CN217086536U - Wafer box assembly and wafer cleaning unit comprising same - Google Patents
Wafer box assembly and wafer cleaning unit comprising same Download PDFInfo
- Publication number
- CN217086536U CN217086536U CN202123108934.1U CN202123108934U CN217086536U CN 217086536 U CN217086536 U CN 217086536U CN 202123108934 U CN202123108934 U CN 202123108934U CN 217086536 U CN217086536 U CN 217086536U
- Authority
- CN
- China
- Prior art keywords
- wafer
- wafers
- accommodating
- box
- cleaning unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer box subassembly and contain its wafer cleaning unit, it includes spool box and two at least wafers, be equipped with two at least holding check in the spool box, each the wafer parallel placement respectively in corresponding in the holding check, be located both ends in the holding check the front orientation of wafer is adjacent the holding check. This scheme is through setting up the orientation of the wafer in the holding check, and wherein, the front of the wafer that is located the holding check at spool box both ends is towards adjacent holding check, and when wasing, the back of wafer is towards cell body or carrier, prevents that cell body or carrier from causing the influence to the front of wafer, avoids using the separation blade simultaneously, has improved the productivity.
Description
Technical Field
The utility model relates to a wafer manufacturing field, in particular to wafer box subassembly and contain its wafer cleaning unit.
Background
In the present full-automatic semiconductor tank type cleaning equipment, as shown in fig. 2, before cleaning, a plurality of wafers are integrally placed into a holding grid of a special wafer box in the same direction, and then the wafer box is placed into a chemical tank for subsequent cleaning, at this time, the wafer at one edge contacts with a tank body or a carrier, so that the front surface of the wafer is polluted, and the yield is reduced.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a wafer cleaning unit that wafer box subassembly and contain it in order to overcome the defect that the productivity that leads to reduces among the prior art in the wafer cleaning process.
The utility model discloses an above-mentioned technical problem is solved through following technical scheme: the utility model provides a tablet box subassembly, its includes spool box and two at least wafers, be equipped with two at least holding check in the spool box, each the wafer parallel placement respectively in corresponding in the holding check, be located both ends in the holding check the front orientation of wafer is adjacent the holding check.
In this scheme, through the orientation that sets up the wafer in the holding check, wherein, the front of the wafer that is located the holding check at spool box both ends is towards adjacent holding check, and when wasing, the back of wafer is towards cell body or carrier, prevents that cell body or carrier from causing the influence to the front of wafer, avoids using the separation blade simultaneously, has improved the productivity.
Preferably, the front surfaces of the wafers in the accommodating cells at the middle position of the wafer box face the same direction.
In the scheme, only one of the wafers at the two ends of the wafer box has a different direction from the other wafers, and after cleaning, the directions of all the wafers can be the same only by adjusting the wafers in the different directions, so that the subsequent operation steps are simplified.
Preferably, the number of the accommodating cells in the cassette is even, the front surfaces of the wafers positioned in the odd-numbered accommodating cells face a first direction, the front surfaces of the wafers positioned in the even-numbered accommodating cells face a second direction, and the first direction is opposite to the second direction.
In the scheme, the direction of the wafers in the containing grids is set, so that the front surface of any wafer is not opposite to the back surfaces of other wafers, the front surface of the wafer is prevented from facing the back surfaces of other wafers, the pollution of the back surfaces of the wafers to the front surfaces of other wafers during cleaning is prevented, and the wafer yield is improved.
Preferably, the inside of the cassette is provided with an accommodating cavity with an upward opening, and each accommodating grid is respectively arranged in the accommodating cavity.
The utility model also discloses a wafer cleaning unit, it includes foretell spool box subassembly, wafer cleaning unit still includes the wafer mobile device, the wafer mobile device is including the upset module that can overturn 180 with the front of wafer.
Preferably, the wafer cleaning unit further comprises a cleaning tank for cleaning the wafer.
Preferably, the wafer cleaning unit further comprises a lifting platform for carrying the wafer box, and the lifting platform can move back and forth between the inside of the cleaning tank and the position above the cleaning tank in a lifting motion mode.
