CN217098701U - Semiconductor plastic packaging equipment - Google Patents
Semiconductor plastic packaging equipment Download PDFInfo
- Publication number
- CN217098701U CN217098701U CN202220653366.9U CN202220653366U CN217098701U CN 217098701 U CN217098701 U CN 217098701U CN 202220653366 U CN202220653366 U CN 202220653366U CN 217098701 U CN217098701 U CN 217098701U
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- Prior art keywords
- glue
- way
- wall
- plastic package
- adjusting block
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Abstract
The utility model discloses a semiconductor plastic envelope equipment, including the plastic envelope mould, be provided with the injecting glue on the plastic envelope mould and glue the way, the injecting glue is glued the way and is glued the way including injecting glue mouth, first gluey way and second, the second is glued the way and is close to first gluey way department is provided with adjustment mechanism, the second is glued the way and is close to the width of first gluey way department is in adjust mechanism adjusts under the effect. The utility model discloses keep the unblocked nature that the plastic envelope material flows, reach better plastic envelope effect.
Description
Technical Field
The utility model relates to a semiconductor package field especially relates to a semiconductor plastic envelope equipment.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous wafer process is cut into small chips through a scribing process, then the cut chips are attached to corresponding lead frames, and bonding pads of the chips are connected to corresponding pins of the substrate by using superfine metal wires or conductive resin; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, and the like.
In the plastic packaging process, the width of the glue injection channel is usually small, and when plastic packaging materials are injected into the glue injection channel and flow under pressure, the conditions of flow breaking and the like are easy to occur, so that the injection molding effect is poor, and certain defects exist under the conditions of generating bubbles on the packaging surface and the like.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor plastic envelope equipment to realize keeping the unblocked nature that the plastic envelope material flows, guarantee better plastic envelope effect.
For solving the technical problem, the utility model provides a semiconductor plastic envelope equipment, including the plastic envelope mould, be provided with the injecting glue on the plastic envelope mould and glue the way, the injecting glue is glued the way and is included injecting glue mouth, first glue way and second glue way, the second is glued the way and is close to first glue way department is provided with adjustment mechanism, the second is glued the way and is close to the width of first glue way department is in adjustment mechanism adjusts under the effect.
Furthermore, adjustment mechanism is including setting up the inside installation cavity of plastic envelope mould, the inside movable mounting of installation cavity has the regulating block, the regulating block is located on the inside one side outer wall of installation cavity through compression spring with installation cavity inner wall connection.
Furthermore, the regulating block is located be provided with at least one spacing subassembly on the inside one side outer wall of installation cavity, spacing subassembly includes the gag lever post, the gag lever post is kept away from regulating block one end is provided with the stopper, the stopper pass through spacing groove slidable mounting in inside the plastic envelope mould.
Furthermore, the outer wall of the adjusting block is connected with the inner wall of the mounting cavity in a sealing mode.
Furthermore, the outer wall of one side of the adjusting block, which is close to the first rubber channel, is chamfered.
Furthermore, a plurality of groups of positioning holes are symmetrically arranged on the plastic package mold.
Compared with the prior art, the utility model discloses following beneficial effect has at least: in the plastic packaging process, the adjusting block can move in the mounting cavity under the pressure of the plastic package adhesive, the width of the inlet of the second adhesive channel is adjusted in a self-adaptive manner, the plastic package adhesive can conveniently flow into the second adhesive channel, the cutoff condition is avoided, and the plastic packaging effect is improved.
Drawings
Fig. 1 is a top view of an external structure of a plastic package mold according to an embodiment of the present invention;
fig. 2 is a sectional view of the internal structure of the adjusting mechanism according to an embodiment of the present invention.
Detailed Description
The semiconductor plastic encapsulation apparatus of the present invention will now be described in greater detail with reference to the schematic drawings, in which preferred embodiments of the present invention are shown, it being understood that those skilled in the art may modify the invention described herein while still achieving the advantageous effects of the present invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more fully apparent from the following description and appended claims. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.
As shown in fig. 1, the embodiment of the utility model provides a semiconductor plastic packaging equipment is provided, including plastic packaging mould 1, be provided with injecting glue way 11 on the plastic packaging mould 1, injecting glue way 11 includes injecting glue mouth 111, first glue way 112 and second glue way 113, second glue way 113 is close to first glue way 112 department is provided with adjustment mechanism 2, second glue way 113 is close to the width of first glue way 112 department is in adjust mechanism 2 is used down.
After the plastic sealing glue is melted at high temperature, the plastic sealing glue is injected into the glue injection channel 11 from the glue injection port 111 under certain pressure, then flows to the first glue channel 112, and then flows to the second glue channel 113 from the first glue channel 112, and when the width of the inlet of the second glue channel 113 is narrow, the plastic sealing glue can be cut off; the embodiment of the utility model provides an in, but set up the adjustment mechanism 2 of self-adaptation regulation at the entrance of second jiao dao 113, flow to second jiao dao 113 department when the plastic envelope glue, under the pressure of plastic envelope glue, make adjustment mechanism 2 self-adaptation adjust the width of second jiao dao 113 entrance, in the plastic envelope glue of being convenient for flows into second jiao dao 113, avoid the production of the circumstances of cutting out.
