CN216980497U - Bonding device for DFN power integrated device - Google Patents
Bonding device for DFN power integrated device Download PDFInfo
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- CN216980497U CN216980497U CN202123425310.2U CN202123425310U CN216980497U CN 216980497 U CN216980497 U CN 216980497U CN 202123425310 U CN202123425310 U CN 202123425310U CN 216980497 U CN216980497 U CN 216980497U
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- 238000001179 sorption measurement Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 abstract description 37
- 230000000694 effects Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses a bonding device for a DFN power integrated device, which comprises a rack, an operating platform arranged on the rack and a computer arranged on the rack, a limiting groove for installing the chip body is arranged on one side of the upper surface of the operating platform, a second fixing groove is arranged on the other side of the upper surface of the operating platform, a fixing plate is arranged on the rack and above the operating platform, a screw rod arranged along the horizontal direction is arranged in the mounting hole on the fixing plate, a driving block is sleeved on the screw rod, the driving block is provided with an air hole which is communicated up and down, the upper end of the air hole is connected to the vacuum pump through an air pipe, the infrared light sensor is characterized in that a mounting seat is mounted on the driving block and located outside the driving block, first fixing grooves are formed in four corners of the mounting seat respectively, and an infrared light sensor electrically connected with a computer is mounted in each first fixing groove. The utility model improves the bonding position precision of the semiconductor chip body and the bonding head and improves the processing quality.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip packaging, in particular to a bonding device for a DFN power integrated device.
Background
Due to the rapid development of global electronic information technology, integrated circuit chips are continuously developed towards high density, high performance, light weight, short size, and the semiconductor chips are etched and wired on semiconductor chips, and the manufactured semiconductor devices capable of realizing certain functions include not only silicon chips but also gallium arsenide, germanium and other semiconductor materials, and the semiconductor chips are required to be bonded with bonding heads in the processing process, so that the later-stage packaging is facilitated.
For example, chinese patent publication No. CN209169115U proposes a clip bonding apparatus for semiconductor packaging and a clip picker, in which individual clips cut and separated by a clip cutting unit are picked up and the arrangement pitch of the clips is rearranged to be in accordance with the arrangement pitch of a plurality of semiconductor chips mounted on a lead frame, and a lead frame unloading unit is used to unload the lead frame in which the clips are bonded to the semiconductor chips.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a bonding device for a DFN power integrated device, which improves the bonding position precision of a semiconductor chip body and a bonding head and improves the processing quality.
In order to achieve the purpose, the utility model adopts the technical scheme that: a bonding apparatus for DFN power integrated device, comprising: the chip packaging machine comprises a rack, an operating platform arranged on the rack and a computer arranged on the rack, wherein one side of the upper surface of the operating platform is provided with a limiting groove for mounting a chip body, the other side of the upper surface of the operating platform is provided with a second fixing groove, and a bonding head is movably arranged in the second fixing groove through a base;
a fixing plate is arranged on the rack and above the operating platform, a screw rod arranged along the horizontal direction is arranged in a mounting hole on the fixing plate, one end of the screw rod is connected with an output shaft of a driving motor arranged in the mounting hole, the other end of the screw rod is rotatably arranged in the mounting hole through a limiting pipe, a driving block is sleeved on the screw rod, the upper part of the driving block is in threaded connection with the screw rod and can move from the upper part of the limiting groove to the upper part of the bonding head, an air hole which is communicated up and down is formed in the driving block, the upper end of the air hole is connected to a vacuum pump through an air pipe, and the lower end of the air hole is communicated with an adsorption pipe for adsorbing a chip body;
the utility model discloses an infrared ray sensor, including drive block, mount pad, base, infrared ray emitter, infrared ray sensor and infrared ray emitter one-to-one setting, the mount pad is installed to the drive block and lie in the drive block outside, four corners of mount pad respectively are provided with a first fixed slot, every install an infrared ray sensor who is connected with the computer electricity in the first fixed slot, a launching groove has been seted up respectively to four corners of base, installs an infrared ray emitter that is connected with the computer electricity in every launching groove, infrared ray sensor and infrared ray emitter one-to-one set up.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, a plurality of third fixing grooves are formed in two sides of the inner portion of the limiting groove respectively, and the inner circle wall face of each third fixing groove is fixedly sleeved with a rubber block.
2. In the above scheme, the driving motor is electrically connected with the computer.
3. In the scheme, the top surface of the operating platform is fixedly provided with the flashing lamp electrically connected with the computer.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
1. the utility model discloses a bonding device for a DFN power integrated device, which is characterized in that a fixed plate is arranged on a rack and above an operating platform, a lead screw arranged along the horizontal direction is arranged in a mounting hole on the fixed plate, a driving block is sleeved on the lead screw, the upper part of the driving block is in threaded connection with the lead screw and can move from the upper part of a limiting groove to the upper part of a bonding head, an air hole which is communicated from top to bottom is formed in the driving block, the upper end of the air hole is connected to a vacuum pump through an air pipe, the lower end of the air hole is in through connection with an adsorption pipe for adsorbing a chip body, so that the driving block is converted from rotation to linear movement, the semiconductor chip body is driven by the driving block to move, the semiconductor chip body reaches the upper part of the bonding head, and automatic bonding between the bonding head and the semiconductor chip body is realized.
2. The utility model relates to a bonding device for a DFN power integrated device, wherein a mounting seat is arranged on a driving block and positioned outside the driving block, four corners of the mounting seat are respectively provided with a first fixing groove, an infrared light sensor electrically connected with a computer is arranged in each first fixing groove, four corners of a base are respectively provided with an emitting groove, an infrared emitter electrically connected with the computer is arranged in each emitting groove, the infrared light sensors and the infrared emitters are arranged in a one-to-one correspondence manner, so that the effect of positioning a semiconductor chip body is achieved, the position precision of bonding the semiconductor chip body and a bonding head is improved, and the processing quality is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of a bonding apparatus for DFN power integrated devices according to the present invention;
FIG. 2 is a schematic view of a partial structure of a bonding apparatus for DFN power integrated devices according to the present invention;
fig. 3 is an enlarged view of fig. 1 at a.
In the above drawings: 1. an operation table; 2. a frame; 3. a limiting groove; 4. a semiconductor chip body; 5. a fixing plate; 6. mounting holes; 7. a drive motor; 8. a screw rod; 9. a drive block; 10. a limiting pipe; 11. a flashing light; 12. a rubber block; 13. air holes; 14. a vacuum pump; 15. a gas delivery pipe; 16. an adsorption tube; 17. a base; 18. a first fixing groove; 19. a computer; 20. a second fixing groove; 21. a base; 22. a bond head; 23. a launch slot; 24. an infrared emitter; 25. and a third fixing groove.
Detailed Description
Example 1: a bonding apparatus for DFN power integrated device, comprising: the chip mounting device comprises a frame 2, an operating platform 1 arranged on the frame 2 and a computer 19 arranged on the frame 2, wherein one side of the upper surface of the operating platform 1 is provided with a limiting groove 3 for mounting a chip body 4, the other side of the upper surface of the operating platform 1 is provided with a second fixing groove 20, and a bonding head 22 is movably arranged in the second fixing groove 20 through a base 21;
a fixing plate 5 is arranged on the frame 2 and above the operating platform 1, a screw rod 8 arranged along the horizontal direction is arranged in a mounting hole 6 on the fixing plate 5, one end of the screw rod 8 is connected with an output shaft of a driving motor 7 arranged in the mounting hole 6, the other end of the screw rod 8 is rotatably arranged in the mounting hole 6 through a limiting pipe 10, a driving block 9 is sleeved on the screw rod 8, the upper part of the driving block 9 is in threaded connection with the screw rod 8 and can move to the position above the bonding head 22 from the position above the limiting groove 3, an air hole 13 penetrating up and down is formed in the driving block 9, the upper end of the air hole 13 is connected to a vacuum pump 14 through an air pipe 15, and the lower end of the air hole 13 is connected with an adsorption pipe 16 for adsorbing the chip body 4 in a penetrating manner;
the driving block 9 is provided with a mounting seat 17 outside the driving block 9, four corners of the mounting seat 17 are respectively provided with a first fixing groove 18, each fixing groove 18 is internally provided with an infrared light sensor electrically connected with a computer 19, four corners of the base 21 are respectively provided with an emitting groove 23, each emitting groove 23 is internally provided with an infrared emitter 24 electrically connected with the computer 19, and the infrared light sensors and the infrared emitters 24 are arranged in a one-to-one correspondence manner.
A plurality of third fixed slot 25 has been seted up respectively to the inside both sides of above-mentioned spacing groove 3, and the fixed rubber block 12 that has cup jointed of interior circle wall of above-mentioned third fixed slot 25, through setting up rubber block 12, rubber block 12 can increase the frictional force between semiconductor chip body 4 and the spacing groove 3, prevents that semiconductor chip body 4 from taking place the displacement in the inside of spacing groove 3, and the adsorption tube 16 of being convenient for adsorbs semiconductor chip body 4.
The top surface of the operation table 1 is fixedly provided with a flashing lamp 11 which is electrically connected with a computer 19.
Example 2: a bonding apparatus for DFN power integrated device, comprising: the chip mounting device comprises a frame 2, an operating platform 1 arranged on the frame 2 and a computer 19 arranged on the frame 2, wherein one side of the upper surface of the operating platform 1 is provided with a limiting groove 3 for mounting a chip body 4, the other side of the upper surface of the operating platform 1 is provided with a second fixing groove 20, and a bonding head 22 is movably arranged in the second fixing groove 20 through a base 21;
a fixing plate 5 is arranged on the frame 2 and above the operating platform 1, a screw rod 8 arranged along the horizontal direction is arranged in a mounting hole 6 on the fixing plate 5, one end of the screw rod 8 is connected with an output shaft of a driving motor 7 arranged in the mounting hole 6, the other end of the screw rod 8 is rotatably arranged in the mounting hole 6 through a limiting pipe 10, a driving block 9 is sleeved on the screw rod 8, the upper part of the driving block 9 is in threaded connection with the screw rod 8 and can move to the position above the bonding head 22 from the position above the limiting groove 3, an air hole 13 penetrating up and down is formed in the driving block 9, the upper end of the air hole 13 is connected to a vacuum pump 14 through an air pipe 15, and the lower end of the air hole 13 is connected with an adsorption pipe 16 for adsorbing the chip body 4 in a penetrating manner;
the driving block 9 is provided with a mounting seat 17 outside the driving block 9, four corners of the mounting seat 17 are respectively provided with a first fixing groove 18, each fixing groove 18 is internally provided with an infrared light sensor electrically connected with a computer 19, four corners of the base 21 are respectively provided with an emitting groove 23, each emitting groove 23 is internally provided with an infrared emitter 24 electrically connected with the computer 19, and the infrared light sensors and the infrared emitters 24 are arranged in a one-to-one correspondence manner.
The driving motor 7 is electrically connected with a computer 19.
The top surface of the operating platform 1 is fixedly provided with a flashing light 11 which is electrically connected with a computer 19.
When the semiconductor chip bonding device is used, a worker can start the vacuum pump through a computer, the adsorption pipe 16 adsorbs the semiconductor chip body 4 through the suction force generated by the vacuum pump 14, the driving motor 7 is started simultaneously, the driving shaft of the driving motor 7 rotates to drive the screw rod 8 to rotate, the screw rod 8 rotates to drive the driving block 9 to rotate through thread linkage, the driving block 9 is limited by the mounting hole 6, the driving block is converted into linear movement from rotation and drives the semiconductor chip body to move, the semiconductor chip body reaches the upper part of the bonding head, the worker starts the infrared emitter 24 through the computer at the moment, when the infrared sensor in the first fixing groove 18 receives infrared rays, data is transmitted to the computer to be displayed, the semiconductor chip body 4 is completely aligned with the bonding head 22 at the moment, and the effect of positioning the semiconductor chip body 4 is achieved;
in addition, through the arranged vacuum pump 14, the worker closes the vacuum pump 14, the semiconductor chip body 4 loses suction force and is attached to the bonding head 22, the effect of bonding the semiconductor chip body 4 and the bonding head 22 is achieved, and the semiconductor chip is convenient to package in a later period;
in addition, through the flashing lamp 11 that sets up, when infrared light sensor did not receive the infrared ray that infrared emitter 24 sent, infrared light sensor can give the computer with data transmission this moment, and the computer starts flashing lamp 11, and the red light scintillation of flashing lamp reminds the staff, lets the staff in time adjust the position of semiconductor chip body 4.
When the bonding device for the DFN power integrated device is adopted, a fixed plate is arranged on a rack and above an operation table, a lead screw arranged along the horizontal direction is arranged in a mounting hole on the fixed plate, one end of the lead screw is connected with an output shaft of a driving motor arranged in the mounting hole, the other end of the lead screw is rotatably arranged in the mounting hole through a limiting pipe, a driving block is sleeved on the lead screw, the upper part of the driving block is in threaded connection with the lead screw and can move to the upper part of a bonding head from the upper part of the limiting groove, an air hole which is communicated up and down is arranged on the driving block, the upper end of the air hole is connected to a vacuum pump through an air pipe, the lower end of the air hole is communicated and connected with an adsorption pipe for adsorbing a chip body, so that the driving block is converted into linear movement from rotation, the driving block drives the semiconductor chip body to move, and the semiconductor chip body reaches the upper part of the bonding head, automatic key between the bonding head and the semiconductor chip body is realized;
a mounting seat is arranged on a driving block and positioned outside the driving block, first fixing grooves are respectively arranged at four corners of the mounting seat, an infrared light sensor electrically connected with a computer is arranged in each first fixing groove, an emitting groove is respectively arranged at four corners of a base, an infrared emitter electrically connected with the computer is arranged in each emitting groove, the infrared light sensors and the infrared emitters are arranged in a one-to-one correspondence manner, when the driving block drives the semiconductor chip body to reach the upper part of the bonding head, the infrared emitter emits infrared rays, when the infrared sensor in the first fixing groove receives the infrared rays, the infrared sensor transmits data to a computer for displaying, at the moment, the semiconductor chip body is completely aligned with the bonding head, the effect of positioning the semiconductor chip body is achieved, the position precision of bonding of the semiconductor chip body and the bonding head is improved, and the processing quality is improved.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (4)
1. A bonding apparatus for DFN power integrated device, comprising: frame (2), set up operation panel (1) on frame (2) and install computer (19) in frame (2), its characterized in that: a limiting groove (3) for mounting a chip body (4) is formed in one side of the upper surface of the operating platform (1), a second fixing groove (20) is formed in the other side of the upper surface of the operating platform (1), and a bonding head (22) is movably mounted in the second fixing groove (20) through a base (21);
a fixing plate (5) is arranged on the frame (2) and above the operating platform (1), a screw rod (8) arranged along the horizontal direction is arranged in the mounting hole (6) on the fixing plate (5), one end of the screw rod (8) is connected with an output shaft of a driving motor (7) arranged in the mounting hole (6), the other end of the screw rod (8) is rotatably arranged in the mounting hole (6) through a limiting pipe (10), a driving block (9) is sleeved on the screw rod (8), the upper part of the driving block (9) is in threaded connection with the screw rod (8) and can move from the upper part of the limiting groove (3) to the upper part of the bonding head (22), the driving block (9) is provided with an air hole (13) which is communicated up and down, the upper end of the air hole (13) is connected to a vacuum pump (14) through an air pipe (15), the lower end of the air hole (13) is connected with an adsorption tube (16) for adsorbing the chip body (4) in a penetrating way;
the utility model discloses an infrared ray sensor, including drive block (9), mount pad (17) are installed in drive block (9) and lie in the drive block (9) outside, four corners of mount pad (17) respectively are provided with a first fixed slot (18), every install an infrared light sensor who is connected with computer (19) electricity in first fixed slot (18), an emission groove (23) have been seted up respectively to four corners of base (21), install an infrared emitter (24) of being connected with computer (19) electricity in every emission groove (23), infrared light sensor and infrared emitter (24) one-to-one setting.
2. The bonding apparatus for DFN power integrated device as defined in claim 1, wherein: a plurality of third fixed slots (25) are respectively formed in two sides of the inner portion of the limiting slot (3), and rubber blocks (12) are fixedly sleeved on the inner circle wall face of each third fixed slot (25).
3. The bonding apparatus for DFN power integrated device according to claim 1 or 2, wherein: the driving motor (7) is electrically connected with a computer (19).
4. The bonding apparatus for DFN power integrated device according to claim 1 or 2, wherein: the top surface of the operating platform (1) is fixedly provided with a flashing lamp (11) which is electrically connected with a computer (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123425310.2U CN216980497U (en) | 2021-12-31 | 2021-12-31 | Bonding device for DFN power integrated device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123425310.2U CN216980497U (en) | 2021-12-31 | 2021-12-31 | Bonding device for DFN power integrated device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216980497U true CN216980497U (en) | 2022-07-15 |
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ID=82350768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123425310.2U Active CN216980497U (en) | 2021-12-31 | 2021-12-31 | Bonding device for DFN power integrated device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216980497U (en) |
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2021
- 2021-12-31 CN CN202123425310.2U patent/CN216980497U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240812 Address after: 224015 Zhangzhuang Street, Yandu District, Yancheng City, Jiangsu Province, China. Kangzhuang Avenue Shuangchuang Park Complex 1 # Factory Building Patentee after: Jiangsu Xinfeng integrated circuit Co.,Ltd. Country or region after: China Address before: 224056 room 1601, 16th floor, Yanlong Street innovation center, Yandu District, Yancheng City, Jiangsu Province (d) Patentee before: YANCHENG XINFENG MICROELECTRONICS Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right |