CN212694355U - Heat dissipation shell of electronic computer host - Google Patents

Heat dissipation shell of electronic computer host Download PDF

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Publication number
CN212694355U
CN212694355U CN202021470160.XU CN202021470160U CN212694355U CN 212694355 U CN212694355 U CN 212694355U CN 202021470160 U CN202021470160 U CN 202021470160U CN 212694355 U CN212694355 U CN 212694355U
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CN
China
Prior art keywords
heat
plate
base
heat conducting
moisture absorption
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202021470160.XU
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Chinese (zh)
Inventor
赵洋
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Henan Polytechnic Institute
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Henan Polytechnic Institute
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Publication date
Application filed by Henan Polytechnic Institute filed Critical Henan Polytechnic Institute
Priority to CN202021470160.XU priority Critical patent/CN212694355U/en
Application granted granted Critical
Publication of CN212694355U publication Critical patent/CN212694355U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a heat dissipation shell of a computer mainframe, which comprises a case main body and a base supporting the case main body, wherein the end surface of a condensation pipe is provided with a heat conduction column; the bottom of the case body is provided with a heat conducting plate, the bottom of the case body is arranged on the end surface of the base, and the top of the heat conducting column is in contact with the bottom of the heat conducting plate; the relative both sides of chassis main part are equipped with the hydrofuge mouth to the outside cover that corresponds the hydrofuge mouth is equipped with the frame that is the evagination form, the inside moisture absorption plate that clamps of frame, chassis main part's terminal surface is equipped with the exhaust fan. This computer mainframe heat dissipation casing has the improvement computer mainframe shell to inside air mobility, improves the radiating effect, ensures the normal use of computer advantage.

Description

Heat dissipation shell of electronic computer host
Technical Field
The utility model relates to a computer technology field specifically is an electronic computer host computer heat dissipation casing.
Background
At present, computers become one of essential digital products of students and office families, can be used for office work, internet surfing, audio-visual entertainment and the like, and greatly enrich the amateur life of people, however, as main operation parts of the computers are all installed inside the main computer, the shell heat dissipation effect of the main computer is low, heat generated by the parts inside the main computer body during operation cannot be timely dissipated, phenomena such as crash, blue screen and the like caused by overhigh temperature during the operation of the computers are easily caused, the use effect of the computers is reduced, and the service life of the computers is prolonged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic computer host computer heat dissipation casing has the advantage that improves computer host shell to inside air mobility, improves the radiating effect, ensures the normal use of computer, and it is lower to have solved current computer host shell radiating efficiency, easily causes the computer operation to produce the emergence of phenomenons such as dead halt, blue screen because of the high temperature, reduces computer result of use and life's problem.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation shell of a main frame of an electronic computer comprises a main frame body and a base supporting the main frame body, wherein a condenser connected with a compressor is arranged inside the base, a condenser pipe is arranged at the output end of the condenser pipe, the condenser pipe is arranged inside the base in a bow shape, and a heat conduction column is arranged on the end surface of the condenser pipe;
the bottom of the case body is provided with a heat conducting plate, the bottom of the case body is arranged on the end surface of the base, and the top of the heat conducting column is in contact with the bottom of the heat conducting plate;
the relative both sides of chassis main part are equipped with the hydrofuge mouth to the outside cover that corresponds the hydrofuge mouth is equipped with the frame that is the evagination form, the inside moisture absorption plate that clamps of frame, chassis main part's terminal surface is equipped with the exhaust fan.
Furthermore, a second moisture absorption plate is placed between the base and the bottom of the case body, a through groove is formed in the moisture absorption plate corresponding to the heat conduction column, and the heat conduction column penetrates through the through groove and is in contact with the end face of the heat conduction plate.
Furthermore, the heat conducting plate and the heat conducting columns are coated with insulating coatings.
Furthermore, the end face of the moisture absorption plate is provided with a limiting plate corresponding to the outer frame, and the limiting plate is clamped with the top opening end of the outer frame.
Furthermore, the input ends of the exhaust fan and the condenser are connected with a power supply in parallel.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up the condenser pipe in the inside base, and set up the moisture absorption plate in the relative both sides of chassis main part, install the part that computer operation used inside the chassis main part, and accept electronic component through the heat-conducting plate, when calculating and moving, the compressor operation exports the condenser to air compression, the condenser operation is the liquid output that pressure is higher to the vapor compression after the compression to the condenser pipe, realize defeated air conditioning through the condenser pipe, the condenser pipe is defeated to the heat cooling heat dissipation that the heat conduction post derives chassis main part internal component operation to produce when cold, the auxiliary condenser pipe of exhaust fan is to the inside air exchange of chassis main part, thereby improve the inside radiating effect of chassis main part, ensure the normal operating of computer, the moisture absorption that the moisture absorption plate produced because of cold and hot alternation to the inside of chassis main part, keep the aridity of the inside of chassis main;
2. the utility model discloses exhaust fan and condensing engine are parallelly connected with the power, are convenient for select the operation exhaust fan alone to take a breath to quick-witted case main part inside according to the ambient temperature when the computer uses, improve the inside air circulation nature of quick-witted case main part and realize radiating effect, or operation exhaust fan and condensing engine are simultaneously to the cooling of the inside heat conduction of quick-witted case main part and improve the heat dissipation of air circulation nature.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the longitudinal cross-section structure of the present invention;
FIG. 3 is a schematic view of the internal structure of the base of the present invention;
fig. 4 is a schematic structural view of a moisture absorption plate of the present invention.
In the figure: 1. a chassis main body; 2. a base; 3. a compressor; 4. a condenser; 5. a condenser tube; 6. a heat-conducting column; 7. a heat conducting plate; 8. a moisture removal port; 9. an outer frame; 10. a moisture absorption plate; 11. an exhaust fan; 12. a second moisture absorption plate; 13. a through groove; 14. and a limiting plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a heat dissipation housing for a mainframe of an electronic computer includes a main case body 1 and a base 2 supporting the main case body 1, a condenser 4 connected with a compressor 3 is disposed inside the base 2, a condenser pipe 5 is disposed at an output end of the condenser 4, the condenser pipe 5 is disposed inside the base 2 in an arch shape, and a heat conduction column 6 is disposed on an end surface of the condenser pipe 5;
the bottom of the case body 1 is provided with a heat conducting plate 7, the bottom of the case body 1 is arranged on the end surface of the base 2, and the top of the heat conducting column 6 is in contact with the bottom of the heat conducting plate 7;
the relative both sides of chassis body 1 are equipped with hydrofuge mouth 8 to the outside cover that corresponds hydrofuge mouth 8 is equipped with and is outer frame 9 of evagination form, the inside moisture absorption board 10 that clamps of frame 9, the terminal surface of chassis body 1 is equipped with exhaust fan 11.
Specifically, as shown in fig. 4, a second moisture absorption plate 12 is placed between the base 2 and the bottom of the chassis body 1, a through groove 13 is formed in the second moisture absorption plate 12 corresponding to the heat conduction column 6, and the heat conduction column 6 penetrates through the through groove 13 and is in contact with the end face of the heat conduction plate 7. The second moisture absorption plate 12 can absorb moisture between the base 2 and the case body 1, the inside of the base 2 is kept dry, and the phenomenon that the shell of the case body 1 is corroded by water condensation beads generated by cold and hot alternation inside the base 2 is avoided.
Specifically, the heat conducting plate 7 and the heat conducting column 6 are coated with insulating coatings. The problem of short-circuiting between the electronic components by the heat-conducting plate 7 is avoided by the insulating coating.
Specifically, the end face of the moisture absorption plate 10 is provided with a limit plate 14 corresponding to the outer frame, and the limit plate 14 is clamped with the top opening end of the outer frame 9. The moisture absorption plate 10 can be conveniently drawn out from the outer frame 9 and the moisture exhaust port 8 through the limit plate 14 for replacement, and the moisture absorption effect of the moisture absorption plate 10 on the inner part of the case main body 1 is ensured.
Specifically, the input ends of the exhaust fan 11 and the condenser 4 are connected in parallel with a power supply. The exhaust fan 11 is selected to be operated to ventilate the inside of the case body 1 independently according to the ambient temperature when the computer is used, the heat dissipation effect is achieved by improving the air circulation inside the case body 1, or the exhaust fan 11 and the condenser 4 are operated to conduct heat and cool the inside of the case body 1 and improve the heat dissipation of the air circulation.
When the computer case is used, components used by the operation of a computer are installed inside the case body 1 and are connected with electronic elements through the heat conducting plate 7, when the computer case is calculated and operated, the compressor 3 operates to compress air and outputs the compressed air to the condenser 4, the condenser 4 operates to compress the compressed steam and outputs the compressed steam to the condenser pipe 5, cold air is conveyed through the condenser pipe 5, the condenser pipe 5 cools and dissipates heat generated by the heat conducting columns 6 after guiding the internal elements out of the case body 1 during cold conveyance, the exhaust fan 11 assists the condenser pipe 5 to ventilate the air inside the case body 1, the internal heat dissipation effect of the case body 1 is improved, the normal operation of the computer is ensured, the moisture absorption plate 10 absorbs water vapor generated by the cold and hot alternation inside the case body 1, and the dryness of the inside of the case body 1 is kept.

Claims (5)

1. The utility model provides an electronic computer host computer heat dissipation casing, includes chassis main part (1) and base (2) to chassis main part (1) support, its characterized in that: a condenser (4) connected with a compressor (3) is arranged in the base (2), a condenser pipe (5) is arranged at the output end of the condenser (4), the condenser pipe (5) is arranged in the base (2) in a bow shape, and a heat conduction column (6) is arranged on the end surface of the condenser pipe (5);
the bottom of the case body (1) is provided with a heat conducting plate (7), the bottom of the case body (1) is arranged on the end surface of the base (2), and the top of the heat conducting column (6) is in contact with the bottom of the heat conducting plate (7);
the utility model discloses a fan case, including chassis main body (1), the relative both sides of chassis main body (1) are equipped with hydrofuge mouth (8) to the outside cover that corresponds hydrofuge mouth (8) is equipped with frame (9) that are outer evagination form, moisture absorption plate (10) have been clamped to frame (9) inside, the terminal surface of chassis main body (1) is equipped with exhaust fan (11).
2. A heat dissipating housing for a host computer of an electronic computer, as claimed in claim 1, wherein: a second moisture absorption plate (12) is placed between the base (2) and the bottom of the case body (1), a through groove (13) is formed in the second moisture absorption plate (12) corresponding to the heat conduction column (6), and the heat conduction column (6) penetrates through the end face of the through groove (13) and the end face of the heat conduction plate (7) to be in contact with each other.
3. A heat dissipating housing for a host computer of an electronic computer, as claimed in claim 1, wherein: and insulating coatings are respectively coated outside the heat conducting plate (7) and the heat conducting columns (6).
4. A heat dissipating housing for a host computer of an electronic computer, as claimed in claim 1, wherein: the end face of the moisture absorption plate (10) is provided with a limiting plate (14) corresponding to the outer frame, and the limiting plate (14) is clamped with the top opening end of the outer frame (9).
5. A heat dissipating housing for a host computer of an electronic computer, as claimed in claim 1, wherein: the input ends of the exhaust fan (11) and the condenser (4) are connected with a power supply in parallel.
CN202021470160.XU 2020-07-23 2020-07-23 Heat dissipation shell of electronic computer host Expired - Fee Related CN212694355U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021470160.XU CN212694355U (en) 2020-07-23 2020-07-23 Heat dissipation shell of electronic computer host

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021470160.XU CN212694355U (en) 2020-07-23 2020-07-23 Heat dissipation shell of electronic computer host

Publications (1)

Publication Number Publication Date
CN212694355U true CN212694355U (en) 2021-03-12

Family

ID=74898833

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021470160.XU Expired - Fee Related CN212694355U (en) 2020-07-23 2020-07-23 Heat dissipation shell of electronic computer host

Country Status (1)

Country Link
CN (1) CN212694355U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210312

Termination date: 20210723

CF01 Termination of patent right due to non-payment of annual fee