CN217103899U

CN217103899U - Amplification module device applied to digital PCR

Info

Publication number: CN217103899U
Application number: CN202220051965.3U
Authority: CN
Inventors: 刘杰; 吕才树; 钟要齐; 王海; 吴林涛; 卢孔晋
Original assignee: Medcaptain Medical Technology Co Ltd
Current assignee: Medcaptain Medical Technology Co Ltd
Priority date: 2022-01-10
Filing date: 2022-01-10
Publication date: 2022-08-02
Anticipated expiration: 2032-01-10

Abstract

The utility model provides a technical problem lie in providing a can realize the amplification module device of quick temperature rise and fall. The method is realized by adopting the following technical scheme: an amplification module device applied to digital PCR comprises a containing module part and a heating part; the accommodating module part comprises a module body and a module mask matched with the module body, the module body comprises a bottom plate and a plurality of accommodating units which are uniformly distributed on the bottom plate, the accommodating units are cylindrical and extend out of the bottom plate, a reaction cavity matched with the reaction cup is arranged in the accommodating units, hollow structures are arranged in the spacing areas between the accommodating units on the bottom plate, and connecting edge parts are formed between the adjacent accommodating units; the module face cover is arranged on the module body and provided with a hole-shaped structure matched with the open end of the reaction cavity of the accommodating unit, and a heat insulation material is filled between the module face cover and the module body.

Description

Amplification module device applied to digital PCR

Technical Field

The utility model relates to a digital PCR technical field, concretely relates to be applied to digital PCR's amplification module device.

Background

The PCR reaction is one of the main processes of qPCR and digital PCR, and the main process is the process of temperature control change, namely the process of realizing rapid temperature change. The process mainly comprises three temperature sections, namely, a, heating a sample to about 95 ℃ for denaturation, b, cooling the sample to about 55 ℃ for annealing, and c, heating the sample to about 72 ℃ for extension. Repeating the temperature increasing and decreasing process from a to c for about 35 to 40 times.

For the current qPCR, especially for the digital PCR, as a larger reaction vessel is adopted, the volume of the module is increased, the temperature rising and falling speed of the module is slower and slower, and the PCR reaction time is one of the main factors for restricting the time of the whole detection process. Therefore, development of a module technology capable of rapidly increasing and decreasing temperature is of great importance for shortening PCR reaction time and further shortening the whole detection process.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem provide a can realize the amplification module device of quick rise and fall temperature. The method is realized by adopting the following technical scheme:

an amplification module device applied to digital PCR comprises a containing module part and a heating part; the accommodating module part comprises a module body and a module face cover matched with the module body, the module body comprises a bottom plate and a plurality of accommodating units which are uniformly distributed on the bottom plate, the accommodating units are cylindrical, extend out of the bottom plate, a reaction cavity matched with the reaction cup is arranged in the accommodating units, hollow structures are arranged in the interval areas between the accommodating units on the bottom plate, and connecting ridge parts are formed between the adjacent accommodating units; the module face cover is arranged on the module body and provided with a hole-shaped structure matched with the open end of the reaction cavity of the accommodating unit, and a heat insulation material is filled between the module face cover and the module body.

In some embodiments, the heating part comprises a temperature equalizing plate, a semiconductor refrigerating sheet, a heat dissipation block and a heat dissipation fan, wherein the temperature equalizing plate, the semiconductor refrigerating sheet, the heat dissipation block and the heat dissipation fan are arranged below the accommodating module part; the semiconductor refrigeration piece comprises at least four symmetrically distributed semiconductor refrigeration pieces and is connected with the radiating block through heat-conducting silicone grease, the radiating fan is installed at the bottom of the radiating block, and the temperature equalizing plate is arranged between the bottom plate of the containing module portion and the semiconductor refrigeration pieces.

In some embodiments, a module panel is further included, the module panel covering the module mask edge and the heat slug.

In some embodiments, the amplification module device further comprises a control part, wherein the control part comprises a PCB board and a control circuit configured on the PCB board for controlling the heating and cooling processes of the heating part.

In some embodiments, the module body is made of a metal alloy material with high thermal conductivity.

In some embodiments, at least two thermistors are arranged in the module body, an annular groove is arranged on the edge of the bottom surface of the bottom plate, and an auxiliary heating wire is arranged in the annular groove.

In some embodiments, the number of the receiving units on the bottom plate is set to 3 × 4-12 holes to 16 × 24-384 holes.

The beneficial effects of the utility model are explained as follows:

the utility model discloses in, hollow out construction has been designed to the module body, satisfying under the structural strength requirement, will the module quality design minimum, consequently compare the module in the past and have lighter quality. Meanwhile, the module body is made of metal with good thermal conductivity, so that the temperature rising and falling speed can be faster, and the PCR reaction time can be obviously shortened. And a heat insulation material is arranged between the module body and the module mask, so that a better heat insulation effect can be achieved.

Drawings

FIG. 1 is a schematic cross-sectional view of an embodiment of an amplification module apparatus according to the present invention.

Fig. 2 is a partial (circled) enlarged schematic view of the embodiment shown in fig. 1.

FIG. 3 is a top partial cross-sectional view of an embodiment of an amplification module apparatus according to the present invention.

FIG. 4 is a schematic diagram of a module body according to an embodiment of the present invention.

Fig. 5 is a front view of the module body shown in fig. 4.

Fig. 6 is a cross-sectional view a-a of the module body shown in fig. 5.

Fig. 7 is a B-B cross-sectional view of the module body shown in fig. 5.

Fig. 8 is a C-C cross-sectional view of the module body shown in fig. 5.

Fig. 9 is a D-D sectional view of the module body shown in fig. 5.

Fig. 10 is a rear view of the module body shown in fig. 4.

Detailed Description

For further understanding of the present invention, preferred embodiments of the present invention will be described below with reference to examples, but it should be understood that these descriptions are only for the purpose of further illustrating the features and advantages of the present invention, and are not intended to limit the claims of the present invention.

As shown in fig. 1-3, for the schematic structural section of the amplification module device according to the embodiment of the present invention, the device includes a housing module portion composed of a module mask 1, a heat insulation material 2 and a module body 3, and a heating portion composed of a vapor chamber 5, a semiconductor cooling plate 6, a heat dissipation block 9 and a heat dissipation fan 10. A thermistor 7 and an auxiliary heating wire 8 are also arranged in the module body 3, and a control circuit is arranged on the PCB 11. Wherein, fill heat preservation material 2 between module face guard 1 and the module body 3, can effectively reduce the calorific loss in the module heating process, improve heating efficiency. The module panel 4 is arranged on the module face mask 1 and the radiating block 9, and the temperature equalizing plate 5 is arranged between the module body 3 and the semiconductor refrigerating sheet 6, so that heat can be transmitted to the module body more uniformly. The semiconductor refrigeration pieces 6 are connected with the radiating block 9 through heat-conducting silicone grease (which is a heat-conducting medium and is not shown in the figure), and the number of the semiconductor refrigeration pieces 6 is generally more than or equal to 4 and is distributed symmetrically. The thermistors 7 are arranged in the thermistors mounting holes 35 in the module body 3 and used for measuring the actual temperature of the module, the number of the thermistors is more than 2, the thermistors are distributed in different areas of the module to detect the temperature of different areas, and the thermistors can also be set to be gradient PCR (namely, the real-time temperature of different areas of the module is not consistent and keeps certain gradient). The heat dissipation fan 10 is arranged at the bottom of the heat dissipation block 9 and can accelerate the heat volatilization of the heat dissipation block 9, and the semiconductor refrigeration sheet 6, the thermistor 7 and the auxiliary heating wire 8 are all connected with the PCB 11.

Referring to fig. 4-10, in the present embodiment, the module body 3 includes a bottom plate 30 and a plurality of receiving units 31 uniformly arranged on the bottom plate 30. The accommodating unit 31 and the bottom plate 30 are integrally formed, the shape is cylindrical, and a reaction cavity matched with the reaction cup is arranged inside the accommodating unit. In this embodiment, only one module is shown, that is, 96 housing units, namely, 12x8, and actually, 3x4 to 16x24 may be designed as required.

In this embodiment, in order to realize a light weight design of the module, the bottom plate 30 is provided with hollow structures 32 in the spacing areas between the accommodating units, and a connecting edge portion 33 is formed between adjacent accommodating units 30. This hollow out construction can effectively reduce the module quality for heat conduction efficiency. Connecting edges 33 can keep module structure intensity under the prerequisite that hollow out construction alleviates module quality to play certain heat conduction effect.

By adopting the structure, the heat conduction effect and the structural strength of the module can be ensured on the premise of effectively reducing the module quality, the lightweight design of the module is realized to the maximum degree, and the faster temperature rise and fall speed of the module is realized, so that the PCR reaction time is obviously shortened.

In some embodiments, the module body 3 is made of a metal alloy material with high thermal conductivity, such as aluminum alloy, copper, silver alloy, etc. (but not limited to the above-mentioned materials).

In some embodiments, the bottom edge of the bottom plate 30 is provided with an annular groove 34, and the auxiliary heating wire is installed in the annular groove 34. The auxiliary heating wires 8 cooperate with the refrigerating sheets to effectively improve the uniformity of the ambient temperature of the module.

The amplification module apparatus in this example was used as follows:

when the reaction cup is placed in the accommodating unit for amplification, the device performs temperature rise and fall actions according to a set program, and firstly a: the refrigerating sheet 6 is electrified to heat the module body 3, meanwhile, the auxiliary heating wire 8 is also electrified to heat the edge of the module body 3, and when the temperature reaches 95 ℃, the refrigerating sheet 6 maintains a tiny current to keep heat balance; b. when the specified time is up, the refrigerating sheet 6 is electrified reversely, the module body 3 absorbs heat, the auxiliary heating wire is powered on temporarily, and when the temperature of the module body 3 reaches 55 ℃, the refrigerating sheet 6 maintains a tiny current to keep heat balance; c. after the specified time, the refrigerating sheet 6 heats the module body 3, the auxiliary heating wire also starts the heating function, and after the temperature reaches 72 ℃, the refrigerating sheet 6 maintains the micro current to keep the heat balance; and repeating the steps a-c 35-40 times until the execution is finished.

The above description of the embodiments is only intended to help understand the method of the present invention and its core idea. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.

Claims

1. An amplification module device applied to digital PCR is characterized by comprising an accommodating module part and a heating part; the accommodating module part comprises a module body and a module face cover matched with the module body, the module body comprises a bottom plate and a plurality of accommodating units which are uniformly distributed on the bottom plate, the accommodating units are cylindrical, extend out of the bottom plate, a reaction cavity matched with the reaction cup is arranged in the accommodating units, hollow structures are arranged in the interval areas between the accommodating units on the bottom plate, and connecting ridge parts are formed between the adjacent accommodating units; the module face cover is arranged on the module body and provided with a hole-shaped structure matched with the open end of the reaction cavity of the accommodating unit, and a heat insulation material is filled between the module face cover and the module body.

2. The amplification module device applied to digital PCR according to claim 1, wherein the heating part comprises a temperature-uniforming plate, a semiconductor cooling plate, a heat dissipation block and a heat dissipation fan, which are arranged below the accommodating module part; the semiconductor refrigeration piece comprises at least four symmetrically distributed semiconductor refrigeration pieces and is connected with the radiating block through heat-conducting silicone grease, the radiating fan is installed at the bottom of the radiating block, and the temperature equalizing plate is arranged between the bottom plate of the containing module portion and the semiconductor refrigeration pieces.

3. The amplification module apparatus for digital PCR as claimed in claim 2, further comprising a module panel covering the module mask edge and the heat sink.

4. The amplification module device for digital PCR according to any one of claims 1 to 3, further comprising a control part including a PCB board and a control circuit disposed on the PCB board for controlling the heating and cooling processes of the heating part.

5. The amplification module device for digital PCR as claimed in claim 4, wherein the module body is made of a metal alloy material with high thermal conductivity.

6. The device as claimed in claim 4, wherein the module body has at least two thermistors therein, and an annular groove is formed at the bottom edge of the bottom plate, and an auxiliary heating wire is installed in the annular groove.

7. The apparatus of claim 4, wherein the number of the receiving units on the base plate is set from 3x 4-12-16 x 24-384-wells.