The utility model discloses an actively advance the effect and lie in: through the direction of setting up the wafer in the holding check, wherein, the front of the wafer that is located the holding check at spool box both ends is towards adjacent holding check, and when wasing, the back of wafer is towards cell body or carrier, prevents that cell body or carrier from causing the influence to the front of wafer, avoids using the separation blade simultaneously, has improved the productivity.
Drawings
Fig. 1 is a schematic flow chart of a wafer cleaning method according to embodiment 1 of the present invention.
FIG. 2 is a schematic view of the orientation of a wafer placed in a cassette according to the prior art.
Fig. 3 is a schematic view illustrating the orientation of the wafer placed in the wafer cassette according to embodiments 1 and 3 of the present invention.
Fig. 4 is a schematic view of the orientation of the wafer in the cassette according to embodiments 2 and 4 of the present invention.
Description of reference numerals:
Rear face 11
Containing case 20
Detailed Description
The present invention is further illustrated by way of the following examples, which are not intended to limit the scope of the invention.
Example 1
As shown in fig. 1, the present embodiment discloses a wafer cleaning method, which includes the following steps:
s1: controlling a wafer moving device (not shown in the figure) to take the wafer 1 out of other wafer boxes and place the wafer 1 into each accommodating cell 20 of the wafer box 2, and when the wafer moving device is about to place the wafer 1 into the accommodating cells 20 at two ends of the wafer box 2, controlling the wafer moving device to adjust the orientation of the wafer 1 to be placed so that the front surface 10 of the wafer 1 faces the adjacent accommodating cell 20;
s2: the wafer cassette 2 is placed in a cleaning tank to clean the wafer 1.
As shown in fig. 3, in the present embodiment, by controlling the direction of the wafer 1 placed in the holding cells 20, the front surfaces 10 of the wafers 1 in the holding cells 20 at two ends of the wafer box 2 face the adjacent holding cells 20, and during cleaning, the back surfaces 11 of the wafers 1 at two ends of the wafer box 2 face the tank or the carrier, so as to prevent the tank or the carrier from affecting the front surfaces 10 of the wafers 1, and simultaneously, the problem that the number of the wafers 1 that the wafer box 2 can hold is reduced due to the fact that a blocking piece is used to solve the above problem in the prior art is also avoided, so that the productivity can be improved.
In the present embodiment, the wafer moving apparatus is provided with the capability of taking a single wafer 1 and placing it into the accommodating compartment 20 designated in the cassette 2, so that step S1 correspondingly includes step S10: and controlling the wafer moving equipment to sequentially place the single wafer 1 into each accommodating cell 20 of the wafer box 2.
By the arrangement mode, the orientation of the wafer 1 in any one accommodating cell 20 can be adjusted in operation, and the requirements of different processes on the orientation of the wafer 1 in the wafer box 2 can be met.
Of course, in other embodiments, a wafer moving device capable of simultaneously taking a plurality of wafers 1 and placing them into a plurality of designated accommodating compartments 20 may be used. For example: if the wafer moving apparatus has the capability of simultaneously taking three wafers 1, when the wafer moving apparatus is controlled to take the wafers 1 related to the accommodation cells 20 to be placed at the end of the cassette 2, the wafer moving apparatus should turn the three wafers 1 by 180 ° in their entirety so that the wafers 1 are placed in the corresponding accommodation cells 20 in a posture that the front faces the inside of the cassette 2. Through this kind of wafer mobile device towards spool box 2 and put wafer 1, both satisfied and made the different demand of putting of adjacent wafer 1 orientation, promoted relatively again and put efficiency. Wherein, for the wafer mobile device that can take polylith wafer 1 simultaneously, the wafer 1 quantity that the single can take should be controlled in the within range of 2 ~ 5 pieces for this wafer mobile device's equipment volume can not be too big, and compare in the equipment that the monolithic was taken and was put wafer 1, the efficiency of putting wafer 1 towards different holding check 20 in the spool box 2 can promote again.
In this embodiment, step S1 may further include step S11: when the wafer moving equipment needs to put the wafer 1 into the containing compartment 20 located at the middle position of the wafer box 2, the wafer moving equipment is controlled to adjust the orientation of the wafer 1, so that the front surfaces 10 of the wafers 1 to be put all face the same direction.