The following is a description of the preferred embodiments of the semiconductor molding apparatus for clarity, and it should be understood that the present invention is not limited to the following embodiments, and other modifications by conventional techniques of those skilled in the art are within the scope of the present invention.
In one embodiment, a plurality of second adhesive channels 113 are correspondingly connected to one first adhesive channel 112, for example, in a comb shape, and are used as a group. According to actual needs, more than one group can be provided, for example, as shown in fig. 1, that is, two groups are respectively provided at two sides of the glue injection port 111.
The molding compound generally flows out from the second molding channel 113 to the corresponding component to be molded.
Referring to fig. 2, the adjusting mechanism 2 includes an installation cavity 21 disposed inside the plastic package mold 1, an adjusting block 22 is movably installed inside the installation cavity 21, and the adjusting block 22 is located on an outer wall of one side inside the installation cavity 21 and connected to an inner wall of the installation cavity 21 through a compression spring 23. In the embodiment, the adjusting block 22 moves in the mounting cavity 21, and when the plastic package adhesive flows to the second adhesive channel 113, the adjusting block 22 is compressed toward the inside of the mounting cavity 21 under the pressure of the plastic package adhesive, so that the width of the inlet of the second adhesive channel 113 is increased, the plastic package adhesive can flow into the second adhesive channel 113 conveniently, and the cutoff phenomenon is avoided.
The regulating block 22 is located be provided with at least one spacing subassembly 24 on the inside one side outer wall of installation cavity 21, spacing subassembly 24 includes gag lever post 241, gag lever post 241 is kept away from regulating block 22 one end is provided with stopper 242, stopper 242 through spacing groove 243 slidable mounting be in inside plastic envelope mould 1. In the present embodiment, the adjusting block 22 realizes the limitation of the movement stroke of the adjusting block 22 under the action of the limiting rod 241, the limiting block 242 and the limiting groove 243.
In one embodiment, the width adjustment range at the inlet of the second glue channel 113 is as follows: greater than or equal to the normal width of the second glue channel 113 (i.e. the width of the second glue channel 113 when the adjusting block 22 is fully protruded), and less than 1.5 times the normal width of the second glue channel 113.
Furthermore, the outer wall of the adjusting block 22 is hermetically connected with the inner wall of the mounting cavity 21. In the present embodiment, the outer wall of the adjusting block 22 is hermetically connected to the inner wall of the mounting cavity 21, so as to prevent the molding compound from leaking into the mounting cavity 21 from the gap.
Furthermore, the outer wall of the adjusting block 22 near the first glue channel 112 is chamfered. In the present embodiment, the outer wall of the adjusting block 22 near the first glue channel 112 is chamfered, so that the molding glue can flow in the second glue channel 113.
In addition, a plurality of groups of positioning holes 12 are symmetrically arranged on the plastic package mold 1. In the present embodiment, the plastic mold 1 is provided with the positioning holes 12, and the positioning of the plastic mold 1 is realized by the cooperation of the positioning holes 12 and the positioning columns.
In summary, in the plastic package process, under the pressure of the plastic package adhesive, the adjusting block 22 can move in the mounting cavity 21, so as to adaptively adjust the width of the inlet of the second adhesive channel 113, thereby facilitating the plastic package adhesive to flow into the second adhesive channel 113, avoiding the occurrence of a flow-breaking condition, and improving the plastic package effect.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. The utility model provides a semiconductor plastic packaging equipment, its characterized in that, includes the plastic packaging mould, be provided with the injecting glue on the plastic packaging mould and glue the way, the injecting glue is glued the way and is included injecting glue mouth, first glue way and second glue way, the second glue way is close to first glue way department is provided with adjustment mechanism, the second glue way is close to the width of first glue way department is in adjust mechanism adjusts down.
2. The semiconductor plastic package device according to claim 1, wherein the adjusting mechanism comprises a mounting cavity arranged inside the plastic package mold, an adjusting block is movably mounted inside the mounting cavity, and the adjusting block is located on an outer wall of one side inside the mounting cavity and connected with an inner wall of the mounting cavity through a compression spring.
3. The semiconductor plastic package device according to claim 2, wherein at least one limiting component is disposed on an outer wall of one side of the adjusting block located inside the mounting cavity, the limiting component comprises a limiting rod, a limiting block is disposed at one end of the limiting rod away from the adjusting block, and the limiting block is slidably mounted inside the plastic package mold through a limiting groove.
4. The semiconductor plastic package device according to claim 2, wherein an outer wall of the adjusting block is hermetically connected with an inner wall of the mounting cavity.
5. The semiconductor plastic package device according to claim 2, wherein the adjusting block is chamfered at an outer wall of a side thereof close to the first glue channel.
6. A semiconductor plastic package device according to claim 1, wherein the plastic package mold is symmetrically provided with a plurality of groups of positioning holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220653366.9U CN217098701U (en) | 2022-03-24 | 2022-03-24 | Semiconductor plastic packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220653366.9U CN217098701U (en) | 2022-03-24 | 2022-03-24 | Semiconductor plastic packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217098701U true CN217098701U (en) | 2022-08-02 |
Family
ID=82604063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220653366.9U Active CN217098701U (en) | 2022-03-24 | 2022-03-24 | Semiconductor plastic packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217098701U (en) |
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2022
- 2022-03-24 CN CN202220653366.9U patent/CN217098701U/en active Active
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