and low slicing rate.

In the existing vertical slicing, slicing is generally performed on a silicon wafer through the spraying function of a spray head, however, slicing cannot be separated frequently, and slicing effect is poor.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a silicon chip burst shower nozzle and insert machine to when the shower nozzle carries out the burst to the silicon chip among the solution correlation technique, owing to appear the phenomenon that the burst can not be divided often and lead to the poor technical problem of burst effect.

In order to solve the technical problem, the utility model discloses a realize like this:

in a first aspect, an embodiment of the present invention provides a silicon wafer slicing nozzle, including: the nozzle body is used for being fixed on the insert machine;

in the length direction of the spray head body, the spray head body is divided into at least two subareas, and the two adjacent subareas are not communicated;

in the width direction of the spray head body, the spray head body comprises a first surface and a second surface which are opposite, at least two water inlets used for being connected with the wafer inserting machine are arranged on the first surface, one water inlet is arranged in each partition, a plurality of water outlets are arranged on the second surface, and the water outlets of the partitions are respectively communicated with the corresponding water inlets so as to carry out water spray separation on a plurality of stacked silicon wafers.

Further, in the length direction of the nozzle body, from one side where the silicon wafers are stacked to one side where the silicon wafers are separated, the aperture of the water outlet holes in at least two of the partitions is gradually increased, wherein the aperture of the water outlet holes in one of the partitions is the same.

Furthermore, the aperture of the water outlet is smaller than or equal to 1.5 mm.

Furthermore, the nozzle body is divided into three partitions, and the aperture of the water outlet holes in the three partitions is gradually increased from the stacked side of the silicon wafers to the separated side of the silicon wafers in the length direction of the nozzle body.

Further, a plurality of water outlet holes in each partition on the second surface are uniformly arranged.

Furthermore, a first channel and a second channel are respectively arranged in each subarea, the first channel is arranged along the width direction of the sprayer body, and the second channel is vertical to the first channel;

the water inlet, the first channel, the second channel and the plurality of water outlets in one partition are communicated in sequence.

Further, the nozzle body includes a working portion and a connecting portion;

in the length direction of the sprayer body, the working part is divided into at least two partitions, at least two water inlets are formed in a first surface corresponding to the working part, and a plurality of water outlets are formed in a second surface corresponding to the working part;

in the length direction of the spray head body, the connecting parts are respectively arranged on two sides of the working part and are used for being connected with the wafer inserting machine.

Furthermore, the cross-sectional shape of the working part and the cross-sectional shape of the connecting part are both rectangular, and the width of the connecting part is smaller than that of the working part;

every be equipped with the mounting hole on the connecting portion, the mounting hole be used for with insert the mascerating machine is connected.

The embodiment of the utility model provides a silicon chip burst shower nozzle has following advantage:

in an embodiment of the present invention, the silicon wafer slicing nozzle includes: the nozzle body is used for being fixed on the insert machine; in the length direction of the spray head body, the spray head body is divided into at least two subareas, and the two adjacent subareas are not communicated; on the width direction of shower nozzle body, the shower nozzle body includes relative first surface and second surface, is equipped with two at least water inlets that are used for connecting the water pipe of insert machine on the first surface, and a subregion sets up a water inlet, and the second is equipped with a plurality of apopores on the surface, and the apopore of each subregion communicates with the water inlet that corresponds respectively to pile up the silicon chip of placing a plurality of and carry out water spray separation. Therefore, each subarea of the silicon wafer slicing spray head can independently spray water so as to enable the pressure of water outlets of each subarea to be consistent, and therefore the silicon wafer can be effectively sliced.

In a second aspect, an embodiment of the present invention provides a wafer inserting machine, which includes a material holder and the silicon wafer slicing nozzle;

the material support is loaded with a plurality of stacked silicon wafers, and the silicon wafer slicing nozzles spray water to the silicon wafers for separation.

Furthermore, at least one silicon wafer separating sprayer is respectively arranged on two sides of the material support, and the silicon wafer separating sprayers on the two sides of the material support are arranged in a staggered mode.

The advantages of the wafer inserting machine are the same as those of the silicon wafer slicing sprayer, and the description is omitted here.

Drawings

Fig. 1 shows a schematic three-dimensional structure diagram of a silicon wafer slicing showerhead provided in an embodiment of the present invention;

fig. 2 is a schematic view of a silicon wafer slicing showerhead provided in an embodiment of the present invention at a first viewing angle;

fig. 3 is a schematic view of a silicon wafer slicing showerhead provided in an embodiment of the present invention at a second viewing angle;

fig. 4 is a schematic cross-sectional view of a second channel of a silicon wafer slicing showerhead according to an embodiment of the present invention;

fig. 5 is a schematic cross-sectional view illustrating another second channel of a silicon wafer slicing showerhead according to an embodiment of the present invention;

fig. 6 is a schematic cross-sectional view illustrating a first channel of a silicon wafer slicing showerhead according to an embodiment of the present invention;

fig. 7 is a schematic diagram of a portion of a wafer inserting machine according to an embodiment of the present invention;

fig. 8 shows a second schematic view of a part of a wafer inserting machine according to an embodiment of the present invention.

Reference numerals:

100-silicon wafer slicing sprayer, 1-sprayer body, 11-partition, 12-first surface, 13-second surface, 14-water inlet, 141-screw thread, 15-water outlet, 16-working part, 17-connecting part, 171-mounting hole, 2-silicon wafer, 3-material support and 4-water absorption plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the embodiment of the present invention, a silicon wafer separating nozzle 100 is provided, referring to fig. 1 to 6, the silicon wafer separating nozzle 100 specifically may include: the nozzle body 1 is used for being fixed on a sheet inserting machine; in the length direction of the spray head body 1, the spray head body 1 is divided into at least two subareas 11, and the two adjacent subareas 11 are not communicated; on the width direction of shower nozzle body 1, shower nozzle body 1 includes relative first surface 12 and second surface 13, is equipped with two at least water inlets 14 that are used for connecting the water pipe of insert machine on the first surface 12, and a subregion 11 sets up a water inlet 14, is equipped with a plurality of apopores 15 on the second surface 13, and the apopore of each subregion 11 communicates with corresponding water inlet 14 respectively to carry out water spray separation to a plurality of silicon chips of piling up and placing. Therefore, each partition 11 of the silicon wafer slicing nozzle 100 can independently spray water, so that the pressure of the water outlet 15 of each partition 11 is consistent, and the silicon wafer is effectively sliced.

Specifically, the silicon wafer slicing nozzle 100 body 1 is fixed on a wafer inserting machine, the nozzle body 1 is divided into at least two subareas 11 in the length direction of the nozzle body 1, and two adjacent subareas 11 are not communicated with each other.

As shown in fig. 1, the nozzle body 1 includes a first surface 12 and a second surface 13 opposite to each other in a width direction of the nozzle body 1, and at least two water inlets 14 are provided on the first surface 12. One water inlet 14 is arranged in one subarea 11, and each water inlet 14 can be connected with a water pump of the sheet inserting machine through a water pipe. In practice, one end of the water pipe is connected to the water pump, and the other end of the water pipe can be connected to each water inlet 14 through a multi-way joint. The second surface 13 is provided with a plurality of water outlet holes 15, and the plurality of water outlet holes 15 in each partition are respectively communicated with the corresponding water inlet 14, or it can be considered that the water inlet 14 in each partition 11 is respectively communicated with the corresponding water outlet hole 15.

In practical application, after the water pump started, the water pump can lead the water in the insert machine basin into the water inlet 14 of each subregion 11 respectively through the water pipe to respectively follow the 15 blowout of apopore that correspond, with a plurality of piling up and the silicon chip side of placing perpendicularly sprays water, with the purpose of realizing the burst. Because each subarea 11 of the silicon wafer slicing nozzle 100 of the embodiment can independently control the water inflow, generally, the water inflow is greater than the water outflow, and thus, each water outlet 15 in each subarea 11 can be filled with water, so that the pressures of the water outlets 15 of each subarea 11 are consistent, the silicon wafers are sliced effectively, and the slicing effect is improved.

The embodiment of the utility model provides an in, on the length direction of shower nozzle body 1, from one side that the silicon chip piled up to one side of silicon chip separation, the aperture of apopore 15 in two at least subregion 11 increases gradually, and wherein, the aperture of apopore 15 in each subregion 11 is the same.

In an alternative embodiment, as shown in fig. 1, 2 and 4, the head body 1 is divided into three partitions 11 in the longitudinal direction of the head body 1, i.e., in the illustrated left-right direction. Correspondingly, as shown in fig. 3 and 5, three water inlets 14 are also provided on the first surface 12, and one water inlet 14 is provided on one partition 11, so that the other end of the water pipe can be respectively connected with the three water inlets 14 through a four-way joint. From the side of the silicon wafer stack to the side of the silicon wafer stack, i.e. from the left to the right in the drawing, the apertures of the water outlet holes 15 in the three partitions 11 (which may be referred to as pre-partition, partition and stable region in turn) gradually increase, wherein the apertures of the water outlet holes 15 in the same partition are the same. It can also be considered that the density of the outlet holes 15 in the pre-partition, partition and stable region gradually decreases, that is, the diameter of the outlet hole 15 closest to the pre-partition 11 of the silicon wafer is the smallest and the number is the largest, and the diameter of the outlet hole 15 farthest from the stable region of the silicon wafer is the largest and the number is the smallest. With the arrangement, the water pressure of the pre-partition 11 is the largest, and the water sprayed from the water outlet holes 15 is sprayed between the rightmost silicon wafer and the adjacent silicon wafer, so that the rightmost silicon wafer and the adjacent silicon wafer can be separated more easily. In practice, because a plurality of stacked silicon wafers can move towards the spray head, after the rightmost silicon wafer is separated, the water sprayed from the subareas and the stabilizing areas can stabilize the separated silicon wafers in the water tank and can keep a certain distance from the adjacent silicon wafers, so that the silicon wafers are prevented from being damaged due to friction between the two silicon wafers.

The embodiment of the utility model provides an in, apopore 15's aperture less than or equal to 1.5mm to have a determining deviation between the silicon chip that makes the rightmost and its adjacent silicon chip, play the effect of burst. Of course, the upper limit value of the aperture of the water outlet hole 15 is not limited to 1.5mm, and may be set to other sizes according to the specific structure of the actual nozzle body 1. The minimum value of the aperture of the water outlet hole 15 may be 0.5mm, 0.3mm, or the like, which is not limited in this embodiment, and the specific requirement is set according to the specific structure of the actual nozzle body 1.

In the embodiment of the present invention, the plurality of water outlets 15 in each partition 11 on the second surface 13 are uniformly disposed.

Illustratively, as shown in fig. 1 and fig. 2, the plurality of outlet holes 15 in each partition 11 are uniformly arranged, so that the water quantity of the outlet holes 15 in each partition 11 is uniform, and is uniformly sprayed to the silicon wafer to be separated, thereby further improving the slicing effect.

In the embodiment of the present invention, each partition 11 is further provided with a first channel and a second channel, the first channel is arranged along the width direction of the nozzle body 1, and the second channel is perpendicular to the first channel; the water inlet 14, the first channel, the second channel and the water outlets 15 in one subarea 11 are communicated in sequence.

Specifically, each partition 11 is a water inlet 14, a first channel, a second channel, and a plurality of water outlets 15 in sequence from the rear to the front of the diagram, that is, the plurality of water outlets 15 are disposed on the side wall of the second channel far from the water inlet 14. It should be noted that the first channel may be arranged along the front-back direction of the figure, the second channel may be arranged along the left-right direction of the figure, and the sectional area of the first channel may be smaller than that of the second channel, so that the impact force of the water column may be reduced, and damage to the silicon wafer may be avoided.

In the embodiment of the present invention, as shown in fig. 6, each water inlet 14 is respectively provided with a thread 141, and the thread 141 is used for being detachably connected with the corresponding water pipe.

Specifically, in order to facilitate connection and disconnection of each water inlet 14 to and from the water pipe, and in fact, in order to facilitate connection and disconnection of each water inlet 14 to and from the water pipe connector (the four-way connector described above), each water inlet 14 of the present embodiment is provided with a thread 141 that matches the connector. The thread 141 extends from the first surface 12 towards its corresponding first passage, for which the length is set by the length of the thread matching the length of the connecting water pipe.

In the embodiment of the present invention, as shown in fig. 1, the nozzle body 1 includes a working portion 16 and a connecting portion 17; in the length direction of the nozzle body 1, the working part 16 is divided into at least two subareas 11, at least two water inlets 14 are arranged on a first surface 12 corresponding to the working part 16, and a plurality of water outlets 15 are arranged on a second surface 13 corresponding to the working part 16; in the length direction of the nozzle body 1, two sides of the working part 16 are respectively provided with a connecting part 17, and the connecting parts 17 are used for being connected with a chip inserting machine.

Specifically, as shown in fig. 1, the operating unit 16 is divided into three sections 11 in the longitudinal direction of the head body 1, that is, in the illustrated left-right direction, such that the water inlet 14 is provided on the first surface 12 corresponding to the operating unit 16, the plurality of water outlet holes 15 are provided on the second surface 13 corresponding to the operating unit 16, and the first channel and the second channel are also provided on the operating unit 16. As shown in fig. 3, each water inlet 14 is disposed in the middle of the corresponding partition 11 on the first surface 12, so that the length of the channel connecting each water inlet 14 and the corresponding water outlet 15 is shortest, the path of the water flow is shortest, and the efficiency of the water separation can be improved.

Specifically, as shown in fig. 1, the left side and the right side of the working portion 16 are respectively provided with a connecting portion 17 in the left-right direction, wherein the connecting portion 17 and the working portion 16 are integrally formed to improve the strength of the head body 1, thereby improving the service life of the head body 1. The cross-sectional shape of the working portion 16 and the cross-sectional shape of the connecting portion 17 are both rectangular, and the width (the length in the front-rear direction in the figure) of the connecting portion 17 is smaller than the width of the working portion 16, so that the head body 1 is simple in structure, small and easy to manufacture.

Specifically, as shown in fig. 1, each connecting portion 17 is provided with a mounting hole 171, the mounting hole 171 is used for connecting with a chip inserter, wherein the mounting hole 171 may be a blind hole or a through hole, and the mounting hole 171 is set according to actual conditions, and when the mounting hole 171 is a blind hole, the mounting hole 171 extends from the upper surface to the lower surface of the head body 1.

in an embodiment of the present invention, the silicon wafer slicing nozzle includes: the nozzle body is used for being fixed on the insert machine; in the length direction of the spray head body, the spray head body is divided into at least two subareas, and the two adjacent subareas are not communicated; on the width direction of shower nozzle body, the shower nozzle body includes relative first surface and second surface, is equipped with two at least water inlets that are used for connecting the water pipe of insert machine on the first surface, and a subregion sets up a water inlet, is equipped with a plurality of apopores on the second surface, and the apopore of each subregion communicates with the water inlet that corresponds respectively to pile up a plurality of silicon chips of placing and carry out water spray separation. Therefore, each subarea of the silicon wafer slicing spray head can independently spray water so as to enable the pressure of water outlets of each subarea to be consistent, and therefore the silicon wafer can be effectively sliced.

The embodiment of the utility model provides a wafer inserting machine, referring to fig. 7, the wafer inserting machine can specifically include a material support 3 and the silicon wafer slicing spray head 100; the material support 3 is loaded with a plurality of stacked silicon wafers 2, and the silicon wafer slicing spray head 100 sprays water to the silicon wafers 2 for separation.

In fact, the insert machine includes basin and water pump, and the water pump leads to pipe (and lead to more) and links to each other with two at least water inlets 14 of shower nozzle body 1 of silicon chip burst shower nozzle 100, and after the water pump started, the water pump can lead to each water inlet 14 with the water in the basin leads to respectively through corresponding first passageway, first passageway and the 15 blowout of apopore in shower nozzle body 1 to spout to the side of silicon chip 2, realize carrying out the purpose of burst to piling up silicon chip 2 of placing.

In the embodiment of the present invention, referring to fig. 8, the two sides of the material support 3 are respectively provided with at least one silicon wafer separating nozzle 100, and the two sides of the material support 3 are staggered with respect to the silicon wafer separating nozzle 100.

Particularly, the piece-separating spray head is suitable for a vertical type insert piece. The silicon wafer separating nozzles 100 on the two sides of the material support 3 are arranged in a staggered mode, which means that water outlets of the silicon wafer separating nozzles 100 are not on the same plane, wherein the plane can be a horizontal plane or a vertical plane, and therefore silicon wafers can be prevented from being stressed unevenly and broken due to turbulence caused by water column hedging.

Illustratively, as shown in fig. 8, two silicon wafer slicing nozzles 100 are respectively disposed on two sides of the tray 3, the two silicon wafer slicing nozzles 100 on the same side are disposed oppositely, and are parallel up and down in the drawing, and the four silicon wafer slicing nozzles 100 on two sides are disposed in a staggered manner, that is, the centers of the four silicon wafer slicing nozzles 100 are not on the same plane. In the direction from top to bottom, the silicon wafer slicing sprayer 100 on the upper left side, the silicon wafer slicing sprayer 100 on the upper right side, the silicon wafer slicing sprayer 100 on the lower left side and the silicon wafer slicing sprayer 100 on the lower right side are arranged in sequence, and the staggered arrangement mode can reduce the relative impact of water flow of the water outlet holes on the same plane, so that the water flow sprayed to the silicon wafers is more uniform, and the slicing efficiency and stability are improved. Certainly, the dislocation arrangement is not limited to the illustrated example, and with reference to fig. 8, the two silicon wafer slicing showerheads 100 on the same side may not be arranged oppositely, that is, not parallel to each other, and the number of the silicon wafer slicing showerheads 100 on the two sides may be different, and the specific dislocation manner of the silicon wafer slicing showerheads 100 may be specifically set according to actual needs.

In practice, the wafer inserting machine further includes a water suction plate 4 disposed on one side (shown as the right side) of the material support, and the water suction plate 4 is provided with negative pressure water suction holes for sucking the separated silicon wafers 2 to be conveyed to a turnover mechanism of the wafer inserting machine, where the turnover mechanism is used for turning over the vertical silicon wafers into a horizontal state.

The work flow of the insert machine is as follows: 1) the material support 3 loaded with a plurality of stacked silicon wafers 2 moves towards the water absorption plate 4 under the drive of a motor, and stops moving to a preset distance; 2) a part of silicon wafer slicing nozzles 100 on two sides of the material support 3 spray water to the side surfaces of the silicon wafers 2 so as to gradually separate the laminated silicon wafers 2 one by one, and meanwhile, the other part of silicon wafer slicing nozzles 100 spray water to the position between the rightmost silicon wafer 2 and the adjacent silicon wafer 2 so as to separate the two silicon wafers by a certain distance, so that the rightmost silicon wafer 2 is close to the water absorption plate 4; 3) the rightmost silicon wafer 2 is adsorbed on the water absorption plate 4, and the water absorption plate 4 conveys the silicon wafer to the turnover mechanism through a belt.

The utility model provides a sheet inserting machine has following advantage:

in the embodiment of the utility model, the insert machine comprises the silicon wafer separating nozzle, the silicon wafer separating nozzle is divided into at least two subareas, and each subarea can independently spray water, so that the pressure of water outlets of each subarea is consistent, and the silicon wafer is effectively separated; in addition, the silicon wafer slicing nozzles on the two sides of the material support are arranged in a staggered mode, so that the phenomenon that silicon wafers are stressed unevenly and broken due to turbulent flow caused by water column hedging can be avoided.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

While alternative embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the invention.

Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or terminal device comprising the element.

It is right above to the technical scheme that the utility model provides a detailed introduction has been carried out, and it is right to have used specific individual example herein the utility model discloses a principle and implementation mode have been elucidated, simultaneously, to the general technical staff in this field, according to the utility model discloses a principle and implementation mode all have the change part on concrete implementation mode and application scope, to sum up, this description content should not be understood as the restriction of the utility model.

Claims

1. A silicon wafer slicing nozzle is characterized by comprising: the nozzle body is used for being fixed on the insert machine;

2. The silicon wafer slicing sprayer of claim 1, wherein the diameter of the water outlet holes in at least two of the sub-areas gradually increases from the side where the silicon wafers are stacked to the side where the silicon wafers are separated in the length direction of the sprayer body, and the diameter of the water outlet holes in one of the sub-areas is the same.

3. The silicon wafer slicing sprayer of claim 2, wherein the diameter of the water outlet hole is less than or equal to 1.5 mm.

4. The silicon wafer slicing showerhead of claim 2, wherein the showerhead body is divided into three zones, and the diameters of the water outlet holes in the three zones gradually increase from a side where the silicon wafers are stacked to a side where the silicon wafers are separated in a length direction of the showerhead body.

5. The silicon wafer slicing sprayer of claim 1, wherein the plurality of water outlets in each of the sub-areas on the second surface are uniformly arranged.

6. The silicon wafer slicing sprayer of claim 1, wherein each of the sub-areas is further provided with a first channel and a second channel, respectively, the first channel is arranged along the width direction of the sprayer body, and the second channel is perpendicular to the first channel;

7. The silicon wafer slicing showerhead of claim 1, wherein the showerhead body comprises a working portion and a connecting portion;

8. The silicon wafer slicing sprayer of claim 7, wherein the cross-sectional shape of the working portion and the cross-sectional shape of the connecting portion are both rectangular, and the width of the connecting portion is smaller than the width of the working portion;

9. A wafer inserting machine, which is characterized by comprising a material support and the silicon wafer slicing sprayer of any one of claims 1 to 8;

10. The wafer inserting machine according to claim 9, wherein at least one silicon wafer slicing nozzle is respectively arranged on two sides of the stock, and the silicon wafer slicing nozzles on the two sides of the stock are arranged in a staggered manner.