CN217061439U

CN217061439U - Memory bank shell with good heat dissipation effect

Info

Publication number: CN217061439U
Application number: CN202220720057.9U
Authority: CN
Inventors: 尹春
Original assignee: Shenzhen Oscoo Tech Co ltd
Current assignee: Shenzhen Oscoo Tech Co ltd
Priority date: 2022-03-30
Filing date: 2022-03-30
Publication date: 2022-07-26
Anticipated expiration: 2032-03-30

Abstract

The utility model discloses a DRAM shell that radiating effect is good, including the shell, the internally mounted of shell has DRAM body, and the heat dissipation fan is installed to the both sides of shell, and the baffle is installed to the bottom of shell. The utility model discloses a protection casing sets up the heat dissipation fan on the connecting plate surface, and the heat that the shell inside produced is discharged from third louvre, second louvre and ventilation hole for the inside heat of shell dispels the heat fast, keeps the normal temperature in DRAM body surface, does benefit to the use of DRAM body. The memory bank comprises a memory bank body, a first bolt, a second bolt, a first jacking block, a second heat dissipation hole and a heat dissipation plate, wherein the first bolt and the second bolt are arranged on two sides of the memory bank body, the memory bank body is clamped through the first jacking block and the second jacking block, a gap is reserved between the memory bank body and a shell, heat dissipation is facilitated, the heat dissipation effect is improved through the first heat dissipation hole, and the memory bank body and the shell are stably installed and are convenient to disassemble.

Description

Memory bank shell with good heat dissipation effect

Technical Field

The utility model relates to a DRAM technical field specifically is a memory bank shell that the radiating effect is good.

Background

With the rapid progress of computer hardware technology, the capacity of the memory bank is also increased year by year; the memory bank is inserted on the main board of the case, and the memory bank heat dissipation protection device is a device used for dissipating heat of the memory bank so as to play a role in protection; the memory bank plays an important role in the working process of the computer and is used for storing internal information of the working of the computer.

The installation connection between current DRAM shell, shell and the DRAM body, the heat of DRAM body production is concentrated, can't dispel fast for the DRAM body generates heat and scalds, influences the use, moreover, lacks the heat dissipation space between DRAM body and the shell, and the installation is stable inadequately and convenient.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a memory bank shell that radiating effect is good to solve the erection joint between shell and the memory bank body, the heat of memory bank body production is concentrated, can't dispel fast, makes the memory bank body generate heat and send out the scald, influences the problem of use.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a memory bank shell that radiating effect is good, includes the shell, the internally mounted of shell has memory bank body, the heat dissipation fan is installed to the both sides of shell, the baffle is installed to the bottom of shell.

Preferably, the outside of baffle is provided with first bolt, first bolt inserts the inside of shell, the top of first bolt is fixed with first puller block, first puller block with the both sides contact of memory bank body.

Preferably, a protective pad is padded at the top end of the memory bank body, a baffle protrudes from the bottom end of the memory bank body, first heat dissipation holes are formed in the surface of the baffle, and the first heat dissipation holes are located on two sides of the memory bank body.

Preferably, the connecting plate is installed to the both sides of shell, the outside of connecting plate is fixed with the protection casing, the heat dissipation fan is installed the inside of protection casing.

Preferably, the side of protection casing is opened there is the ventilation hole, connecting plate and protection casing are the rectangle structure, the surface of connecting plate is opened there is the second louvre, the second louvre with the ventilation hole intercommunication.

Preferably, the side surface of the shell is provided with a third radiating hole, and the third radiating hole is aligned with and communicated with the second radiating hole.

Preferably, the two ends of the connecting plate are provided with second bolts, the second bolts are inserted into the shell, and second jacking blocks are fixed at the top ends of the second bolts.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a set up the connecting plate in the both sides of shell to set up the heat dissipation fan on the connecting plate surface through the protection casing, third louvre, second louvre and ventilation hole communicate each other, in the use of DRAM body, the heat dissipation fan is rotatory, and the heat that the shell is inside to produce is discharged from third louvre, second louvre and ventilation hole, makes the inside heat of shell dispel the heat fast, keeps DRAM body normal surface temperature, does benefit to the use of DRAM body.

2. The utility model discloses first bolt and second bolt in the both sides of DRAM body to tight piece presss from both sides the DRAM body through first top tightly piece and second top, makes to leave the clearance between DRAM body and the shell, does benefit to the heat dissipation, and increases through first louvre and improves the radiating effect, and moreover, the installation is stable between DRAM body and the shell, and it is convenient to dismantle.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an enlarged view of the point A of FIG. 1 according to the present invention;

fig. 3 is a schematic view of a part of the heat dissipating fan shown in fig. 1.

In the figure: 1. a housing; 2. a protective pad; 3. a second bolt; 4. a protective cover; 5. a heat dissipation fan; 6. a first heat dissipation hole; 7. a baffle plate; 8. a first bolt; 9. a first puller block; 10. a second puller block; 11. a memory bank body; 12. a connecting plate; 13. a vent hole; 14. a third heat dissipation hole; 15. a second heat dissipation hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Example 1

Referring to fig. 1, 2 and 3, the memory bank housing with a good heat dissipation effect in the drawings includes a housing 1, a memory bank body 11 is installed inside the housing 1, heat dissipation fans 5 are installed on two sides of the housing 1, and a baffle 7 is installed at the bottom end of the housing 1.

