CN217025838U - Heat conduction and heat dissipation type wave absorbing plate - Google Patents
Heat conduction and heat dissipation type wave absorbing plate Download PDFInfo
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- CN217025838U CN217025838U CN202123155909.9U CN202123155909U CN217025838U CN 217025838 U CN217025838 U CN 217025838U CN 202123155909 U CN202123155909 U CN 202123155909U CN 217025838 U CN217025838 U CN 217025838U
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Abstract
The utility model relates to a heat conduction and heat dissipation type wave absorbing plate, which relates to the technical field of wave absorbing plates and comprises the following components: follow supreme pasting layer, graphite layer, shielding layer, heat conduction insulating layer and the enhancement layer that sets gradually down, be provided with first cementing layer between graphite layer and the shielding layer, it splices the layer to be provided with the second between shielding layer and the heat conduction insulating layer, be provided with the third between heat conduction insulating layer and the enhancement layer and splice the layer, the top of enhancement layer is provided with a plurality of strip archs. Through the arrangement, the wave absorbing plate has the advantages of good heat conductivity, wave absorption and high electromagnetic shielding capability, accumulated heat cannot be caused when the wave absorbing plate fully-wrapping device improves the wave absorbing capability and the anti-interference capability, the heat dissipation area is increased due to the protrusion at the bottom of the reinforcing layer, and the heat dissipation efficiency of the wave absorbing plate is increased.
Description
Technical Field
The utility model relates to the technical field of wave absorbing plates, in particular to a heat conduction and heat dissipation type wave absorbing plate.
Background
The electromagnetic radiation brought by the products has increasingly more influence on the environment, and the electromagnetic waves released by the electronic products bring electromagnetic interference to other surrounding electronic equipment, so that the electronic equipment works abnormally; and also can cause harm to human health. Therefore, research and development of a wave-absorbing material capable of weakening electromagnetic radiation has become a popular subject of scientific material attention, the wave-absorbing material is a material capable of effectively absorbing incident electromagnetic waves and attenuating the incident electromagnetic waves, the incident electromagnetic waves are converted into heat energy or other energy forms through different loss mechanisms so as to achieve the purpose of wave absorption, and in the wave-absorbing material, the patch type wave-absorbing material is thin in thickness, convenient to use, good in effect of reducing the electromagnetic radiation and preventing electromagnetic interference, and suitable for being applied to electronic products, and heating of electronic elements in the electronic products is a common phenomenon. The traditional wave absorbing plate has poor heat conducting capability, accumulated heat is easily generated when the wave absorbing plate covers an electronic device, and the wave absorbing plate and the device can work in a high-temperature environment for a long time, so that the service lives of the wave absorbing plate and the device are influenced.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems, the utility model provides the heat conduction and radiation type wave absorption plate which has the advantages of good heat conductivity and high wave absorption and electromagnetic shielding capabilities.
In order to achieve the purpose, the technical scheme of the utility model is as follows:
a thermally conductive and dissipative wave-absorbing plate, comprising:
follow supreme pasting layer, graphite layer, shielding layer, heat conduction insulating layer and the enhancement layer that sets gradually down, be provided with first cementing layer between graphite layer and the shielding layer, it splices the layer to be provided with the second between shielding layer and the heat conduction insulating layer, be provided with the third between heat conduction insulating layer and the enhancement layer and splice the layer, the top of enhancement layer is provided with a plurality of strip archs.
The technical scheme is realized, the wave absorbing plate is convenient to be adhered on a device through the arranged adhering layer, the graphite layer can absorb electromagnetic radiation emitted by the device, the battery radiation which penetrates through the graphite layer can be reflected through the shielding layer to be absorbed by the graphite layer for the second time, the wave absorbing capability of the wave absorbing plate is greatly improved, the shielding layer can also protect the device from external electromagnetic interference, the anti-interference capability of the wave absorbing plate is further improved by matching with the graphite layer, the insulating capability of the wave absorbing plate is improved through the heat conducting insulating layer, the electric leakage or external electric power breakdown of the device is avoided, the graphite layer, the shielding layer, the heat conducting insulating layer and the reinforcing layer are made of heat conducting materials, the heat conducting capability of the wave absorbing plate is improved, the heat dissipation of the device is improved, the overheating is avoided, heat accumulation cannot be caused when the wave absorbing plate is completely wrapped on the device so as to improve the wave absorbing capability and the anti-interference capability, and the heat dissipation area is increased through the bulge at the bottom of the reinforcing layer, the heat dissipation efficiency of the wave absorbing plate is increased.
As a preferable scheme of the utility model, the thickness of the sticking layer is 0.1-0.3mm, and the bottom of the sticking layer is provided with the release layer.
Realize above-mentioned technical scheme, tear and to paste on the device surface from the type layer and inhale the wave plate for it is more practical to inhale the wave plate.
As a preferred scheme of the present invention, the adhesive layer, the graphite layer, the first adhesive layer, the shielding layer, the second adhesive layer, the heat conducting insulating layer, the third adhesive layer, and the reinforcing layer longitudinally penetrate through a plurality of heat conducting pillars, the heat conducting pillars are made of heat conducting silica gel, and the heat conducting insulating layer is made of heat conducting silica gel.
By the technical scheme, the heat conduction penetrating power of the wave absorbing plate is increased by the heat conduction column, so that heat can quickly reach the surface of the wave absorbing plate to dissipate heat.
As a preferred scheme of the present invention, a metal layer is disposed on the top of the reinforcing layer, the metal layer is closely attached to the strip-shaped protrusions on the top of the reinforcing layer and the grooves between the strip-shaped protrusions, the heat conducting pillars are located at the bottom of the metal layer, and the heat conducting pillars are located at the top of the release layer.
By adopting the technical scheme, the metal layer can reflect electromagnetic radiation, and the wave absorbing and anti-interference capabilities of the wave absorbing plate are further improved.
In a preferred embodiment of the present invention, the shielding layer is a metal mesh layer, and the density of the metal mesh layer is 100-150 mesh.
As a preferable scheme of the present invention, the material of the reinforcing layer is an epoxy composite material.
As a preferred scheme of the utility model, the first adhesive layer, the second adhesive layer and the third adhesive layer are made of organic silicon elastic glue, and the thicknesses of the first adhesive layer, the second adhesive layer and the third adhesive layer are all 0.2-0.5 mm.
In a preferred embodiment of the present invention, the metal layer is selected from a copper layer, an aluminum layer, an iron layer, or a lead layer, and the thickness of the metal layer is between 0.15 mm and 0.5 mm.
In a preferred embodiment of the present invention, the metal mesh layer is made of red copper.
As a preferable scheme of the present invention, the distance and the height of the strip-shaped protrusions are equal, and the cross-sectional shape of the strip-shaped protrusions is rectangular or semicircular.
In summary, the utility model has the following beneficial effects:
the utility model provides a heat-conducting heat-dissipating type wave absorbing plate, which is convenient to adhere the wave absorbing plate on a device through an adhesive layer, firstly, the graphite layer can absorb electromagnetic radiation emitted by the device, then the battery radiation transmitted through the graphite layer is reflected and secondarily absorbed by the graphite layer through a shielding layer, the wave absorbing capability of the wave absorbing plate is greatly increased, the shielding layer can also protect the device from external electromagnetic interference, the anti-interference capability of the wave absorbing plate is further increased by matching with the graphite layer, the insulating capability of the wave absorbing plate is improved through a heat-conducting insulating layer, the electric leakage or external electric breakdown of the device is avoided, the graphite layer, the shielding layer, the heat-conducting insulating layer and a reinforcing layer are all made of heat-conducting materials, the heat conducting capability of the wave absorbing plate is improved, the heat dissipation of the device is increased, the overheating is avoided, and the accumulated heat cannot be caused when the wave absorbing plate is completely wrapped on the device to improve the wave absorbing capability and the anti-interference capability, the heat dissipation area is increased by the bulges at the bottom of the reinforcing layer, and the heat dissipation efficiency of the wave absorbing plate is increased.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of the present invention.
The corresponding part names indicated by the numbers and letters in the drawings:
1. a release layer; 2. a bonding layer; 3. a graphite layer; 4. a first adhesive layer; 5. a shielding layer; 6. a second adhesive layer; 7. a thermally conductive insulating layer; 8. a third adhesive layer; 9. a metal layer; 10. a reinforcing layer; 11. a heat-conducting column.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
Examples
As shown in fig. 1, a heat conduction and dissipation type wave absorption plate includes:
the adhering layer 2, the graphite layer 3, the shielding layer 5, the heat conducting insulating layer 7 and the reinforcing layer 10 are sequentially arranged from bottom to top, the thickness of the adhering layer 2 is 0.1-0.3mm, the release layer 1 is arranged at the bottom of the adhering layer 2, the wave absorbing plate can be adhered to the surface of a device by tearing the release layer 1, so that the wave absorbing plate is more practical, the first adhesive layer 4 is arranged between the graphite layer 3 and the shielding layer 5, the graphite layer 3 and the shielding layer 5 are adhered by the first adhesive layer 4, the second adhesive layer 6 is arranged between the shielding layer 5 and the heat conducting insulating layer 7, the shielding layer 5 and the heat conducting insulating layer 7 are adhered by the second adhesive layer 6, the third adhesive layer 8 is arranged between the heat conducting insulating layer 7 and the reinforcing layer 10, the heat conducting insulating layer 7 and the reinforcing layer 10 are adhered by the third adhesive layer 8, a plurality of strip-shaped bulges are arranged at the top of the reinforcing layer 10, the intervals and the heights of the strip-shaped bulges are equal, the cross section of the strip-shaped bulges is rectangular or semicircular, and is preferably semicircular in the embodiment, so that the smoothness of the surface of the wave absorbing plate is improved.
Furthermore, the adhesive layer 2, the graphite layer 3, the first adhesive layer 4, the shielding layer 5, the second adhesive layer 6, the heat-conducting insulating layer 7, the third adhesive layer 8 and the reinforcing layer 10 longitudinally penetrate through a plurality of heat-conducting columns 11, the heat-conducting columns 11 are made of heat-conducting silica gel, the heat-conducting insulating layer 7 is made of heat-conducting silica gel, the heat-conducting columns 11 increase the heat-conducting penetrating power of the wave absorbing plate so that heat can quickly reach the surface of the wave absorbing plate for heat dissipation, the top of the reinforcing layer 10 is provided with a metal layer 9, the metal layer 9 is tightly attached to grooves between strip-shaped bulges and strip-shaped bulges at the top of the reinforcing layer 10, the heat-conducting columns 11 are positioned at the bottom of the metal layer 9, the heat-conducting columns 11 are positioned at the top of the release layer 1, the metal layer 9 can reflect electromagnetic radiation, the wave absorbing and anti-interference capabilities of the wave absorbing plate are further increased, the shielding layer 5 is a metal mesh layer, and the density of the metal mesh layer is 100-150 meshes, the material of enhancement layer 10 is epoxy composite, the material of first cementing layer 4, second cementing layer 6 and third cementing layer 8 is the organic silicon elastic adhesive, the thickness of first cementing layer 4, second cementing layer 6 and third cementing layer 8 all is between 0.2-0.5mm, preferably 0.3mm, metal level 9 selects to be suitable for copper layer, aluminium lamination, iron sheet or lead layer, preferably lead layer in this embodiment, it is higher to inhale the wave ability, the thickness of metal level 9 is between 0.15-0.5mm, preferably 0.2mm, the material of metal net layer is red copper.
When the wave absorbing plate is used, the wave absorbing plate is convenient to be adhered on a device through the arranged adhering layer 2, firstly, electromagnetic radiation emitted by the device can be absorbed through the graphite layer 3, then, battery radiation penetrating through the graphite layer 3 can be reflected and secondarily absorbed by the graphite layer 3 through the shielding layer 5, the wave absorbing capacity of the wave absorbing plate is greatly improved, the shielding layer 5 can also protect the device from external electromagnetic interference, the anti-interference capacity of the wave absorbing plate is further improved by matching with the graphite layer 3, the insulating capacity of the wave absorbing plate is improved through the heat conducting insulating layer 7, electric leakage or external electric power breakdown of the device is avoided, the graphite layer 3, the shielding layer 5, the heat conducting insulating layer 7 and the reinforcing layer 10 are all made of heat conducting materials, the heat conducting capacity of the wave absorbing plate is improved, heat dissipation of the device is improved, overheating is avoided, accumulated heat cannot be caused when the wave absorbing plate is completely wrapped on the device to improve the wave absorbing capacity and the anti-interference capacity, and the heat dissipation area is increased through the bulge at the bottom of the reinforcing layer 10, the heat dissipation efficiency of the wave absorbing plate is increased.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A heat conduction and dissipation type wave absorbing plate is characterized by comprising:
follow supreme pasting layer, graphite layer, shielding layer, heat conduction insulation layer and the enhancement layer that sets gradually down, be provided with first cementing layer between graphite layer and the shielding layer, be provided with the second cementing layer between shielding layer and the heat conduction insulation layer, be provided with the third cementing layer between heat conduction insulation layer and the enhancement layer, the top of enhancement layer is provided with a plurality of strip archs.
2. The heat conduction and dissipation wave plate as recited in claim 1, wherein the thickness of the adhesive layer is 0.1-0.3mm, and a release layer is disposed at the bottom of the adhesive layer.
3. The heat-conducting heat-dissipating wave plate as claimed in claim 2, wherein a plurality of heat-conducting pillars are longitudinally penetrated through the adhesive layer, the graphite layer, the first adhesive layer, the shielding layer, the second adhesive layer, the heat-conducting insulating layer, the third adhesive layer and the reinforcing layer, the heat-conducting pillars are made of heat-conducting silica gel, and the heat-conducting insulating layer is made of heat-conducting silica gel.
4. The heat conduction and dissipation wave plate according to claim 3, wherein a metal layer is disposed on the top of the reinforcing layer, the metal layer is closely attached to the strip-shaped protrusions and the grooves between the strip-shaped protrusions on the top of the reinforcing layer, the heat conduction pillars are located at the bottom of the metal layer, and the heat conduction pillars are located at the top of the release layer.
5. The heat conduction and dissipation type wave absorption plate as claimed in claim 1, wherein the shielding layer is a metal mesh layer, and the density of the metal mesh layer is 100-150 mesh.
6. The heat conduction and dissipation type wave absorption plate of claim 1, wherein the reinforcing layer is made of epoxy composite material.
7. The heat conduction and dissipation type wave absorption plate of claim 1, wherein the first adhesive layer, the second adhesive layer and the third adhesive layer are made of silicone elastic adhesive, and the thicknesses of the first adhesive layer, the second adhesive layer and the third adhesive layer are all 0.2-0.5 mm.
8. The heat conducting and dissipating wave absorbing plate as claimed in claim 4, wherein the metal layer is selected from a copper layer, an aluminum layer, an iron layer or a lead layer, and the thickness of the metal layer is between 0.15 mm and 0.5 mm.
9. The heat conduction and dissipation type wave absorption plate according to claim 5, wherein the metal mesh layer is made of red copper.
10. The heat conduction and dissipation type wave absorption plate according to claim 4, wherein the distance and height of the strip-shaped protrusions are equal, and the cross-sectional shape of the strip-shaped protrusions is rectangular or semicircular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123155909.9U CN217025838U (en) | 2021-12-15 | 2021-12-15 | Heat conduction and heat dissipation type wave absorbing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123155909.9U CN217025838U (en) | 2021-12-15 | 2021-12-15 | Heat conduction and heat dissipation type wave absorbing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217025838U true CN217025838U (en) | 2022-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123155909.9U Active CN217025838U (en) | 2021-12-15 | 2021-12-15 | Heat conduction and heat dissipation type wave absorbing plate |
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| Country | Link |
|---|---|
| CN (1) | CN217025838U (en) |
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2021
- 2021-12-15 CN CN202123155909.9U patent/CN217025838U/en active Active
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