CN213152006U

CN213152006U - High-efficiency heat dissipation structure for high-power assembly junction box

Info

Publication number: CN213152006U
Application number: CN202022200540.8U
Authority: CN
Inventors: 庄浩; 姜亚帅; 孙观; 黄国平; 李菁楠
Original assignee: CECEP Solar Energy Technology Zhenjiang Co Ltd
Current assignee: CECEP Solar Energy Technology Zhenjiang Co Ltd
Priority date: 2020-09-30
Filing date: 2020-09-30
Publication date: 2021-05-07
Anticipated expiration: 2030-09-30

Abstract

The utility model discloses a high-efficient heat radiation structure of high-power component terminal box, including a plurality of terminal box body, link to each other through the heat dissipation bridgewire between two adjacent terminal box bodies, be located the other frame that is equipped with of the terminal box body at both ends, the terminal box body at both ends passes through the heat dissipation bridgewire and the frame links to each other. The utility model discloses a set up the bridge structure fin, utilize the bridge structure to increase the radiating efficiency, can guarantee the radiating effect, better outwards give off the high temperature efficient that produces in the subassembly use, improve the radiating efficiency.

Description

High-efficiency heat dissipation structure for high-power assembly junction box

Technical Field

The utility model relates to a high-efficient heat radiation structure for high-power component terminal box

Background

High-power subassembly is in outdoor use, because the shadow thing shelters from, the battery produces the hot spot, and the hot spot can cause the diode start-up work in the terminal box, and the diode can have higher electric current to pass through, leads to it to obviously generate heat, and whole terminal box peripheral region temperature all can rise by a wide margin, and the subassembly power generation performance can be reduced to the temperature that risees, and higher temperature can lead to the decomposition of backplate rete material, backplate burn through, EVA decomposes, the subassembly damages scheduling problem.

The heat dissipation of present terminal box relies on the free natural diffusion basically, and the inside diode of terminal box conducts the heat to subassembly back face and in the air through the silica gel and the box body of packing around, and the radiating efficiency is low. Under the background that the current module version is continuously enlarged and the current is continuously increased, the heating problem of the junction box is more prominent.

The risk of loss of power generation and the risk of reliability of the assembly during its life cycle due to heat generation are significantly increased. The prior art does not have a heat dissipation channel design aiming at the outer part of the junction box, and mainly relies on the heat conduction of peripheral inherent contact parts. And the used silica gel has poor heat-conducting property, so that the heat of the diode is difficult to be efficiently dissipated outwards.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a high-efficient heat radiation structure of high-power component terminal box in order to solve the not enough of above prior art.

The utility model provides a high-efficient heat radiation structure for high-power component terminal box, includes a plurality of terminal box body, links to each other through the heat dissipation bridgework piece between two adjacent terminal box bodies, is located the other frame that is equipped with of terminal box body at both ends, and the terminal box body at both ends passes through the heat dissipation bridgework piece and links to each other with the frame.

As a further improvement, the high-efficiency heat dissipation structure for the junction box of the high-power assembly is characterized in that the heat dissipation bridge piece comprises a plurality of heat dissipation layers.

As a further improvement, each layer of heat dissipation bridge piece is provided with a heat dissipation hole, and a gap is arranged between every two adjacent heat dissipation layers.

In order to prevent the additional reliability problem of the assembly caused by the heat conduction between the back plate and the heat dissipation bridge, the heat dissipation bridge is not in direct contact with the back plate.

As a further improvement, the heat dissipation bridge piece is in a bridge structure.

In order to improve the heat conductivity and the heat dissipation effect, the frame is made of metal.

Has the advantages that:

the utility model discloses the radiating efficiency is high, designs metal heat dissipation bridge piece, turns into the intercommunication heat dissipation of interconnection each other with the independent monomer heat dissipation of terminal box each other, guarantees excellent radiating effect.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a high-efficiency heat dissipation structure of a junction box of a high-power module;

FIG. 2 is a cross-sectional view of a high power assembly junction box;

1. the frame 2, the heat-conducting silica gel 3, the heat dissipation bridge piece 4, the junction box body 5, the heat dissipation hole 6 and the heat dissipation layer.

Detailed Description

In order to deepen the understanding of the present invention, the present invention will be further described in detail with reference to the following embodiments and the attached drawings, and the embodiments are only used for explaining the present invention, and do not constitute the limitation to the protection scope of the present invention.

As shown in fig. 1-2, a high-efficient heat radiation structure for high-power component terminal box, includes a plurality of terminal box body 4, links to each other through heat dissipation bridge piece 3 between two adjacent terminal box body 4, and heat dissipation bridge piece 3 is the bridge structure, and heat dissipation bridge piece 3 includes a plurality of heat dissipation layer 6, is equipped with a plurality of louvre 5 on the heat dissipation bridge piece 3, is equipped with the clearance between two adjacent heat dissipation layers 6, and the terminal box body back is equipped with the backplate, heat dissipation bridge piece 3 and backplate between no direct contact, be located the other 4 of terminal box body at both ends and be equipped with frame 1, frame 1 adopts the metal material, and terminal box body 4 at both ends links to each other through heat dissipation bridge piece 3 and frame 1. Explanation of heat dissipation effect:

in the use, the diode that generates heat produces the heat, the heat that the diode that generates heat produced conducts to terminal box body 4 through heat conduction silica gel 2 in the terminal box body, be equipped with heat dissipation bridge piece 3 between the adjacent terminal box body 4, terminal box body 4 is connected with heat dissipation bridge piece 3, the heat of production transmits heat dissipation bridge piece 3 through terminal box body 4, the other frame 1 that is equipped with of terminal box body 4 at both ends, heat dissipation bridge piece 3 links to each other with frame 1, the heat of production transmits frame 1 through heat dissipation bridge piece 3 and gives off the heat to the lateral space.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The high-efficiency heat dissipation structure of the high-power assembly junction box is characterized by comprising a plurality of junction box bodies, wherein two adjacent junction box bodies are connected through a heat dissipation bridge piece.

2. The high efficiency heat dissipating structure of a junction box for high power components of claim 1, wherein the heat dissipating bridge comprises a plurality of heat dissipating layers.

3. The efficient heat dissipating structure of a junction box for high power modules as claimed in claim 2, wherein the heat dissipating layers have a plurality of heat dissipating holes, and a gap is formed between two adjacent heat dissipating layers.

4. The high efficiency heat dissipating structure of a junction box for high power components of claim 1, wherein the heat dissipating bridge is a bridge structure.

5. The efficient heat dissipating structure of a junction box for high power module as claimed in claim 1, wherein a frame is disposed beside the junction box bodies at both ends, and the junction box bodies at both ends are connected to the frame via a heat dissipating bridge.

6. The efficient heat dissipation structure of a junction box for high power components of claim 5, wherein said frame is made of metal.