As shown in fig. 3, the directions of the wafers 1 in the accommodating compartments 20 at the middle position of the wafer box 2 are the same, and only one of the wafers 1 at the two ends of the wafer box 2 has a different direction from the other wafers 1, so that after cleaning, the directions of all the wafers 1 can be the same by adjusting the wafers 1 in the different directions, thereby simplifying the subsequent operation steps.
In this embodiment, step S3 may be further performed after step S2: and taking out the wafer 1 with the direction inconsistent with the direction of the wafer 1 in the containing grid 20 at the middle position of the wafer box 2, controlling the wafer moving equipment to adjust the direction of the taken-out wafer 1, and putting the wafer 1 back into the containing grid 20 after adjusting to be consistent with the direction of the wafer 1 in the containing grid 20 at the middle position of the wafer box 2.
Through the operation of step S3, after the cleaning is completed, the present embodiment readjusts all the wafers 1 in the wafer cassette 2 to face the same direction by controlling the wafer moving device, so as to facilitate the subsequent operations of other processes. It should be noted that the wafer transfer apparatus for performing step S1 and the wafer transfer apparatus for performing step S3 may be the same wafer transfer apparatus, or two relatively independent wafer transfer apparatuses may be used to perform step S1 and step S3, respectively.
Specifically, in this embodiment, the wafer moving device may employ a robot, the robot connects the wafer 1 through a vacuum chuck or other taking structure, so as to achieve taking and placing of the wafer 1, wherein the robot should have an overturning module, and the overturning module can overturn the taking structure of the robot by 180 ° so as to achieve the purpose of turning the wafer 1 by 180 ° when taking the wafer 1, and in addition, preferably, the robot should further have the capability of scanning the number of the wafers 1 in the wafer box 2, so as to identify the order of the accommodating compartments 20 in the wafer box 2, so that the robot can better plan the orientation of placing the wafers 1 in the accommodating compartments 20.
Example 2
This embodiment is substantially the same as embodiment 1, and now, a difference will be described, as shown in fig. 4, in this embodiment, the total number of the accommodating compartments 20 in the sheet cassette 2 is even, so that step S1 further includes step S12: when the wafer moving equipment is to place the wafer 1 into the odd-numbered containing cells 20 in the wafer box 2, the wafer moving equipment is controlled to adjust the orientation of the wafer 1, so that the front surface 10 of the wafer 1 to be placed faces a first direction, and when the wafer moving equipment is to place the wafer 1 into the even-numbered containing cells 20 in the wafer box 2, the wafer moving equipment is controlled to adjust the orientation of the wafer 1, so that the front surface 10 of the wafer 1 to be placed faces a second direction, wherein the first direction is opposite to the second direction.
Wherein, the accommodating case 20 in the pair cassette 2 of the utility model is odd number or even number and is all defined from the same direction, odd number accommodating case 20 refers to odd number accommodating case 20 such as 1 st, 3 rd, 5 th 5 … … etc., even number accommodating case 20 refers to even number accommodating case 20 such as 2 nd, 4 th, 6 th 6 … … etc.
In the embodiment, by controlling the direction of the wafers 1 placed in the accommodating compartments 20 at specific positions, the front surface 10 of any one wafer 1 is not opposite to the back surfaces 11 of other wafers 1, so that the front surface 10 of the wafer 1 is prevented from facing the back surfaces 11 of other wafers 1, the back surfaces 11 of the wafers 1 are prevented from polluting the front surfaces 10 of other wafers 1 during cleaning, and the yield of the wafers 1 is improved.
In this embodiment, the step S2 may be followed by the step S4: and controlling the wafer moving equipment to take out the wafers 1 in the odd number of accommodating cells 20, adjusting the direction of the taken-out wafers 1 until the front surface 10 of the wafer 1 faces to the second direction, and then putting the wafers back into the accommodating cells 20 again. In this embodiment, after cleaning, the wafer moving apparatus is controlled to take out the wafers 1 in the odd number of accommodating compartments 20 and then return the wafers 1 after adjusting the directions, that is, all the wafers 1 are adjusted to face the same direction, which is convenient for the operation of other subsequent processes.
Of course, step S3 may also employ the following operations: and controlling the wafer moving equipment to take out the wafers 1 in the even number of accommodating cells 20, adjusting the direction of the taken-out wafers 1 until the front surface 10 of the wafer 1 faces to the first direction, and then placing the wafers back into the accommodating cells 20. The wafers 1 in even number of accommodating cells 20 are taken out and placed back after the direction is adjusted by controlling the wafer moving equipment, and the effect that the directions of all the wafers 1 are the same can be achieved.
Example 3
As shown in fig. 3, the embodiment further discloses a tablet cassette assembly, which includes a tablet cassette 2 and at least two wafers 1, at least two accommodating cells 20 are disposed in the tablet cassette 2, each wafer 1 is respectively placed in the corresponding accommodating cell 20 in parallel, and the front surface 10 of the wafer 1 in the accommodating cell 20 at both ends faces the adjacent accommodating cell 20.
In this embodiment, the "front surface 10" of the wafer 1 refers to the plated surface of the wafer 1, and the direction of the wafer 1 in the holding cells 20 is set, wherein the front surface 10 of the wafer 1 in the holding cells 20 at the two ends of the wafer box 2 faces the adjacent holding cells 20, and when cleaning, the back surface 11 of the wafer 1 faces the tank or the carrier, so as to prevent the tank or the carrier from affecting the front surface 10 of the wafer 1, and meanwhile, avoid using a blocking sheet, and improve the productivity.
As shown in fig. 3, in the present embodiment, the front surfaces 10 of the wafers 1 in the accommodating compartments 20 located at the middle position of the cassette 2 all face the same direction.
In this embodiment, only one of the wafers 1 at the two ends of the wafer box 2 has a different direction from the other wafers 1, and after cleaning, the directions of all the wafers 1 can be the same by adjusting the wafers 1 in the different directions, thereby simplifying the subsequent operation steps. Of course, in other embodiments, the orientation of the wafer 1 in the accommodating compartment 20 at the middle position may also be different, and the subsequent operation flow of adjusting the orientation of the wafer 1 by the wafer moving apparatus may also be relatively more complicated.
In this embodiment, the film box 2 has an accommodating cavity with an upward opening therein, and each accommodating compartment 20 is disposed in the accommodating cavity.
The embodiment also discloses a wafer cleaning unit, which comprises the wafer box assembly, and the wafer cleaning unit further comprises wafer moving equipment, wherein the wafer moving equipment comprises a turnover module capable of turning the wafer 1 by 180 degrees. The wafer moving device may adopt a manipulator, and the manipulator may also scan the number of wafers 1 in the cassette 2, and may recognize the order of the accommodating compartments 20 in the cassette 2.
In this embodiment, the wafer cleaning unit further includes a cleaning tank for cleaning the wafer 1 placed therein.
In this embodiment, the wafer cleaning unit further includes a lifting platform for carrying the cassette 2, and the lifting platform can move back and forth between the inside of the cleaning tank and the upper position of the cleaning tank by means of lifting movement.
Example 4
The embodiment is substantially the same as embodiment 3, and a difference will now be described, as shown in fig. 4, the total number of the accommodating compartments 20 in the cassette 2 in the embodiment is an even number, wherein the front surfaces 10 of the wafers 1 located in the odd number of accommodating compartments 20 all face a first direction, the front surfaces 10 of the wafers 1 located in the even number of accommodating compartments 20 all face a second direction, and the first direction is opposite to the second direction.
In the embodiment, by adjusting the direction of the wafer 1 in the specific accommodating compartment 20 in the wafer box 2, the front surface 10 of the wafer 1 in any one accommodating compartment 20 is not opposite to the back surfaces 11 of the adjacent other wafers 1, so that the front surface 10 of the wafer 1 is prevented from facing the back surfaces 11 of the other wafers 1, the back surfaces 11 of the wafers 1 are prevented from polluting the front surfaces 10 of the other wafers 1 during cleaning, and the yield of the wafers 1 is improved.
In the present embodiment, odd or even accommodating compartments 20 in the cassette 2 are defined from the same direction, wherein the odd accommodating compartments 20 refer to the 1 st, 3 rd, 5 th 5 … … and so on odd accommodating compartments 20, and the even accommodating compartments 20 refer to the 2 nd, 4 th, 6 … … and so on even accommodating compartments 20.
Although specific embodiments of the present invention have been described above, it will be understood by those skilled in the art that this is by way of example only and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and the principles of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (6)
1. The utility model provides a tablet box subassembly, its includes spool box and two at least wafers, its characterized in that, be equipped with two at least holding check in the spool box, each the wafer parallel placement respectively in corresponding in the holding check, be located both ends in the holding check the positive orientation of wafer is adjacent the holding check.
2. A cassette assembly of claim 1, wherein the front faces of the wafers in the pockets at the cassette intermediate position all face in the same direction.
3. The cartridge assembly of claim 1, wherein the cartridge has an accommodating chamber therein with an upward opening, and each accommodating compartment is disposed in the accommodating chamber.
4. A wafer cleaning unit comprising a cassette assembly as claimed in any one of claims 1 to 3, wherein the wafer cleaning unit further comprises a wafer moving apparatus comprising a flipping module that can flip the front side of the wafer by 180 °.
5. The wafer cleaning unit as claimed in claim 4, wherein the wafer cleaning unit further comprises a cleaning tank for cleaning the wafer placed therein.
6. The wafer cleaning unit of claim 4, further comprising a lift platform for carrying the cassette, the lift platform being movable back and forth between a position within the cleaning tank and above the cleaning tank by a lifting motion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123108934.1U CN217086536U (en) | 2021-12-06 | 2021-12-06 | Wafer box assembly and wafer cleaning unit comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123108934.1U CN217086536U (en) | 2021-12-06 | 2021-12-06 | Wafer box assembly and wafer cleaning unit comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217086536U true CN217086536U (en) | 2022-07-29 |
Family
ID=82538584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123108934.1U Active CN217086536U (en) | 2021-12-06 | 2021-12-06 | Wafer box assembly and wafer cleaning unit comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217086536U (en) |
-
2021
- 2021-12-06 CN CN202123108934.1U patent/CN217086536U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101071326B1 (en) | Batch forming apparatus, substrate processing system, batch forming method, and recording medium having batch forming program | |
| KR20090091702A (en) | Method for forming stacks of wafers to be doped one-sided, in particular solar wafers, and handling system for loading a process boat with wafer batches | |
| EP3955355A1 (en) | Multi-plate laminating device for lithium battery cell and laminating method thereof | |
| KR20140089517A (en) | Load port and efem | |
| CN105931980A (en) | Workpiece Transfer System | |
| CN217086536U (en) | Wafer box assembly and wafer cleaning unit comprising same | |
| US8845262B2 (en) | Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program | |
| JP6986611B2 (en) | Secondary battery cell supply device for secondary battery cell folding process | |
| CN212610894U (en) | Double-sided coating equipment | |
| CN217134329U (en) | Wafer box assembly and wafer cleaning unit comprising same | |
| CN214488797U (en) | Lead-acid storage battery cast-weld production line | |
| KR20130104341A (en) | Method of transferring substrate, robot for transferring substrate and substrate treatment system having the same | |
| US20130316485A1 (en) | Dye adsorption apparatus and dye adsorption method | |
| KR101768519B1 (en) | Apparatus for Processing Substrate | |
| JP3974985B2 (en) | Substrate transfer device | |
| KR102586960B1 (en) | Separator Handling Apparatus for Stacking One-sided Eelectrode of Secondary Battery Cell And Method for Manufacturing Secondary Battery Cell Using the Same | |
| US11476143B2 (en) | Substrate processing apparatus and substrate receptacle storage method | |
| CN217675344U (en) | Transfer device for flower basket and production line for battery piece | |
| CN220627824U (en) | Half silicon chip processing transmission line | |
| JP3615042B2 (en) | Substrate transfer device | |
| CN218050751U (en) | Selective wave soldering tin storage material carrying tray | |
| CN117162358B (en) | Full-automatic feeding and discharging bubble removing machine | |
| CN216503355U (en) | Blanking device in automatic processing equipment of air pressure switch | |
| CN217915351U (en) | A manipulator structure for lithium cell turn-over | |
| CN220627826U (en) | Linear half silicon wafer transmission line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |