CN219834816U - Chip mounter with multiple chip heads - Google Patents
Chip mounter with multiple chip heads Download PDFInfo
- Publication number
- CN219834816U CN219834816U CN202320592159.1U CN202320592159U CN219834816U CN 219834816 U CN219834816 U CN 219834816U CN 202320592159 U CN202320592159 U CN 202320592159U CN 219834816 U CN219834816 U CN 219834816U
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- CN
- China
- Prior art keywords
- negative pressure
- suction pipe
- chip
- body shell
- chip mounter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001179 sorption measurement Methods 0.000 claims abstract description 30
- 238000007789 sealing Methods 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000741 silica gel Substances 0.000 claims description 13
- 229910002027 silica gel Inorganic materials 0.000 claims description 13
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 14
- 239000000758 substrate Substances 0.000 description 8
- 239000010902 straw Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Manipulator (AREA)
Abstract
The utility model relates to the technical field of chip mounters, and provides a chip mounter with multiple chip heads, which comprises a body shell, a driving motor, an adsorption device and an adjusting worm wheel, wherein the front end of the body shell is connected with a mounting cover plate through a bolt, a negative pressure machine is fixedly arranged on the inner wall of the mounting cover plate, the driving motor is fixedly connected with the front end of a supporting frame, the output end of the driving motor is fixedly connected with an adjusting worm, the adsorption device is fixedly connected with the outer wall of the body shell, the adjusting worm wheel is connected with the body shell through a rotating shaft rod, the body shell is in sliding connection with the inner wall of the supporting frame through a limiting sliding block, the body shell is of a hollow rectangular structure, the body shell forms a rotating structure on the inner wall of the supporting frame through the rotating shaft rod and the limiting sliding block, and the supporting frame is of a concave structure. This chip mounter of many patch heads conveniently fixes the absorption to the chip of not co-altitude position, avoids influencing the work efficiency of paster.
Description
Technical Field
The utility model relates to the technical field of chip mounters, in particular to a chip mounter with multiple chip mounters.
Background
In the field of semiconductor encapsulation, a chip mounter is equipment for realizing die bonding, is the most critical and complex equipment in the whole SMT production, and mainly comprises a wafer carrier for carrying wafers, a substrate carrier for carrying the substrates and a traditional chip mounter, wherein an included angle between the wafer carrier and the substrate carrier is smaller than 180 degrees, the traditional chip mounter is arranged above the substrate carrier and used for moving back and forth between the wafer carrier and the substrate carrier, the wafers are taken out from the wafer carrier, the positions and the directions of the wafers are adjusted, the wafers are mounted on the substrate carrier, and the traditional chip mounter sucks the wafers from the wafer carrier and then mounts the wafers on the substrate carrier; then, returning to absorb the next wafer from the wafer carrier and then attaching the next wafer to the substrate carrier, and repeating the steps;
prior art 1 (application number: cn202121903874. X) a multi-patch head patch structure comprising a rail and at least two patch heads; each patch head is arranged on the guide rail through a movable slide block, a rotating device is sleeved on the circumference of the movable slide block, at least 2 telescopic rods are arranged on the circumference of the rotating device, suction nozzles are fixedly arranged at the top ends of the telescopic rods, the rotating device is in a circular ring shape, the telescopic rods are uniformly distributed along the circumference of the telescopic rods, meanwhile, the utility model also discloses a patch machine with a patch structure with multiple patch heads, the 2 patch heads of the utility model work in a crossed mode, patch efficiency is provided, more use values are created in unit time, and the improvement of production efficiency in unit time can obtain more benefits for enterprises.
However, the following problems are found in implementing the related art for the chip mounter: above-mentioned chip mounter, the chip of inconvenient to different high positions is fixed and is absorbed, influences the work efficiency of paster.
Disclosure of Invention
The utility model provides a chip mounter with multiple chip heads, which solves the problems that the chip mounter in the related technology is inconvenient to fix and absorb chips at different height positions and affects the working efficiency of the chip.
The technical scheme of the utility model is as follows: the chip mounter with the multiple chip heads comprises a housing shell, wherein the front end of the housing shell is connected with a mounting cover plate through bolts, and a negative pressure machine is fixedly arranged on the inner wall of the mounting cover plate;
the driving motor is installed and connected at the front end of the supporting frame, and the output end of the driving motor is fixedly connected with an adjusting worm;
further comprises:
the adsorption device is installed and connected on the outer wall of the machine body shell, and a connection port of the adsorption device and the machine body shell is connected with an air suction pipe port of the negative pressure machine;
the adjusting worm wheel is connected with the engine body shell through the rotating shaft rod, and the engine body shell is in sliding connection on the inner wall of the supporting frame through the limiting slide block.
Preferably, the engine body shell is of a hollow rectangular structure, the engine body shell forms a rotary structure on the inner wall of the supporting frame through the rotating shaft rod and the limiting sliding block, and the supporting frame is of a concave structure.
