CN217062056U - Packaging mechanism for semiconductor chip - Google Patents
Packaging mechanism for semiconductor chip Download PDFInfo
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- CN217062056U CN217062056U CN202123127503.XU CN202123127503U CN217062056U CN 217062056 U CN217062056 U CN 217062056U CN 202123127503 U CN202123127503 U CN 202123127503U CN 217062056 U CN217062056 U CN 217062056U
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- semiconductor chip
- groove
- mounting
- packaging mechanism
- mounting seat
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Abstract
The utility model discloses a packaging mechanism that semiconductor chip used relates to semiconductor chip packaging technology field. The mounting structure comprises a mounting seat, the top activity of mounting seat is provided with protection machanism, the top of mounting seat is provided with fixing bolt, the mounting hole has been seted up at the top of mounting seat, the bottom outer wall of mounting hole is provided with the connecting sleeve pad, the spread groove has been seted up at the top of mounting seat. Through setting up the mounting groove, make it effectively carry out the joint installation to semiconductor chip, and carry out the joint equipment through the spread groove to the protecting crust that sets up in the protection machanism, simultaneously through the setting of pegging graft in the inside dustproof ventilative baffle of connection slot and the protection machanism both sides slip joint setting at the protection curb plate of spacing inslot portion of activity, effectively protect device internally mounted's semiconductor chip, and make things convenient for the dismouting of its device, the convenient maintenance and the change of device, and then the usability of device has been strengthened.
Description
Technical Field
The utility model relates to a semiconductor chip encapsulates technical field, specifically is a packaging mechanism that semiconductor chip used.
Background
A semiconductor chip: with the development of semiconductor technology, semiconductor chips have smaller and smaller volumes and larger powers, and the demand of the high-power density chips is on a rapidly increasing trend, so that the semiconductor chips are widely applied to multiple fields.
In the prior art, a semiconductor chip is generally required to be packaged in a production process, although the existing semiconductor chip packaging structure has good sealing performance and poor heat dissipation performance, the heat generated by the semiconductor chip in actual use cannot be dissipated outwards in time, so that the service life of the semiconductor chip packaging structure is influenced to a certain extent.
SUMMERY OF THE UTILITY MODEL
The utility model provides a packaging mechanism that semiconductor chip used to solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a packaging mechanism for a semiconductor chip comprises an installation seat, wherein a protection mechanism is movably arranged at the top of the installation seat, and a fixing bolt is arranged at the top of the installation seat;
the mounting hole has been seted up at the top of mount pad, the bottom outer wall of mounting hole is provided with the connecting sleeve pad, the spread groove has been seted up at the top of mount pad, the mounting groove has been seted up to the inner bottom wall of spread groove, the interior bottom of mounting groove is provided with the heat dissipation baffle, the bottom of heat dissipation baffle is provided with the fin.
Furthermore, protection machanism's bottom is provided with the protecting crust, the shape size of protecting crust and the shape size of spread groove match each other, protecting crust activity joint sets up the inside at the spread groove.
Furthermore, a connecting clamping groove is formed in the top of the front face of the protective shell, and a dustproof breathable partition plate is movably inserted in the connecting clamping groove.
Furthermore, the inner walls of the two sides of the protective shell are provided with limit grooves, and the inner parts of the limit grooves on the two sides are provided with protective side plates in a sliding clamping mode.
Furthermore, the inner wall of protective housing is provided with the encapsulated body, the encapsulated body partly surrounds the laminating setting at semiconductor chip's outer wall.
Furthermore, the heat dissipation guide plate is composed of a heat conduction adhesion layer, a diffusion layer and a graphene layer, wherein the heat conduction adhesion layer and the diffusion layer are respectively made of gold-tin alloy and copper sheets.
Compared with the prior art, the utility model provides a packaging mechanism that semiconductor chip used possesses following beneficial effect:
1. this packaging mechanism that semiconductor chip used, through setting up the mounting groove, make it effectively carry out the joint installation to semiconductor chip, and carry out the joint equipment through the protecting crust that the spread groove set up in to protection mechanism, simultaneously through activity grafting setting at the inside dustproof ventilative baffle of connect the slot and protection mechanism both sides slip joint setting at the inside protection curb plate of spacing inslot, effectively protect device internally mounted's semiconductor chip, and make things convenient for the dismouting of its device, the maintenance of device is repaired and the change has been made things convenient for, and then the usability of device has been strengthened.
2. This packaging mechanism that semiconductor chip used, through setting up the heat dissipation baffle, make its effective installation use the heat that produces at the inside semiconductor chip of mounting groove to concentrate the absorption, and derive it through the fin that the bottom set up, the setting of connecting sleeve pad simultaneously, the use height of effective lifting mount pad, use for the heat dissipation of fin and provide the circulation of air space, and then the radiating stability of guarantee fin, reduce the inside hot pressure of device, reduce its heat loss, improve its semiconductor chip's life, strengthen its practicality.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a schematic structural view of the mounting base of the present invention;
FIG. 3 is a schematic view of the bottom structure of the mounting base of the present invention;
fig. 4 is an exploded view of the protection mechanism of the present invention.
In the figure: 1. a mounting seat; 101. mounting holes; 102. connecting grooves; 103. mounting grooves; 104. a heat dissipation guide plate; 105. connecting sleeve gaskets; 106. a heat sink; 2. a protection mechanism; 201. a protective shell; 202. a connecting clamping groove; 203. an enclosure; 204. a limiting groove; 205. a protective side plate; 206. a dustproof breathable partition plate; 3. and (5) fixing the bolt.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-4, the utility model discloses a packaging mechanism for semiconductor chip, which comprises a mounting base 1, wherein a protection mechanism 2 is movably arranged on the top of the mounting base 1, and a fixing bolt 3 is arranged on the top of the mounting base 1;
Specifically, the bottom of protection machanism 2 is provided with protecting crust 201, the shape and size of protecting crust 201 and the shape and size of spread groove 102 match each other, protecting crust 201 activity joint sets up in the inside of spread groove 102.
In this embodiment, when the device is used, the protective shell 201 arranged in the protective mechanism 2 is clamped and assembled through the connecting groove 102, so that the device is effectively convenient to assemble and use, the installation time is saved, and the investment of installation cost is reduced.
Specifically, the top of the front surface of the protective shell 201 is provided with a connecting clamping groove 202, and the inside of the connecting clamping groove 202 is movably inserted with a dustproof breathable partition plate 206.
In this embodiment, make the device to semiconductor chip under the sealed circumstances of protecting, through the setting of dustproof ventilative baffle 206, ensured that the inside semiconductor chip of device uses thermal giving off, and then effectively improve its radiating effect, reduce semiconductor chip's thermal wear, strengthen its life.
Specifically, the inner walls of the two sides of the protective shell 201 are both provided with limiting grooves 204, and the limiting grooves 204 on the two sides are slidably clamped and provided with protective side plates 205.
In this embodiment, the protective shell 201 is arranged through the limiting groove 204, so that the protective side plate 205 can be conveniently and effectively detached by sliding, maintenance and replacement of the semiconductor chip are facilitated, and the usability of the device is further enhanced.
Specifically, the inner wall of the protective shell 201 is provided with an encapsulating body 203, and the encapsulating body 203 is arranged on the outer wall of the semiconductor chip in a semi-surrounding and attaching manner.
In this embodiment, when the device is used, the encapsulant 203 isolates the passing of the resistor, thereby avoiding the leakage problem in the use of the semiconductor chip and further effectively improving the protection and safety of the device.
Specifically, the heat dissipation guide plate 104 is composed of a heat conduction adhesion layer, a diffusion layer and a graphene layer, and the heat conduction adhesion layer and the diffusion layer are respectively made of gold-tin alloy and copper sheets.
In this embodiment, when the heat dissipation guide plate 104 is used, the heat dissipation guide plate is adhered to the bottom of the semiconductor chip through the heat conduction adhesion layer, the heat of the heat dissipation guide plate is diffused and conducted through the diffusion layer made of the copper sheet, and the heat of the heat dissipation guide plate is conducted out of the interior of the heat dissipation guide plate through the graphene layer, so that the heat dissipation performance of the heat dissipation guide plate is effectively improved.
When using, through mounting groove 103, make it effectively carry out the joint installation to semiconductor chip to carry out the joint equipment to the protecting crust 201 that sets up in the protection machanism 2 through spread groove 102, set up dustproof ventilative baffle 206 and the protection machanism 2 both sides slip joint setting at the inside protection curb plate 205 of spacing groove 204 inside connecting groove 202 through the activity grafting simultaneously, effectively protect device internally mounted's semiconductor chip, accomplish the operation to the device through the aforesaid.
In conclusion, the packaging mechanism for the semiconductor chip has the advantages that the heat dissipation guide plate 104 is arranged, the semiconductor chip which is effectively installed inside the installation groove 103 is enabled to be absorbed in a concentrated mode through the generated heat, the semiconductor chip is led out through the heat dissipation sheet 106 arranged at the bottom, meanwhile, the mounting seat 1 is effectively lifted, the air circulation space is provided for the heat dissipation use of the heat dissipation sheet 106, the heat dissipation stability of the heat dissipation sheet 106 is further guaranteed, the heat pressure inside the packaging mechanism is reduced, the heat loss is reduced, the service life of the semiconductor chip is prolonged, and the practicability of the packaging mechanism is enhanced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A packaging mechanism for a semiconductor chip comprises a mounting seat (1), and is characterized in that: the top of the mounting seat (1) is movably provided with a protection mechanism (2), and the top of the mounting seat (1) is provided with a fixing bolt (3);
mounting hole (101) have been seted up at the top of mount pad (1), the bottom outer wall of mounting hole (101) is provided with connecting sleeve pad (105), connecting groove (102) have been seted up at the top of mount pad (1), mounting groove (103) have been seted up to the inner bottom wall of connecting groove (102), the interior bottom of mounting groove (103) is provided with heat dissipation baffle (104), the bottom of heat dissipation baffle (104) is provided with fin (106).
2. A packaging mechanism for a semiconductor chip according to claim 1, characterized in that: the bottom of protection machanism (2) is provided with protecting crust (201), the shape size of protecting crust (201) matches each other with the shape size of spread groove (102), protecting crust (201) activity joint sets up the inside at spread groove (102).
3. A packaging mechanism for semiconductor chips as defined in claim 2, wherein: the front top of the protective shell (201) is provided with a connecting clamping groove (202), and the inside of the connecting clamping groove (202) is movably inserted with a dustproof and breathable partition plate (206).
4. A packaging mechanism for a semiconductor chip according to claim 3, characterized in that: limiting grooves (204) are formed in the inner walls of the two sides of the protective shell (201), and protective side plates (205) are arranged on the inner walls of the limiting grooves (204) in the two sides in a sliding and clamping mode.
5. A packaging mechanism for a semiconductor chip according to claim 4, wherein: the inner wall of protective housing (201) is provided with encapsulated body (203), encapsulated body (203) half surrounds the laminating and sets up the outer wall at semiconductor chip.
6. A packaging mechanism for a semiconductor chip according to claim 1, characterized in that: the heat dissipation guide plate (104) is composed of a heat conduction adhesion layer, a diffusion layer and a graphene layer, and the heat conduction adhesion layer and the diffusion layer are made of gold-tin alloy and copper sheets respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123127503.XU CN217062056U (en) | 2021-12-13 | 2021-12-13 | Packaging mechanism for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123127503.XU CN217062056U (en) | 2021-12-13 | 2021-12-13 | Packaging mechanism for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217062056U true CN217062056U (en) | 2022-07-26 |
Family
ID=82478163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123127503.XU Active CN217062056U (en) | 2021-12-13 | 2021-12-13 | Packaging mechanism for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217062056U (en) |
-
2021
- 2021-12-13 CN CN202123127503.XU patent/CN217062056U/en active Active
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