Two sides of the shell 1 are provided with connecting plates 12, the outer side of the connecting plates 12 is fixed with a protective cover 4, and a heat dissipation fan 5 is arranged in the protective cover 4; the side of the protective cover 4 is provided with a vent hole 13, and the connecting plate 12 and the protective cover 4 are both rectangular structures.

The surface of connecting plate 12 is opened has second louvre 15, and second louvre 15 and ventilation hole 13 intercommunication, and the side of shell 1 is opened has third louvre 14, and third louvre 14 aligns and communicates with second louvre 15.

This memory bank shell that radiating effect is good, during the use: set up connecting plate 12 in the both sides of shell 1 to set up heat dissipation fan 5 on connecting plate 12 surface through protection casing 4, third louvre 14, second louvre 15 and ventilation hole 13 communicate each other.

In the use of DRAM body 11, heat dissipation fan 5 is rotatory, and the heat that 1 inside produced of shell is discharged from third louvre 14, second louvre 15 and ventilation hole 13 for the heat is dispelled the heat fast in the inside heat of shell 1, keeps 11 surperficial normal temperatures of DRAM body, does benefit to the use of DRAM body 11.

Example 2

Referring to fig. 1, 2 and 3, in this embodiment, a memory bank housing with a good heat dissipation effect is further described with respect to example 1, and includes a housing 1, a memory bank body 11 is installed inside the housing 1, heat dissipation fans 5 are installed on two sides of the housing 1, a baffle 7 is installed at a bottom end of the housing 1, and the baffle 7 is in a rectangular frame structure and is clamped on two sides of the bottom end of the housing 1.

A first bolt 8 is arranged on the outer side of the baffle 7, and the first bolt 8 is inserted into the shell 1, so that the baffle 7 is detachably connected with the shell 1 through the first bolt 8; the top end of the first bolt 8 is fixed with a first puller block 9, and the first puller block 9 contacts with two sides of the memory bank body 11 and clamps two sides of the bottom end of the memory bank body 11.

The top end of the memory bank body 1 is padded with a protective pad 2, and the bottom end of the memory bank body 11 protrudes out of the baffle 7; the surface of the baffle 7 is provided with first heat dissipation holes 6, and the first heat dissipation holes 6 are located at two sides of the memory bank body 11, so that the heat dissipation effect of the memory bank body 11 is improved.

Two sides of the shell 1 are provided with connecting plates 12, the outer side of the connecting plates 12 is fixed with a protective cover 4, and a heat dissipation fan 5 is arranged in the protective cover 4; the both ends of connecting plate 12 are provided with second bolt 3, and second bolt 3 is located the both ends of protection casing 4 for connecting plate 12 is connected with shell 1 demountable installation through second bolt 3.

The second bolt 3 inserts shell 1, and the top of second bolt 3 is fixed with the tight piece 10 in second top, and the tight piece 10 in second top contacts with the both sides of memory bank body 11 to press from both sides tight top both sides of memory bank body 11, keep the stable installation of memory bank body 11, it is convenient to dismantle.

In the embodiment, the first bolt 8 and the second bolt 3 are arranged on two sides of the memory bank body 11, and the memory bank body 11 is clamped by the first tightening block 9 and the second tightening block 10, so that a gap is reserved between the memory bank body 11 and the shell 1, heat dissipation is facilitated, and the heat dissipation effect is improved through the first heat dissipation hole 6; moreover, the memory bank body 11 and the shell 1 are stably installed and conveniently detached.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a memory bank shell that radiating effect is good which characterized in that includes: shell (1), the internally mounted of shell (1) has DRAM body (11), heat dissipation fan (5) are installed to the both sides of shell (1), baffle (7) are installed to the bottom of shell (1).

2. The memory bank shell with the good heat dissipation effect as claimed in claim 1, wherein: the outside of baffle (7) is provided with first bolt (8), the inside of shell (1) is inserted in first bolt (8), the top of first bolt (8) is fixed with first puller block (9), first puller block (9) with the both sides contact of memory bank body (11).

3. The memory bank shell with the good heat dissipation effect as claimed in claim 1, wherein: the protection pad (2) is padded at the top end of the memory bank body (11), the baffle (7) protrudes out of the bottom end of the memory bank body (11), the surface of the baffle (7) is provided with first radiating holes (6), and the first radiating holes (6) are positioned on two sides of the memory bank body (11).

4. The memory bank shell with the good heat dissipation effect as claimed in claim 1, wherein: connecting plates (12) are installed on two sides of the shell (1), a protective cover (4) is fixed on the outer side of each connecting plate (12), and a heat dissipation fan (5) is installed inside each protective cover (4).

5. The memory bank shell with the good heat dissipation effect as claimed in claim 4, wherein: open the side of protection casing (4) has ventilation hole (13), connecting plate (12) and protection casing (4) are the rectangle structure, open the surface of connecting plate (12) has second louvre (15), second louvre (15) with ventilation hole (13) intercommunication.

6. The memory bank shell with the good heat dissipation effect as claimed in claim 5, wherein: the side surface of the shell (1) is provided with a third heat dissipation hole (14), and the third heat dissipation hole (14) is aligned with and communicated with the second heat dissipation hole (15).

7. The memory bank shell with the good heat dissipation effect as claimed in claim 4, wherein: the two ends of the connecting plate (12) are provided with second bolts (3), the second bolts (3) are inserted into the shell (1), and second jacking blocks (10) are fixed at the top ends of the second bolts (3).