Preferably, the connection mode between the adjusting worm wheel and the adjusting worm is meshed connection, and the adjusting worm wheel and the machine body shell form an integrated welding structure through the rotating shaft rod.
Preferably, the adsorption devices are distributed in an array on the outer surface of the machine body shell, and a communication structure is formed between the adsorption devices and the negative pressure machine.
Preferably, the adsorption equipment includes negative pressure straw, universal hose, absorption silica gel head, first electric telescopic handle, sealed regulating block and second electric telescopic handle, and the negative pressure straw runs through and installs on engine body shell's outer wall, and the outer end of negative pressure straw is connected with universal hose, and universal hose's expansion end is connected with the absorption silica gel head, installs and is connected with first electric telescopic handle between the surface of negative pressure straw and absorption silica gel head, and the inside lower extreme fixed mounting of negative pressure straw has the second electric telescopic handle, and the output fixedly connected with sealed regulating block of second electric telescopic handle.
Preferably, the adsorption silica gel head forms a telescopic structure on the negative pressure suction pipe through a universal hose, and the adsorption silica gel head is in a horn-shaped structure.
Preferably, the sealing adjusting block is in a truncated cone-shaped structure, and the sealing adjusting block forms a telescopic structure in the negative pressure suction pipe through a second electric telescopic rod.
Preferably, the sealing adjusting block is attached to the middle of the negative pressure suction pipe, and the joint of the negative pressure suction pipe and the machine body shell is of a frame structure.
The working principle and the beneficial effects of the utility model are as follows: the chip of different high positions is fixed to be absorbed conveniently, avoids influencing the work efficiency of paster.
1. The utility model is also provided with the adsorption device and the negative pressure machine, and the negative pressure machine adsorbs and fixes the plurality of groups of chips through the adsorption device, so that the chip pasting treatment is convenient to be carried out simultaneously, the falling phenomenon is avoided, the working efficiency is convenient to be improved, and the simultaneous pasting treatment of the plurality of groups of chips is convenient to be carried out at one time;
2. according to the utility model, the limiting slide block and the rotating shaft rod are further arranged, the limiting slide block slides on the inner wall of the supporting frame, meanwhile, the rotating shaft rod drives the engine body shell to rotate in the supporting frame, so that the whole process of sucking and pasting chips is conveniently realized, stable angle adjustment is convenient, and the chips at different height positions are sucked by utilizing the expansion and contraction of the universal hose;
3. according to the utility model, the second electric telescopic rod and the sealing adjusting block are further arranged, the sealing adjusting block is matched with the thin end of the negative pressure suction pipe, the sealing adjusting block is pulled in a telescopic manner through the second electric telescopic rod, the ventilation in the negative pressure suction pipe is adjusted and controlled, and therefore the chip is convenient to adsorb or loosen, and the negative pressure suction pipe is convenient to use.
Drawings
The utility model will be described in further detail with reference to the drawings and the detailed description.
Fig. 1 is a schematic perspective view of a housing of the present utility model;
FIG. 2 is a schematic perspective view of an adsorption device according to the present utility model;
FIG. 3 is a schematic view of the internal perspective structure of the adsorption device according to the present utility model;
fig. 4 is a schematic diagram of the overall structure according to the present utility model.
In the figure: 1. a housing; 2. an adsorption device; 201. a negative pressure suction pipe; 202. a universal hose; 203. adsorbing a silica gel head; 204. a first electric telescopic rod; 205. sealing the adjusting block; 206. a second electric telescopic rod; 3. a negative pressure machine; 4. installing a cover plate; 5. a limit sliding block; 6. a support frame; 7. adjusting a worm wheel; 8. adjusting a worm; 9. a driving motor; 10. and rotating the shaft lever.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a chip mounter with multiple chip heads, which comprises: the vacuum cleaner comprises a machine body shell 1, an adsorption device 2, a negative pressure suction pipe 201, a universal hose 202, an adsorption silica gel head 203, a first electric telescopic rod 204, a sealing adjusting block 205, a second electric telescopic rod 206, a negative pressure machine 3, an installation cover plate 4, a limit sliding block 5, a supporting frame 6, an adjusting worm wheel 7, an adjusting worm 8, a driving motor 9 and a rotating shaft rod 10.
The working principle and the using flow of the utility model are as follows: referring to fig. 1, fig. 2 and fig. 4, according to the height position of the chip to be sucked, the first electric telescopic rod 204 is used for performing telescopic adjustment on the universal hose 202, further, the position of the adsorption silica gel head 203 is automatically adjusted, the chip at different positions is sucked conveniently, the chip is convenient to use, then, the power switch of the driving motor 9 is turned on, further, the rotation treatment on the adjusting worm 8 is facilitated, the connecting mode of the adjusting worm 8 and the adjusting worm wheel 7 is meshed connection, so that the adjusting worm 8 is convenient to drive the adjusting worm wheel 7 to rotate on the supporting frame 6, the engine body shell 1 is driven to rotate in the supporting frame 6, the chip is conveniently subjected to multi-angle adjustment, the chip is conveniently sucked, and the chip is also conveniently transported and pasted;
as shown in fig. 1, fig. 2 and fig. 3, when the chip is required to be sucked, the sealing adjusting block 205 is not attached to the inner wall of the negative pressure suction pipe 201, the negative pressure machine 3 sucks the chip under negative pressure through the adsorption device 2, and then the chip is convenient to fix, when the chip is required to be stuck, the second electric telescopic rod 206 pushes the sealing adjusting block 205 outwards, and the sealing adjusting block 205 forms a telescopic structure in the negative pressure suction pipe 201 through the second electric telescopic rod 206, so that the sealing adjusting block 205 is convenient to attach and seal the inner wall of the negative pressure suction pipe 201, the inside of the negative pressure suction pipe 201 is convenient to block, the adsorption silica gel head 203 loses the suction force to the chip, the adsorption silica gel head 203 is convenient to loosen the chip, the chip is convenient to stick, and the chip is convenient to use, namely the work flow of the chip mounter with multiple chip heads.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (8)
1. The chip mounter with multiple chip heads comprises a housing shell (1), wherein the front end of the housing shell (1) is connected with a mounting cover plate (4) through bolts, and a negative pressure machine (3) is fixedly arranged on the inner wall of the mounting cover plate (4);
the driving motor (9), the front end of the supporting frame (6) is installed and connected with the driving motor (9), and the output end of the driving motor (9) is connected with the adjusting worm (8);
characterized by further comprising:
the adsorption device (2) is installed and connected on the outer wall of the machine body shell (1), and a connection port of the adsorption device (2) and the machine body shell (1) is connected with an air suction pipe port of the negative pressure machine (3);
the adjusting worm wheel (7), the adjusting worm wheel (7) is connected with the engine body shell (1) through the rotating shaft rod (10), and the engine body shell (1) is connected on the inner wall of the supporting frame (6) in a sliding mode through the limiting sliding block (5).
2. The multi-chip mounter according to claim 1, wherein said housing (1) has a hollow rectangular structure, and said housing (1) is formed into a rotary structure on an inner wall of said supporting frame (6) by a rotary shaft (10) and a limit slider (5), and said supporting frame (6) has a "concave" shape.
3. The multi-chip mounter according to claim 1, wherein the connection mode between the adjusting worm wheel (7) and the adjusting worm (8) is a meshed connection, and the adjusting worm wheel (7) and the housing (1) form an integrated welding structure through the rotating shaft lever (10).
4. The multi-chip mounter according to claim 1, wherein said adsorption devices (2) are arranged in an array on the outer surface of the housing (1), and a communication structure is formed between the adsorption devices (2) and the negative pressure machine (3).
5. The multi-patch head chip mounter according to claim 4, wherein the adsorption device (2) comprises a negative pressure suction pipe (201), a universal hose (202), an adsorption silica gel head (203), a first electric telescopic rod (204), a sealing adjusting block (205) and a second electric telescopic rod (206), the negative pressure suction pipe (201) is installed on the outer wall of the housing (1) in a penetrating mode, the universal hose (202) is connected to the outer end of the negative pressure suction pipe (201), the adsorption silica gel head (203) is connected to the movable end of the universal hose (202), a first electric telescopic rod (204) is installed between the negative pressure suction pipe (201) and the outer surface of the adsorption silica gel head (203), the second electric telescopic rod (206) is fixedly installed at the lower end of the inside of the negative pressure suction pipe (201), and the sealing adjusting block (205) is fixedly connected to the output end of the second electric telescopic rod (206).
6. The multi-chip mounter according to claim 5, wherein said adsorption silicone head (203) forms a telescopic structure on a negative pressure suction pipe (201) through a universal hose (202), and said adsorption silicone head (203) has a horn-like structure.
7. The multi-chip mounter according to claim 5, wherein said seal regulating block (205) has a truncated cone-like structure, and said seal regulating block (205) forms a telescopic structure inside said negative pressure suction pipe (201) through a second electric telescopic rod (206).
8. The multi-chip mounter according to claim 5, wherein said seal adjusting block (205) is attached to a middle portion of the negative pressure suction pipe (201), and a joint portion of the negative pressure suction pipe (201) and the housing (1) is in a frame structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320592159.1U CN219834816U (en) | 2023-03-23 | 2023-03-23 | Chip mounter with multiple chip heads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320592159.1U CN219834816U (en) | 2023-03-23 | 2023-03-23 | Chip mounter with multiple chip heads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219834816U true CN219834816U (en) | 2023-10-13 |
Family
ID=88245785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320592159.1U Active CN219834816U (en) | 2023-03-23 | 2023-03-23 | Chip mounter with multiple chip heads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219834816U (en) |
-
2023
- 2023-03-23 CN CN202320592159.1U patent/CN219834816U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |