CN213818786U - Adsorption device of SMT chip mounter - Google Patents
Adsorption device of SMT chip mounter Download PDFInfo
- Publication number
- CN213818786U CN213818786U CN202120053968.6U CN202120053968U CN213818786U CN 213818786 U CN213818786 U CN 213818786U CN 202120053968 U CN202120053968 U CN 202120053968U CN 213818786 U CN213818786 U CN 213818786U
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- air
- chip mounter
- main part
- sucking disc
- device main
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 23
- 238000009423 ventilation Methods 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005728 strengthening Methods 0.000 abstract description 2
- 241000252254 Catostomidae Species 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
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Abstract
The utility model discloses a SMT chip mounter adsorption equipment relates to chip mounter adsorption technology field, including the device main part, the inside top of device main part is run through there is the aspiration pump, and the ventilation groove has been seted up to the inside of device main part, and the bottom of device main part is connected with the blotter, and the bottom of blotter is run through there is the connecting block, and the bottom of connecting block is run through there is the sucking disc. The utility model discloses an air pipe, the ventilation groove, the aspiration pump, the air outlet, air intake and connecting block play the effect of strengthening suction to the device, at first the sucking disc adsorbs the work piece, later the aspiration pump starts, through the air suction of air intake in with the sucking disc, make and be negative pressure state in the sucking disc, increase the adsorption efficiency of sucking disc, later the air passes through air pipe and gets into the ventilation inslot, discharge through the air outlet, the aspiration pump lasts the function, prevent that ventilation groove air from flowing back into in the sucking disc, make the work piece drop, through a plurality of sucking discs, make the device can adsorb the work piece of equidimension not, increase the adsorption efficiency of sucking disc.
Description
Technical Field
The utility model relates to a chip mounter adsorbs technical field, specifically is a SMT chip mounter adsorption equipment.
Background
In the field of electronic product production and manufacturing, the SMT (surface mount technology) chip technology has the advantages of high efficiency, high yield and low cost, so that the technology is widely applied to the electronic product production and manufacturing process.
The adsorption device of the existing SMT chip mounter is simple in structure mostly, a sucker is adopted to adsorb workpieces, the sucker can drop easily when adsorbing the workpieces and is not suitable for workpieces with different sizes, the adsorption device of the existing SMT chip mounter is fixed in a structure mostly, and when adsorbing the workpieces with low height, the adsorption device can not suck up completely, so that the workpieces drop to cause damage.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: in order to solve the problem that a sucker is not firmly adsorbed and inconvenient to adsorb a workpiece with a lower height, an adsorption device of an SMT chip mounter is provided.
In order to achieve the above object, the utility model provides a following technical scheme: an adsorption device of an SMT chip mounter comprises a main body, wherein an air suction pump penetrates through the upper portion inside the main body, a ventilation groove is formed in the main body, a cushion pad is connected to the bottom of the main body, a connecting block penetrates through the bottom of the cushion pad, a sucker penetrates through the bottom of the connecting block, an air inlet penetrates through the top of the sucker, a ventilation pipeline is formed in the top of the connecting block, the top of the main body is connected with an air box, air outlets are formed in two sides of the air box, the top of the air box is connected with a connecting frame, a threaded sleeve is arranged in the connecting frame, a baffle is sleeved outside the connecting frame and the air box, telescopic rods are connected to two sides of the baffle through supporting blocks, the top of the baffle is connected with the main body of the chip mounter, a motor is installed in the main body of the chip mounter, and a threaded rod is connected to the output end of the motor, the outer surface of the chip mounter main body is provided with a control panel.
Preferably, the bellows is slidably connected to the baffle, and the connecting frame is slidably connected to the baffle.
Preferably, the buffer pad is made of sponge material, and a plurality of connecting blocks are arranged at the bottom of the buffer pad.
Preferably, the suction cup is provided with a plurality of suction cups, and the plurality of suction cups are equidistantly distributed.
Preferably, the ventilation duct is provided in plurality, and the air inlet is provided in plurality.
Preferably, the top of the ventilation slot is inclined upward in the direction of the suction pump.
Preferably, the air pump and the motor are both electrically connected with the control panel.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses an air pipe, the ventilation groove, the aspiration pump, the air outlet, air intake and connecting block play the effect of strengthening suction to the device, at first the sucking disc adsorbs the work piece, later the aspiration pump starts, the air suction in the sucking disc through the air intake, make and be the negative pressure state in the sucking disc, increase the adsorption efficiency of sucking disc, later the air passes through air pipe and gets into the ventilation groove, discharge through the air outlet, the aspiration pump lasts the function, prevent ventilation groove air backflow into the sucking disc, make the work piece drop, through a plurality of sucking discs, make the device can adsorb the work piece of equidimension not, increase the adsorption efficiency of sucking disc;
2. the utility model discloses a thread bush, the threaded rod, the link, supporting shoe and telescopic link play the effect that can adjust adsorption height to the device, when needs adjusting the sucking disc height, motor start drive threaded rod is rotatory, the link passes through the thread bush and is connected with the threaded rod, make the link drive bellows and device main part move down, adsorb the lower work piece of height, when the device main part moves down, the telescopic link plays direction and spacing effect to the device main part, when the telescopic link can't continue to extend, it is spacing to carry out the device main part, make the device can height-adjusting, be applicable to the work piece of not co-altitude.
Drawings
FIG. 1 is a schematic view of the structure of the device of the present invention;
FIG. 2 is a schematic cross-sectional view of the device of the present invention;
FIG. 3 is a schematic cross-sectional view of the connecting block of the present invention;
fig. 4 is a side view of the device of the present invention.
In the figure: 1. a device main body; 2. a control panel; 3. a chip mounter main body; 4. a baffle plate; 5. a support block; 6. a telescopic rod; 7. a cushion pad; 8. a suction cup; 9. a ventilation duct; 10. a ventilation slot; 11. an air pump; 12. an air box; 13. a connecting frame; 14. a threaded sleeve; 15. a threaded rod; 16. a motor; 17. an air outlet; 18. an air inlet; 19. and (4) connecting the blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "disposed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. The following describes an embodiment of the present invention according to its overall structure.
Referring to fig. 1-4, an adsorption device of an SMT chip mounter includes a device body 1, a control panel 2, a chip mounter body 3, a baffle 4, a support block 5, an expansion link 6, a buffer pad 7, a suction cup 8, a ventilation duct 9, a ventilation groove 10, an air pump 11, an air box 12, a connection frame 13, a threaded sleeve 14, a threaded rod 15, a motor 16, an air outlet 17, an air inlet 18 and a connection block 19, wherein the air pump 11 penetrates through the upper portion inside the device body 1, the ventilation groove 10 is formed inside the device body 1, the buffer pad 7 is connected to the bottom of the device body 1, the connection block 19 penetrates through the bottom of the buffer pad 7, the suction cup 8 penetrates through the bottom of the connection block 19, the air inlet 18 penetrates through the top of the suction cup 8, the ventilation duct 9 is formed at the top of the connection block 19, the air box 12 is connected to the top of the device body 1, and the air outlets 17 are formed on both sides of the air box 12, the top of bellows 12 is connected with link 13, the inside of link 13 is provided with thread bush 14, baffle 4 has been cup jointed to link 13 and bellows 12's outside, baffle 4's both sides all are connected with telescopic link 6 through supporting shoe 5, baffle 4's top is connected with chip mounter main part 3, the internally mounted of chip mounter main part 3 has motor 16, motor 16's output is connected with threaded rod 15, chip mounter main part 3's surface is provided with control panel 2, motor 16 starts back output drive threaded rod 15 and rotates, because link 13 passes through thread bush 14 and is connected with threaded rod 15, threaded rod 15's rotation makes link 13 downstream, drive bellows 12 and device main part 1 downstream when removing the frame downstream.
Referring to fig. 1, 2 and 4, the bellows 12 is slidably connected to the baffle 4, the connecting frame 13 is moved downward by the rotation of the threaded rod 15, and the bellows 12 and the device body 1 are moved downward by the downward movement of the moving frame.
Referring to fig. 1-4, the buffer pad 7 is made of sponge material, and the bottom of the buffer pad 7 is provided with a plurality of connecting blocks 19, the device body 1 moves down to enable the suction cups 8 to suck the tops of the workpieces, the suction cups 8 absorb a plurality of positions of the workpieces, so that the device can absorb the workpieces with different sizes, the workpieces are buffered through the suction cups 8 and the buffer pad 7, and the workpieces are prevented from being damaged due to overlarge suction force of the suction pump 11.
Please refer to fig. 2, the plurality of suckers 8 are arranged and distributed at equal intervals, the device body 1 moves downwards to enable the suckers 8 to suck the tops of the workpieces, the suckers 8 adsorb a plurality of positions of the workpieces, the device can adsorb the workpieces with different sizes, the workpieces are buffered through the suckers 8 and the buffer pads 7, and the workpieces are prevented from being damaged due to the fact that the suction force of the air suction pump 11 is too large.
Please refer to fig. 2-3, the ventilation duct 9 is provided with a plurality of ventilation ducts, the air inlet 18 is provided with a plurality of air inlets, the plurality of suction cups 8 adsorb a plurality of positions of the workpiece, and after the air pump 11 is started, the air in the suction cups 8 is pumped out through the air inlets 18, so that the inside of the suction cups 8 is in a negative pressure state.
Referring to fig. 2 again, the top of the ventilation slot 10 is inclined upward along the direction of the air pump 11, and air enters the ventilation slot 10 through the ventilation duct 9, is pumped into the air box 12 by the air pump 11, and is discharged from the air outlet 17.
Referring to fig. 1-2, the air pump 11 and the motor 16 are electrically connected to the control panel 2, and the operator turns on or off the air pump 11 and the motor 16 through the control panel 2.
The working principle is as follows: firstly, a worker starts an air suction pump 11 and a motor 16 through a control panel 2, an output end drives a threaded rod 15 to rotate after the motor 16 is started, as a connecting frame 13 is connected with the threaded rod 15 through a threaded sleeve 14, the rotation of the threaded rod 15 enables the connecting frame 13 to move downwards, a moving frame drives an air box 12 and a device main body 1 to move downwards when moving downwards, the device main body 1 is connected with a supporting block 5 through an expansion rod 6 when moving downwards, the expansion rod 6 limits and guides the device main body 1, the expansion rod 6 limits the device main body 1 after extending out to prevent the threaded rod 15 from being separated from the threaded sleeve 14, the device main body 1 moves downwards to enable a suction cup 8 to suck the top of a workpiece, a plurality of suction cups 8 suck a plurality of positions of the workpiece, the device can suck workpieces with different sizes, after the air suction pump 11 is started, air in the suction cup 8 is pumped out through an air inlet 18 to enable the interior of the suction cup 8 to be in a negative pressure state, increase suction, the air passes through ventilation pipe 9 and gets into in the ventilation groove 10, is discharged from air outlet 17 by the suction pump 11 suction bellows 12, when the sucking disc 8 adsorbs the work piece, the work piece cushions through sucking disc 8 and cushion 7, prevents that the too big work piece that makes of suction pump 11 suction from receiving the damage.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. The utility model provides a SMT chip mounter adsorption equipment, includes device main part (1), its characterized in that: the air suction device is characterized in that an air suction pump (11) is installed at the top of the device main body (1), the air outlet end of the air suction pump (11) extends to the inside of an air box (12), a ventilation groove (10) is formed in the inside of the device main body (1), a cushion pad (7) is connected to the bottom of the device main body (1), a connecting block (19) is arranged at the bottom of the cushion pad (7), a suction disc (8) is connected to the bottom of the connecting block (19), an air inlet (18) is formed in the top of the suction disc (8), a ventilation pipeline (9) is formed in the top of the connecting block (19), the air box (12) is connected to the top of the device main body (1), air outlets (17) are formed in two sides of the air box (12), a connecting frame (13) is connected to the top of the air box (12), and a threaded sleeve (14) is arranged in the connecting frame (13), baffle (4) have been cup jointed to the outside of link (13) and bellows (12), the both sides of baffle (4) all are connected with telescopic link (6) through supporting shoe (5), the top of baffle (4) is connected with chip mounter main part (3), the internally mounted of chip mounter main part (3) has motor (16), the output of motor (16) is connected with threaded rod (15), the surface of chip mounter main part (3) is provided with control panel (2).
2. An adsorption device of an SMT chip mounter according to claim 1, wherein: bellows (12) and baffle (4) sliding connection, just link (13) and baffle (4) sliding connection.
3. An adsorption device of an SMT chip mounter according to claim 1, wherein: the buffer pad (7) is made of sponge materials, and a plurality of connecting blocks (19) are arranged at the bottom of the buffer pad (7).
4. An adsorption device of an SMT chip mounter according to claim 1, wherein: the sucking discs (8) are arranged in a plurality of and distributed in the same distance with the sucking discs (8).
5. An adsorption device of an SMT chip mounter according to claim 1, wherein: the ventilation pipeline (9) is provided with a plurality of air inlets (18).
6. An adsorption device of an SMT chip mounter according to claim 1, wherein: the top of the ventilation groove (10) inclines upwards along the direction of the air suction pump (11).
7. An adsorption device of an SMT chip mounter according to claim 1, wherein: the air pump (11) and the motor (16) are electrically connected with the control panel (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120053968.6U CN213818786U (en) | 2021-01-11 | 2021-01-11 | Adsorption device of SMT chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120053968.6U CN213818786U (en) | 2021-01-11 | 2021-01-11 | Adsorption device of SMT chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213818786U true CN213818786U (en) | 2021-07-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120053968.6U Expired - Fee Related CN213818786U (en) | 2021-01-11 | 2021-01-11 | Adsorption device of SMT chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213818786U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115258679A (en) * | 2022-08-05 | 2022-11-01 | 安泰爱科科技有限公司 | Automatic box swinging equipment for rare earth permanent magnet material production |
-
2021
- 2021-01-11 CN CN202120053968.6U patent/CN213818786U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115258679A (en) * | 2022-08-05 | 2022-11-01 | 安泰爱科科技有限公司 | Automatic box swinging equipment for rare earth permanent magnet material production |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210727 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |