CN214956931U

CN214956931U - CSP on-line die bonder

Info

Publication number: CN214956931U
Application number: CN202121425015.4U
Authority: CN
Inventors: 胡稳; 胡牛凡; 徐金宏; 杨帅; 黄锦钿
Original assignee: Shenzhen Grandseed Technology Development Co ltd
Current assignee: Shenzhen Grandseed Technology Development Co ltd
Priority date: 2021-06-25
Filing date: 2021-06-25
Publication date: 2021-11-30
Anticipated expiration: 2031-06-25

Abstract

The utility model discloses a CSP on-line die bonder, which belongs to the field of die bonder and comprises a frame, a portal frame, a die plate component, an ejector pin component, a feeding visual component, a swing arm component, a die bonding visual component, a dispensing component, a glue supply component, a die bonding component and a feeding positioning component; the machine frame plays a supporting role, the portal frame is fixed on one side of the top end face of the machine frame, and the wafer assembly is fixed on the top end face of the machine frame and is positioned on one side of the portal frame; the thimble assembly is fixed on one side of the wafer assembly; the feeding visual assembly is positioned above the wafer assembly and is fixedly connected with the portal frame; the swing arm assembly is positioned on one side of the feeding visual assembly and is fixedly connected with the portal frame; the die bonding visual assembly is positioned on one side of the swing arm assembly, which is far away from the feeding visual assembly, and is fixedly connected with the portal frame. Through a series of structures that set up, not only simplify equipment structure, improve the stability of equipment operation, the shake when can also lightening equipment high-speed operation improves solid brilliant precision.

Description

CSP on-line die bonder

Technical Field

The utility model relates to a solid brilliant machine specifically is CSP solid brilliant machine on line.

Background

With the rapid development of economy and the continuous progress of society, the increase in energy conservation, emission reduction and efficiency increase has become a necessary trend of global development, and the society has wide consensus. Various electrical appliances are developed in the direction of energy conservation, convenient use, space conservation, safety, high efficiency, multiple functions and the like. The LED is extremely wide in the current society, and the energy-saving space is very promising.

CSP packaging is a leading technology of current LED production, which refers to a packaging technology in which the size of the package itself does not exceed 20% of the size of the chip itself. To achieve this, LED manufacturers minimize unnecessary structures such as using standard high power LEDs, removing the ceramic heat sink substrate and connecting wires, metalizing the P and N electrodes, and covering the phosphor layer directly over the LED.

The die bonder is used as essential equipment in the LED production link, and has great natural demand. Conventional die attach machines are used to make electrical connections between semiconductor devices and substrates. The conventional die bonder can bond a semiconductor device on a substrate by using conductive silver paste or non-conductive glue. And then, carrying out a baking process to solidify the semiconductor device bonded by the conductive silver paste or the non-conductive adhesive. And finally, under the action of hot-pressing ultrasound, connecting the substrate and the semiconductor device through a gold wire (a copper wire or a silver alloy wire) by a wire bonding machine so as to realize the electrical communication between the semiconductor device and the substrate.

The prior art has the following problems: the equipment has large volume, poor stability and serious jitter when the equipment runs at high speed. Accordingly, one skilled in the art provides a CSP on-line die bonder to solve the problems set forth in the background above.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a CSP fixes brilliant machine on line, through a series of structures that set up, not only simplifies equipment structure, and improve equipment operation's stability can also alleviate the shake of equipment when high-speed moving, improves solid brilliant precision to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the CSP online die bonder comprises a rack, a portal frame, a die assembly, an ejector pin assembly, a feeding visual assembly, a swing arm assembly, a die bonding visual assembly, a dispensing assembly, a glue supply assembly, a die bonding assembly and a feeding positioning assembly; the machine frame plays a supporting role, the portal frame is fixed on one side of the top end face of the machine frame, and the wafer assembly is fixed on the top end face of the machine frame and is positioned on one side of the portal frame; the thimble assembly is fixed on one side of the wafer assembly; the feeding visual assembly is positioned above the wafer assembly and is fixedly connected with the portal frame; the swing arm assembly is positioned on one side of the feeding visual assembly and is fixedly connected with the portal frame; the die bonding visual assembly is positioned on one side of the swing arm assembly, which is far away from the feeding visual assembly, and is fixedly connected with the portal frame; the dispensing assembly is fixed on one side, close to the die bonding visual assembly, of the top end face of the portal frame; the glue supply assembly is fixed on one side of the glue dispensing assembly; the die bonding assembly is positioned below the glue supply assembly and fixed on the top end face of the rack; the feeding positioning assembly is fixed inside the die bonding assembly.

Through a series of structures that set up, not only simplify equipment structure, improve the stability of equipment operation, the shake when can also lightening equipment high-speed operation improves solid brilliant precision.

As a further aspect of the present invention: the wafer tray assembly comprises a first X-Y axis robot, the first X-Y axis robot is fixed on the top end face of the rack and located on one side of the portal frame, a wafer tray support is fixedly connected to the top end of the first X-Y axis robot, a wafer tray positioning groove is formed in the top end face of the wafer tray support, and a hasp is movably connected to the outer side face of the wafer tray positioning groove.

When the ejector pin component is used, the crystal plate is placed into the crystal plate positioning groove, the locking hasp is used for fixing the crystal plate, and the first X-Y axis robot is used for accurately positioning the crystal grains under the matching of the feeding visual component, so that the crystal grains are accurately aligned with the ejector pin needle head of the ejector pin component.

As a further aspect of the present invention: the thimble assembly comprises a thimble base, the thimble base is fixed on one side of the wafer assembly, the top end of the thimble base is movably connected with a micro-motion platform, the top end face of the micro-motion platform is fixedly connected with a cam module, a side face of the cam module is fixedly connected with a servo motor, the output end of the servo motor is connected with the cam module, the top end face of the cam module is fixedly connected with a thimble module, and the top end face of the thimble module is fixedly connected with a jacking sleeve. The thimble module is including fixing the sharp bearing frame at cam module top face, and sharp bearing frame top is fixed with the sleeve fixing base, the inside swing joint of sleeve fixing base has the thimble pole, and the thimble pole top can be dismantled and be fixed with thimble anchor clamps, thimble pole lateral surface top threaded connection has the thimble cap, thimble anchor clamps top can be dismantled and be fixed with the thimble head, be equipped with the sealing washer between sleeve fixing base and the thimble pole.

During the use, at first, adjust the thimble base to suitable height, and then make thimble module height fit, then, through the horizontal position of fine motion platform adjustment thimble module, finally, start servo motor, servo motor drives the cam module and rotates, and the cam module drives the thimble rod intermittent type nature ejecting in the thimble module, and then drives the thimble ejecting.

As a further aspect of the present invention: the feeding vision assembly comprises a first camera support, the first camera support is located above the wafer assembly and fixedly connected with the portal frame, one side of the top end face of the first camera support is fixedly connected with a first industrial camera, the bottom end of the first industrial camera penetrates through the first camera support and is fixedly connected with a first high-power lens, and the bottom end of the first high-power lens is fixedly connected with a first vision light source.

When the device is used, the first visual light source automatically adjusts the brightness of the light source as required, the first high-power lens amplifies crystal grains, the first industrial camera captures and captures the positions of the crystal grains at a high speed, and the first X-Y axis robot of the wafer assembly is controlled to be accurately positioned.

As a further aspect of the present invention: the swing arm component comprises a swing rod motor base, the swing rod motor base is located on one side of the feeding vision component and fixedly connected with the portal frame, the bottom end of the swing rod motor base is fixedly connected with a cam motor base, one end of the cam motor base is connected with a cam motor, the other end of the cam motor base is movably connected with a solid crystal swing rod, a swing rod motor is fixed to the top end of the swing rod motor base, and the output end of the swing rod motor is connected with the solid crystal swing rod.

After the wafer assembly is corrected, the cam motor drives the die bonding swing rod to descend, the bakelite suction nozzle at one end of the die bonding swing rod timely and accurately adsorbs the crystal grains, the cam motor drives the die bonding swing rod to ascend, then the swing rod motor rotates by one hundred eighty degrees, the anode and the cathode of the crystal grains are just exchanged, the cam motor drives the swing rod to descend again, the negative pressure pipeline is closed after the swing rod motor reaches a proper position, the positive pressure pipeline is opened, and the crystal grains are accurately placed on the electrodes of the lamp strip.

As a further aspect of the present invention: the die bonding visual assembly comprises a second camera support, the second camera support is located on one side, away from the feeding visual assembly, of the swing arm assembly and is fixedly connected with the portal frame, a second industrial camera is fixedly connected to one side of the top end face of the second camera support, the bottom end of the second industrial camera penetrates through the second camera support and is fixedly connected with a second high-power lens, and a second visual light source is fixedly connected to the bottom end of the second high-power lens.

When the device is used, the brightness of the light source is automatically adjusted by the second visual light source according to needs, the crystal grains are amplified by the second high-power lens, and the positions of the crystal grains are captured and snapshotted by the second industrial camera at high speed.

As a further aspect of the present invention: the subassembly is glued to point includes the mounting panel, and the mounting panel is located swing arm subassembly and keeps away from one side of material loading vision subassembly and with portal frame fixed connection, motor and driving motor are glued to a side fixedly connected with point of mounting panel, and the point is glued the one side that the motor is located driving motor, the another side swing joint of mounting panel has drive mechanism, and drive mechanism and point and glue the motor output and be connected, drive mechanism one side is equipped with the point and glues the connecting rod, and a point glue connecting rod swing joint between drive mechanism and driving motor output, drive mechanism's output swing joint has the adhesive arm a bit, and the one end fixedly connected with point of gluing the arm glues the head.

During the use, at first, the needle is glued to the fixed point on the dispensing head, then, start point and glue motor and driving motor, point and glue the motor output and be the cam structure, under drive mechanism's cooperation, the rotary motion of cam is transformed into linear reciprocating motion, and the dispensing arm is glued the head and is followed with the point and be linear reciprocating motion, the connecting rod is glued to the point this moment and is transformed into linear motion driving motor's rotary motion, the position is glued to the control point, the solid brilliant visual subassembly of dispensing head cooperation, solid brilliant subassembly, the accurate point of the dispensing needle that has dipped in the glue solution is on the lamp area electrode that needs solid brilliant, glue the point size moderate, it is even to glue the volume.

As a further aspect of the present invention: the glue supply assembly comprises a glue supply arm, the glue supply arm is fixed on one side of the glue dispensing assembly, a fixed pressing block is fixedly connected with one end of the glue supply arm, a glue disc is movably connected to the outer side face of the fixed pressing block, a magnetic wheel is fixedly connected to the top end of the glue disc, the top end of the magnetic wheel is connected with the output end of a glue supply motor, and a fine adjustment micrometer is movably connected to the top end of the fixed pressing block.

The rubber plate is installed on supplying gluey arm, drives the rubber plate rotation through the power transmission that the magnetic wheel supplied gluey motor to provide to the rubber plate, and fixed briquetting plays the positioning action to the rubber plate, and the fine setting micrometer can adjust glue film thickness.

As a further aspect of the present invention: the die bonding assembly comprises a second X-Y axis robot, the second X-Y axis robot is located below the glue supply assembly and fixed to the top end face of the rack, and the top end of the second X-Y axis robot is fixedly connected with a die bonding platform.

During die bonding, the die bonding component firmly fixes the lamp strip on the die bonding platform, and the positive and negative electrodes of the lamp strip are accurately aligned to the positive and negative electrodes of the crystal grains adsorbed on the suction nozzle by matching with the die bonding visual component under the driving of the second X-Y axis robot.

As a further aspect of the present invention: the feeding positioning assembly comprises a first positioning mechanism and a second positioning mechanism which are fixed inside the die bonder assembly, the first positioning mechanism is located on one side of the second positioning mechanism, the first positioning mechanism comprises a first three-rod cylinder fixed inside the die bonder assembly, a first anti-slip block fixedly connected to the top end of the first three-rod cylinder is embedded in the top end face of the first anti-slip block, the second positioning mechanism comprises a second three-rod cylinder fixed on one side of the first three-rod cylinder, a second anti-slip block fixedly connected to the top end of the second three-rod cylinder is embedded in the top end face of the second anti-slip block, and the second sucker is embedded in the top end face of the second anti-slip block.

Positioning mechanism divide into two sets ofly, when carrying out the lamp area reloading, two sets of synchronous working: the sucking disc passes through the hose to be connected with external evacuation equipment, and three pole cylinders rise, make the sucking disc laminating in the lower surface in lamp area and evacuation, and the sucking disc contracts under the atmospheric pressure effect and warp, drives the lamp area firmly fix on the non slipping spur to the fixed lamp area.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the industrial camera automatically captures and corrects die bonding points on the LED lamp strip and the flexible circuit board, and high-speed, high-precision and high-stability dispensing and die bonding are achieved.

2. The feed locating component is fixed on one side, so that the dismounting fixture is prevented from reducing the operation difficulty when the product is remodeled, the remodelling time is shortened, and the remodelling efficiency is improved.

3. The equipment adopts a gantry structure, so that the rigidity of the main body of the equipment is improved, and the vibration during high-speed operation is reduced.

4. The full-automatic control of the die bonding process is realized, manual operation is not needed, and the transportation speed and the safety are greatly improved.

Drawings

FIG. 1 is a schematic view of the overall structure of a CSP on-line die bonder;

FIG. 2 is a schematic structural diagram of a wafer assembly in the CSP on-line die bonder;

FIG. 3 is a schematic structural diagram of a thimble assembly in the CSP on-line die bonder;

FIG. 4 is a schematic structural diagram of a feeding vision assembly in the CSP on-line die bonder;

FIG. 5 is a schematic structural diagram of a swing arm assembly in the CSP on-line die bonder;

FIG. 6 is a schematic structural diagram of a die attach vision module in the CSP on-line die attach machine;

FIG. 7 is a schematic structural diagram of a dispensing assembly in the CSP on-line die bonder;

FIG. 8 is a schematic structural diagram of a glue supply assembly in the CSP on-line die bonder;

FIG. 9 is a schematic structural diagram of a die attach assembly in the CSP on-line die attach machine;

FIG. 10 is a schematic structural diagram of a feeding positioning assembly in the CSP on-line die bonder;

fig. 11 is a schematic structural diagram of the ejector pin module in the CSP online die bonder.

In the figure: 1. a frame; 2. a gantry; 3. a wafer assembly; 301. a first X-Y axis robot; 302. a wafer support; 303. a crystal plate positioning groove; 304. a hasp; 4. a thimble assembly; 401. a thimble base; 402. a micro-motion platform; 403. a cam module; 404. a servo motor; 405. a thimble module; 4051. a linear bearing seat; 4052. a sleeve fixing seat; 4053. a thimble rod; 4054. a seal ring; 4055. a thimble clamp; 4056. a thimble cap; 4057. a thimble head; 406. jacking and sucking the sleeve; 5. a feeding vision component; 501. a first visual light source; 502. a first high power lens; 503. a first industrial camera; 504. a first camera support; 6. a swing arm assembly; 601. fixing a crystal swing rod; 602. a swing rod motor base; 603. a cam motor base; 604. a cam motor; 605. a swing rod motor; 7. a die bond vision component; 701. a second visual light source; 702. a second high power lens; 703. a second industrial camera; 704. a second camera support; 8. dispensing components; 801. dispensing a glue head; 802. dispensing an adhesive arm; 803. a transmission mechanism; 804. mounting a plate; 805. a dispensing motor; 806. a drive motor; 807. dispensing a connecting rod; 9. a glue supply assembly; 901. a rubber plate; 902. a magnetic wheel; 903. fixing a pressing block; 904. finely adjusting a micrometer; 905. a glue supply motor; 906. a glue supply arm; 10. a die bonding assembly; 1001. a second X-Y axis robot; 1002. a die bonding platform; 11. a feeding positioning assembly; 1101. a first third rod cylinder; 1102. a first anti-skid block; 1103. a first suction cup; 1104. a second third rod cylinder; 1105. a second anti-skid block; 1106. and a second suction cup.

Detailed Description

Referring to fig. 1-11, in an embodiment of the present invention, the CSP online die bonder includes a frame 1, a gantry 2, a die pad assembly 3, a thimble assembly 4, a feeding vision assembly 5, a swing arm assembly 6, a die bonder vision assembly 7, a dispensing assembly 8, a glue supply assembly 9, a die bonder assembly 10, and a feeding positioning assembly 11. The frame 1 plays a supporting role, the portal frame 2 is fixed on one side of the top end face of the frame 1, and the wafer assembly 3 is fixed on the top end face of the frame 1 and located on one side of the portal frame 2. The thimble assembly 4 is fixed on one side of the wafer assembly 3. The feeding visual assembly 5 is positioned above the wafer assembly 3 and is fixedly connected with the portal frame 2. The swing arm assembly 6 is positioned on one side of the feeding visual assembly 5 and is fixedly connected with the portal frame 2. The die bonding visual assembly 7 is positioned on one side of the swing arm assembly 6, which is far away from the feeding visual assembly 5, and is fixedly connected with the portal frame 2. The dispensing component 8 is fixed on one side of the top end face of the portal frame 2 close to the die bonding visual component 7. The glue supply assembly 9 is fixed on one side of the glue dispensing assembly 8. The die bonding assembly 10 is positioned below the glue supply assembly 9 and fixed on the top end face of the machine frame 1. The feeding positioning assembly 11 is fixed inside the die bonding assembly 10. Through a series of structures that set up, not only simplify equipment structure, improve the stability of equipment operation, the shake when can also lightening equipment high-speed operation improves solid brilliant precision.

In fig. 2: the wafer assembly 3 comprises a first X-Y axis robot 301, the first X-Y axis robot 301 is fixed on the top end face of the rack 1 and is located on one side of the portal frame 2, a wafer support 302 is fixedly connected to the top end of the first X-Y axis robot 301, a wafer positioning groove 303 is formed in the top end face of the wafer support 302, and a buckle 304 is movably connected to the outer side face of the wafer positioning groove 303. When the device is used, the wafer is firstly placed into the wafer positioning groove 303, the locking buckle 304 is used for fixing the wafer, and the first X-Y axis robot 301 is used for accurately positioning the crystal grains under the matching of the feeding visual component 5, so that the crystal grains are accurately aligned to the thimble head 4057 of the thimble component 4.

In fig. 3: the thimble assembly 4 comprises a thimble base 401, the thimble base 401 is fixed on one side of the wafer assembly 3, the top end of the thimble base 401 is movably connected with a micro-motion platform 402, a cam module 403 is fixedly connected to the top end face of the micro-motion platform 402, a servo motor 404 is fixedly connected to one side face of the cam module 403, the output end of the servo motor 404 is connected with the cam module 403, a thimble module 405 is fixedly connected to the top end face of the cam module 403, and a top end face of the thimble module 405 is fixedly connected with a jacking sleeve 406. When the ejector pin module is used, firstly, the ejector pin base 401 is adjusted to a proper height, so that the height of the ejector pin module 405 is proper, then, the horizontal position of the ejector pin module 405 is adjusted through the micro-motion platform 402, and finally, the servo motor 404 is started, and the cam module 403 is driven by the servo motor 404 to rotate.

In fig. 11: the thimble module 405 includes a linear bearing base 4051 fixed on the top end face of the cam module 403, and a sleeve fixing base 4052 is fixed on the top end of the linear bearing base 4051, an thimble 4053 is movably connected inside the sleeve fixing base 4052, a thimble clamp 4055 is detachably fixed on the top end of the thimble 4053, a thimble cap 4056 is screwed on the top end of the outer side face of the thimble 4053, the thimble cap 4056 is used for fixing the thimble clamp 4055 on the top end of the thimble 4053, a sealing ring 4054 is arranged between the sleeve fixing base 4052 and the thimble 4053, and a thimble head 4057 is detachably fixed on the top end of the thimble clamp 4055. Along with the rotation of the cam module 403, the cam module 403 drives the ejector pin 4053 in the ejector pin module 405 to intermittently eject the ejector sleeve 406, and further drives the ejector pin 4057 to eject, during the ejection process, the ejector pin 4053 moves up and down in the sleeve fixing seat 4052.

In fig. 4: the feeding visual assembly 5 comprises a first camera support 504, the first camera support 504 is located above the wafer assembly 3 and fixedly connected with the portal frame 2, a first industrial camera 503 is fixedly connected to one side of the top end face of the first camera support 504, the bottom end of the first industrial camera 503 penetrates through the first camera support 504 and is fixedly connected with a first high-power lens 502, and a first visual light source 501 is fixedly connected to the bottom end of the first high-power lens 502. When the device is used, the first visual light source 501 automatically adjusts the brightness of the light source as required, the first high-power lens 502 amplifies crystal grains, the first industrial camera 503 captures and captures the positions of the crystal grains at a high speed, and the first X-Y axis robot 301 of the wafer assembly 3 is controlled to be accurately positioned.

In fig. 5: the swing arm assembly 6 comprises a swing rod motor base 602, the swing rod motor base 602 is located on one side of the feeding visual assembly 5 and is fixedly connected with the portal frame 2, the bottom end of the swing rod motor base 602 is fixedly connected with a cam motor base 603, one end of the cam motor base 603 is connected with a cam motor 604, the other end of the cam motor base 603 is movably connected with a solid crystal swing rod 601, a swing rod motor 605 is fixed at the top end of the swing rod motor base 602, and the output end of the swing rod motor 605 is connected with the solid crystal swing rod 601. After the wafer assembly 3 is corrected, the cam motor 604 drives the die bonding swing rod 601 to descend, the bakelite suction nozzle at one end of the die bonding swing rod 601 timely and accurately adsorbs a crystal grain, the cam motor 604 drives the die bonding swing rod 601 to ascend, then the swing rod motor 605 rotates by one hundred eighty degrees, the anode and the cathode of the crystal grain are just exchanged, the cam motor 604 drives the swing rod to descend again, a negative pressure pipeline is closed after the swing rod arrives at a proper position, a positive pressure pipeline is opened, and the crystal grain is accurately placed on an electrode of a lamp strip.

In fig. 6: the die bonding visual assembly 7 comprises a second camera support 704, the second camera support 704 is located on one side, away from the feeding visual assembly 5, of the swing arm assembly 6 and is fixedly connected with the portal frame 2, a second industrial camera 703 is fixedly connected to one side of the top end face of the second camera support 704, the bottom end of the second industrial camera 703 penetrates through the second camera support 704 and is fixedly connected with a second high-power lens 702, and a second visual light source 701 is fixedly connected to the bottom end of the second high-power lens 702. When the device is used, the second visual light source 701 automatically adjusts the brightness of the light source according to the requirement, the second high-power lens 702 amplifies the crystal grains, and the second industrial camera 703 captures and captures the positions of the crystal grains at a high speed.

In fig. 7: the dispensing assembly 8 comprises a mounting plate 804, the mounting plate 804 is located on one side of the swing arm assembly 6 away from the feeding visual assembly 5 and is fixedly connected with the portal frame 2, a dispensing motor 805 and a driving motor 806 are fixedly connected to one side of the mounting plate 804, the dispensing motor 805 is located on one side of the driving motor 806, a transmission mechanism 803 is movably connected to the other side of the mounting plate 804, the transmission mechanism 803 is connected with the output end of the dispensing motor 805, a dispensing connecting rod 807 is arranged on one side of the transmission mechanism 803, the dispensing connecting rod 807 is movably connected between the transmission mechanism 803 and the output end of the driving motor 806, a dispensing arm 802 is movably connected to the output end of the transmission mechanism 803, and a dispensing head 801 is fixedly connected to one end of the dispensing arm 802. In use, a glue needle is fixed to the glue dispensing head 801. Then, the dispensing motor 805 and the driving motor 806 are started, the output end of the dispensing motor 805 is in a cam structure, and the rotation motion of the cam is converted into a linear reciprocating motion under the coordination of the transmission mechanism 803, and the dispensing arm 802 and the dispensing head 801 follow the linear reciprocating motion. At this time, the glue dispensing connecting rod 807 converts the rotary motion of the driving motor 806 into linear motion, controls the glue dispensing position, and the glue dispensing head 801 is matched with the die bonding visual component 7 and the die bonding component 10 to accurately dispense glue dispensing needles dipped with glue solution from the glue plate 901 on the lamp strip electrode needing die bonding, so that the glue dispensing points are moderate in size and uniform in glue amount.

In fig. 8: supply gluey subassembly 9 including supplying gluey arm 906, and supply gluey arm 906 to fix in one side of gluing subassembly 8, supply the one end fixedly connected with fixed briquetting 903 of gluey arm 906, and the lateral surface swing joint of fixed briquetting 903 has a rubber tyer 901, the top fixedly connected with magnetic wheel 902 of rubber tyer 901, and the connection on magnetic wheel 902 top supplies gluey motor 905 output, fixed briquetting 903 top swing joint has fine setting micrometer 904. The rubber plate 901 is installed on the rubber supply arm 906, and the power provided by the rubber supply motor 905 is transmitted to the rubber plate 901 through the magnetic wheel 902 to drive the rubber plate 901 to rotate. During the use, the manual work adds the glue to the rubber disc 901, and fixed briquetting 903 plays the positioning action to rubber disc 901, and fine setting micrometer 904 can adjust glue film thickness.

In fig. 9: the die bonding assembly 10 comprises a second X-Y axis robot 1001, the second X-Y axis robot 1001 is located below the glue supply assembly 9 and fixed on the top end face of the rack 1, and the top end of the second X-Y axis robot 1001 is fixedly connected with a die bonding platform 1002. During die bonding, the die bonding component 10 firmly fixes the lamp strip on the die bonding platform 1002, and the positive and negative electrodes of the lamp strip are accurately aligned to the positive and negative electrodes of the die adsorbed on the suction nozzle by matching with the die bonding visual component 7 under the driving of the second X-Y axis robot 1001.

In fig. 10: the feeding positioning assembly 11 comprises a first positioning mechanism and a second positioning mechanism which are fixed inside the die bonder assembly 10, the first positioning mechanism is located on one side of the second positioning mechanism, the first positioning mechanism comprises a first three-rod cylinder 1101 which is fixed inside the die bonder assembly 10, a first anti-slip block 1102 is fixedly connected to the top end of the first three-rod cylinder 1101, a plurality of first sucking discs 1103 are embedded on the top end face of the first anti-slip block 1102, the second positioning mechanism comprises a second three-rod cylinder 1104 which is fixed on one side of the first three-rod cylinder 1101, a second anti-slip block 1105 is fixedly connected to the top end of the second three-rod cylinder 1104, and a plurality of second sucking discs 1106 are embedded on the top end face of the second anti-slip block 1105. Positioning mechanism divide into two sets ofly, when carrying out the lamp area reloading, two sets of synchronous working: the sucking disc passes through the hose to be connected with external evacuation equipment, and three pole cylinders rise, make the sucking disc laminating in the lower surface in lamp area and evacuation, and the sucking disc contracts under the atmospheric pressure effect and warp, drives the lamp area firmly fix on the non slipping spur to the fixed lamp area.

The utility model discloses a theory of operation is: in use, a wafer is first placed on wafer assembly 3, and the die is accurately aligned with pin head 4057 of pin assembly 4 by pin assembly 4 and feeding vision assembly 5. Then, when the die bonding swing rod 601 takes the material, the die attachment film is timely and accurately punctured, and the die is jacked up for a proper distance. At this time, the swing arm assembly 6 absorbs the crystal grains, the LED lamp strip needing die bonding is placed on the die bonding assembly 10, the second X-Y axis robot 1001 of the die bonding assembly 10 is matched with the die bonding visual assembly 7, the anode and the cathode of the lamp strip are accurately aligned to the anode and the cathode of the crystal grains adsorbed on the suction nozzle, and the die bonding assembly 10 accurately places the crystal grains on the electrodes of the lamp strip. Finally, the dispensing component 8 is matched with the die bonding visual component 7 and the die bonding component 10, and a dispensing needle dipped with glue solution is accurately dispensed on a lamp strip electrode needing die bonding, so that the size of glue dots is moderate, and the glue amount is uniform. When the lamp strip is replaced, the sucker is connected with external vacuumizing equipment through the hose, the three-rod cylinder is lifted, the sucker is attached to the lower surface of the lamp strip and vacuumized, and the sucker contracts and deforms under the action of atmospheric pressure to drive the lamp strip to be firmly fixed on the anti-skid block, so that the lamp strip is fixed.

In the utility model, the first X-Y axis robot 301 and the second X-Y axis robot 1001 are both DKW-X200Y320-L005 in model number; DKW-X150Y 150-L005. The model of the servo motor 404 is MSMF082L1U2M, the model of the first visual light source 501 is KM-RND5026A90, the model of the first industrial camera 503 is MGS130M-H, the model of the cam motor 604 is SV-X2MM010A-N2LN, the model of the swing rod motor 605 is sgm7j-08a _ c6s, the model of the dispensing motor 805 is MSMF012L1U2M, the model of the driving motor 806 is 86BYGH4330, the model of the glue supply motor 905 is 28CM006, and the models of the first three-rod cylinder 1101 and the second three-rod cylinder 1104 are TCL20X25S _0_ + _ CS 1-G-2.

The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

CSP online die bonder is characterized by comprising:

the frame plays a supporting role;

the portal frame is fixed on one side of the top end face of the rack;

the wafer assembly is fixed on the top end face of the rack and is positioned on one side of the portal frame;

the thimble assembly is fixed on one side of the wafer assembly;

the feeding visual assembly is positioned above the wafer assembly and is fixedly connected with the portal frame;

the swing arm assembly is positioned on one side of the feeding visual assembly and is fixedly connected with the portal frame;

the die bonding visual assembly is positioned on one side of the swing arm assembly, which is far away from the feeding visual assembly, and is fixedly connected with the portal frame;

the dispensing assembly is fixed on one side, close to the die bonding visual assembly, of the top end face of the portal frame;

the glue supply assembly is fixed on one side of the glue dispensing assembly;

the die bonding assembly is positioned below the glue supply assembly and fixed on the top end face of the rack;

and the feeding positioning assembly is fixed in the die bonding assembly.
2. The CSP on-line die bonder of claim 1, wherein the die pad assembly comprises a first X-Y axis robot, the first X-Y axis robot is fixed on the top end surface of the frame and is located at one side of the portal frame, a die pad bracket is fixedly connected to the top end of the first X-Y axis robot, a die pad positioning groove is formed in the top end surface of the die pad bracket, and a hasp is movably connected to the outer side surface of the die pad positioning groove.
3. The CSP online die bonder of claim 1, wherein the ejector pin assembly comprises an ejector pin base fixed to one side of the die assembly, a micro-motion platform is movably connected to a top end of the ejector pin base, a cam module is fixedly connected to a top end face of the micro-motion platform, a servo motor is fixedly connected to one side face of the cam module, an output end of the servo motor is connected to the cam module, an ejector pin module is fixedly connected to a top end face of the cam module, and a top end face of the ejector pin module is fixedly connected to the ejector sleeve.
4. The CSP on-line die bonder of claim 1, wherein the feeding vision assembly comprises a first camera bracket, the first camera bracket is located above the die bonder assembly and is fixedly connected with the portal frame, one side of the top end surface of the first camera bracket is fixedly connected with a first industrial camera, the bottom end of the first industrial camera penetrates through the first camera bracket and is fixedly connected with a first high power lens, and the bottom end of the first high power lens is fixedly connected with a first vision light source.
5. The CSP online die bonder of claim 1, wherein the swing arm assembly comprises a swing arm motor base, the swing arm motor base is located on one side of the feeding vision assembly and is fixedly connected with the portal frame, a cam motor base is fixedly connected to the bottom end of the swing arm motor base, one end of the cam motor base is connected with a cam motor, the other end of the cam motor base is movably connected with a die bonder swing rod, a swing arm motor is fixed to the top end of the swing arm motor base, and the output end of the swing arm motor is connected with the die bonder swing rod.
6. The CSP on-line die bonder of claim 1, wherein the die bonder vision assembly comprises a second camera support, the second camera support is located on one side of the swing arm assembly away from the feeding vision assembly and is fixedly connected with the portal frame, a second industrial camera is fixedly connected to one side of the top end face of the second camera support, the bottom end of the second industrial camera penetrates through the second camera support and is fixedly connected with a second high power lens, and a second vision light source is fixedly connected to the bottom end of the second high power lens.
7. The CSP online die bonder of claim 1, wherein the dispensing assembly comprises a mounting plate, the mounting plate is located on one side of the swing arm assembly away from the feeding vision assembly and is fixedly connected with the portal frame, a side surface of the mounting plate is fixedly connected with a dispensing motor and a driving motor, the dispensing motor is located on one side of the driving motor, the other side surface of the mounting plate is movably connected with a transmission mechanism, the transmission mechanism is connected with the output end of the dispensing motor, a dispensing connecting rod is arranged on one side of the transmission mechanism, the dispensing connecting rod is movably connected between the transmission mechanism and the output end of the driving motor, the output end of the transmission mechanism is movably connected with a dispensing arm, and one end of the dispensing arm is fixedly connected with a dispensing head.
8. The CSP on-line die bonder according to claim 1, wherein the glue supply assembly comprises a glue supply arm fixed at one side of the glue dispensing assembly, one end of the glue supply arm is fixedly connected with a fixed pressing block, the outer side surface of the fixed pressing block is movably connected with a glue tray, the top end of the glue tray is fixedly connected with a magnetic wheel, the top end of the magnetic wheel is connected with the output end of the glue supply motor, and the top end of the fixed pressing block is movably connected with a fine adjustment micrometer.
9. The CSP on-line die bonder of claim 1, wherein the die bonder comprises a second X-Y axis robot, the second X-Y axis robot is located below the glue supply assembly and fixed on the top end surface of the frame, and the die bonder platform is fixedly connected to the top end of the second X-Y axis robot.
10. The CSP on-line die bonder according to claim 1, wherein the feeding positioning assembly comprises a first positioning mechanism and a second positioning mechanism fixed inside the die bonder, the first positioning mechanism is located at one side of the second positioning mechanism, the first positioning mechanism comprises a first three-rod cylinder fixed inside the die bonder, a first anti-skid block is fixedly connected to the top end of the first three-rod cylinder, a plurality of first suckers are embedded on the top end face of the first anti-skid block, the second positioning mechanism comprises a second three-rod cylinder fixed at one side of the first three-rod cylinder, a second anti-skid block is fixedly connected to the top end of the second three-rod cylinder, and a plurality of second suckers are embedded on the top end face of the second anti-skid block.