CN115315147A

CN115315147A - Heat radiation structure and electric automobile

Info

Publication number: CN115315147A
Application number: CN202210947325.5A
Authority: CN
Inventors: 张细平; 刘玉伟; 孙永宝; 陶安发
Original assignee: Suzhou Huichuan United Power System Co Ltd
Current assignee: Suzhou Huichuan United Power System Co Ltd
Priority date: 2022-08-09
Filing date: 2022-08-09
Publication date: 2022-11-08

Abstract

The invention discloses a heat dissipation structure and an electric automobile. The heat dissipation structure comprises a shell, a liquid inlet mechanism and a liquid outlet mechanism, wherein the shell is provided with a heat dissipation cavity, the inside and the outside of the heat dissipation cavity can be provided with heating elements, so that the utilization rate of a heat dissipation space is improved; establish a plurality of runners in the casing, the both sides of liquid cooling return circuit tubular construction connection casing, and communicate the inlet and the liquid outlet at each runner both ends respectively, the one end of liquid cooling return circuit tubular construction lets in the coolant liquid of lower temperature, in order to dispel the heat through a plurality of runners of a plurality of inlets flow through, the higher temperature coolant liquid after the heat dissipation is discharged through the one side liquid cooling return circuit tubular construction of intercommunication liquid outlet, the casing strengthens the support intensity through the runner wall of every two adjacent runners, the setting of runner can reduce casing weight simultaneously, and can increase radiating effective area of contact, promote the radiating efficiency, solve the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight.

Description

Heat radiation structure and electric automobile

Technical Field

The invention relates to the technical field of liquid cooling heat dissipation, in particular to a heat dissipation structure and an electric automobile.

Background

The liquid-cooled heat dissipation device adopted by the existing vehicle-mounted charger is generally formed by die-casting or metal plate forming, and the wall thickness of a formed water channel of a die-cast heat dissipation water channel is thick due to process limitation, so that the liquid-cooled heat dissipation device is heavy, high in thermal resistance and poor in heat dissipation effect; the wall thickness of the heat dissipation water channel formed by the metal plates is thin, but the pressure resistance of the water channel is low, and the water channel wall is easy to deform.

Disclosure of Invention

The invention mainly aims to provide a heat dissipation structure and an electric automobile, and aims to solve the technical problems of large weight or insufficient compressive strength of the existing liquid cooling heat dissipation device.

In order to achieve the above object, the heat dissipation structure provided by the present invention is located in the vehicle-mounted charger, and includes at least one heat dissipation module, where the heat dissipation module includes:

the heat dissipation device comprises a shell, a heat dissipation cavity and a heat dissipation cover, wherein the shell is provided with a heat dissipation cavity, a plurality of flow channels which are arranged at intervals are arranged in at least one side wall of the shell, the flow channels are arranged around the heat dissipation cavity, the inner wall of the heat dissipation cavity and/or the outer wall of the heat dissipation cavity are used for being connected with a heating element, and a liquid inlet and a liquid outlet are respectively arranged at two ends of each flow channel; and

the liquid inlet mechanism is communicated with liquid inlets of the flow channels; and

and the liquid outlet mechanism is communicated with the liquid outlets of the plurality of flow channels.

Optionally, the housing comprises:

the liquid cooling piece is provided with a plurality of flow passages which are arranged at intervals, one surface of the liquid cooling piece is concavely provided with a containing groove, and the liquid inlet and the liquid outlet are arranged around the notch of the containing groove; and

the two partition plates are connected with two sides of the liquid cooling piece and are enclosed with the containing groove to form the heat dissipation cavity with one side opened, and an installation part is arranged on each partition plate to connect an external part.

Optionally, two the installation department is respectively towards deviating from the open-ended both sides extend the setting, the opening part is used for installing first circuit board, the installation department with first circuit board can dismantle the connection, first circuit board lid closes the opening.

Optionally, a side of the heat dissipation cavity facing away from the opening is used for mounting at least one heat generating element;

or, the surface of one side of the heat dissipation cavity, which is back to the opening, is used for installing a second circuit board, at least one side of the liquid cooling piece, which is adjacent to the partition plate, is provided with a guide connection part, and the guide connection part is provided with a plurality of through holes so that the pins of the heating element accommodated in the heat dissipation cavity can penetrate through the through holes.

Optionally, the accommodating groove is a U-shaped groove;

or, the both ends of liquid cooling spare are equipped with the extension, two the extension is dorsad respectively the opening extends the setting, the inlet with the liquid outlet runs through the extension, the periphery wall of extension is used for installing heating element.

Optionally, the partition plate is an aluminum substrate;

and/or the liquid cooling piece is a temperature-equalizing plate;

and/or the liquid cooling piece is of an extrusion molding structure;

and/or at least one clapboard is welded with the liquid cooling piece;

and/or at least one baffle plate is detachably connected with the liquid cooling piece.

Optionally, the housing further includes at least one baffle, at least one baffle is disposed in the heat dissipation cavity to divide the heat dissipation cavity into at least a first cavity and a second cavity, and the first cavity and the second cavity are respectively used for accommodating the heating element.

Optionally, the heat dissipation structure includes a plurality of heat dissipation modules, and the liquid inlet mechanism and the liquid outlet mechanism of the plurality of heat dissipation modules are connected in series to form a liquid cooling loop.

The present invention also proposes an electric vehicle comprising:

the electric vehicle comprises a vehicle body, wherein an electric power storage structure is arranged in the vehicle body; and

as described above, the heat dissipation structure is disposed in the vehicle body and electrically connected to the power storage structure.

According to the technical scheme, the shell with the flow channel is adopted to form the heat dissipation cavity, and the heating elements can be arranged inside and outside the heat dissipation cavity, so that the technical problems that the existing liquid cooling heat dissipation device is heavy in weight or insufficient in compressive strength are solved. The heat dissipation structure comprises a shell, a liquid inlet mechanism and a liquid outlet mechanism, wherein the shell is provided with a heat dissipation cavity, the inside and the outside of the heat dissipation cavity can be provided with heating elements, so that the utilization rate of a heat dissipation space is improved; establish a plurality of runners in the casing, inlet mechanism communicates the inlet of a plurality of runners, go out the liquid outlet of a plurality of runners of liquid mechanism intercommunication, let in lower cold coolant liquid through inlet mechanism, lower cold coolant liquid dispels the heat through a plurality of runners of a plurality of inlets flow through, higher warm coolant liquid after the heat dissipation is discharged through going out liquid mechanism after passing through the liquid outlet, the casing is through the runner wall enhancement support intensity between every two adjacent runners, the setting of runner can reduce casing weight simultaneously, and can increase radiating effective area of contact, promote the radiating efficiency, solve the big or not enough technical problem of compressive strength of current liquid cooling heat abstractor weight.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is an exploded schematic view of a heat dissipation structure according to an embodiment of the present invention;

fig. 2 is a schematic view of a housing structure of an embodiment of the heat dissipation structure of the invention;

FIG. 3 is a schematic view of a liquid cooling element according to an embodiment of the heat dissipation structure of the present invention;

fig. 4 is a schematic structural diagram of a housing according to another embodiment of the heat dissipation structure of the present invention;

fig. 5 is a schematic view of a housing structure according to another embodiment of the heat dissipation structure of the present invention;

FIG. 6 is a schematic view of a liquid flow direction structure inside a housing according to another embodiment of the heat dissipation structure of the present invention;

FIG. 7 is a schematic view of a liquid cooling element according to another embodiment of the heat dissipation structure of the present invention;

FIG. 8 is a schematic view of the heat dissipation structure of the present invention combined with the housing structure of FIG. 7;

FIG. 9 is an exploded view of the heat sink structure of the present invention in combination with the heat sink structure of FIG. 7;

FIG. 10 is a schematic view of the heat dissipation structure of the present invention combined with the assembly structure of the heat dissipation structure of FIG. 7;

fig. 11 is a schematic view of an assembly and disassembly structure of the heat dissipation structure of the present invention combined with the housing and the heat generating element of the embodiment of fig. 7;

FIG. 12 is a schematic view of an assembly structure of the heat dissipation structure of the present invention in combination with the embodiment of FIG. 7;

FIG. 13 is a schematic view of a liquid cooling element according to another embodiment of the heat dissipation structure of the present invention;

FIG. 14 is a schematic view of the heat dissipation structure of the present invention combined with the housing structure of FIG. 13;

fig. 15 is a schematic structural view of a liquid cooling element according to another embodiment of the heat dissipation structure of the present invention;

FIG. 16 is a schematic view of the heat dissipation structure of the present invention combined with the housing structure of FIG. 15;

FIG. 17 is a schematic view of the heat dissipation structure of the present invention combined with the heat dissipation structure of FIG. 15;

FIG. 18 is a schematic view of an assembled and disassembled structure of the heat dissipation structure of the present invention in combination with the housing and the heat generating element of FIG. 17;

FIG. 19 is a schematic view of a liquid cooling element according to still another embodiment of the heat dissipation structure of the present invention;

FIG. 20 is a schematic view of the heat dissipation structure of the present invention combined with the heat dissipation structure of FIG. 19;

FIG. 21 is a schematic view of the heat dissipation structure of the present invention combined with the heat dissipation structure of FIG. 19 and the assembly structure of the heat generating component;

fig. 22 is a schematic view of the heat dissipation structure of the present invention combined with the assembly structure of another heat dissipation structure and a heat generating element of fig. 19.

The reference numbers indicate:

reference numerals

Name (R)

Reference numerals

Name (R)

Reference numerals

Name (R)

100

Heat radiation structure

30

Liquid cooling piece

50

Partition board

10

Shell body

30A

Flow passage

51

Mounting part

10A

Heat dissipation cavity

301A

Liquid inlet

51A

Mounting hole

10B

Opening(s)

302A

Liquid outlet

90

Liquid cooling loop pipe structure

80

Baffle plate

30B

Containing groove

91

Liquid inlet pipe

70

Heating element

31

Main body

911

A first liquid inlet passage

71

Circuit board

32

Guide connection part

912

The second liquid inlet passage

72

Magnetic core component

32A

Perforation

92

Drain pipe

73

Patch MOS

33

Extension part

921

The first liquid outlet passage

74

Plug-in MOS

90A

Liquid inlet interface

922

Second liquid outlet passage

90B

Liquid drainage interface

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indications in the embodiments of the present invention are only used to explain the relative position relationship, the motion condition, etc. of each component in a certain posture, and if the certain posture is changed, the directional indication is changed accordingly.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, descriptions such as "first", "second", etc. in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the expression "and/or" as used throughout is meant to encompass three juxtaposed aspects, exemplified by "A and/or B", including either the A aspect, or the B aspect, or aspects in which both A and B are satisfied. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The present invention provides a heat dissipation structure 100.

Referring to fig. 1 to 22, fig. 1 to 4 are schematic views of a heat dissipation structure 100 employing one kind of liquid cooling member 30, fig. 7 to 10 are schematic views of a heat dissipation structure 100 employing another kind of liquid cooling member 30, fig. 13 to 14 are schematic views of a heat dissipation structure 100 employing yet another kind of liquid cooling member 30, and fig. 15 to 18 are schematic views of a heat dissipation structure 100 employing yet another kind of liquid cooling member 30;

fig. 5 and 6 are schematic diagrams of the heat dissipation structure 100 with a plurality of heat dissipation chambers 10A and the flow direction of the liquid in the four liquid cooling members 30; fig. 19 to 22 are schematic views of a heat dissipation structure 100 using still another liquid cooling member 30.

In the embodiment of the present invention, the heat dissipation structure 100 is located in the vehicle-mounted charger, and includes at least one heat dissipation module, where the heat dissipation module includes a housing 10, a liquid inlet mechanism, and a liquid outlet mechanism, and the housing 10 has a heat dissipation cavity 10A; as shown in fig. 1 to 4, a plurality of flow channels 30A are disposed in the housing 10 at intervals, the plurality of flow channels 30A are disposed around the heat dissipation cavity 10A, an inner wall of the heat dissipation cavity 10A and/or an outer wall of the heat dissipation cavity 10A are used for connecting the heating element 70, and a liquid inlet 301A and a liquid outlet 302A are respectively disposed at two ends of each flow channel 30A; the liquid inlet mechanism is communicated with liquid inlets 301A of the plurality of flow channels 30A; the liquid outlet mechanism is communicated with liquid outlets 302A of the plurality of flow channels.

According to the technical scheme, the shell 10 with the flow channel 30A is adopted to form the heat dissipation cavity 10A, and the heating element 70 can be arranged inside and outside the heat dissipation cavity 10A, so that the technical problem that the existing liquid cooling heat dissipation device is heavy in weight or insufficient in compressive strength is solved. The heat dissipation structure 100 comprises a shell 10, a liquid inlet mechanism and a liquid outlet mechanism, wherein the shell 10 is provided with a heat dissipation cavity 10A, the inside and the outside of which can be provided with a heating element 70, so that the heat dissipation space utilization rate is improved; a plurality of flow channels 30A are arranged in the housing 10, the liquid inlet mechanism is communicated with liquid inlets 301A of the flow channels 30A, and the liquid outlet mechanism is communicated with liquid outlets 302A of the flow channels to communicate the flow channels 30A for heat dissipation. The heat dissipation structure 100 is connected to a liquid inlet mechanism, and is provided with a plurality of liquid inlets 301A, a plurality of flow channels 30A are arranged for flowing through the cooling liquid at a lower temperature, the cooling liquid at a lower temperature is discharged through a liquid outlet 302A after passing through the liquid inlet mechanism, the shell 10 is reinforced in support strength through the flow channel wall between every two adjacent flow channels 30A, meanwhile, the weight of the shell 10 can be reduced due to the arrangement of the flow channels 30A, the effective contact area of heat dissipation can be increased, the heat dissipation efficiency is improved, and the technical problem that the existing liquid cooling heat dissipation device is heavy in weight or insufficient in compressive strength is solved.

It can be understood that the heat generating component 70 includes a first heat generating source and a second heat generating source, the first heat generating source is a PCB board, and includes a circuit board 71 and a magnetic core component 72, the magnetic core component 72 is a transformer, and may also be a high heat generating component 70 such as a capacitor or a power board, wherein the core package of the transformer and the capacitor may be accommodated in the heat dissipation cavity 10A and electrically connected to the circuit board 71 through a pin, one or two circuit boards 71 may be provided, that is, the first circuit board 71 and the second circuit board 71, the first circuit board 71 and/or the second circuit board 71 are provided on one side or two sides of the heat dissipation cavity 10A, and may also be provided as an adjacent side or an opposite side, such as a PCB board; the second heat source may be disposed on an outer wall of the heat dissipation chamber 10A, including being disposed on the outer sidewall and/or the outer bottom wall, and the second heat source may be a patch MOS73, a plug MOS74, or the like.

It can be understood that when the installation condition allows, the second heat generating source can be arranged on the outer wall of the liquid inlet mechanism and/or the liquid outlet mechanism, as shown in fig. 1, so as to facilitate heat dissipation.

Optionally, the housing 10 includes a liquid cooling member 30 and two partition plates 50, the liquid cooling member 30 is provided with a plurality of flow passages 30A arranged at intervals, one surface of the liquid cooling member 30 is recessed to form a containing groove 30B, and the liquid inlet 301A and the liquid outlet 302A are arranged around the notch of the containing groove 30B; two partition plates 50 are connected to both sides of the liquid cooling member 30 and enclose the receiving groove 30B to form a heat dissipation chamber 10A having an opening 10B at one side, and a mounting portion 51 is provided on each partition plate 50 to connect an external member.

In this embodiment, the plate of the liquid cooling member 30 is provided inside with a plurality of flow channels 30A arranged at intervals, two ends of each flow channel 30A penetrate through two side ends of the plate to form a liquid inlet 301A and a liquid outlet 302A, the liquid inlet 301A and the liquid outlet 302A are distributed at two groove wall ends of the accommodating groove 30B, one section of the liquid inlet pipe is correspondingly communicated with the liquid inlet 301A to input the cooling liquid with lower temperature, and the other section of the liquid inlet pipe is correspondingly communicated with the liquid outlet 302A to discharge the cooling liquid with higher temperature after heat absorption. The cooling liquid of lower temperature flows in flow channel 30A inside to discharge from the liquid outlet 302A that is located inlet 301A offside, make the cooling liquid encircle the panel extending direction of whole liquid cooling member 30, greatly increased heat dissipation area of contact promotes the radiating efficiency.

In another embodiment, at least one side of each partition 50 is provided with a mounting portion 51, the mounting portion 51 is provided with a mounting hole 51A for connecting with an external component, when the two opposite sides of the heat dissipation cavity 10A are both provided with the heat generating elements 70, two mounting portions 51 are respectively provided on the heat generating elements 70 on the two corresponding sides of each partition 50, so that the assembly space utilization rate and the heat dissipation contact area of the liquid cooling element 30 and the heat generating elements 70 are increased, the heat dissipation loss of the cooling liquid is reduced, and the heat dissipation efficiency is improved.

It is understood that the heat generating element 70 disposed inside the heat dissipating chamber 10A and/or outside the heat dissipating chamber 10A can directly contact the liquid cooling member 30; the heat generating element 70 accommodated in the heat dissipation chamber 10A can not directly contact the liquid cooling member 30 due to the structure or the space, and the heat dissipation chamber 10A is filled with glue to relatively fix the relative position of the heat generating element 70 and increase the heat conduction efficiency.

Optionally, the partition 50 is an aluminum substrate, which has the characteristics of low cost, light weight and good heat conduction effect, and reduces the manufacturing cost and weight of the heat dissipation structure 100.

Optionally, the heat dissipation structure 100 includes a plurality of heat dissipation modules, and the liquid inlet mechanism and the liquid outlet mechanism of the plurality of heat dissipation modules are connected in series to form a liquid cooling loop.

In this embodiment, the liquid inlet mechanism and the liquid outlet mechanism of the present invention are the liquid cooling loop pipe structure 90 of the heat dissipation structure 100, the liquid inlet mechanism is set as a liquid inlet pipe 91, the liquid outlet mechanism is set as a liquid outlet pipe 92, the liquid inlet pipe 91 is disposed on one side of the housing 10 adjacent to the liquid inlet 301A, the liquid inlet pipe 91 is provided with a liquid inlet channel, and the liquid inlet channel is communicated with the liquid inlet 301A; the drain tube 92 is disposed on a side of the housing 10 adjacent to the liquid outlet 302A, and the drain tube 92 is provided with a drain passage communicating with the liquid outlet 302A. A liquid inlet is formed in one end, away from the liquid cooling piece 30, of the liquid inlet pipe 91, a first passage and a first liquid passing hole are formed in the liquid inlet pipe 91, the first liquid passing hole is arranged corresponding to the liquid inlet 301A of the flow path, two ends of the first passage are respectively communicated with the liquid inlet and the first liquid passing hole to form a liquid inlet channel, and the liquid inlet channel is communicated with the liquid inlets 301A through the first liquid passing holes; one end that fluid-discharge tube 92 kept away from liquid cooling spare 30 is equipped with liquid outlet 302A, and fluid-discharge tube 92 is inside to be equipped with second route and second and to cross the liquid hole, and the second is crossed the liquid hole and is corresponded the liquid outlet 302A setting of flow path, and the both ends of second route communicate liquid outlet 302A and second respectively and pass the liquid hole to form drainage channel, drainage channel passes through the second and passes a plurality of liquid outlets 302A of liquid hole intercommunication. The arrangement of the liquid inlet pipe 91 and the liquid outlet pipe 92 enables the cooling liquid to flow in and out smoothly, and the smoothness of the flowing of the cooling liquid is improved.

When the heat dissipation structure 100 includes a heat dissipation module, the liquid inlet mechanism and the liquid outlet mechanism may be a liquid inlet pipe 91 and a liquid outlet pipe 92 that are separately disposed on two sides of the housing 10 and are independently disposed, as shown in fig. 1-2, 9 and 17, the liquid inlet pipe 91 is connected to the liquid inlet 301A, the liquid outlet pipe 92 is connected to the liquid outlet 302A, the heat dissipation structure 100 conveys the cooling liquid with a lower temperature through the liquid inlet pipe 91 to enter the liquid inlet 301A, and flows through the flow channel 30A until reaching the liquid outlet 302A at an end of the flow channel 30A away from the liquid inlet 301A, and discharges the cooling liquid with a higher temperature that absorbs the heat of the heating element 70 through the liquid outlet 302A, thereby improving the heat dissipation efficiency and the flow order of the cooling liquid.

When the heat dissipation structure 100 includes a plurality of heat dissipation modules, the plurality of housings 10 form a plurality of heat dissipation cavities 10A, in order to improve the distribution convenience of the liquid cooling loop structure 90, a plurality of first liquid passing holes may be disposed on the liquid inlet pipe 91 of the liquid inlet mechanism, a plurality of second liquid passing holes may be disposed on the liquid outlet pipe 92 of the liquid outlet mechanism, and at least one of the first liquid passing holes and/or at least one of the second liquid passing holes is disposed corresponding to one of the housings 10. Referring to fig. 11, two first liquid passing holes or two second liquid passing holes are correspondingly disposed on the liquid inlet 301A or the liquid outlet 302A of the housing 10, respectively, and the pipe wall portion between the two first liquid passing holes or the two second liquid passing holes increases the structural strength of the liquid inlet pipe 91 or the liquid outlet pipe 92, thereby enhancing the flow order and smoothness of the cooling liquid and increasing the heat exchange efficiency of the cooling liquid.

Furthermore, the first liquid passing holes can be set to be one or a small number of strip-shaped holes which can be simultaneously communicated with the liquid inlet ports 301A, so that the structural strength of the liquid inlet pipe 91 is ensured to be set, and the pressure resistance of the liquid inlet pipe 91 is improved; or the first liquid passing holes can be arranged to be a plurality of through holes corresponding to the liquid inlet 301A in number one to one, so that the flow process of the cooling liquid is definitely planned and divided, and the flow process can be understood as a liquid inlet channel of the liquid inlet pipe 91 formed by connecting the plurality of through holes in series, so that the cooling liquid flows orderly and is accurately radiated.

It will be appreciated that the second liquid passing holes may be arranged similarly.

It is understood that the liquid inlet 301A and the liquid outlet 302A of the flow channel 30A are both two ports communicating with the space in the flow channel 30A, that is, for one of the ports, the port into which the cooling liquid flows is the liquid inlet 301A, and the port out of which the cooling liquid flows is the liquid outlet 302A, and the names are not only used for limiting the port position and the liquid flow direction, but also for practical applications.

It should be noted that, when the external liquid inlet 90A and the external liquid outlet 90B are faced to a working condition that they are disposed on two sides, the housing 10 forms a heat dissipation cavity 10A, the liquid inlet pipe 91 and the liquid outlet 92 are independent pipes respectively and located on two sides of the liquid cooling member 30 with the flow channel 30A, which are adjacent to the liquid inlet 301A and the liquid outlet 302A, respectively, and the lower temperature coolant enters the flow channel 30A from the side of the liquid inlet pipe 91 and flows out of the heat dissipation structure 100 from the side of the liquid outlet 92.

When the external liquid inlet and outlet port 90B is not suitable for the bilateral arrangement, the liquid inlet pipe 91 and the liquid outlet pipe 92 may be arranged in the same side connection structure, as shown in fig. 5 and 6, that is, at least a portion of the liquid inlet pipe 91 and the liquid outlet pipe 92 are arranged on the same side, so as to meet the requirements of single-side liquid inlet and liquid outlet.

Further, the liquid inlet channel of the liquid inlet pipe 91 may be independently set and disconnected with the liquid discharge channel of the liquid discharge pipe 92, and may also be staggered according to the number of the heat dissipation cavities 10A, taking three heat dissipation cavities 10A as an example, that is, the liquid cooling loops corresponding to the three heat dissipation cavities are connected in series, which is specifically represented as: the cooling liquid with lower temperature enters from the liquid inlet port 90A and is discharged from the liquid discharge port 90B after sequentially passing through the first liquid inlet passage 911, the flow channel 30A of the first cavity, the first liquid outlet passage 921, the flow channel 30A of the second cavity, the second liquid inlet passage 912, the flow channel 30A of the third cavity and the second liquid outlet passage 922;

the first liquid inlet passage 911 is communicated with the liquid inlet port 90A, and the first liquid inlet passage 911 and the second liquid inlet passage 912 are arranged on the liquid inlet pipe 91 and are isolated and not communicated with each other; the first liquid outlet passage 921 and the second liquid outlet passage 922 are arranged on the liquid discharge pipe 92, and are isolated and not communicated, and the second liquid outlet passage 922 is communicated with the liquid discharge interface 90B.

Optionally, the liquid cooling piece 30 is a temperature equalizing plate, the temperature equalizing plate is arranged in a harmonica tube type, the temperature equalizing plate is provided with a plurality of runners 30A, the runners 30A penetrate through the extending area of the temperature equalizing plate, the heat dissipation uniformity can be improved, the local overheating condition in the heat dissipation process is avoided, the effective heat dissipation efficiency is improved, and the heat dissipation reliability of the heat dissipation structure 100 is high.

Optionally, the liquid cooling member 30 is an extrusion-molded structure, and the plurality of flow channels 30A in the extrusion-molded harmonica-shaped temperature equalization plate increase the convection exchange area and improve the heat dissipation effect. The retaining wall between each flow channel 30A of each adjacent chain plays a supporting role on the upper surface and the lower surface of the plate, so that the pressure resistance of the temperature equalizing plate is enhanced, the flow channels 30A are prevented from deforming under the condition of high pressure, and the temperature equalizing plate is high in stability and strong in reliability.

Optionally, at least one partition 50 is welded to the fluid cooling member 30; and/or at least one partition 50 is removably connected to the fluid-cooled element 30.

In this embodiment, the arrangement of the partition plate 50 and the liquid cooling member 30 includes the following conditions:

firstly, two partition boards 50 can be directly welded with the liquid cooling piece 30 to form a heat dissipation cavity 10A structure with an opening 10B on one side in a surrounding manner, so that the installation steps are reduced, and the heating element 70 is accommodated through the opening 10B;

second, two partition plates 50 can be detachably connected to the liquid cooling member 30, so as to adjust the spatial layout of the heat dissipation chamber 10A and improve the space utilization. If the heat dissipation structure is used in a specific use scene and does not need to be frequently disassembled, the two partition plates 50 and the liquid cooling element 30 can be pre-assembled in advance, and the heat dissipation structure 100 does not need to be disassembled into parts even if the heat dissipation structure is disassembled, so that the assembly, maintenance or replacement efficiency is improved;

thirdly, a baffle 50 and the welding of liquid cooling piece 30, another baffle 50 can be dismantled with liquid cooling piece 30 and be connected, when still being provided with a plurality of baffles 80 in heat dissipation chamber 10A, baffle 80 and liquid cooling piece 30 are can dismantle the connection to in adjustment installation space, promotion space utilization, can also promote simultaneously and dismantle speed, be convenient for demolish the encapsulating, so that heat radiation structure 100's reuse.

Optionally, the two mounting portions 51 extend towards two sides away from the opening 10B, the opening 10B is used for mounting the first circuit board 71, the mounting portions 51 are detachably connected with the first circuit board 71, and the first circuit board 71 covers the opening 10B.

In this embodiment, first circuit board 71 locates heat dissipation chamber 10A's opening 10B side, and carry out the dismouting assembly through installation department 51 on the both sides baffle 80, installation department 51 extends to opening 10B dorsad, be convenient for the installation and do not hinder the space that sets up of components and parts on first circuit board 71, reduce the risk of the components and parts colliding with on first circuit board 71, damage, make first circuit board 71 can hold high heat generation nature's heating element 70 in heat dissipation chamber 10A, with dispel the heat fast, avoid damaging first circuit board 71 or other electronic components on its board.

Optionally, the receiving groove 30B is a U-shaped groove.

In this embodiment, the liquid cooling member 30 is a temperature-uniforming plate, the temperature-uniforming plate is bent to form a U-shaped groove, and the two partition plates 50 are respectively disposed on two side edges of the U-shaped groove to form the heat dissipation chamber 10A by enclosing with the temperature-uniforming plate.

Optionally, the two ends of the liquid cooling member 30 are provided with extending portions 33, the two extending portions 33 extend away from the opening 10B, the liquid inlet 301A and the liquid outlet 302A penetrate through the extending portions 33, and the outer peripheral wall of the extending portions 33 is used for mounting the heating element 70.

In another embodiment, the two side edges of the liquid cooling element 30, which are parallel to the flow channel 30A, are respectively provided with an extension portion 33, and both the two extension portions 33 are disposed opposite to the opening 10B side of the heat dissipation cavity 10A, so that the liquid cooling element 30 is disposed in a pi shape, wherein the liquid inlet 301A and the liquid outlet 302A of the flow channel 30A penetrate through the extension portions 33 and are disposed facing the surface of the liquid cooling loop pipe structure 90, and the extension portions 33, which are not in contact with the outer surface of the liquid cooling loop pipe structure 90, can further be provided with a plug-in MOS74, thereby increasing the heat dissipation element, improving the utilization rate of the lower temperature difference of the lower temperature cooling liquid for heat dissipation, and reducing the energy loss.

Referring to fig. 10, 12 and 17 in combination, optionally, the side of the heat dissipation chamber 10A facing away from the opening 10B is used for mounting at least one heat generating element 70.

In this embodiment, one side of the heat dissipation cavity 10A away from the opening 10B is used for installing at least one patch MOS73, so as to save an installation space, and the heat dissipation structure 100 can dissipate heat from a first heat source in the heat dissipation cavity 10A, and also can dissipate heat from a second heat source outside the heat dissipation cavity 10A.

Referring to fig. 7 to 10 and 15 to 18, optionally, a surface of the heat dissipation chamber 10A on a side facing away from the opening 10B is used for mounting a second circuit board 71, at least one side of the liquid cooling element 30 adjacent to the partition plate 50 is provided with a conductive portion 32, and the conductive portion 32 is provided with a plurality of through holes 32A, so that pins of a part of the heat generating element 70 accommodated in the heat dissipation chamber 10A can pass through the through holes.

In this embodiment, circuit boards 71 are disposed on the sides of the heat dissipation chamber 10A and the heat dissipation chamber 10A facing away from the opening 10B, the heat generating element 70 disposed on the side of the heat dissipation chamber 10A facing away from the opening 10B is set as a second circuit board 71, and the partition 50 is also provided with a mounting portion 51 corresponding to the second circuit board 71, wherein the mounting portion 51 is used for detachable assembly with the second circuit board 71. A plurality of through holes 32A are formed in the extending portion 33 of the liquid cooling element 30, and at least two groups of first heat sources are accommodated in the heat dissipation cavity 10A, taking two groups as an example, pins of one group of first heat sources extend toward the first circuit board 71 to be electrically welded with the first circuit board 71; the other group of the first heating sources and the previous group of the first heating sources are mutually static and arranged at intervals through glue pouring, and pins of the reorganized first heating sources penetrate through the plurality of through holes 32A in the extension part 33 to be electrically welded with the second power piece arranged on the back side of the opening 10B, so that the heat dissipation efficiency and the utilization rate of the installation space are improved.

Referring to fig. 19 to fig. 22, optionally, the casing 10 further includes at least one baffle 80, and the at least one baffle 80 is disposed in the heat dissipation chamber 10A to divide the heat dissipation chamber 10A into at least a first chamber and a second chamber, where the first chamber and the second chamber are respectively used for accommodating the heat generating element 70.

In this embodiment, both the baffle 80 and the partition 50 can be made of aluminum substrates, the baffle 80 divides the heat dissipation chamber 10A into a plurality of small chambers, such as a first chamber, a second chamber, a third chamber, and the like, and the small chambers are used for installing a plurality of heating elements 70 arranged in a centralized manner, so as to improve the heat dissipation efficiency.

Further, when the heat dissipation requirements of more intensively arranged heat-dissipating heating elements 70 to be dissipated face to face, a plurality of temperature equalizing plates can be used for connection, the baffle plates 80 and the baffle plates 50 divide the connected large heat-dissipating cavity 10A into a plurality of small heat-dissipating cavities 10A for subpackaging the heating elements 70, and meanwhile, the baffle plates 80 and/or the baffle plates 50 can also shield mutual interference among the heating elements 70.

The invention also provides an electric automobile, which comprises an automobile body and the heat dissipation structure; the specific structure of the heat dissipation structure refers to the above embodiments, and since the electric vehicle adopts all technical solutions of all the above embodiments, at least all beneficial effects brought by the technical solutions of the above embodiments are achieved, and details are not repeated here. The vehicle-mounted charger is arranged in the vehicle body, the heat dissipation structure is arranged on the vehicle-mounted charger, the electric power storage structure is further arranged in the vehicle body, the vehicle-mounted charger is electrically connected with the electric power storage structure, the heat dissipation efficiency of the vehicle-mounted charger is improved through the arrangement of the heat dissipation structure, and the charging safety guarantee of the electric vehicle is improved.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. The utility model provides a heat radiation structure, is applied to on-vehicle machine that charges, its characterized in that, heat radiation structure is located in the on-vehicle machine that charges, including at least one heat dissipation module, heat dissipation module includes:

the heat dissipation device comprises a shell, a heat dissipation cavity and a heat dissipation cover, wherein the shell is provided with a heat dissipation cavity, a plurality of flow channels which are arranged at intervals are arranged in at least one side wall of the shell, the flow channels are arranged around the heat dissipation cavity, the inner wall of the heat dissipation cavity and/or the outer wall of the heat dissipation cavity are used for being connected with a heating element, and a liquid inlet and a liquid outlet are respectively arranged at two ends of each flow channel;

2. The heat dissipation structure of claim 1, wherein the housing comprises:

the two partition plates are connected with two sides of the liquid cooling piece and form the heat dissipation cavity with one side opened in a surrounding mode with the containing groove, and an installation portion is arranged on each partition plate to be connected with an external piece.

3. The heat dissipation structure of claim 2, wherein the two mounting portions extend toward two sides away from the opening, the opening is used for mounting a first circuit board, the mounting portions are detachably connected with the first circuit board, and the first circuit board covers the opening.

4. The heat dissipation structure of claim 3, wherein a side of the heat dissipation chamber facing away from the opening is configured to receive at least one of the heat generating components;

5. The heat dissipating structure of claim 2, wherein said receiving groove is a U-shaped groove;

6. The heat dissipating structure of claim 2, wherein the spacer is an aluminum substrate;

and/or the liquid cooling piece is a temperature equalizing plate;

and/or the liquid cooling piece is of an extrusion molding structure;

and/or at least one clapboard is welded with the liquid cooling piece;

7. The heat dissipating structure of claim 1, wherein the housing further comprises at least one baffle disposed within the heat dissipating cavity to divide the heat dissipating cavity into at least a first cavity and a second cavity, the first cavity and the second cavity being respectively configured to receive the heat generating component.

8. The heat dissipation structure of claim 1, wherein the heat dissipation structure comprises a plurality of heat dissipation modules, and the liquid inlet mechanism and the liquid outlet mechanism of the plurality of heat dissipation modules are connected in series to form a liquid cooling loop.

9. An electric vehicle, characterized in that the electric vehicle comprises:

the heat dissipation structure according to any one of claims 1 to 8, which is provided in the vehicle body and is electrically connected to the power storage structure.