CN212851612U - Heat dissipation box, automobile controller and automobile - Google Patents

Abstract

The utility model discloses a heat dissipation case, automobile controller and car. The heat dissipation box comprises a box body and a cooling module. The box body is provided with a containing cavity, and a first cooling channel is arranged on the cavity wall of the containing cavity. The cooling module is internally provided with a second cooling channel, and the cooling module is arranged in the accommodating cavity and is arranged at intervals with the bottom wall of the accommodating cavity so as to form an accommodating space for accommodating the electronic component. The surface of the first cooling channel and the cooling module can be provided with electronic devices needing heat dissipation, the electronic devices are cooled, and the accommodating space between the bottom walls of the cooling module and the accommodating cavity can be provided with the electronic devices needing heat dissipation. Therefore, can see the utility model discloses a heat dissipation case sets up cooling module through elevating at the box internal, can satisfy the radiating while of device, improves the complete machine power density of heat dissipation case, guarantees that the complete machine volume of heat dissipation case accords with the customer requirement.

Description

Heat dissipation box, automobile controller and automobile

Technical Field

The utility model belongs to the technical field of the heat dissipation, especially, relate to a heat dissipation case, automobile controller and car.

Background

High-power electronic devices such as a motor controller, a charger, a DCDC (direct current) and the like in the automobile industry can be concentrated in one installation box, when a plurality of high-power electronic devices work simultaneously, the high-power electronic devices are easy to generate larger heat, in the running process, the electronic devices are easy to be used in an overheat environment for a long time, and the overheat environment is easy to influence the service life of the electronic devices; in a traditional heat dissipation mode, a water channel is arranged in a box body provided with high-power electronic devices such as a motor controller, a charger, a DCDC (direct current DC) and the like, and the electronic devices are dissipated by arranging the water channel; however, when there are many devices requiring heat dissipation, the devices requiring heat dissipation cannot be arranged due to the limitation of the volume of the whole device by the customer, and the heat dissipation of the devices can encounter bottlenecks and difficulties.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a main aim at provides a heat dissipation case, automobile controller and car, aim at to the aforesaid when radiating device of needs is more, receive the restriction of customer to the complete machine volume, lead to the defect that radiating device can't all be arranged on the water course of box to have improved, through set up the cooling module of elevating in the box, form more electron device installation spaces, when satisfying the device heat dissipation, improve complete machine power density, reduce the complete machine volume.

The utility model provides an above-mentioned technical problem's technical scheme be, provide a heat dissipation case, the heat dissipation case includes: the box body is provided with an accommodating cavity and a first cooling channel, and the accommodating cavity and the first cooling channel are arranged in a back-to-back mode; and the cooling module is internally provided with a second cooling channel and is arranged in the accommodating cavity, and the cooling module and the bottom wall of the accommodating cavity are arranged at intervals to form an accommodating space for accommodating the electronic component.

Further, the first cooling passage and the second cooling passage communicate.

Furthermore, a first inlet and a first outlet which penetrate through the bottom wall of the second cooling channel are formed in the second cooling channel, and a second inlet and a second outlet which penetrate through the bottom wall of the first cooling channel and the bottom wall of the accommodating cavity are formed in the first cooling channel; the first inlet is in communication with the second outlet; the first outlet communicates with the second inlet to form a circulation passage between the first cooling channel and the second cooling channel.

Further, the heat dissipation case includes certainly the diapire of holding chamber is towards keeping away from first support column and the second support column that the direction of the diapire of holding chamber extends, first through-hole that runs through is seted up to first support column, the second through-hole that runs through is seted up to the second support column, first through-hole be located first entry with in order to communicate between the second export first entry reaches the second export, the second through-hole be located first export with in order to communicate between the second entry first export with the second entry.

The cooling module comprises a shell, and a third supporting column and a fourth supporting column which extend from the shell to a direction far away from the shell, wherein the third supporting column is provided with a third through hole in a penetrating manner, and the fourth supporting column is provided with a fourth through hole in a penetrating manner; one end of the third through hole is connected with the first inlet, and the other end of the third through hole extends into the first through hole; one end of the fourth through hole is connected with the first outlet, and the other end of the fourth through hole extends into the second through hole.

Further, the heat dissipation box still includes certainly the diapire is towards keeping away from at least one partition wall of the direction extension of diapire, the partition wall will the holding chamber is separated into a plurality of sub-chambeies, and is a plurality of the sub-chamber is used for holding electronic component, first support column and/or second support column form in the partition wall.

Further, the cooling module includes: the inner surface of the bottom shell is convexly provided with a retaining wall, one end of the retaining wall is connected with the side wall of the bottom shell, the other end of the retaining wall is arranged at an interval with the opposite side wall, and the bottom shell is arranged at an interval with the bottom wall of the accommodating cavity; the upper cover is covered on the bottom shell to form the second cooling channel together with the bottom shell, and a plurality of heat dissipation teeth are arranged on the inner surface of the upper cover.

Furthermore, the bottom shell of the cooling module and the retaining wall convexly arranged on the inner surface of the shell are integrally formed in a forging and pressing mode; the upper cover and the heat dissipation teeth of the upper cover are integrally formed in a forging and pressing mode.

Further, the heat dissipation case still includes certainly the diapire is towards keeping away from at least one partition wall that the direction of diapire extends, the partition wall will the holding chamber is separated for a plurality of sub-chambeies, and is a plurality of the sub-chamber is used for the holding electronic components, be provided with first conjunction on the partition wall, be provided with the second conjunction on the casing of cooling module, first conjunction be used for with the second conjunction combines in order to fix the cooling module in the box.

The utility model discloses still provide an automobile controller, automobile controller includes: a plurality of electronic components; and the plurality of electronic components are arranged in the accommodating cavity of the heat dissipation box and/or arranged on the cooling module.

The utility model discloses still provide an automobile, the automobile includes: a body; and the automobile controller is combined with the body.

The embodiment of the utility model provides a heat dissipation case, automobile controller and car, set up first cooling channel in the box, and set up cooling module in the box, the surface of first cooling channel and cooling module all can set up the radiating electron device of needs, for the electron device heat dissipation, and the accommodation space that is located between the diapire in cooling module and holding chamber also can set up the radiating electron device of needs, the electron device that is located accommodation space can be attached at the diapire in holding chamber, also can attach in cooling module's bottom surface, certainly also can attach simultaneously at the diapire in holding chamber and cooling module's bottom surface. Therefore, can see the utility model discloses a heat dissipation case sets up cooling module through elevating at the box internal, can satisfy the radiating while of device, improves the complete machine power density of heat dissipation case, guarantees that the complete machine volume of heat dissipation case accords with the customer requirement.

Drawings

FIG. 1 is an exploded view of the heat dissipation case of the present invention;

fig. 2 is an exploded view of the cooling module according to the present invention;

FIG. 3 is a schematic structural view of the box body of the present invention;

fig. 4 is a schematic view of the back structure of the heat dissipation box of the present invention.

The reference numbers illustrate:

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

As shown in fig. 1-4, the utility model provides a heat dissipation box, heat dissipation box 100 includes: the cooling device comprises a box body 11, wherein the box body 11 is provided with an accommodating cavity 12 and a first cooling channel 13, and the accommodating cavity 12 is arranged opposite to the first cooling channel 13; the cooling module 21 is provided with a second cooling channel 22 in the cooling module 21, and the cooling module 21 is arranged in the accommodating cavity 12 and spaced from the bottom wall of the accommodating cavity 12 to form an accommodating space for accommodating the electronic component.

It can be understood that the existing automobile electronic component mounting box is provided with a cooling channel, and the purpose of the cooling channel is to absorb heat generated by the electronic component due to operation through a cooling medium in the cooling channel so as to transmit the heat to the outside of the box body when the electronic component operates, so that the temperature in the mounting box is reduced. However, due to the fact that too many electronic components are arranged in the installation box, the electronic components cannot be uniformly distributed on the cooling channel, the temperature of some electronic components in the installation box is too high, and therefore problems such as circuit damage and the like are easily caused.

The utility model provides a heat dissipation box 100, set up first cooling channel 13 in box 11, and set up cooling module 21 in box 11, diapire through with cooling module 21 interval box 11 is established in box 11, make cooling module 21 and the diapire of holding chamber 12 be formed with the accommodation space of installation electronic part, electronic part and cooling module 21 contact, so reduced arranging of electronic part on first cooling channel 13, can make electronic part can obtain effectual heat dissipation on first cooling channel 13, and the electronic part that contacts with cooling module 21, can absorb the heat that electronic part produced because of work through second cooling channel 22, thereby dispel the heat to the electronic part in the box 11 more effectively.

Specifically, the box 11 includes a first side 111 and a second side 112 opposite to each other, the first side 111 is recessed towards the second side 112 to form an accommodating cavity 12, the second side 112 is recessed towards the first side 111 to form a first cooling channel 13, the accommodating cavity 12 is disposed opposite to the first cooling channel 13, electronic devices requiring heat dissipation can be disposed on the surfaces of the first cooling channel 13 and the cooling module, and dissipate heat for the electronic devices, and an accommodating space between the bottom walls of the cooling module 21 and the accommodating cavity 12 can also be provided with the electronic devices requiring heat dissipation, the electronic devices in the accommodating space can be attached to the bottom wall of the accommodating cavity, can also be attached to the bottom surface of the cooling module, and certainly can also be attached to the bottom wall of the accommodating cavity and the bottom surface of the cooling module. Therefore, can see that the utility model discloses a heat dissipation case sets up cooling module 21 through overhead in box 11, can satisfy the radiating while of device, improves the complete machine power density of heat dissipation case, guarantees that the complete machine volume of heat dissipation case accords with the customer requirement.

Specifically, in one example, the second cooling passages 22 may be water pipes closely arranged in the cooling module 21, so that the design is simple and the cost is low. In another example, the second cooling channel 22 may also be a plurality of channels formed in a cavity in the cooling module 21, and two adjacent channels are communicated, so that the cooling medium may sequentially pass through the plurality of channels, the flow path of the cooling medium is increased, and the cooling medium may more fully absorb heat generated by the electronic component, which is beneficial to improving the heat dissipation effect.

In the embodiment of the present application, the cooling medium flowing through the first cooling channel 13 and the second cooling channel 22 may be a liquid or a gas capable of performing a cooling function, and is not limited herein.

Further, as shown in fig. 1 to 3, the first cooling passage 13 and the second cooling passage 22 communicate.

It should be noted that, in the present embodiment, the first cooling passage 13 and the second cooling passage 22 are communicated, and the first cooling passage 13 and the second cooling passage 22 can share one pipe for the cooling medium to flow in and one pipe for the cooling medium to flow out, so that the number of the inlet and outlet pipes is reduced and the structure of the box is simplified, so that the cooling mediums in the first cooling passage 13 and the second cooling passage 22 can be circulated together.

Of course, in other embodiments, the first cooling channel 13 and the second cooling channel 22 may not be communicated, in which case the first cooling channel 13 is communicated with one pair of inlet and outlet pipes, and the second cooling channel 22 is communicated with the other pair of inlet and outlet pipes.

Further, as shown in fig. 2 and 4, the second cooling channel 22 is provided with a first inlet 221 and a first outlet 222 penetrating through the bottom wall of the second cooling channel 22, and the first cooling channel 22 is provided with a second inlet 131 and a second outlet 132 penetrating through the bottom wall of the first cooling channel 13 and the bottom wall of the accommodating cavity 12; the first inlet 221 communicates with the second outlet 132, and the first outlet 222 communicates with the second inlet 131 to form a circulation passage between the first cooling passage 13 and the second cooling passage 22.

It should be noted that, in the present embodiment, the cooling medium in the first cooling passage 13 may flow from the second outlet 132 into the first inlet 221, so that the cooling medium may flow into the second cooling passage 22. The cooling medium absorbing heat in the second cooling channel 22 flows into the second inlet 131 through the first outlet 222, and then flows out through the pipe for flowing out the cooling medium, so that the circulation of the cooling medium is realized, and the heat of the electronic component is better dissipated.

Further, the heat dissipation box 100 includes a first support column 231 and a second support column 232 extending from the bottom wall of the accommodating cavity 12 toward a direction away from the bottom wall of the accommodating cavity 12, the first support column 231 is provided with a first through hole 233 penetrating therethrough, the second support column 232 is provided with a second through hole 234 penetrating therethrough, the first through hole 233 is located between the first inlet 221 and the second outlet 132 to communicate the first inlet 221 and the second outlet 132, and the second through hole 234 is located between the first outlet 222 and the second inlet 131 to communicate the first outlet 222 and the second inlet 131.

In this embodiment, the first support column 231 is provided with a first through hole 233 for communicating the first inlet 221 and the second outlet 132; the second support column 232 is provided with a second through hole 234 for communicating the first outlet 222 and the second inlet 131; therefore, the arrangement of the channel can be facilitated, and the installation of unnecessary devices is saved; the first support column 231 and the second support column 232 support the cooling module 21, so that an accommodating space is formed between the cooling module 21 and the bottom wall of the accommodating cavity 12, and electronic components can be mounted in the accommodating space.

Further, as shown in fig. 2 and 3, the cooling module 21 includes a housing 25, and a third supporting pillar 235 and a fourth supporting pillar 236 extending from the housing 25 to a direction away from the housing 25, wherein the third supporting pillar 235 is provided with a third through hole 237, and the fourth supporting pillar 236 is provided with a fourth through hole 238; one end of the third through hole 237 is connected to the first inlet 221, and the other end of the third through hole 237 extends into the first through hole 233; one end of the fourth through hole 238 is connected to the first outlet 222, and the other end of the fourth through hole 238 extends into the second through hole 234.

It should be noted that, in this embodiment, the third supporting column 235 is disposed corresponding to the first supporting column 231, and the third supporting column 235 extends into the first through hole 233, so that the first supporting column 231 is tightly connected to the third supporting column 235, and thus the first through hole 233 is tightly connected to the third through hole 237, which can prevent liquid (or gas) from leaking (or leaking) when flowing through the channel between the second outlet 132 and the first inlet 221; the fourth supporting column 236 is disposed corresponding to the second supporting column 232, and the fourth through hole 238 disposed on the fourth supporting column 236 extends into the second through hole 234, so that the fourth supporting column 236 and the second supporting column 232 can be tightly connected, and thus, the second through hole 234 and the fourth through hole 238 can also be tightly connected, and liquid (or gas) can be prevented from leaking (or leaking) when flowing through the channel between the first outlet 222 and the second inlet 131. In addition, a certain height is formed by the connection between the third supporting column 235 and the first supporting column 231, and a certain height is also formed by the connection between the fourth supporting column 236 and the second supporting column 232, so that the cooling module 21 can be elevated to form an accommodating space with the bottom wall of the accommodating cavity 12, which is convenient for installing electronic components.

Further, a sealing ring is disposed at an end of the third through hole 237 extending into the first through hole 233, and a sealing ring is disposed at an end of the fourth through hole 238 extending into the second through hole 234. The air tightness of the channel communicated between the first cooling channel and the second cooling channel can be further improved by arranging the sealing ring, and air leakage or liquid leakage is prevented.

Further, as shown in fig. 1, the heat dissipation case 100 further includes at least one partition wall 14 extending from the bottom wall in a direction away from the bottom wall, the partition wall 14 divides the accommodation chamber 12 into a plurality of sub-chambers for accommodating electronic components, and the first support column 231 and/or the second support column 232 are formed in the partition wall 14.

It should be noted that, in this embodiment, the partition wall 14 is used to divide the bottom wall into a plurality of receiving sub-cavities, and a plurality of electronic devices can be installed in the receiving sub-cavities. Both the first support column 231 and the second support column 232 may be formed within the partition wall 14. Thus, the positions of the partition walls 14 in the accommodating cavity 12 are multiplexed, and the first supporting column 231 and the second supporting column 232 can be formed without occupying other spaces of the accommodating cavity 12, which is beneficial to reducing the volume of the whole heat dissipation box.

Further, as shown in fig. 1 and 2, the cooling module 21 includes: a retaining wall is convexly arranged on the inner surface of the bottom shell 23, one end of the retaining wall is connected with the side wall of the bottom shell 23, the other end of the retaining wall is arranged at an interval with the opposite side wall, and the bottom shell 23 is arranged at an interval with the bottom wall of the accommodating cavity 12; the upper cover 24 is covered on the bottom shell 23 to form the second cooling channel 22 with the bottom shell 23, and a plurality of heat dissipation teeth are arranged on the inner surface of the upper cover 24.

In this embodiment, the bottom case 23 and the upper cover 24 may be formed by a forging process or a stamping process. The bottom shell 23 is hermetically connected with the upper cover 24 to prevent the cooling medium in the second cooling channel 22 from leaking out of the cooling module 21; the bottom shell 23 is arranged at an interval with the bottom wall of the accommodating cavity 12, and electronic components can be arranged in the interval space; the second cooling passage 22 is formed to be bent along the bottom surface of the bottom case 23, and the bent cooling passage 22 can more completely remove heat generated from the electronic components mounted on the bottom case 23 or the upper cover 24.

Specifically, a retaining wall is convexly arranged on the bottom shell 23, one end of the retaining wall is connected with the side wall of the bottom shell 23, and the other end of the retaining wall is arranged at an interval with the opposite side wall, so that a U-shaped or S-shaped second cooling channel 22 is formed; cooling flows through the U-shaped or S-shaped second cooling passage 22;

in a possible embodiment, at least two retaining walls are disposed on the bottom casing 23, and one end of any two adjacent retaining walls are respectively fixed on two opposite side walls of the bottom casing 23, so that two adjacent retaining walls 14 form the second cooling channel 22; the plurality of retaining walls 14 are sequentially arranged to form the orderly-arranged bent second cooling passages 22; therefore, the water body can stay for a plurality of times in the cooling module 21, and more heat can be conveniently absorbed. Set up the fin on the wall, because the metal heat absorption is very fast, improve the heat convection area, transmit the cooling medium in second cooling channel 22 through the fin more fast with the heat on the cooling module 21 for second cooling channel 22 endothermic speed is faster.

Furthermore, the bottom shell 23 of the cooling module 21 and the retaining wall convexly arranged on the inner surface of the shell are integrally formed in a forging manner; the upper cover 24 and the heat dissipation teeth of the upper cover are integrally formed by forging. Being equivalent to traditional die-casting casing, the barricade that the drain pan and the protruding establishment of drain pan internal surface that adopt in this embodiment passes through forging and pressing mode integrated into one piece, and the heat dissipation tooth of upper cover 24 and upper cover 24 passes through forging and pressing mode integrated into one piece, can be so that the water course design is more nimble, and heat dissipation tooth density design is denser to can further promote the radiating effect.

Further, as shown in fig. 1, the heat dissipation box 100 further includes at least one partition wall 14 extending from the bottom wall toward a direction away from the bottom wall, the partition wall 14 divides the accommodation chamber 12 into a plurality of sub-chambers, the sub-chambers are used for accommodating electronic components, a first bonding member is disposed on the partition wall 14, a second bonding member is disposed on the housing of the cooling module, and the first bonding member is used for being bonded with the second bonding member to fix the cooling module 21 in the box 11.

Specifically, in one example, the first coupling member may be a screw through hole, and the second coupling member may also be a screw through hole, and the two screw through holes are connected by a screw to firmly fix the cooling module 21 in the case 11; in another example, the first coupling member may also be an adhesive, and the corresponding second coupling member is also configured as an adhesive, by which the cooling module 21 is firmly fixed in the box 11; in yet another example, the first engaging member may be a fastening member, and the corresponding second engaging member is a fastening member, and the cooling module 21 is firmly fixed in the housing 11 by the fastening member and the fastening member; in another example, the first and second coupling members may be connected by welding, and the first and second coupling members are connected by welding, so that the cooling module 21 is stably fixed in the cabinet 11.

The utility model discloses still provide an automobile controller, automobile controller includes: a plurality of electronic components; and the heat dissipation box 100 according to any of the above embodiments, a plurality of electronic components are disposed in the accommodating chamber 12 of the heat dissipation box 100 and/or on the cooling module 21.

In this embodiment, the vehicle controller may be a single or an integrated module of a vehicle-mounted charger, a dc converter, a power distribution socket, a motor controller, and the like. A plurality of electronic components on the automobile controller can be arranged in the accommodating cavity 12, and also can be arranged on the cooling module 21 at the same time, or can be arranged in the space between the bottom wall of the accommodating cavity 12 and the cooling module 21, so that the electronic components in the automobile controller are more uniformly arranged, most of the electronic components can be tightly attached to the first cooling channel 13 or the cooling module 21, the heat dissipation of the electronic components is facilitated, and some higher electronic components can be arranged between the first cooling channel 13 and the cooling module 21 and can be commonly dissipated through the first cooling channel 13 and the cooling module 21.

The utility model also provides an automobile, automobile include body and foretell automobile controller, and automobile controller combines with the body.

In the present embodiment, the vehicle may be a vehicle body such as a kerosene vehicle, a gasoline vehicle, an electric vehicle, and a hybrid vehicle, and is not limited herein. The vehicle controller may be housed in the body or mounted outside the body, which is not limited herein.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (11)

1. A heat dissipation case, characterized in that, the heat dissipation case includes:

the box body is provided with an accommodating cavity and a first cooling channel, and the accommodating cavity and the first cooling channel are arranged in a back-to-back mode;

and the cooling module is internally provided with a second cooling channel and is arranged in the accommodating cavity, and the cooling module and the bottom wall of the accommodating cavity are arranged at intervals to form an accommodating space for accommodating the electronic component.

2. The heat dissipation box of claim 1, wherein the first cooling channel and the second cooling channel are in communication.

3. The heat dissipation box of claim 2, wherein the second cooling channel is provided with a first inlet and a first outlet penetrating through a bottom wall of the second cooling channel, and the first cooling channel is provided with a second inlet and a second outlet penetrating through a bottom wall of the first cooling channel and a bottom wall of the accommodating cavity; the first inlet is in communication with the second outlet; the first outlet communicates with the second inlet to form a circulation passage between the first cooling channel and the second cooling channel.

4. The heat dissipation box according to claim 3, wherein the heat dissipation box comprises a first support column and a second support column extending from the bottom wall of the accommodating cavity in a direction away from the bottom wall of the accommodating cavity, the first support column is provided with a first through hole therethrough, the second support column is provided with a second through hole therethrough, the first through hole is located between the first inlet and the second outlet to communicate the first inlet and the second outlet, and the second through hole is located between the first outlet and the second inlet to communicate the first outlet and the second inlet.

5. The heat dissipation box of claim 4, wherein the cooling module comprises a housing, and a third support column and a fourth support column extending from the housing in a direction away from the housing, the third support column being provided with a third through hole therethrough, and the fourth support column being provided with a fourth through hole therethrough;

one end of the third through hole is connected with the first inlet, and the other end of the third through hole extends into the first through hole;

one end of the fourth through hole is connected with the first outlet, and the other end of the fourth through hole extends into the second through hole.

6. The heat dissipation box according to claim 4, further comprising at least one partition wall extending from the bottom wall in a direction away from the bottom wall, the partition wall dividing the housing chamber into a plurality of sub-chambers for housing the electronic component, the first support column and/or the second support column being formed in the partition wall.

7. The heat dissipation box according to any one of claims 1 to 6, wherein the cooling module comprises:

the inner surface of the bottom shell is convexly provided with a retaining wall, one end of the retaining wall is connected with the side wall of the bottom shell, the other end of the retaining wall is arranged at an interval with the opposite side wall, and the bottom shell is arranged at an interval with the bottom wall of the accommodating cavity;

the upper cover is covered on the bottom shell to form the second cooling channel together with the bottom shell, and a plurality of heat dissipation teeth are arranged on the inner surface of the upper cover.

8. The heat dissipation box of claim 7, wherein the bottom casing of the cooling module and the retaining wall protruding from the inner surface of the casing are integrally formed by forging; the upper cover and the heat dissipation teeth of the upper cover are integrally formed in a forging and pressing mode.

9. The heat dissipation box according to claim 8, further comprising at least one partition wall extending from the bottom wall in a direction away from the bottom wall, wherein the partition wall divides the housing chamber into a plurality of sub-chambers, the sub-chambers are configured to house the electronic component, a first engaging member is disposed on the partition wall, a second engaging member is disposed on the housing of the cooling module, and the first engaging member is configured to be engaged with the second engaging member to fix the cooling module in the box.

10. An automotive controller, characterized in that the automotive controller comprises:

a plurality of electronic components; and

the heat dissipation box of any of claims 1-9, a plurality of the electronic components being disposed within the receiving cavity of the heat dissipation box and/or on the cooling module.

11. An automobile, comprising:

a body; and

the automotive controller of claim 10, in combination with the body.

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