CN215933571U - Heat radiation structure for microelectronic chip packaging - Google Patents
Heat radiation structure for microelectronic chip packaging Download PDFInfo
- Publication number
- CN215933571U CN215933571U CN202122097899.1U CN202122097899U CN215933571U CN 215933571 U CN215933571 U CN 215933571U CN 202122097899 U CN202122097899 U CN 202122097899U CN 215933571 U CN215933571 U CN 215933571U
- Authority
- CN
- China
- Prior art keywords
- heat
- groove
- sealing cover
- chip
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to the field of electronic communication equipment, in particular to a heat dissipation structure for packaging a microelectronic chip. The packaging structure comprises a packaging shell, wherein a top cover is arranged at the top of the packaging shell, a groove is formed in the upper surface of the top cover, a groove is formed in the center of the groove, a mounting through hole is formed in the center of the groove, a heat conduction piece is embedded in the mounting through hole and at least comprises a soaking piece, a plurality of radiating fins are uniformly arranged on the upper surface of the soaking piece, the top of each radiating fin is fixedly connected with a sealing cover, side edge walls are arranged at the edges of the left side and the right side of the sealing cover, liquid injection holes are formed in the upper surface of the sealing cover, a plurality of limiting clamping grooves are symmetrically formed at the edges of the left side and the right side of the groove, through the top cap of installing heat conduction spare that sets up, heat conduction spare exports the heat of encapsulation inner chamber and chip through the soaking piece, and the heat dissipation of encapsulation inner chamber has been improved to the tradition and has been slower to packaging surface casing radiating efficiency, and chip and encapsulation inner chamber temperature can not in time be derived, influence chip work efficiency's problem.
Description
Technical Field
The utility model relates to the field of electronic communication equipment, in particular to a heat dissipation structure for packaging a microelectronic chip.
Background
The design of heat dissipation of microelectronic chips focuses on two aspects from the chip to the package shell and from the package shell to the environment, the traditional chip heat dissipation mode is that the package shell is usually dissipated to the external environment, the surface of the package shell adopts the design of a traditional air-cooled heat sink and a fan, and heat is dissipated through the upper surface of the package; however, the problem of heat dissipation from the chip to the package housing cannot be solved, and the heat of the chip and the package cavity cannot be dissipated in time, which causes the temperature of the package cavity to rise, and directly affects the working efficiency of the chip.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat dissipation structure for packaging a microelectronic chip, aiming at the technical problems of the heat dissipation structure for packaging the microelectronic chip.
In order to achieve the purpose, the utility model adopts the technical scheme that the heat dissipation structure for packaging the microelectronic chip comprises a packaging shell, wherein a top cover is arranged at the top of the packaging shell, a groove is formed in the upper surface of the top cover, a groove is formed in the center of the groove, a mounting through hole is formed in the center of the groove, a heat conduction piece is embedded in the mounting through hole and at least comprises a soaking piece, a plurality of heat dissipation pieces are uniformly arranged on the upper surface of the soaking piece, the top of each heat dissipation piece is fixedly connected with a sealing cover, side edge walls are arranged at the left edge and the right edge of the sealing cover, a liquid injection hole is formed in the upper surface of the sealing cover, and a plurality of limiting clamping grooves are symmetrically formed at the left edge and the right edge of the groove.
As a further improvement of the technical scheme, a packaging inner cavity is formed in the packaging shell, a chip is installed in the packaging inner cavity, and the heat conduction piece is attached to the upper surface of the chip through the soaking piece.
As a further improvement of the technical scheme, the heat conduction piece is installed in the installation through hole in an embedded mode through the soaking piece, and the side wall of the soaking piece is fixedly connected with the inner wall of the installation through hole.
As a further improvement of the technical scheme, the length of the radiating fin is greater than that of the soaking fin, the radiating fin is installed in the limiting clamping groove in an inserted mode, and the top of the radiating fin is fixedly connected with the lower surface of the sealing cover.
As a further improvement of the technical scheme, the sealing cover is of a U-shaped structure, and the sealing cover is matched with the groove in size.
As a further improvement of the technical scheme, the sealing cover is fastened and fixed above the groove, a sealing cavity is reserved between the lower surface of the sealing cover and the groove, and the cavity is filled with a cooling medium.
As a further improvement of the technical scheme, the radiating fin and the sealing cover are both made of copper metal materials.
Compared with the prior art, the utility model has the beneficial effects that:
1. in this heat radiation structure for microelectronic chip encapsulation, through the top cap of installing heat conduction spare that sets up, heat conduction spare passes through the soaking piece and exports the heat of encapsulation inner chamber and chip, and the heat dissipation of encapsulation inner chamber has been improved the tradition and has been slower to encapsulation surface casing radiating efficiency, and chip and encapsulation inner chamber temperature can not in time be derived, influence chip work efficiency's problem.
2. In the heat radiation structure for packaging the microelectronic chip, the sealing cavity formed between the groove and the sealing cover is filled with the liquid cooling medium through the arranged groove, so that the heat conduction piece is assisted to cool, and the heat of the packaging inner cavity and the chip is led out at an accelerated speed.
Drawings
FIG. 1 is a schematic overall structure diagram of an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a package housing according to an embodiment of the utility model;
FIG. 3 is an enlarged schematic view of structure A of FIG. 2 in accordance with an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a top cover structure of an embodiment of the present invention;
FIG. 5 is a schematic view of a closure structure according to an embodiment of the present invention;
FIG. 6 is a schematic plan view of a top cover structure according to an embodiment of the present invention;
FIG. 7 is a schematic view of a heat transfer element mounting structure according to an embodiment of the present invention;
FIG. 8 is a schematic view of a heat transfer element according to an embodiment of the present invention.
The various reference numbers in the figures mean:
1. a package housing; 101. packaging the inner cavity; 102. a chip;
2. a top cover;
201. grooving; 2011. a limiting clamping groove; 2012. mounting a through hole; 202. a groove;
3. a heat conductor;
301. a soaking sheet; 302. a heat sink; 303. sealing the cover; 3031. a liquid injection hole; 3032. the side edges are walls.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
An embodiment of the utility model, as shown in fig. 1 to 8, provides a heat dissipation structure for microelectronic chip packaging, including a package housing 1, a top cover 2 is disposed on a top of the package housing 1, the top cover 2 is fixedly mounted on the top of the package housing 1, a groove 202 is formed on an upper surface of the top cover 2, a groove 201 is formed in a center of the groove 202, a mounting through hole 2012 is formed in a center of the groove 201, a heat conduction piece 3 is embedded in the mounting through hole 2012, the heat conduction piece 3 at least includes a soaking plate 301, a plurality of heat dissipation fins 302 are uniformly disposed on an upper surface of the soaking plate 301, a cover 303 is fixedly connected to a top of the heat dissipation fins 302, side edge walls 3032 are disposed at left and right edges of the cover 303, a liquid injection hole 3031 is formed on an upper surface of the cover 303, and a plurality of limiting clamping grooves 2011 are symmetrically disposed at left and right edges of the groove 201.
In order to improve the heat dissipation efficiency of the chip 102, a package inner cavity 101 is formed in the package shell 1, the chip 102 is installed in the package inner cavity 101, the heat conduction piece 3 is attached to the upper surface of the chip 102 through a heat equalizing sheet 301, preferably, heat conduction silica gel is coated between the chip 102 and the heat equalizing sheet 301, the heat equalizing sheet 301 is made of a nano carbon copper foil, and the heat equalizing sheet 301 is used for uniformly diffusing a plurality of hot spots on the surface of the chip to the surface of the heat equalizing sheet 301.
In order to ensure the tightness of the mounting through hole 2012 and prevent the cooling medium in the groove 202 from entering the package cavity 101 through the mounting through hole 2012, the heat conduction piece 3 is embedded and mounted in the mounting through hole 2012 through the soaking sheet 301, the side wall of the soaking sheet 301 is fixedly connected with the inner wall of the mounting through hole 2012, and the tightness of the connection between the soaking sheet 301 and the inner wall of the mounting through hole 2012 is ensured.
In order to ensure the installation stability of the heat conduction piece 3, the length of the heat radiating fin 302 is greater than that of the soaking fin 301, the heat radiating fin 302 is inserted into the limiting clamping groove 2011, the top of the heat radiating fin 302 is fixedly connected with the lower surface of the sealing cover 303, and the heat conduction efficiency between the sealing cover 303 and the heat radiating fin 302 is ensured.
Further, in order to ensure the requirement that the sealing cover 303 seals the groove 202, the sealing cover 303 provided by the present invention is of a U-shaped structure, the sealing cover 303 and the two side edge walls 3032 form a U-shaped structure, and the size of the sealing cover 303 is matched with that of the groove 202.
The specific demand for filling of cooling medium is met, heat dissipation of the heat conduction piece 3 is accelerated, the sealing cover 303 is fastened and fixed above the groove 202, a sealing cavity is reserved between the lower surface of the sealing cover 303 and the groove 202, the cooling medium is filled in the sealing cavity, the cooling medium can be preferably OPTEON SF33 phase change cooling medium, the side edge wall 3032 is used for sealing the left end and the right end of the groove 202, the sealing plug is installed at the liquid injection hole 3031, the upper surface of the sealing cover 303 is horizontally aligned with the upper surface of the packaging shell 1, the liquid injection hole 3031 is communicated with the sealing cavity, the cooling fins 302 are cooled through the cooling medium, the shell stability of the packaging shell 1 is effectively reduced, and the working efficiency of the chip 102 is effectively improved.
In order to ensure the efficient heat conduction efficiency of the heat conduction member 3, the heat sink 302 and the sealing cover 303 provided by the utility model are both made of copper metal materials and are used for improving the heat conduction efficiency, the heat on the surface of the chip and the heat in the packaging inner cavity 101 are directly and uniformly transferred to the heat sink 302 and the sealing cover 303 through the heat equalizing sheet 301, an air-cooled heat dissipation device can be preferably arranged on the upper surface of the sealing cover 303, and the heat conduction efficiency is improved through the sealing cover 303, so that the heat can be more quickly transferred out through the sealing cover 303.
When the liquid cooling type packaging shell is used specifically, a cooling medium is injected into the cavity through the liquid injection hole 3031, the liquid injection hole 3031 is sealed through the sealing plug, when the chip 102 generates heat during work, the heat of the chip 102 and the packaging inner cavity 101 can be directly absorbed through the soaking piece 301 and is transferred to the radiating fin 302, the cooling medium carries out liquid cooling on the radiating fin 302, the cooling medium can assist the shell of the packaging shell 1 to cool simultaneously, the heat of the packaging inner cavity 101 and the chip 102 is accelerated to be led out to the surface of the sealing cover 303 in time, the residual heat is transferred to the sealing cover 303 through the radiating fin 302, and the heat is dissipated in time through the sealing cover 303, so that the heat dissipation of the packaging inner cavity 101 and the chip is realized.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. A heat dissipation structure for packaging a microelectronic chip is characterized in that: including encapsulation casing (1), encapsulation casing (1) top is provided with top cap (2), top cap (2) upper surface is seted up fluted (202), recess (202) center department has seted up fluting (201), fluting (201) center department has seted up installation through-hole (2012), embedded the establishing of installation through-hole (2012) installs heat conduction spare (3), include soaking piece (301) in heat conduction spare (3) at least, soaking piece (301) upper surface evenly is provided with a plurality of fin (302), fin (302) top fixedly connected with closing cap (303), closing cap (303) left and right sides edge is provided with side edge wall (3032), closing cap (303) upper surface has been seted up notes liquid hole (3031), a plurality of spacing draw-in grooves (2011) have been seted up to fluting (201) left and right sides edge symmetry.
2. The heat dissipation structure of claim 1, wherein: encapsulation inner chamber (101) have been seted up in encapsulation casing (1), install chip (102) in encapsulation inner chamber (101), heat conduction spare (3) pass through soaking piece (301) with the laminating of chip (102) upper surface.
3. The heat dissipation structure of claim 1, wherein: the heat conduction piece (3) is installed in the installation through hole (2012) through the heat equalizing sheet (301) is embedded, the side wall of the heat equalizing sheet (301) is fixedly connected with the inner wall of the installation through hole (2012).
4. The heat dissipation structure of claim 1, wherein: the length of the radiating fin (302) is greater than that of the soaking fin (301), the radiating fin (302) is installed in the limiting clamping groove (2011) in an inserted mode, and the top of the radiating fin (302) is fixedly connected with the lower surface of the sealing cover (303).
5. The heat dissipation structure of claim 1, wherein: the sealing cover (303) is of a U-shaped structure, and the size of the sealing cover (303) is matched with that of the groove (202).
6. The heat dissipation structure of claim 5, wherein: the sealing cover (303) is fastened and fixed above the groove (202), a sealing cavity is reserved between the lower surface of the sealing cover (303) and the groove (202), and cooling media are filled in the cavity.
7. The heat dissipation structure of claim 1, wherein: the heat radiating fin (302) and the sealing cover (303) are both made of copper metal materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122097899.1U CN215933571U (en) | 2021-09-01 | 2021-09-01 | Heat radiation structure for microelectronic chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122097899.1U CN215933571U (en) | 2021-09-01 | 2021-09-01 | Heat radiation structure for microelectronic chip packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215933571U true CN215933571U (en) | 2022-03-01 |
Family
ID=80417942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122097899.1U Active CN215933571U (en) | 2021-09-01 | 2021-09-01 | Heat radiation structure for microelectronic chip packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215933571U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024055767A1 (en) * | 2022-09-14 | 2024-03-21 | 北京市九州风神科技股份有限公司 | Auxiliary structure for chip package |
-
2021
- 2021-09-01 CN CN202122097899.1U patent/CN215933571U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024055767A1 (en) * | 2022-09-14 | 2024-03-21 | 北京市九州风神科技股份有限公司 | Auxiliary structure for chip package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018503934A (en) | Heat sink and power battery system | |
| CN211980672U (en) | Battery pack and vehicle with same | |
| CN215933571U (en) | Heat radiation structure for microelectronic chip packaging | |
| CN213694681U (en) | Heat radiation module | |
| CN201467613U (en) | Combined radiator for electronic device with enclosed shell | |
| CN207368163U (en) | A kind of battery modules | |
| CN210958057U (en) | Electromechanical integrated motor protector | |
| CN211575316U (en) | Radiating component, radiator and air conditioner | |
| CN115315147A (en) | Heat radiation structure and electric automobile | |
| CN210405072U (en) | Converter with directional heat dissipation function | |
| CN211699571U (en) | Heat dissipation LED module and LED display screen | |
| CN210133520U (en) | Circuit board with plastic package structure | |
| CN212676249U (en) | Semiconductor with long service life | |
| CN209949722U (en) | Totally-enclosed dustproof magnetron power supply | |
| CN218677129U (en) | Cover plate with heat dissipation device | |
| CN218384848U (en) | High-power electrolytic capacitor with radiator and vehicle-mounted charger | |
| CN210298365U (en) | Air-cooled power supply device | |
| CN217822752U (en) | Integrated circuit packaging structure for multi-chip packaging | |
| CN217902836U (en) | Reactor shell easy to radiate heat | |
| CN218414749U (en) | Heat radiation structure, power supply unit and electric automobile | |
| CN220210834U (en) | Heat pipe urgent heat dissipation module | |
| CN218125237U (en) | Heat radiation structure and electric automobile | |
| CN218920806U (en) | Inverter heat dissipation case and inverter device | |
| CN220044006U (en) | Filling and sealing box | |
| CN213717998U (en) | Computer gateway equipment with high temperature protection function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |